JPS54107261A - Production of resin seal-type semiconductor device and lead frame used in this production - Google Patents

Production of resin seal-type semiconductor device and lead frame used in this production

Info

Publication number
JPS54107261A
JPS54107261A JP1342178A JP1342178A JPS54107261A JP S54107261 A JPS54107261 A JP S54107261A JP 1342178 A JP1342178 A JP 1342178A JP 1342178 A JP1342178 A JP 1342178A JP S54107261 A JPS54107261 A JP S54107261A
Authority
JP
Japan
Prior art keywords
production
lead frame
semiconductor device
protrusion piece
mold region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1342178A
Other languages
Japanese (ja)
Inventor
Hajime Murakami
Yuji Sano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1342178A priority Critical patent/JPS54107261A/en
Publication of JPS54107261A publication Critical patent/JPS54107261A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To perform efficiently the treatment work of a semiconductor device by making it easy to separate the contact part between the frame part of a lead frame and a mold region.
CONSTITUTION: Protrusion piece 8 which is protruded from frames 5 and 6 of lead frame 1 to mold region 10 is provided, and the thickness of the part where this protrusion piece contacts with the mold region is made smaller than other parts. Dam breaking and lead separation are so perfromed that the semiconductor device may link with the lead frame only in this protrusion piece after molding, and the protrusion piece is cut off in the thin part contacting with the mold region after characteristic inspection, selection, marking, etc., thereby producing individual semiconductor devices.
COPYRIGHT: (C)1979,JPO&Japio
JP1342178A 1978-02-10 1978-02-10 Production of resin seal-type semiconductor device and lead frame used in this production Pending JPS54107261A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1342178A JPS54107261A (en) 1978-02-10 1978-02-10 Production of resin seal-type semiconductor device and lead frame used in this production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1342178A JPS54107261A (en) 1978-02-10 1978-02-10 Production of resin seal-type semiconductor device and lead frame used in this production

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP8177784A Division JPS6041247A (en) 1984-04-25 1984-04-25 Manufacture of resin-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS54107261A true JPS54107261A (en) 1979-08-22

Family

ID=11832659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1342178A Pending JPS54107261A (en) 1978-02-10 1978-02-10 Production of resin seal-type semiconductor device and lead frame used in this production

Country Status (1)

Country Link
JP (1) JPS54107261A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169334A (en) * 1986-12-24 1987-07-25 Hitachi Ltd Assembling method of semiconductor device
JPS63124754U (en) * 1987-02-04 1988-08-15
KR20020078769A (en) * 2001-04-10 2002-10-19 (주)오토엠아이티 A method for manufacturing of package

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169334A (en) * 1986-12-24 1987-07-25 Hitachi Ltd Assembling method of semiconductor device
JPS63124754U (en) * 1987-02-04 1988-08-15
KR20020078769A (en) * 2001-04-10 2002-10-19 (주)오토엠아이티 A method for manufacturing of package

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