JPS5556650A - Semiconductor device - Google Patents

Abstract

PURPOSE: To prevent the cracks of a semiconductor element and the disconnection of conductors, by manufacturing grooves on a radiator plate, by forming the grooves in shapes that the width of openings is larger that internal width, by fixing the semiconductor element at locations except groove portions and by sealing the whole with resin.

CONSTITUTION: Two inverted V-type grooves 12a, 12b, which internal width is larger than which opening width, are mounted onto a radiator plate 11 in copper at regular intervals in the width direction of the radiator plate. A semiconductor element 15 that conductors 14 are connected to a Si element piece 13 is fixed between groove portions with a lead-tin alloy, and the whole is sealed with resin 16. The conductors 14 are connected to lead frames 17 inserted and put into the resin 16. According to this constitution, stress produced in the resin layer 16 is dispersed to the radiator plate side and the stress in the resin layer is remarkably moderated because the resin 16 infiltrates to the grooves and the strength of junction is considerably heightened. Impact force from the outside is also softened similarly. Thus, the cracks of the semiconductor element can be prevented, and the conductors are not disconnected because the uniform thermal expansive force of the resin applies to the conductors.

COPYRIGHT: (C)1980,JPO&Japio