JPS56147453A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56147453A
JPS56147453A JP5086880A JP5086880A JPS56147453A JP S56147453 A JPS56147453 A JP S56147453A JP 5086880 A JP5086880 A JP 5086880A JP 5086880 A JP5086880 A JP 5086880A JP S56147453 A JPS56147453 A JP S56147453A
Authority
JP
Japan
Prior art keywords
metal plate
resin
groove
constitution
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5086880A
Other languages
Japanese (ja)
Inventor
Yukio Hayakawa
Koichi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP5086880A priority Critical patent/JPS56147453A/en
Publication of JPS56147453A publication Critical patent/JPS56147453A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for individual devices of subclass H10D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve the humidity resistance of a semiconductor device by forming an annular groove in the heat sink surface, between the resin end surface and the semiconductor element-mounting position, so as to surround the element. CONSTITUTION:An annular groove 16 is formed in the surface of a metal plate 12, surrounding a semiconductor element 13. The electrodes of the element 13 are connected 15 with external leads 14, and with the back surface of the metal plate 12 exposed, this is sealed with resin 11. The groove 16 permits the increase of the bonding area between the metal plate 12 and the resin 11, so that adhesion improves and the penetrating path of moisture elongates as well. By said constitution, the humidity resistance can be improved without increasing the external shape. The deeper and the larger the groove is in number, the more effective it becomes.
JP5086880A 1980-04-17 1980-04-17 Semiconductor device Pending JPS56147453A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5086880A JPS56147453A (en) 1980-04-17 1980-04-17 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5086880A JPS56147453A (en) 1980-04-17 1980-04-17 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS56147453A true JPS56147453A (en) 1981-11-16

Family

ID=12870693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5086880A Pending JPS56147453A (en) 1980-04-17 1980-04-17 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56147453A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6078138U (en) * 1983-10-31 1985-05-31 松下電工株式会社 Sealing structure of semiconductor elements
EP0777272A3 (en) * 1995-11-30 2000-03-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6078138U (en) * 1983-10-31 1985-05-31 松下電工株式会社 Sealing structure of semiconductor elements
EP0777272A3 (en) * 1995-11-30 2000-03-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

Similar Documents

Publication Publication Date Title
JPS5315763A (en) Resin sealed type semiconductor device
JPS56147453A (en) Semiconductor device
JPS5651851A (en) Semiconductor device
JPS5379381A (en) Production of resin seal type semiconductor device and lead frame used forthe same
JPS55105354A (en) Resin-sealed semiconductor device
JPS56146263A (en) Manufacture of semiconductor device
JPS5732658A (en) Resin sealing type semiconductor device with radiator plate
JPS5629352A (en) Resin-sealed semiconductor device
JPS5796561A (en) Lead for connection of semiconductor device
JPS56115550A (en) Manufacture of semiconductor device
JPS54111768A (en) Semiconductor device of resin sealing type
JPS57114266A (en) Resin-sealed semiconductor device
JPS5745938A (en) Semiconductor device
JPS522282A (en) Semiconductor device
JPS57111041A (en) Semiconductor device
JPS57109350A (en) Semiconductor device
JPS57120386A (en) Semiconductor device
JPS54146577A (en) Semiconductor device
JPS5745960A (en) Resin-sealed semiconductor device
JPS5374367A (en) Semiconductor device
JPS54148479A (en) Resin-sealed semiconductor device
JPS645079A (en) Semiconductor light emitting device
JPS57136339A (en) Resin sealing type semiconductor device
JPS649647A (en) Semiconductor device
JPS5710954A (en) Semiconductor device