JPS57197844A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57197844A
JPS57197844A JP8230881A JP8230881A JPS57197844A JP S57197844 A JPS57197844 A JP S57197844A JP 8230881 A JP8230881 A JP 8230881A JP 8230881 A JP8230881 A JP 8230881A JP S57197844 A JPS57197844 A JP S57197844A
Authority
JP
Japan
Prior art keywords
sealing region
resin sealing
displacement
lead frame
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8230881A
Other languages
Japanese (ja)
Inventor
Kaoru Sonobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8230881A priority Critical patent/JPS57197844A/en
Publication of JPS57197844A publication Critical patent/JPS57197844A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To measure the displacement of a resin sealing region of a lead frame after sealed with resin due to the difference of the displacement of a positioning pin and the thermal expansion of the lead frame by forming a thin deep groove onto the extension of the external-form edge end of the resin sealing region. CONSTITUTION:The grooves, 4, 5, 0.1mm. wide and 0.1mm. deep are shaped onto the external-form extension of the resin sealing region on design of the lead frame 1 and a mold sealing die. Accordingly, the amount of displacement in the longitudinal and lateral directions of the resin sealing region after sealed by a mold.
JP8230881A 1981-05-29 1981-05-29 Semiconductor device Pending JPS57197844A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8230881A JPS57197844A (en) 1981-05-29 1981-05-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8230881A JPS57197844A (en) 1981-05-29 1981-05-29 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS57197844A true JPS57197844A (en) 1982-12-04

Family

ID=13770922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8230881A Pending JPS57197844A (en) 1981-05-29 1981-05-29 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57197844A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61131849U (en) * 1985-02-06 1986-08-18
JPS61162063U (en) * 1985-03-28 1986-10-07
JPS6240845U (en) * 1985-08-29 1987-03-11
JPS6265848U (en) * 1985-10-16 1987-04-23
JPS62160553U (en) * 1986-04-02 1987-10-13

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61131849U (en) * 1985-02-06 1986-08-18
JPS61162063U (en) * 1985-03-28 1986-10-07
JPS6240845U (en) * 1985-08-29 1987-03-11
JPS6265848U (en) * 1985-10-16 1987-04-23
JPS62160553U (en) * 1986-04-02 1987-10-13

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