JPS6459843A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS6459843A JPS6459843A JP62216853A JP21685387A JPS6459843A JP S6459843 A JPS6459843 A JP S6459843A JP 62216853 A JP62216853 A JP 62216853A JP 21685387 A JP21685387 A JP 21685387A JP S6459843 A JPS6459843 A JP S6459843A
- Authority
- JP
- Japan
- Prior art keywords
- grooves
- face
- parts
- heat
- protruding parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
PURPOSE:To enhance a heat-dissipating effect by a method wherein first grooves having recessed parts and protruding parts formed in a first material where a semiconductor chip is mounted coincide with second grooves having recessed parts and protruding parts formed in a second material acting as a radiator and these grooves are bonded. CONSTITUTION:A semiconductor chip 1 is mounted on one face of a first material 2; first grooves 3 having recessed parts and protruding parts are formed on the other face. A radiator 6 is formed on one face of a second material 4; second grooves 5 having recessed parts and protruding parts are formed on the other face. The second grooves 5 formed on the other face of the second material 4 are formed in one direction; the second grooves 5 formed on the other face of the second material 4 coincide with the first grooves 3 formed on the other face of the first material 2. At the first material 2 and the second material 4, the recessed parts and the protruding parts formed on the respective other faces of the first grooves 3 and the second grooves 5 coincide with each other, and are fixed by using an adhesive material 7 such as a solder, an adhesive agent or the like. Side-face parts 8 of the grooves are obtained as heat-conducting regions; a bonding area and a heat-conducting area are expanded as a whole; a heat-dissipating effect is thereby enhanced.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62216853A JPS6459843A (en) | 1987-08-31 | 1987-08-31 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62216853A JPS6459843A (en) | 1987-08-31 | 1987-08-31 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6459843A true JPS6459843A (en) | 1989-03-07 |
Family
ID=16694931
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62216853A Pending JPS6459843A (en) | 1987-08-31 | 1987-08-31 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6459843A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4961107A (en) * | 1989-04-03 | 1990-10-02 | Motorola Inc. | Electrically isolated heatsink for single-in-line package |
US5731632A (en) * | 1995-05-16 | 1998-03-24 | Kabushiki Kaisha Toshiba | Semiconductor device having a plastic package |
JP2007175706A (en) * | 2005-12-26 | 2007-07-12 | Toyota Motor Corp | Joining method, solder applying device, and joining member |
-
1987
- 1987-08-31 JP JP62216853A patent/JPS6459843A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4961107A (en) * | 1989-04-03 | 1990-10-02 | Motorola Inc. | Electrically isolated heatsink for single-in-line package |
US5731632A (en) * | 1995-05-16 | 1998-03-24 | Kabushiki Kaisha Toshiba | Semiconductor device having a plastic package |
JP2007175706A (en) * | 2005-12-26 | 2007-07-12 | Toyota Motor Corp | Joining method, solder applying device, and joining member |
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