JPH0517870Y2 - - Google Patents

Description

[Detailed explanation of the idea] [Industrial application field]

The present invention relates to an electronic component in which a ceramic body is covered with an insulating sheath.

[Conventional technology]

Conventionally, as this type of electronic component, electrodes are formed on both opposing principal surfaces of a ceramic body.
One end of the plate-shaped lead terminal is connected to the electrode, and an insulating sheath made of moisture-resistant and insulating resin is molded around the ceramic body, and from this insulating sheath, the lead terminal is It is known that the other end is derived. The structure of such an insulated exterior electronic component will be explained with reference to FIG. 4. Electrodes 7, 7 are formed by printing on both main surfaces of a ceramic body 8 made of dielectric ceramic or the like. One ends of the lead terminals 2, 3 are conductively fixed to the electrodes 7, 7 with solder or the like, and the other ends of the lead terminals 2, 3 are led out in opposite directions. Then, the ceramic body 8 is covered with an insulating sheathing body 9 formed by molding or the like, and the lead terminals 2,
The other end of the insulating sheath 9 is bent so as to be attached to the end faces 10, 10 and the bottom face 11 of the insulating sheath 9. In this case, the portions of the lead terminal wires 2, 3 led out from the insulating sheath 9 (hereinafter referred to as "electrode pads 4, 5") are symmetrical to each other, and the bases of the electrode pads 4, 5 are insulated. One lead terminal 3 is appropriately bent inside the insulating sheathing body 9 to adjust the position where it is led out from the insulating sheathing body 4 so that it is led out from the same position on the opposing end faces 10, 10 of the sheathing body 4. ing. Here, one of the reasons why the two electrode pads 4 and 5 must be symmetrical on both end surfaces 10 and 10 of the insulating sheath 9 is to facilitate the production of a resin mold for the insulating sheath 9. Second, when the insulated exterior electronic component is mounted on a printed circuit board and soldered, the surface tension of the solder generated on the two electrode pads is balanced with each other.
This is to prevent the mounting position of the electronic component from shifting or from standing up on one end side.

[Problem that the invention is trying to solve]

However, in the insulated exterior electronic component having the above structure, in order to make the lead-out positions of the electrode pads 4 and 5 from both surfaces 10 and 10 of the insulating exterior body 9 to be at the same corresponding positions, one lead terminal 2 must be It must be longer than the other lead terminal 3, and each must be bent into a different shape. Therefore, each of the lead terminals 2 and 3 must undergo a separate bending process using a different press die. Further, by bending the lead terminal 2 in a complicated manner within the insulating exterior body 9, the inductance component of the electronic component increases, and when the insulated exterior electronic component is used in a high frequency circuit, there is a problem that desired circuit characteristics cannot be obtained. It was hot. An object of the present invention is to provide an insulated exterior electronic component that can solve the above problems.

[Means to solve the problem]

The present invention proposes the following means to solve the above problem. That is, a ceramic body 8 having electrodes 7, 7 on both main surfaces, an insulating exterior body 9 formed to cover the ceramic body 8, and an electrode 7 of the ceramic body 8 on one end side. . In the insulated exterior electronic component having the lead terminals 2 and 3, the main surface of the ceramic body 8 on which the electrodes 7 and 7 are formed is inclined with respect to the end surfaces 10 and 10 of the insulating exterior body 9. This is an insulated exterior electronic component characterized in that a ceramic body 8 is embedded in an insulating exterior body 9. Furthermore, in such an edge exterior electronic component, the lead terminals 2 and 3 are bent at an acute angle with respect to the main surface of the ceramic body 8 on the base side fixed to the electrodes 7 and 7, and are parallel to each other. ,
We also propose an insulated exterior electronic component characterized in that the base side thereof is embedded in an insulated exterior body 9.

[Effect]

In the insulating exterior electronic component of the present invention, the lead terminals 2 are connected to both sides of the ceramic body 8 which is oriented obliquely to the end faces 10, 10 of the insulating exterior body 9.
3 can be led out in a direction perpendicular to both end surfaces 10, 10 of the insulating exterior body 9 and on extensions of each other. For this reason, one or both lead terminals 2, 3 are bent inside the insulating sheath 9, and the electrode pads 4, 5 are connected from the end faces 10, 10 of the insulating sheath 9.
There is no need to adjust the derivation position. Therefore, the electrode pads 4 and 5 can be formed by making both the lead terminals 2 and 3 equal in length and bending them in the same way. As a result, lead terminal 2,
This makes it possible to reduce the bending process in step 3 and suppress the inductance component. In addition, in the case of an insulated exterior electronic component in which the base side of the lead terminals 2, 3 fixed to the electrodes 7, 7 is bent at an acute angle with respect to the main surface of the ceramic body 8, heating and cooling such as a heat cycle test may be performed. When repeated, the thermal stress caused by the difference in thermal expansion between the insulating sheath 9 and the ceramic body 8 is alleviated by the elasticity of the base side of the lead terminals 2 and 3, and the ceramic body 8 is heated inside the insulating sheath 9. Also, the lead terminals 2, 3 and the insulating sheathing body 9 are no longer separated and misaligned.

【Example】

Next, an embodiment of the present invention will be described below with reference to the drawings. 1 and 2 are drawings showing an embodiment in which the present invention is applied to a ceramic capacitor. In these drawings, reference numeral 8 denotes a ceramic body formed of a disk-shaped ceramic derivative for use in a capacitor. The shape of the illustrated ceramic body 8 is a disk shape, but it goes without saying that it may also be a square plate shape, a columnar shape, or a cylindrical shape. Opposite electrodes 7, 7 are formed on both main surfaces of this ceramic body 8, and one ends of a pair of lead terminals 2, 3 formed by punching out a thin metal plate are soldered to these electrodes 7, 7. connected by. Here, the lead terminals 2 and 3 are connected to the electrodes 7 and 3.
One end side soldered to 7 is bent at an obtuse angle with respect to the main surface of the ceramic body 8, and the two ends are extended from each other. In this state, resin is molded around the ceramic body 8 to form an insulating exterior body 9. In this case, the insulating sheath 9
is formed into a rectangular or cylindrical shape, with both end surfaces 10, 10 substantially perpendicular to the lead terminals 2, 3 led out from both main surfaces of the ceramic body 8. Therefore, the ceramic body 8 is embedded so that its main surface is oblique to the end faces 10, 10 of the insulating sheath 9. In this state, lead terminals 2 and 3
is led out from the end faces 10, 10 of the insulating sheath 4, and this led out portion is bent so as to follow the end faces 10, 10 and the bottom face 11 of the insulating sheath 9, and the electrode pads 4, 5 It is said that Both lead terminals 2 and 3 have the same length, and electrode pads 4 and 5 led out from the insulating sheath 9 are symmetrical with respect to the insulating sheath 9. When a surface-mountable ceramic capacitor with the structure shown in FIGS. 1 and 2 was incorporated into a circuit on a board, no fluctuation in circuit characteristics due to the inductance component was observed, even in the high frequency band. Furthermore, since the number of bends in the lead terminals has been reduced, the manufacturing process has been simplified compared to the conventional method. FIG. 3 is a drawing showing another embodiment of the present invention,
Here, one end is the electrode 7, 7 of the ceramic body 8.
The base sides of the lead terminals 2 and 3 soldered to the ceramic body 8 are led out at an acute angle to the main surface of the ceramic body 8 and parallel to each other. The other configurations are the same as those of the above embodiment, and in this case as well, the same operations and effects as those of the above embodiment can be obtained. Furthermore, since the base sides of the lead terminals 2 and 3 fixed to the electrodes 7 and 7 are bent at an acute angle with respect to the main surface of the ceramic body 8, heating and cooling such as a heat cycle test are repeated. In this case, the thermal stress caused by the difference in thermal expansion between the insulating sheath 9 and the ceramic body 8 is relaxed, and the ceramic body 8, the lead terminals 2 and 3, and the insulating sheath 9 are bonded together inside the insulating sheath 9. No more peeling or misalignment. Furthermore, since the bent portions of the lead terminals 2 and 3 on the base side fixed to the electrodes 7 and 7 are located symmetrically with respect to the central axis of the ceramic body 8, the lead terminals 2 and 3 are connected to the electrodes 7 and 7, respectively. When fixing the lead terminals 2 and 3 to the electrodes 7 and 7, even if there are slight variations in the bending angles of the bent portions of the lead terminals 2 and 3, the ceramic body 8 is tilted and the lead terminals 2 and 3 are fixed to the electrodes 7 and 7. can be fixed with good adhesion. In the above embodiments, the present invention is applied to ceramic capacitors, but even if the present invention is applied to other types of insulated exterior electronic components, such as varistors or thermistors, the same effects as described above can be obtained. be able to.

[Effect of the idea]

As is clear from the above description, the present invention simplifies manufacturing by reducing the bending process of the lead terminals compared to conventional insulated exterior electronic components, and reduces the inductance caused by bending the lead terminals. It is possible to obtain an insulated exterior electronic component in which the components can be reduced. Furthermore, in the insulating exterior electronic component according to the second aspect, there is no peeling or positional shift between the ceramic body 8 and the lead terminals 2, 3 and the insulating exterior body 9 inside the insulating exterior body 9 due to thermal stress, and the reliability is improved. It is possible to obtain electronic components with a highly insulated exterior.

[Brief explanation of drawings]

FIG. 1 is a perspective view of an insulated exterior electronic component seen through an insulated exterior body showing an embodiment of the present invention, and FIG.
FIG. 3 is a vertical side view of the insulated exterior electronic component showing another embodiment,
FIG. 4 is a longitudinal sectional side view of an insulated exterior electronic component showing a conventional example. DESCRIPTION OF SYMBOLS 1, 2... Lead terminal, 7... Electrode, 8... Ceramic body, 9... Insulating exterior body, 10... End face of insulating exterior body, 11... Bottom face of insulating exterior body.

Claims (1)

[Claims for Utility Model Registration] (1) A ceramic body 8 having electrodes 7, 7 on both principal surfaces, an insulating sheath 9 formed to cover the ceramic body 8, and one end thereof are respectively fixed to the electrodes 7, 7 of the ceramic element body 8, and the other end side is led out from the end faces 10, 10 of the insulating exterior body 9,
From the end faces 10, 10 to the bottom face 11 of the insulating exterior body 9
In an insulated exterior electronic component comprising a pair of plate-shaped lead terminals 2 and 3 bent so as to follow, the main surface on which the electrodes 7 and 7 of the ceramic body 8 are formed is the end face 10 of the insulating exterior body 9. . (2) A ceramic element body 8 having electrodes 7, 7 on both principal surfaces, an insulating exterior body 9 formed to cover the ceramic element body 8, and one end side of which is the electrode of the ceramic element body 8. 7, 7, and the other end side is led out from the end faces 10, 10 of the insulating sheathing body 9,
From the end faces 10, 10 to the bottom face 11 of the insulating exterior body 9
In an insulated exterior electronic component comprising a pair of plate-shaped lead terminals 2 and 3 bent so as to follow, the main surface on which the electrodes 7 and 7 of the ceramic body 8 are formed is the end face 10 of the insulating exterior body 9. , 10, the ceramic body 8 is embedded in an insulating exterior body 9 so as to be oblique to the lead terminals 2, 3.
is characterized in that the base side fixed to the electrodes 7, 7 is bent at an acute angle with respect to the main surface of the ceramic body 8 so as to be parallel to each other, and the base side is embedded in the insulating exterior body 9. Insulated exterior electronic components.