JPS5595348A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5595348A
JPS5595348A JP206279A JP206279A JPS5595348A JP S5595348 A JPS5595348 A JP S5595348A JP 206279 A JP206279 A JP 206279A JP 206279 A JP206279 A JP 206279A JP S5595348 A JPS5595348 A JP S5595348A
Authority
JP
Japan
Prior art keywords
fin
semiconductor element
constitution
back side
heat radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP206279A
Other languages
Japanese (ja)
Other versions
JPS5910585B2 (en
Inventor
Masanobu Obara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP206279A priority Critical patent/JPS5910585B2/en
Publication of JPS5595348A publication Critical patent/JPS5595348A/en
Publication of JPS5910585B2 publication Critical patent/JPS5910585B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE: To prevent breaking of jointed part of semiconductor element and electrode lead, by relaxing stress created when a heat radiation fin is set on the back side of semiconductor element.
CONSTITUTION: After a semiconductor element 1 and an elecrode lead 2-a are connected, a plate type cap 8 of ceramics etc. is bonded on the joining surface with an epoxy resin 5 etc. Then, a heat radiation fin 6 is set on the back side of element with solder 4 etc., and the exposed part of element is sealed with the resin 5. With this constitution, breaking of the jointed part of element and electrode lead due to stress created when the fin is set on, is prevented. And also, as the fin is bonded directly the element, it reduces the heat resistance.
COPYRIGHT: (C)1980,JPO&Japio
JP206279A 1979-01-10 1979-01-10 Manufacturing method of semiconductor device Expired JPS5910585B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP206279A JPS5910585B2 (en) 1979-01-10 1979-01-10 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP206279A JPS5910585B2 (en) 1979-01-10 1979-01-10 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5595348A true JPS5595348A (en) 1980-07-19
JPS5910585B2 JPS5910585B2 (en) 1984-03-09

Family

ID=11518848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP206279A Expired JPS5910585B2 (en) 1979-01-10 1979-01-10 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5910585B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100261959B1 (en) * 1996-02-01 2000-07-15 포만 제프리 엘 Electronic package with strain relief means and method of making

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100261959B1 (en) * 1996-02-01 2000-07-15 포만 제프리 엘 Electronic package with strain relief means and method of making

Also Published As

Publication number Publication date
JPS5910585B2 (en) 1984-03-09

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