JPS5419652A - Lead bonding method - Google Patents

Lead bonding method

Info

Publication number
JPS5419652A
JPS5419652A JP8424777A JP8424777A JPS5419652A JP S5419652 A JPS5419652 A JP S5419652A JP 8424777 A JP8424777 A JP 8424777A JP 8424777 A JP8424777 A JP 8424777A JP S5419652 A JPS5419652 A JP S5419652A
Authority
JP
Japan
Prior art keywords
bonding method
lead bonding
lead
deforming
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8424777A
Other languages
Japanese (ja)
Inventor
Toru Kawanobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8424777A priority Critical patent/JPS5419652A/en
Publication of JPS5419652A publication Critical patent/JPS5419652A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To achieve the reduction in bonding defects by deforming the ends of leads.
COPYRIGHT: (C)1979,JPO&Japio
JP8424777A 1977-07-15 1977-07-15 Lead bonding method Pending JPS5419652A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8424777A JPS5419652A (en) 1977-07-15 1977-07-15 Lead bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8424777A JPS5419652A (en) 1977-07-15 1977-07-15 Lead bonding method

Publications (1)

Publication Number Publication Date
JPS5419652A true JPS5419652A (en) 1979-02-14

Family

ID=13825125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8424777A Pending JPS5419652A (en) 1977-07-15 1977-07-15 Lead bonding method

Country Status (1)

Country Link
JP (1) JPS5419652A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4626478A (en) * 1984-03-22 1986-12-02 Unitrode Corporation Electronic circuit device components having integral spacers providing uniform thickness bonding film
JPH01297833A (en) * 1988-05-26 1989-11-30 Hitachi Ltd semiconductor equipment
US5027995A (en) * 1988-08-31 1991-07-02 Siemens Aktiengesellschaft Process for bonding semiconductor chips to substrates
US5046657A (en) * 1988-02-09 1991-09-10 National Semiconductor Corporation Tape automated bonding of bumped tape on bumped die

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4626478A (en) * 1984-03-22 1986-12-02 Unitrode Corporation Electronic circuit device components having integral spacers providing uniform thickness bonding film
US5046657A (en) * 1988-02-09 1991-09-10 National Semiconductor Corporation Tape automated bonding of bumped tape on bumped die
JPH01297833A (en) * 1988-05-26 1989-11-30 Hitachi Ltd semiconductor equipment
US5027995A (en) * 1988-08-31 1991-07-02 Siemens Aktiengesellschaft Process for bonding semiconductor chips to substrates

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