JPS5556651A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5556651A JPS5556651A JP12939478A JP12939478A JPS5556651A JP S5556651 A JPS5556651 A JP S5556651A JP 12939478 A JP12939478 A JP 12939478A JP 12939478 A JP12939478 A JP 12939478A JP S5556651 A JPS5556651 A JP S5556651A
- Authority
- JP
- Japan
- Prior art keywords
- conductors
- resin
- flanks
- concave portion
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: To prevent the cracks of a semiconductor element and the disconnection of conductors, by fixing the semiconductor element to a base of a concave portion mounted to a radiator plate, and by sealing the whole with resin.
CONSTITUTION: A square cylinder-like concave portion 12 is manufactured to a radiator plate 11 in copper, a semiconductor element 15 that conductors 14 are connected to a Si element piece 13 is fixed to the base with a lead-tin alloy and the whole is sealed with resin 16. The conductors 14 are connected to lead frames 17 inserted and put into the resin 16. According to this constitution, stress to the flanks of the element piece 13 is remarkably moderated because only the components of the little stress of the resin 16 of a small zone partitioned by the concave portion apply to the flanks of the element piece 13 and the flanks of the concave portion 12. When impact force is applied from the outside, the impact force is also lightened at the flanks of the element piece 13 considerably. Thus, the cracks of the semiconductor element are prevented, and the conductors are not disconnected because the uniform, thermal, expansive force of the resin applies to the conductors.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12939478A JPS5556651A (en) | 1978-10-20 | 1978-10-20 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12939478A JPS5556651A (en) | 1978-10-20 | 1978-10-20 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5556651A true JPS5556651A (en) | 1980-04-25 |
Family
ID=15008480
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12939478A Pending JPS5556651A (en) | 1978-10-20 | 1978-10-20 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5556651A (en) |
-
1978
- 1978-10-20 JP JP12939478A patent/JPS5556651A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MY118367A (en) | Thermally reworkable binders for flip-chip devices | |
JPS5556651A (en) | Semiconductor device | |
JPS5627988A (en) | Semiconductor laser device | |
IE822681L (en) | Semiconductor devices with heat-dissipating means | |
JPS5556650A (en) | Semiconductor device | |
JPS5662345A (en) | Load frame and semiconductor device | |
JPS5556649A (en) | Semiconductor device | |
JPS5314561A (en) | Packaging device of semiconductor device | |
JPS6459841A (en) | Semiconductor device | |
JPS5710951A (en) | Semiconductor device | |
JPS5556648A (en) | Semiconductor device | |
JPS53144695A (en) | Semiconductor laser device | |
JPS5333064A (en) | Semiconductor device | |
JPS54578A (en) | Resin seal semiconductor device | |
JPS5521163A (en) | Solar cell device | |
JPS6436055A (en) | Method of sealing electronic component | |
JPS55107251A (en) | Electronic part and its packaging construction | |
GB8503303D0 (en) | Electronic integrated component | |
JPS5595348A (en) | Semiconductor device | |
JPS54111766A (en) | Coupling construction of lead and heat sink in semiconductor device | |
JPS54579A (en) | Resin seal semiconductor device | |
JPS54109381A (en) | Resin mold semiconductor device | |
JPS5394874A (en) | Connecting method for semiconductor device | |
JPS57207357A (en) | Component part holder | |
JPS54158171A (en) | Resin-sealed type semiconductor device |