JPS54107261A - Production of resin seal-type semiconductor device and lead frame used in this production - Google Patents
Production of resin seal-type semiconductor device and lead frame used in this productionInfo
- Publication number
- JPS54107261A JPS54107261A JP1342178A JP1342178A JPS54107261A JP S54107261 A JPS54107261 A JP S54107261A JP 1342178 A JP1342178 A JP 1342178A JP 1342178 A JP1342178 A JP 1342178A JP S54107261 A JPS54107261 A JP S54107261A
- Authority
- JP
- Japan
- Prior art keywords
- production
- lead frame
- semiconductor device
- protrusion piece
- mold region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To perform efficiently the treatment work of a semiconductor device by making it easy to separate the contact part between the frame part of a lead frame and a mold region.
CONSTITUTION: Protrusion piece 8 which is protruded from frames 5 and 6 of lead frame 1 to mold region 10 is provided, and the thickness of the part where this protrusion piece contacts with the mold region is made smaller than other parts. Dam breaking and lead separation are so perfromed that the semiconductor device may link with the lead frame only in this protrusion piece after molding, and the protrusion piece is cut off in the thin part contacting with the mold region after characteristic inspection, selection, marking, etc., thereby producing individual semiconductor devices.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1342178A JPS54107261A (en) | 1978-02-10 | 1978-02-10 | Production of resin seal-type semiconductor device and lead frame used in this production |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1342178A JPS54107261A (en) | 1978-02-10 | 1978-02-10 | Production of resin seal-type semiconductor device and lead frame used in this production |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8177784A Division JPS6041247A (en) | 1984-04-25 | 1984-04-25 | Manufacture of resin-sealed semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54107261A true JPS54107261A (en) | 1979-08-22 |
Family
ID=11832659
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1342178A Pending JPS54107261A (en) | 1978-02-10 | 1978-02-10 | Production of resin seal-type semiconductor device and lead frame used in this production |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54107261A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62169334A (en) * | 1986-12-24 | 1987-07-25 | Hitachi Ltd | Assembling method of semiconductor device |
JPS63124754U (en) * | 1987-02-04 | 1988-08-15 | ||
KR20020078769A (en) * | 2001-04-10 | 2002-10-19 | (주)오토엠아이티 | A method for manufacturing of package |
-
1978
- 1978-02-10 JP JP1342178A patent/JPS54107261A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62169334A (en) * | 1986-12-24 | 1987-07-25 | Hitachi Ltd | Assembling method of semiconductor device |
JPS63124754U (en) * | 1987-02-04 | 1988-08-15 | ||
KR20020078769A (en) * | 2001-04-10 | 2002-10-19 | (주)오토엠아이티 | A method for manufacturing of package |
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