JPS56104459A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56104459A
JPS56104459A JP685080A JP685080A JPS56104459A JP S56104459 A JPS56104459 A JP S56104459A JP 685080 A JP685080 A JP 685080A JP 685080 A JP685080 A JP 685080A JP S56104459 A JPS56104459 A JP S56104459A
Authority
JP
Japan
Prior art keywords
tab
resin
prevent
semiconductor
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP685080A
Inventor
Fujio Ito
Kunihiko Nishi
Yoshiaki Wakashima
Original Assignee
Hitachi Ltd
Hitachi Tokyo Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Tokyo Electronics Co Ltd filed Critical Hitachi Ltd
Priority to JP685080A priority Critical patent/JPS56104459A/en
Publication of JPS56104459A publication Critical patent/JPS56104459A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49503Lead-frames or other flat leads characterised by the die pad
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319Arrangement of the layer connectors prior to mounting
    • H01L2224/83194Lateral distribution of the layer connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385Shape, e.g. interlocking features
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

PURPOSE:To prevent the crack of the semiconductor due to the stress concentration in the semiconductor device in which the tab securing the semiconductor pellet and a plurality of lead wires are resin molded and sealed by forming thicknesswise unevenness or the back surface of the tab and thus introducing a part of the resin into the recess. CONSTITUTION:In the semiconductor device in which the semiconductor pellet 12 is secured onto the tab 13, the pellet is connected to the lead wire 14 via the wire 16, and then the resin 15 is covered thereon to mold and seal itself, a plurality of holes 17 are formed entirely on the back surface of the tab in the thicknesswise direction at the tab 13, and a part 15a of the resin thus molded is introduced and solidified into the recess 17. Circular, rectangular or square groove or blind hole may be formed instead of the hole. Thus, the bonding strength between the tab and the resin is increased to prevent the exfoliation of the adhesive due to the thermal expansion difference therebetween and to thus prevent the crack of the resin.
JP685080A 1980-01-25 1980-01-25 Semiconductor device Pending JPS56104459A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP685080A JPS56104459A (en) 1980-01-25 1980-01-25 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP685080A JPS56104459A (en) 1980-01-25 1980-01-25 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS56104459A true JPS56104459A (en) 1981-08-20

Family

ID=11649705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP685080A Pending JPS56104459A (en) 1980-01-25 1980-01-25 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56104459A (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57175448U (en) * 1981-04-30 1982-11-05
JPS59111348A (en) * 1982-12-17 1984-06-27 Toshiba Corp Lead frame for resin seal type semiconductor device
EP0146330A2 (en) * 1983-12-12 1985-06-26 Texas Instruments Incorporated Integrated circuit device with textured bar pad
JPS60123046A (en) * 1983-12-07 1985-07-01 Toshiba Corp Semiconductor device
JPS6280342U (en) * 1985-11-08 1987-05-22
JPS6329956U (en) * 1986-08-08 1988-02-27
JPS6358859A (en) * 1986-08-28 1988-03-14 Mitsubishi Electric Corp Semiconductor device
JPS6439754A (en) * 1987-08-05 1989-02-10 Mitsubishi Electric Corp Resin sealed semiconductor device
US4857989A (en) * 1986-09-04 1989-08-15 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
EP0345760A2 (en) * 1988-06-08 1989-12-13 SGS-THOMSON MICROELECTRONICS S.r.l. Semiconductor device in plastic case with means of anchoring between chip-bearing slice and plastic body
JPH0252357U (en) * 1989-09-20 1990-04-16
FR2704114A1 (en) * 1993-04-12 1994-10-21 Fujitsu Ltd Casing structure for an electronic device of the surface-mounting type, and method of mounting such a structure on a printed-wiring board
WO2000033420A1 (en) * 1998-12-03 2000-06-08 Intermedics Inc. Surface mounted device with grooves on a termination lead
DE19618976C2 (en) * 1995-10-30 2002-06-27 Mitsubishi Electric Corp resin-sealed semiconductor device
EP1376691A2 (en) * 2002-06-21 2004-01-02 W. C. Heraeus GmbH & Co. KG Method of making a carrier from a metallic leadframe and leadframe with a support for electronic components
KR100652517B1 (en) * 2004-03-23 2006-12-01 삼성전자주식회사 semiconductor package having leads directly attached to chip, manufacturing method and apparatus thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5295173A (en) * 1976-02-06 1977-08-10 Hitachi Ltd Lead frame
JPS554983A (en) * 1978-06-27 1980-01-14 Nec Kyushu Ltd Lead frame for semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5295173A (en) * 1976-02-06 1977-08-10 Hitachi Ltd Lead frame
JPS554983A (en) * 1978-06-27 1980-01-14 Nec Kyushu Ltd Lead frame for semiconductor device

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57175448U (en) * 1981-04-30 1982-11-05
JPS6225905Y2 (en) * 1981-04-30 1987-07-02
JPS59111348A (en) * 1982-12-17 1984-06-27 Toshiba Corp Lead frame for resin seal type semiconductor device
JPS60123046A (en) * 1983-12-07 1985-07-01 Toshiba Corp Semiconductor device
JPH0433136B2 (en) * 1983-12-07 1992-06-02 Tokyo Shibaura Electric Co
EP0146330A2 (en) * 1983-12-12 1985-06-26 Texas Instruments Incorporated Integrated circuit device with textured bar pad
JPS6280342U (en) * 1985-11-08 1987-05-22
JPS6329956U (en) * 1986-08-08 1988-02-27
JPS6358859A (en) * 1986-08-28 1988-03-14 Mitsubishi Electric Corp Semiconductor device
US4857989A (en) * 1986-09-04 1989-08-15 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JPS6439754A (en) * 1987-08-05 1989-02-10 Mitsubishi Electric Corp Resin sealed semiconductor device
EP0345760A3 (en) * 1988-06-08 1990-11-14 SGS-THOMSON MICROELECTRONICS S.r.l. Semiconductor device in plastic case with means of anchoring between chip-bearing slice and plastic body
EP0345760A2 (en) * 1988-06-08 1989-12-13 SGS-THOMSON MICROELECTRONICS S.r.l. Semiconductor device in plastic case with means of anchoring between chip-bearing slice and plastic body
JPH0252357U (en) * 1989-09-20 1990-04-16
FR2704114A1 (en) * 1993-04-12 1994-10-21 Fujitsu Ltd Casing structure for an electronic device of the surface-mounting type, and method of mounting such a structure on a printed-wiring board
DE19618976C2 (en) * 1995-10-30 2002-06-27 Mitsubishi Electric Corp resin-sealed semiconductor device
WO2000033420A1 (en) * 1998-12-03 2000-06-08 Intermedics Inc. Surface mounted device with grooves on a termination lead
US6426880B1 (en) * 1998-12-03 2002-07-30 Intermedics, Inc. Surface mounted device with grooves on a termination lead
EP1376691A2 (en) * 2002-06-21 2004-01-02 W. C. Heraeus GmbH & Co. KG Method of making a carrier from a metallic leadframe and leadframe with a support for electronic components
EP1376691A3 (en) * 2002-06-21 2004-06-23 W. C. Heraeus GmbH & Co. KG Method of making a carrier from a metallic leadframe and leadframe with a support for electronic components
KR100652517B1 (en) * 2004-03-23 2006-12-01 삼성전자주식회사 semiconductor package having leads directly attached to chip, manufacturing method and apparatus thereof

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