JPS54162468A - Manufacture for semiconductor device - Google Patents

Manufacture for semiconductor device

Info

Publication number
JPS54162468A
JPS54162468A JP7193578A JP7193578A JPS54162468A JP S54162468 A JPS54162468 A JP S54162468A JP 7193578 A JP7193578 A JP 7193578A JP 7193578 A JP7193578 A JP 7193578A JP S54162468 A JPS54162468 A JP S54162468A
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
tip
lead
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7193578A
Other languages
Japanese (ja)
Other versions
JPS6227545B2 (en
Inventor
Katsuyoshi Miyairi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7193578A priority Critical patent/JPS54162468A/en
Publication of JPS54162468A publication Critical patent/JPS54162468A/en
Publication of JPS6227545B2 publication Critical patent/JPS6227545B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To establish the semiconductor device high in reliability, by providing the plating protection film at the entire surface other than the tip of external leads.
CONSTITUTION: In forming the resin sealing part 2 of the semiconductor device through the use of lead frame 1, it is normal that the resin 3 is leaked between the upper and lower mold and reached to the tie-bar 4. Thus, after making resin-sealing by using the same punch, the tie-bar 4 being unnecessary is cut off and the resin 3 leaked is removed with cut-off, and the tip 6 of the external leads is left as it is. Further, with this condition, electrolytic tin plating is made to the entire lead frame 1, the device is separated by cutting off the external leads 5 at the position of the external lead tip 6, and the leads 5 are folded and molded. Thus, no bending of lead is caused and anti-corrosive performance can be increased.
COPYRIGHT: (C)1979,JPO&Japio
JP7193578A 1978-06-13 1978-06-13 Manufacture for semiconductor device Granted JPS54162468A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7193578A JPS54162468A (en) 1978-06-13 1978-06-13 Manufacture for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7193578A JPS54162468A (en) 1978-06-13 1978-06-13 Manufacture for semiconductor device

Publications (2)

Publication Number Publication Date
JPS54162468A true JPS54162468A (en) 1979-12-24
JPS6227545B2 JPS6227545B2 (en) 1987-06-15

Family

ID=13474857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7193578A Granted JPS54162468A (en) 1978-06-13 1978-06-13 Manufacture for semiconductor device

Country Status (1)

Country Link
JP (1) JPS54162468A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4914086A (en) * 1972-05-16 1974-02-07
JPS5332675A (en) * 1976-09-07 1978-03-28 Matsushita Electronics Corp Production of semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4914086A (en) * 1972-05-16 1974-02-07
JPS5332675A (en) * 1976-09-07 1978-03-28 Matsushita Electronics Corp Production of semiconductor device

Also Published As

Publication number Publication date
JPS6227545B2 (en) 1987-06-15

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