JPS51149782A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS51149782A
JPS51149782A JP7348575A JP7348575A JPS51149782A JP S51149782 A JPS51149782 A JP S51149782A JP 7348575 A JP7348575 A JP 7348575A JP 7348575 A JP7348575 A JP 7348575A JP S51149782 A JPS51149782 A JP S51149782A
Authority
JP
Japan
Prior art keywords
semiconductor device
main surface
header
junction
stress
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7348575A
Other languages
Japanese (ja)
Inventor
Ario Mita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP7348575A priority Critical patent/JPS51149782A/en
Publication of JPS51149782A publication Critical patent/JPS51149782A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

PURPOSE: To prevent the stress which occurs at the bonding time by fixing the main surface near to the junction on the header through the In layer and by connecting the other main surface to the lead with low melting point solder.
COPYRIGHT: (C)1976,JPO&Japio
JP7348575A 1975-06-17 1975-06-17 Semiconductor device Pending JPS51149782A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7348575A JPS51149782A (en) 1975-06-17 1975-06-17 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7348575A JPS51149782A (en) 1975-06-17 1975-06-17 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS51149782A true JPS51149782A (en) 1976-12-22

Family

ID=13519616

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7348575A Pending JPS51149782A (en) 1975-06-17 1975-06-17 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS51149782A (en)

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