JPS5530809A - Producing method of resin mold type semiconductor device - Google Patents

Producing method of resin mold type semiconductor device

Info

Publication number
JPS5530809A
JPS5530809A JP10272478A JP10272478A JPS5530809A JP S5530809 A JPS5530809 A JP S5530809A JP 10272478 A JP10272478 A JP 10272478A JP 10272478 A JP10272478 A JP 10272478A JP S5530809 A JPS5530809 A JP S5530809A
Authority
JP
Japan
Prior art keywords
package
fixture
semiconductor device
type semiconductor
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10272478A
Other languages
Japanese (ja)
Inventor
Takehisa Hamano
Masaru Tsunetomo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10272478A priority Critical patent/JPS5530809A/en
Publication of JPS5530809A publication Critical patent/JPS5530809A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To rationalize sealing work without using a mold, etc. by clipping a package with a springy fixture to be fixed.
CONSTITUTION: A package 10 of a desired shape is formed of resin by deviding into a base 10A and a cap 10B; the base 10A is combined with a lead frame; a semiconductor chip is mounted on a tab 12 of the lead frame: the cap 10B is placed for assembling; and, before or after the pouring operation when resin is poured into the package 10 through a port, the package is longitudinally clipped and fixed with a springy fixture 20, as shown in the figures, for sealing. This structure will do away with a transfer-mold press or a high precision mold to rationalize opertion. The suitable material for the fixture 20 are steel, stainless steel, phosphorus bronze, nickel silver, heat-resist steel, etc.
COPYRIGHT: (C)1980,JPO&Japio
JP10272478A 1978-08-25 1978-08-25 Producing method of resin mold type semiconductor device Pending JPS5530809A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10272478A JPS5530809A (en) 1978-08-25 1978-08-25 Producing method of resin mold type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10272478A JPS5530809A (en) 1978-08-25 1978-08-25 Producing method of resin mold type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5530809A true JPS5530809A (en) 1980-03-04

Family

ID=14335207

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10272478A Pending JPS5530809A (en) 1978-08-25 1978-08-25 Producing method of resin mold type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5530809A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5106785A (en) * 1989-01-16 1992-04-21 Siemens Aktiengesellschaft Method for encapsulating electronic components or assemblies using a thermoplastic encapsulant

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5106785A (en) * 1989-01-16 1992-04-21 Siemens Aktiengesellschaft Method for encapsulating electronic components or assemblies using a thermoplastic encapsulant
US5376824A (en) * 1989-01-16 1994-12-27 Siemens Aktiengesellschaft Method and an encapsulation for encapsulating electrical or electronic components or assemblies

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