JPS5758342A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5758342A JPS5758342A JP55131674A JP13167480A JPS5758342A JP S5758342 A JPS5758342 A JP S5758342A JP 55131674 A JP55131674 A JP 55131674A JP 13167480 A JP13167480 A JP 13167480A JP S5758342 A JPS5758342 A JP S5758342A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- heat sink
- pellet
- boundary
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To stop water tending to impregnate into a resin through is boundary and to prevent the contraction of the resin by forming a groove to surround a pellet on the pellet securing surface of a heat sink. CONSTITUTION:A heat sink 10 has a mounting screw hole 12 at its one end 11, and a semiconductor pellet secured to the upper surface of the other end 13. A groove 17 is formed over the entire width of the heat sink 10 at the boundary position between the one end 11 and the other end 13 of the heat sink 10. A planer ?-shaped groove 18 is formed along the periphery of the other end 13, and the semiconductor pellet securing portion P is surrouned by the grooves 17, 18. In this manner, water tending to impregnate into the resin through the boundary between the heat sink 10 and the resin is stopped via the grooves 17, 18, and the thermal shrinkage of the resin can be prevented by the engagement of the heat sink with the resin, thereby preventing the production of a stress.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55131674A JPS5758342A (en) | 1980-09-24 | 1980-09-24 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55131674A JPS5758342A (en) | 1980-09-24 | 1980-09-24 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5758342A true JPS5758342A (en) | 1982-04-08 |
Family
ID=15063569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55131674A Pending JPS5758342A (en) | 1980-09-24 | 1980-09-24 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5758342A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0102988A1 (en) * | 1982-03-08 | 1984-03-21 | Motorola Inc | Integrated circuit lead frame. |
JPS61251156A (en) * | 1985-04-30 | 1986-11-08 | Nippon Denso Co Ltd | Semiconductor device |
CN102637674A (en) * | 2012-05-14 | 2012-08-15 | 宜兴市东晨电子科技有限公司 | TO247 lead frame |
-
1980
- 1980-09-24 JP JP55131674A patent/JPS5758342A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0102988A1 (en) * | 1982-03-08 | 1984-03-21 | Motorola Inc | Integrated circuit lead frame. |
JPS61251156A (en) * | 1985-04-30 | 1986-11-08 | Nippon Denso Co Ltd | Semiconductor device |
JPH0363810B2 (en) * | 1985-04-30 | 1991-10-02 | Nippon Denso Co | |
CN102637674A (en) * | 2012-05-14 | 2012-08-15 | 宜兴市东晨电子科技有限公司 | TO247 lead frame |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5745959A (en) | Resin-sealed semiconductor device | |
JPS5758342A (en) | Semiconductor device | |
JPS5381073A (en) | Oroduction of resin seal type semiconductor device and lead frame used the same | |
JPS57211761A (en) | Semiconductor device | |
JPS5345978A (en) | Insulated-gate-protective semiconductor device | |
JPS55160449A (en) | Semiconductor device | |
SE8501678D0 (en) | THE FLOW STOP FOR SANITARY OBJECTS | |
JPS5732658A (en) | Resin sealing type semiconductor device with radiator plate | |
JPS57197844A (en) | Semiconductor device | |
SE396302B (en) | KIT FOR MOLDING METAL IN A KOKILL WITH SINK BOX, WHERE THE METAL SURFACE IS PROVIDED WITH A HEAT RADIATION PREVENTION LAYER AND A DEVICE FOR PERFORMING THE KIT | |
JPS5745960A (en) | Resin-sealed semiconductor device | |
JPS6449247A (en) | Semiconductor light emitting device | |
JPS5639921A (en) | Rail structure for automobile slide door | |
ES340181A1 (en) | Improvements in or relating to Self-Locking Screw Threaded Fastening Devices | |
JPS5795641A (en) | Semiconductor device | |
JPS57188857A (en) | Semiconductor device | |
JPS55130158A (en) | Semiconductor pellet | |
JPS54128279A (en) | Heat sink for resin-sealed semiconductor device and its manufacture | |
JPS5570079A (en) | Luminous diode | |
JPS5484476A (en) | Semiconductor pellet with improved juncture | |
JPS5764954A (en) | Plastic molded type semiconductor device | |
JPS53143169A (en) | Resin molded semiconductor device | |
JPS57135401A (en) | Parts block molding method to substrate | |
JPS55111233A (en) | Imbedding of screw-clamping anchor for non-metal molding such as plastic | |
JPS52115172A (en) | Semiconductor device |