JPS5745960A - Resin-sealed semiconductor device - Google Patents

Resin-sealed semiconductor device

Info

Publication number
JPS5745960A
JPS5745960A JP12151480A JP12151480A JPS5745960A JP S5745960 A JPS5745960 A JP S5745960A JP 12151480 A JP12151480 A JP 12151480A JP 12151480 A JP12151480 A JP 12151480A JP S5745960 A JPS5745960 A JP S5745960A
Authority
JP
Japan
Prior art keywords
heat dissipating
dissipating plate
resin
groove
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12151480A
Other languages
Japanese (ja)
Inventor
Shinichi Akashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12151480A priority Critical patent/JPS5745960A/en
Publication of JPS5745960A publication Critical patent/JPS5745960A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve the adherence of a resin-sealed semiconductor device by forming a through hole at a heat dissipating plate, forming a groove on the back surface of the heat dissipating plate with the through hole as a starting point and burying sealing resin to the parts of the groove and hole. CONSTITUTION:Through holes 6 are opened at four corners of a semiconductor element 2 of a heat dissipating plate 1 at the positions isolated from the mounting part of the semiconductor element 2. A groove 7 is formed on the back surface of the heat dissipating plate with the lead side of a lead 3 and a pair of holes 6 of the mounting side to the opposite side of the lead 3 as both ends, the resin 4 is buried even at the groove part, and a part of the heat dissipating plate 1 is completely surrounded at both front and back surfaces. Thus, the adherence of semiconductor device can be remarkably improved.
JP12151480A 1980-09-02 1980-09-02 Resin-sealed semiconductor device Pending JPS5745960A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12151480A JPS5745960A (en) 1980-09-02 1980-09-02 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12151480A JPS5745960A (en) 1980-09-02 1980-09-02 Resin-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS5745960A true JPS5745960A (en) 1982-03-16

Family

ID=14813083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12151480A Pending JPS5745960A (en) 1980-09-02 1980-09-02 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS5745960A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6727575B2 (en) 2001-04-12 2004-04-27 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6727575B2 (en) 2001-04-12 2004-04-27 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

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