JPS5556651A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5556651A
JPS5556651A JP12939478A JP12939478A JPS5556651A JP S5556651 A JPS5556651 A JP S5556651A JP 12939478 A JP12939478 A JP 12939478A JP 12939478 A JP12939478 A JP 12939478A JP S5556651 A JPS5556651 A JP S5556651A
Authority
JP
Japan
Prior art keywords
conductors
resin
flanks
concave portion
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12939478A
Other languages
Japanese (ja)
Inventor
Koji Suzuki
Toshio Aoki
Sachie Kusanagi
Hiroshi Mochizuki
Ko Aso
Yayo Yoshida
Takamasa Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12939478A priority Critical patent/JPS5556651A/en
Publication of JPS5556651A publication Critical patent/JPS5556651A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To prevent the cracks of a semiconductor element and the disconnection of conductors, by fixing the semiconductor element to a base of a concave portion mounted to a radiator plate, and by sealing the whole with resin.
CONSTITUTION: A square cylinder-like concave portion 12 is manufactured to a radiator plate 11 in copper, a semiconductor element 15 that conductors 14 are connected to a Si element piece 13 is fixed to the base with a lead-tin alloy and the whole is sealed with resin 16. The conductors 14 are connected to lead frames 17 inserted and put into the resin 16. According to this constitution, stress to the flanks of the element piece 13 is remarkably moderated because only the components of the little stress of the resin 16 of a small zone partitioned by the concave portion apply to the flanks of the element piece 13 and the flanks of the concave portion 12. When impact force is applied from the outside, the impact force is also lightened at the flanks of the element piece 13 considerably. Thus, the cracks of the semiconductor element are prevented, and the conductors are not disconnected because the uniform, thermal, expansive force of the resin applies to the conductors.
COPYRIGHT: (C)1980,JPO&Japio
JP12939478A 1978-10-20 1978-10-20 Semiconductor device Pending JPS5556651A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12939478A JPS5556651A (en) 1978-10-20 1978-10-20 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12939478A JPS5556651A (en) 1978-10-20 1978-10-20 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5556651A true JPS5556651A (en) 1980-04-25

Family

ID=15008480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12939478A Pending JPS5556651A (en) 1978-10-20 1978-10-20 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5556651A (en)

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