JPS53104171A - Mold for semiconductor device - Google Patents

Mold for semiconductor device

Info

Publication number
JPS53104171A
JPS53104171A JP1820177A JP1820177A JPS53104171A JP S53104171 A JPS53104171 A JP S53104171A JP 1820177 A JP1820177 A JP 1820177A JP 1820177 A JP1820177 A JP 1820177A JP S53104171 A JPS53104171 A JP S53104171A
Authority
JP
Japan
Prior art keywords
mold
base
semiconductor device
respect
valley
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1820177A
Other languages
Japanese (ja)
Inventor
Haruo Kugimiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1820177A priority Critical patent/JPS53104171A/en
Publication of JPS53104171A publication Critical patent/JPS53104171A/en
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To prevent a valley of the mold by holding the base between upper and lower molds while contacting with the base in respect to the base part of the external lead and isolating one mold at least from the lead frame face in respect to the greater part of the tip side from the base.
COPYRIGHT: (C)1978,JPO&Japio
JP1820177A 1977-02-23 1977-02-23 Mold for semiconductor device Pending JPS53104171A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1820177A JPS53104171A (en) 1977-02-23 1977-02-23 Mold for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1820177A JPS53104171A (en) 1977-02-23 1977-02-23 Mold for semiconductor device

Publications (1)

Publication Number Publication Date
JPS53104171A true JPS53104171A (en) 1978-09-11

Family

ID=11965015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1820177A Pending JPS53104171A (en) 1977-02-23 1977-02-23 Mold for semiconductor device

Country Status (1)

Country Link
JP (1) JPS53104171A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57202745A (en) * 1981-06-05 1982-12-11 Yamagata Nippon Denki Kk Manufacture of semiconductor device
JPS60220922A (en) * 1985-04-01 1985-11-05 日立エーアイシー株式会社 Chip type capacitor
JPH0497535A (en) * 1990-08-16 1992-03-30 Nec Yamagata Ltd Manufacture of semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57202745A (en) * 1981-06-05 1982-12-11 Yamagata Nippon Denki Kk Manufacture of semiconductor device
JPS60220922A (en) * 1985-04-01 1985-11-05 日立エーアイシー株式会社 Chip type capacitor
JPH0330977B2 (en) * 1985-04-01 1991-05-01 Hitachi Ee Ai Shii Kk
JPH0497535A (en) * 1990-08-16 1992-03-30 Nec Yamagata Ltd Manufacture of semiconductor device

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