JPH0330977B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a chip type capacitor mounted on a printed circuit board. In particular, it relates to chip-type capacitors that are molded and packaged with insulating resin.

2. Description of the Related Art The structure of a conventional chip-type capacitor lead will be described with reference to FIGS. 2 to 5.

Figure 2 shows the capacitor element 1 and the anode lead 3 connected to the anode lead 2 led out from the element.
and the cathode extraction lead 4 are bent into a crank shape, and the tips 3A, 4 of the extraction leads 3, 4 are bent parallel to the bottom surface 6 of the molded resin 5 in opposite directions.
A is exposed, and FIG. 3 shows that the anode lead 7 and the cathode lead 8 are bent into a U-shape inside and outside the exterior insulating resin 5, and are bent along the side walls 9 and 10 of the resin. hanging down, its tip 7A,
8A shows the case where the resin is drawn out in opposite directions along the bottom surface of the resin, and in FIG. Instead, it is exposed from the middle part and drawn out in opposite directions. Since these lead-out leads all protrude from the resin 5, the size of the capacitor becomes large, which tends to cause problems when automatically supplying the capacitor.

In the chip type capacitor shown in FIG. Bottom 6
Since the capacitor is folded into the cap, the overall size of the capacitor is more compact than that shown in FIGS. 2 to 4.

Problems to be Solved by the Invention Conventional chip-type capacitors are
On the other hand, even in the case shown in FIG. 5, where the anode and cathode drawer leads 5 protruding from the resin 5 protrude from the side walls 9 and 10 of the resin 5, the attachment rate by the automatic attachment machine may be reduced. , the demand for miniaturization had not yet been met.

Means for Solving the Problems The present invention aims to miniaturize chip-type capacitors and facilitate automatic mounting, and has a structure in which the lead-out leads do not protrude from the side wall of the exterior resin. According to the present invention, when the protruding part of the drawer lead connected to the capacitor element is bent to the wall surface of the exterior resin, the width of the lower insulating resin is This is a chip type capacitor in which the width of the insulating resin is made small so that the outer surface of the lead-out lead is approximately flush with the outer wall of the outer insulating resin.

Example Example 2 of the present invention will be described based on the drawings.
0 is a tantalum capacitor element, and a cathode lead 21 is mechanically and electrically fixed to the circumferential surface of the element 20. An anode lead 23 is led out from the element 20, and the anode lead 23 is welded. The anode and cathode lead leads 21 and 23 are arranged on the same plane. This plane part becomes the parting line 24 of the upper mold and lower mold when molding the resin. When the capacitor element 20 is molded with resin, it becomes as shown in FIG. When performing this molding, the width b of the outer wall 29 of the lower insulating resin 26 is set relative to the width B of the outer wall 24 of the upper insulating resin 25, using the boundary line 24 from which the drawer leads 21 and 23 are drawn as a boundary. It is necessary to make it smaller.

The molded capacitor is then bent along the lower resin side walls 27 and 28 and along the bottom surface, so that the outer surfaces 21B and 23B of the leads are almost flush with the resin outer wall 29, and the A chip type capacitor 40 having a structure as shown in FIG. 8 is obtained. Another embodiment will be described with reference to FIG. 9. The figure shows a bottom view, and a groove 31 having a width A wider than the width a of the lead-out leads 21 and 23 is formed in the resin side wall portions 27 and 28. Keep this groove 31
If the leads 21 and 23 are bent and stored within the resin side walls 27 and 28, the leads 21 and 23 will fit within the resin side walls 27 and 28.
In addition, although the case of a solid electrolytic capacitor was explained as an example, it can be applied to any capacitor.

Effects of the Invention The chip-type capacitor of the present invention has improved reliability in automatic mounting on a printed circuit board, and has also become smaller than conventional capacitors.

[Brief explanation of drawings]

Fig. 1 is a perspective view of the present invention, Figs. 2 to 5 are cross-sectional views of the conventional device, Fig. 6 is a front view of the element of the present invention with a drawer lead attached, and Fig. 7 is a cross-section of the device molded with resin. FIG. 8 is a cross-sectional view of a bent lead-out lead, and FIG. 9 is a bottom view of another embodiment. In the drawings, 20: capacitor element, 21,
23: Drawer lead, 24: Boundary line, 25: Upper resin, 26: Lower resin, 27, 28: Side wall portion of lower resin.

Claims (1)

[Scope of Claims] 1. In a chip-type capacitor in which the protruding part of the drawer lead connected to the capacitor element is bent along the wall surface of the outer insulating resin, the upper side is defined by the drawer lead protruding from the outer insulating resin as the boundary line. A chip type capacitor characterized by having a lower insulating resin width smaller than that of the insulating resin width. 2. The chip type capacitor according to claim 1, wherein the boundary line is a parting line. 3. The chip type capacitor according to claim 1, wherein the outer surface of the lead-out lead is provided so as to be substantially flush with the outer wall of the exterior insulating resin. 4. The chip type capacitor according to claim 1, wherein a groove for a lead is provided in the side wall of the lower insulating resin.