JPS5295173A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS5295173A
JPS5295173A JP1144876A JP1144876A JPS5295173A JP S5295173 A JPS5295173 A JP S5295173A JP 1144876 A JP1144876 A JP 1144876A JP 1144876 A JP1144876 A JP 1144876A JP S5295173 A JPS5295173 A JP S5295173A
Authority
JP
Japan
Prior art keywords
lead frame
pellet
peal
crack
fixture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1144876A
Other languages
Japanese (ja)
Inventor
Sadao Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1144876A priority Critical patent/JPS5295173A/en
Publication of JPS5295173A publication Critical patent/JPS5295173A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To prevent from the crack of the pellet and to peal off from the lead frame by making up the pellet fixture with the transformation small frame to the heat stress.
COPYRIGHT: (C)1977,JPO&Japio
JP1144876A 1976-02-06 1976-02-06 Lead frame Pending JPS5295173A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1144876A JPS5295173A (en) 1976-02-06 1976-02-06 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1144876A JPS5295173A (en) 1976-02-06 1976-02-06 Lead frame

Publications (1)

Publication Number Publication Date
JPS5295173A true JPS5295173A (en) 1977-08-10

Family

ID=11778364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1144876A Pending JPS5295173A (en) 1976-02-06 1976-02-06 Lead frame

Country Status (1)

Country Link
JP (1) JPS5295173A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56104459A (en) * 1980-01-25 1981-08-20 Hitachi Ltd Semiconductor device
JPS56109043U (en) * 1980-01-22 1981-08-24
JPS6184841A (en) * 1984-10-02 1986-04-30 Toshiba Corp Enclosure of semiconductor device
JPS6280342U (en) * 1985-11-08 1987-05-22
JPS6350049A (en) * 1986-08-19 1988-03-02 Mitsubishi Electric Corp Resin sealed type semiconductor device
JPH01157559A (en) * 1988-07-29 1989-06-20 Hitachi Ltd Semiconductor device
JPH0273660A (en) * 1988-09-08 1990-03-13 Mitsubishi Electric Corp Lead frame for semiconductor device
US5264730A (en) * 1990-01-06 1993-11-23 Fujitsu Limited Resin mold package structure of integrated circuit
EP0655782A3 (en) * 1993-11-29 1995-10-18 Toshiba Kk Resin-sealed semiconductor device and method of fabricating same.
USRE37690E1 (en) 1987-02-25 2002-05-07 Hitachi, Ltd. Lead frame and semiconductor device

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56109043U (en) * 1980-01-22 1981-08-24
JPS636673Y2 (en) * 1980-01-22 1988-02-25
JPS56104459A (en) * 1980-01-25 1981-08-20 Hitachi Ltd Semiconductor device
JPS6184841A (en) * 1984-10-02 1986-04-30 Toshiba Corp Enclosure of semiconductor device
JPS6280342U (en) * 1985-11-08 1987-05-22
JPS6350049A (en) * 1986-08-19 1988-03-02 Mitsubishi Electric Corp Resin sealed type semiconductor device
JPH0579173B2 (en) * 1986-08-19 1993-11-01 Mitsubishi Electric Corp
USRE37690E1 (en) 1987-02-25 2002-05-07 Hitachi, Ltd. Lead frame and semiconductor device
JPH01157559A (en) * 1988-07-29 1989-06-20 Hitachi Ltd Semiconductor device
JPH0273660A (en) * 1988-09-08 1990-03-13 Mitsubishi Electric Corp Lead frame for semiconductor device
US5264730A (en) * 1990-01-06 1993-11-23 Fujitsu Limited Resin mold package structure of integrated circuit
EP0655782A3 (en) * 1993-11-29 1995-10-18 Toshiba Kk Resin-sealed semiconductor device and method of fabricating same.

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