JPS6459843A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6459843A
JPS6459843A JP62216853A JP21685387A JPS6459843A JP S6459843 A JPS6459843 A JP S6459843A JP 62216853 A JP62216853 A JP 62216853A JP 21685387 A JP21685387 A JP 21685387A JP S6459843 A JPS6459843 A JP S6459843A
Authority
JP
Japan
Prior art keywords
grooves
face
parts
heat
protruding parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62216853A
Other languages
Japanese (ja)
Inventor
Nobutoshi Takebashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP62216853A priority Critical patent/JPS6459843A/en
Publication of JPS6459843A publication Critical patent/JPS6459843A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

PURPOSE:To enhance a heat-dissipating effect by a method wherein first grooves having recessed parts and protruding parts formed in a first material where a semiconductor chip is mounted coincide with second grooves having recessed parts and protruding parts formed in a second material acting as a radiator and these grooves are bonded. CONSTITUTION:A semiconductor chip 1 is mounted on one face of a first material 2; first grooves 3 having recessed parts and protruding parts are formed on the other face. A radiator 6 is formed on one face of a second material 4; second grooves 5 having recessed parts and protruding parts are formed on the other face. The second grooves 5 formed on the other face of the second material 4 are formed in one direction; the second grooves 5 formed on the other face of the second material 4 coincide with the first grooves 3 formed on the other face of the first material 2. At the first material 2 and the second material 4, the recessed parts and the protruding parts formed on the respective other faces of the first grooves 3 and the second grooves 5 coincide with each other, and are fixed by using an adhesive material 7 such as a solder, an adhesive agent or the like. Side-face parts 8 of the grooves are obtained as heat-conducting regions; a bonding area and a heat-conducting area are expanded as a whole; a heat-dissipating effect is thereby enhanced.
JP62216853A 1987-08-31 1987-08-31 Semiconductor device Pending JPS6459843A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62216853A JPS6459843A (en) 1987-08-31 1987-08-31 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62216853A JPS6459843A (en) 1987-08-31 1987-08-31 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6459843A true JPS6459843A (en) 1989-03-07

Family

ID=16694931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62216853A Pending JPS6459843A (en) 1987-08-31 1987-08-31 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6459843A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4961107A (en) * 1989-04-03 1990-10-02 Motorola Inc. Electrically isolated heatsink for single-in-line package
US5731632A (en) * 1995-05-16 1998-03-24 Kabushiki Kaisha Toshiba Semiconductor device having a plastic package
JP2007175706A (en) * 2005-12-26 2007-07-12 Toyota Motor Corp Joining method, solder applying device, and joining member

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4961107A (en) * 1989-04-03 1990-10-02 Motorola Inc. Electrically isolated heatsink for single-in-line package
US5731632A (en) * 1995-05-16 1998-03-24 Kabushiki Kaisha Toshiba Semiconductor device having a plastic package
JP2007175706A (en) * 2005-12-26 2007-07-12 Toyota Motor Corp Joining method, solder applying device, and joining member

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