JPS61202412A - Chip-like electronic component - Google Patents
Chip-like electronic componentInfo
- Publication number
- JPS61202412A JPS61202412A JP4256185A JP4256185A JPS61202412A JP S61202412 A JPS61202412 A JP S61202412A JP 4256185 A JP4256185 A JP 4256185A JP 4256185 A JP4256185 A JP 4256185A JP S61202412 A JPS61202412 A JP S61202412A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- electronic component
- molded body
- resin molded
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、各種電子機器に用いられるチップ状電子部品
に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to chip-shaped electronic components used in various electronic devices.
（従来の技術）
従来のチップ状電子部品は第２図に示すような構造にな
っている。同図において、１０は樹脂成形体であり、金
属板端子１１ａ、ｌｌｂの一端と、これに各々電気的に
接続されたコンデンサ、コイル等の回路素子（図示せず
）を封止している。金属板端子１１ａ、ｌｌｂの他端は
各々樹脂成形体１０の外面に沿って曲げられ、外部端子
となっている。(Prior Art) A conventional chip-shaped electronic component has a structure as shown in FIG. In the figure, 10 is a resin molded body, which seals one end of metal plate terminals 11a and 11b and circuit elements (not shown) such as a capacitor and a coil electrically connected thereto. The other ends of the metal plate terminals 11a and llb are each bent along the outer surface of the resin molded body 10 to serve as external terminals.
（発明が解決しようとする問題点）
従来の構成のチップ状電子部品では、外部端子を形成す
るための金属板端子の曲げ加工時に樹脂との封止境界部
近傍の曲げ角度が鋭角になり、この曲げ部に亀裂等が発
生し１機械的強度が劣化する。このようなチップ状電子
部品を回路基板に実装した場合、外部からの機械的およ
び熱的衝撃により曲げ部が破断するという欠点を有して
いた。(Problems to be Solved by the Invention) In a chip-shaped electronic component having a conventional configuration, when bending a metal plate terminal to form an external terminal, the bending angle near the sealing boundary with the resin becomes an acute angle. Cracks and the like occur in this bent portion, and the mechanical strength deteriorates. When such a chip-shaped electronic component is mounted on a circuit board, it has a disadvantage that the bent portion breaks due to external mechanical and thermal shocks.
また、上記問題の発生を防止するため、封止境界部の曲
げ部に適度な曲げ半径が得られるような加工方法がとら
れるが、この加工方法は複雑で機械化が困戴であり、ま
た曲げ半径のばらつきが大きいなどの問題を有していた
。In addition, in order to prevent the above problem from occurring, a processing method is used to obtain an appropriate bending radius at the bent part of the sealing boundary, but this processing method is complicated and difficult to mechanize, and the bending There were problems such as large variations in radius.
本発明の目的は、上記問題点を除去し、複雑な加工方法
を必要とすることなく、金属板端子の曲げ加工ができる
チップ状電子部品を提供することである。SUMMARY OF THE INVENTION An object of the present invention is to provide a chip-shaped electronic component that eliminates the above-mentioned problems and allows bending of metal plate terminals without requiring complicated processing methods.
（問題点を解決するための手段）
本発明のチップ状電子部品は、樹脂成形体の両端に少な
くとも１箇所の突起を設け、金属板端子を、前記突起を
介し樹脂成形体の外面に沿って曲げて外部端子とするも
のである。(Means for Solving the Problems) The chip-shaped electronic component of the present invention is provided with at least one protrusion at both ends of a resin molded body, and a metal plate terminal is inserted along the outer surface of the resin molded body through the protrusion. It is bent to form an external terminal.
（作 用）
本発明による。金属板端子を樹脂成形体に設けた突起を
介して曲げることにより、樹脂成形体との封止境界部近
傍の曲げ部に、前記突起に応じた曲げ半径をもたせるこ
とができ、したがって前記曲げ部に亀裂等が発生するの
を防止することができる。(Function) According to the present invention. By bending the metal plate terminal through a protrusion provided on the resin molded body, the bent portion near the sealing boundary with the resin molded body can have a bending radius corresponding to the protrusion, and therefore the bent portion It is possible to prevent cracks, etc. from occurring in the
（実施例） 本発明の一実施例を第１図に基づいて説明する。(Example) An embodiment of the present invention will be described based on FIG.
同図は本発明のチップ状電子部品の斜視図であり、１は
樹脂成形体であり、金属板端子２ａ、２ｂの一端と、こ
れに各々電気的に接続されたコンデンサ、コイル等の回
路素子（図示せず）を封止している。This figure is a perspective view of a chip-shaped electronic component of the present invention, in which 1 is a resin molded body, one end of metal plate terminals 2a and 2b, and circuit elements such as capacitors and coils electrically connected to these terminals. (not shown) is sealed.
３ａ 、 ３ｂは樹脂成形体１に設けた突起であり、金
属板端子２ａ 、 ２ｂの幅全体に接触するように設け
である。金属板端子２ａ 、 ２ｂの他端は突起３ａ、
３ｂを介し樹脂成形体１の外面に沿って曲げ外部端子と
している。このような構成よりなるチップ状電子部品は
、金属板端子２ａ 、 ２ｂが突起３ａ 、 ３ｂを介
して曲げられるため、樹脂成形体から導出した近傍の金
属板端子２ａ、２ｂの曲げ部に突起３ａ 、 ３ｂに応
じた曲げ半径が形成でき、その結果１曲げ部には亀裂の
発生を防止することができる。3a and 3b are protrusions provided on the resin molded body 1, and are provided so as to contact the entire width of the metal plate terminals 2a and 2b. The other ends of the metal plate terminals 2a and 2b have protrusions 3a,
3b is bent along the outer surface of the resin molded body 1 to form an external terminal. In the chip-shaped electronic component having such a configuration, since the metal plate terminals 2a, 2b are bent via the protrusions 3a, 3b, the protrusions 3a are formed on the bent portions of the metal plate terminals 2a, 2b led out from the resin molded body. , 3b can be formed, and as a result, it is possible to prevent cracks from forming in the first bent part.
（発明の効果）
本発明によれば、従来のような複雑な加工工程を必要と
せず機械化が容易にでき１曲げ部の亀裂の発生が防止で
き、曲げ半径のばらつきを小さくでき１歩留りの向上が
図れる等の種々の効果がある。(Effects of the Invention) According to the present invention, it is possible to easily mechanize without requiring complicated processing steps as in the past, prevent cracks from occurring at one bending part, reduce variations in bending radius, and improve yield. There are various effects such as the ability to achieve
第１図は本発明の一実施例によるチップ状電子部品の斜
視図、第２図は従来のチップ状電子部品の斜視図である
。
１．１０−・・樹脂成形体、２ａ、２ｂ、ｌｌａ、ｌｌ
ｂ −金属板端子、３ａ 、 ３ｂ・・・突起。FIG. 1 is a perspective view of a chip-shaped electronic component according to an embodiment of the present invention, and FIG. 2 is a perspective view of a conventional chip-shaped electronic component. 1.10--Resin molded body, 2a, 2b, lla, ll
b - Metal plate terminals, 3a, 3b... protrusions.
Claims (1)
れた回路素子とが樹脂成形体で封止一体化され、前記樹
脂成形体の両端に少なくとも１箇所の突起が設けられ、
前記金属板端子の他端を、前記突起を覆って、前記樹脂
成形体の外面に沿って曲げ、外部端子としたことを特徴
とするチップ状電子部品。One end of a pair of metal plate terminals and a circuit element electrically connected to each end are sealed and integrated with a resin molded body, and at least one protrusion is provided at both ends of the resin molded body,
A chip-shaped electronic component characterized in that the other end of the metal plate terminal is bent to cover the protrusion and along the outer surface of the resin molded body to form an external terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4256185A JPS61202412A (en) | 1985-03-06 | 1985-03-06 | Chip-like electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4256185A JPS61202412A (en) | 1985-03-06 | 1985-03-06 | Chip-like electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61202412A true JPS61202412A (en) | 1986-09-08 |
Family
ID=12639456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4256185A Pending JPS61202412A (en) | 1985-03-06 | 1985-03-06 | Chip-like electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61202412A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60220922A (en) * | 1985-04-01 | 1985-11-05 | 日立エーアイシー株式会社 | Chip type capacitor |
-
1985
- 1985-03-06 JP JP4256185A patent/JPS61202412A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60220922A (en) * | 1985-04-01 | 1985-11-05 | 日立エーアイシー株式会社 | Chip type capacitor |
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