JPS5595348A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5595348A JPS5595348A JP206279A JP206279A JPS5595348A JP S5595348 A JPS5595348 A JP S5595348A JP 206279 A JP206279 A JP 206279A JP 206279 A JP206279 A JP 206279A JP S5595348 A JPS5595348 A JP S5595348A
- Authority
- JP
- Japan
- Prior art keywords
- fin
- semiconductor element
- constitution
- back side
- heat radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To prevent breaking of jointed part of semiconductor element and electrode lead, by relaxing stress created when a heat radiation fin is set on the back side of semiconductor element.
CONSTITUTION: After a semiconductor element 1 and an elecrode lead 2-a are connected, a plate type cap 8 of ceramics etc. is bonded on the joining surface with an epoxy resin 5 etc. Then, a heat radiation fin 6 is set on the back side of element with solder 4 etc., and the exposed part of element is sealed with the resin 5. With this constitution, breaking of the jointed part of element and electrode lead due to stress created when the fin is set on, is prevented. And also, as the fin is bonded directly the element, it reduces the heat resistance.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP206279A JPS5910585B2 (en) | 1979-01-10 | 1979-01-10 | Manufacturing method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP206279A JPS5910585B2 (en) | 1979-01-10 | 1979-01-10 | Manufacturing method of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5595348A true JPS5595348A (en) | 1980-07-19 |
JPS5910585B2 JPS5910585B2 (en) | 1984-03-09 |
Family
ID=11518848
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP206279A Expired JPS5910585B2 (en) | 1979-01-10 | 1979-01-10 | Manufacturing method of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5910585B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100261959B1 (en) * | 1996-02-01 | 2000-07-15 | 포만 제프리 엘 | Electronic package with strain relief means and method of making |
-
1979
- 1979-01-10 JP JP206279A patent/JPS5910585B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100261959B1 (en) * | 1996-02-01 | 2000-07-15 | 포만 제프리 엘 | Electronic package with strain relief means and method of making |
Also Published As
Publication number | Publication date |
---|---|
JPS5910585B2 (en) | 1984-03-09 |
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