JP2002043166A - Electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component having a wide capacitance range, even if it is reduced in size. SOLUTION: The electronic component has a pair of lead terminals 13, 14 connected to a pair of terminal parts 11, 12 of a laminated capacitor 10 and a housing material 15 for covering at least a part of the lead terminals 13, 14 and the laminated capacitor 10. The pair of lead terminals 13, 14 have portions 13a, 14a counterposed to the sides of the laminated capacitor 10; portions 13b, 14b connected to the portions 13a, 14a and counterposed to the both end surfaces of the laminated capacitor 10; extensions 13c, 14c connected to the portions 13b, 14b and extending outside of the housing material 15; and packages 13d, 14d connected to the extensions 13c, 14c and forming external terminals, respectively.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component suitably used for electronic equipment such as a modem, a power supply circuit, a liquid crystal power supply, and a DC-DC converter.

[0002]

2. Description of the Related Art FIG. 15 is a side sectional view showing a conventional electronic component.

In FIG. 15, reference numeral 1 denotes electrodes 2 and 3 on both main surfaces.
, 4 and 5 are terminal portions connected to the electrodes 2 and 3, and 6 is the substrate 1, the electrode 2, the electrode 3 and the terminal portions 4.
This is an exterior material for molding the terminal portion 5.

The electronic component configured as described above has been used as a surface-mounted component by bending the terminal portions 4 and 5 along the exterior material 6 and extending to the same surface of the exterior material 6.

[0005]

However, in the above-described conventional configuration, in order to further reduce the size of electronic components, the size and thickness of the substrate 1 must be reduced, and the substrate 1 is easily broken. Or the range of the capacity that can be formed is narrowed.

An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide an electronic component having a wide range of capacity even if it is miniaturized.

[0007]

According to the present invention, a pair of lead terminals connected to a pair of terminal portions of a multilayer capacitor are provided.
An exterior material covering at least a part of the lead terminals and the multilayer capacitor is provided, and each of the pair of lead terminals has a side facing portion facing the side of the multilayer capacitor,
An end face opposing part connected to the side face opposing part and opposing both end faces of the multilayer capacitor; an extending part connected to the end face opposing part and extending outward of the exterior part; and an external terminal connected to the extending part and connected to the extending part. And a mounting portion.

[0008]

DETAILED DESCRIPTION OF THE INVENTION The invention according to a first aspect of the present invention is directed to a multilayer capacitor having an internal electrode embedded in a dielectric substrate and having a pair of terminals at both ends, and a pair of capacitors connected to the pair of terminals. A lead terminal, comprising an exterior material covering at least a part of the lead terminal and the multilayer capacitor,
Each of the pair of lead terminals has a side surface facing portion facing the side surface of the multilayer capacitor, an end surface facing portion connected to the side surface facing portion and facing both end surfaces of the multilayer capacitor, and the end surface facing portion. An electronic component, comprising: an extended portion connected to and extending outside the exterior portion, and a mounting portion connected to the extended portion and serving as an external terminal. Although it is small, it can have a very large capacity range, can be made from low capacity to high capacity, and supports multilayer capacitors at the side facing part, so it can be used in exterior materials. Variations in characteristics due to variations in the orientation of the multilayer capacitor can be suppressed.

According to a second aspect of the present invention, the end face opposing portions of the pair of lead terminals are provided in the same direction, and the side face opposing portions of the pair of lead terminals oppose the same side surface of the multilayer capacitor. The electronic component according to claim 1, wherein the multilayer capacitor can be supported from one side surface, so that when the multilayer capacitor is arranged between the lead terminals, it becomes easy. The performance is improved.

According to a third aspect of the present invention, the end face opposing portions of the pair of lead terminals are provided in opposite directions, and the side face opposing portions of the pair of lead terminals are formed on different opposing side surfaces of the multilayer capacitor. The electronic component according to claim 1, wherein the multilayer capacitor can be sandwiched between two opposing side surfaces, so that variations in the orientation of the multilayer capacitor in the exterior material can be reduced. It can be suppressed reliably, and variations in characteristics can be suppressed.

According to a fourth aspect of the present invention, there is provided the electronic component according to the first aspect of the present invention, wherein a plurality of side facing portions are provided at the end face facing portion. Therefore, variations in the orientation of the multilayer capacitor in the exterior material can be reliably suppressed, and variations in characteristics can be suppressed.

According to a fifth aspect of the present invention, another side facing portion is provided on both sides of the side facing portion so that the side facing portion faces a plurality of adjacent side surfaces of the multilayer capacitor. With the electronic component according to the first aspect, the multilayer capacitor can be sandwiched between a plurality of side surfaces, so that variations in the orientation of the multilayer capacitor in the exterior material can be reliably suppressed, and variations in characteristics can be reduced. Can be suppressed.

According to a sixth aspect of the present invention, one end terminal is provided on one of the lead terminals by providing end face opposing parts provided in opposite directions to the extending part, and providing a side face opposing part on the end face opposing part. 2. The electronic component according to claim 1, wherein the side-facing portions face opposite side surfaces of the multilayer capacitor, so that the multilayer capacitor can be sandwiched between a plurality of side surfaces. Variations in the orientation of the multilayer capacitor in the inside can be reliably suppressed, and variations in characteristics can be suppressed.

According to a seventh aspect of the present invention, there is provided a dual-purpose part which also serves as an extension part and an end-face-facing part, and one of the dual-purpose parts is provided with a side-facing part, and the other end of the dual-purpose part is provided at the other end. The electronic component according to claim 1, wherein a mounting portion is provided, thereby simplifying the structure of the lead terminal and improving productivity.

According to an eighth aspect of the present invention, the electrical junction between the multilayer capacitor and the terminal portion of the pair of lead terminals is a non-tip portion of the side facing portion.
With the electronic component described above, both the electrical connection portion with the terminal portion and the support portion of the multilayer capacitor can be provided on the side facing portion.

FIG. 1 is a perspective view showing an electronic component according to an embodiment of the present invention.

In FIG. 1, a multilayer capacitor 10 has terminals 11, 1 at both ends.
2 are provided. 13 and 14 are terminal portions 1
Lead terminals 15 are respectively joined to the terminals 1 and 12, and a substantially rectangular parallelepiped exterior member provided so as to cover the multilayer capacitor 10 and a part of the lead terminals 13 and 14.

As shown in FIG. 1, when the length of the electronic component is M1, the height is M2, and the width is M3, as shown in FIG. 1, 4.5 mm ≦ M1 ≦ 7.5 mm 1.0 mm ≦ M2 ≤ 3.5 mm 2.0 mm ≤ M3 ≤ 7.0 mm

When M1, M2 and M3 are smaller than the lower limit,
A multilayer capacitor having a size capable of forming a sufficient capacitance range cannot be embedded, and if it is larger than the upper limit, the electronic component itself becomes large, and as a result, a small circuit board or the like cannot be formed. .

As described above, by using the multilayer capacitor 10 and molding it with the exterior material 15, the capacity range can be extremely widened while being small.

The details of each section will be described below.

First, the multilayer capacitor 10 will be described with reference to FIGS.

In FIG. 3, reference numeral 16 denotes a base made of a dielectric. The base 16 is preferably made of a dielectric material such as titanium oxide or barium titanate. Reference numerals 17 and 18 denote internal electrodes buried in the base member 16.
Examples of the constituent material 8 include a metal material containing at least one of Ag, Ni, Pd, and Cu. In particular, using Ni alone or a Ni alloy is particularly advantageous in terms of cost.

The thickness of the internal electrodes 17 and 18 is 1 to 5
μm. Further, the interval between the internal electrode 17 and the adjacent internal electrode 18 is preferably set to 15 μm or more.

The internal electrode 17 is electrically connected to the terminal portion 12, and the internal electrode 18 is electrically connected to the terminal portion 11, and forms a main capacitance between the internal electrodes 17, 18.

As an example of a specific manufacturing method, a plurality of dielectric sheets each having an electrode coated on one surface are prepared, and these dielectric sheets are laminated so that the electrodes do not directly contact each other. It is manufactured by forming the terminal portions 11 and 12 on the substrate.

As shown in FIG. 2, the length of the multilayer capacitor 10 is L1, the height is L2, the width is L3, and the distance between the terminals is L.
4, when the width of the terminal portion on the side surface is L5, 3.0 mm ≦ L1 ≦ 5.5 mm 0.5 mm ≦ L2 ≦ 2.5 mm 1.5 mm ≦ L3 ≦ 3.5 mm L4 ≧ 2.0 mm L5 ≧ 0.5 mm.

When L1 to L3 are smaller than the lower limit, the formation area of the internal electrodes 17 and 18 becomes small,
Since the interval between the internal electrodes 17 and 18 is inevitably narrow and the number of the internal electrodes 17 and 18 must be reduced, a large capacity cannot be obtained as desired, and a small electronic component having a wide capacity can be obtained. It is difficult.

If L4 is smaller than 2.0 mm, the distance between the terminal portions 11 and 12 is reduced, and the withstand voltage and reliability are deteriorated. In order to prove this, a so-called wet and medium load test in which a rated voltage is continuously applied at a temperature of 40 ° C. and a relative humidity of 95% or more is performed, and the results are shown in (Table 1).

[0030]

[Table 1]

As can be seen from Table 1, when L4 is 1.5 mm, insulation failure occurs at 1000 hr (1000 hours). Also, L4
Is 2.0 mm or more, insulation failure does not occur even if it exceeds 2000 Hr (2000 hours).

If L5 is smaller than 0.5 m, the terminal portions 11 and
The bonding strength between the base 12 and the base 16 is weakened.

The capacitance C of the multilayer capacitor 10 is preferably set to 4 pF ≦ C ≦ 4700 pF. If C is smaller than 4 pF, effects such as noise removal cannot be obtained. It is difficult to remove noise. The capacitance C can be easily adjusted by changing the facing area of the internal electrodes 17 and 18, the number of the internal electrodes 17, 18 and the formation area of the internal electrodes 17, 18 themselves.

Further, the DC breakdown voltage BDV of the multilayer capacitor 10 is preferably set to BDV ≧ 4.8 KV. BDV is 4.5 KV or less (450
(0 V or less), it is difficult to obtain an electronic component that guarantees a rated voltage of 2000 V or more.

The corner A shown in FIG.
The chamfer of 2 mm is provided, and by performing the chamfering, cracks hardly occur near the corner A of the exterior material 15. This is shown in (Table 2).

[0036]

[Table 2]

As shown in (Table 2), when only normal reflow is applied, no crack occurs even if the corner A is sharp. 5% (5 out of 100 electronic components) cracks were observed in the electronic components in which the laminated capacitor 10 was not embedded. This crack is generated in the multilayer capacitor 10.
From the corner portion A of the exterior material 15.

The terminals 11 and 12 provided on the multilayer capacitor 10 will be described.

The terminal portions 11 and 12 are formed by laminating a single layer or a plurality of layers, or by connecting a metal cap with a conductive bonding material.

The outermost portions (outermost portions) of the terminal portions 11 and 12 are preferably made of a conductive material having a melting point of 200 ° C. or more. With this configuration, even if an electronic component is subjected to high temperature by reflow or the like. The terminal portions 11 and 12 are not thermally damaged, and stable reflow characteristics can be obtained.

In the case where the terminal portions 11 and 12 are formed of a metal film, they are made of a material containing at least one of Ag, Ni and Cu, which is very effective in terms of cost and characteristics. When the terminal portions 11 and 12 are formed of a single layer, they are formed of a material containing at least one of Ag, Ni, and Cu, and specifically, a Ni—Ag alloy or Ag, N
It is composed of an alloy or the like containing at least one material of i and Cu and another element. When it is composed of a plurality of layers, layers composed of different materials are laminated.

Next, the lead terminals 13 and 14 will be described.

As a main constituent material of the lead terminals 13 and 14, a material selected from at least one of Fe, Cu and Ni is suitably selected, and by using these materials, it is advantageous in terms of electrical characteristics and workability. It is.

As shown in FIG. 4, the structure of the lead terminals 13 and 14 includes side facing portions 13a and 14a facing the side 10a of the multilayer capacitor 10, and side facing portions 13a and 14a.
a, 14a connected to the end face 10b of the multilayer capacitor and facing the end face 10b of the multilayer capacitor;
b, 14b, extending portions 13c, 14c extending to the outside of the exterior material 15; mounting portions connected to the extending portions 13c, 14c, respectively, and bent in the same direction along the outer shape of the exterior material 15 Parts 13d and 14d are provided. At this time, what is electrically connected to the terminal portions 11 and 12 is as follows.
Side facing portion 13a, 14a or end face facing portion 13
b and 14b. Further, the tip portions of the side facing portions 13a and 14a are not in contact with the terminal portions 11 and 12, and support the multilayer capacitor 10;
The end face opposing portions 13b of the side opposing portions 13a, 14a,
The vicinity (root portion) of 14 b is joined to the terminal portions 11 and 12 extending to the side surface of the multilayer capacitor 10. In addition,
The terminal portions 11 and 12 are connected to the end face 10 b of the multilayer capacitor 10.
In the case of being provided only on the side, the side facing portions 13a, 1
4a is not in contact with the terminal portions 11 and 12, and only supports the multilayer capacitor 10.

Further, in the embodiment shown in FIG. 4, by providing the side facing portions 13a and 14a on the same side 10a, when the multilayer capacitor 10 is arranged between the lead terminals 13 and 14 during manufacturing. In addition, terminal part 11,
12 and good connection with the side-facing portion 13
Since the multilayer capacitor 10 can be reliably held at the points a and 14a, the multilayer capacitor 10 can be prevented from falling off, which is very advantageous in manufacturing. Moreover, since the multilayer capacitor 10 can be reliably held in the exterior material 15, the exterior material 1
When the multilayer capacitor 10 is provided, the multilayer capacitor 10 is not provided at an inclination, and stable characteristics can be obtained.

As shown in FIG. 4, the mounting portions 13d and 14d may be provided with opposing portions 13e and 14e provided on the bottom surface serving as the mounting surface of the exterior material 15. This facing part 1
By providing 3e and 14e, bonding with a land or the like provided on the circuit board can be reliably performed at the time of surface mounting. When the opposing portions 13e and 14e are not provided, a bonding material such as solder is applied to at least a part of the mounting portions 13d and 14d, and is electrically and mechanically connected to lands and the like. In the present embodiment, the opposing portions 13e and 14e are bent in directions facing each other, but may be formed in a so-called gull wing type by bending in different directions.

The minimum distance M4 between the lead terminals 13 and 14 outside the exterior material 15 is preferably not less than 3.0 mm. Particularly, in the case of an electronic component for central pressure,
This is useful for improving the withstand voltage, and can suppress the decrease in the withstand voltage due to deterioration of the characteristics of other members due to long-term use. In the case where the size of the electronic component is reduced, M4 is preferably set to 6.0 mm or less.

Also, as shown in FIG.
If it is 14, since it has a very simple structure, the production of the lead terminals 13 and 14 is simple, which is very advantageous in terms of cost.

Further, as shown in FIG.
In addition to the side facing parts 13a, 14a, the side facing parts 13f, 14f sandwich the end face facing parts 13b, 14b of the third and fourteenth faces.
Are provided on the end face opposing portions 13b and 14b, whereby the side face 10c of the multilayer capacitor 10 and the side face 10c (not shown) are provided.
The opposite side faces 13a and 14f also come into contact with each other, so that the multilayer capacitor 10 can be more reliably held between the lead terminals 13 and 14.

Further, as shown in FIG.
f, 14f may be provided on the side facing parts 13a, 14a so as to sandwich the side facing parts 13a, 14a.

Further, as shown in FIG.
By providing the protrusions 13g and 14g on the b and 14b, the electrical contact between the end face opposing portions 13b and 14b and the terminals 11 and 12 can be surely realized, and the layers are laminated by utilizing the elasticity of the lead terminals 13 and 14 themselves. Since the mold capacitor 10 can be sandwiched, the multilayer capacitor 10 can be firmly fixed. In addition, as a method of forming the protrusions 13g and 14g, the end face opposing portions 13b and 14b are formed in a corrugated shape as shown in FIG. 8 or by providing a portion protruding from other portions. 13 g and 14 g may be formed.

Further, as shown in FIG.
By providing support portions 30 and 40 provided with V-shaped protrusions in the middle on both sides of the lead terminals 13 and 14, the multilayer capacitor can be reliably held between the lead terminals 13 and 14. It is possible to prevent the capacitor 10 from moving during manufacturing. Note that the support portions 30 and 40 are cut off during manufacturing and do not exist in actual electronic components.

Next, an electronic component according to another embodiment is shown in FIG.
As shown in FIG.

The difference from the electronic component shown in FIG. 4 is the structure of the lead terminals 13 and 14.

As shown in FIG. 10 and FIG.
3 is bent in a direction opposite to the end surface facing portion 14b of the lead terminal 14b, the side surface facing portion 14a faces the side surface 10a of the multilayer capacitor 10, and the side surface facing portion 13a is a multilayer type. The capacitor 10 faces a side surface 10d opposite to the side surface 10a. Other structures are substantially the same as those of the electronic component shown in FIG.

With such a configuration, the opposing side surfaces 1
Since the multilayer capacitor 10 is sandwiched between the lead terminals 13 and 14 from 0a and 10d, the multilayer capacitor 10 can be reliably held between the lead terminals 13 and 14, so that the posture of the multilayer capacitor 10 is stabilized. And variations in characteristics can be suppressed.

Next, an electronic component according to still another embodiment is shown in FIG.
2, shown in FIG.

The difference from the electronic parts shown in FIGS. 4, 10 and 11 is the structure of the lead terminals 13 and 14, and the other parts are substantially the same.

As shown in FIG. 12 and FIG.
Each of the terminals 3 and 14 has a terminal structure that sandwiches the multilayer capacitor 10 alone.

That is, end face facing portions 13b and 14b are provided in opposite directions from the extending portions 13c and 14c, respectively, and the side face facing portions 13a and 13b are provided on the respective end face facing portions 13b and 14b.
14a. In the present embodiment, the side 1
One end face opposing portion 13b is provided for each of the lead terminals 13 and 14 on the 0d side, and two end face opposing portions 13b are provided for each of the lead terminals 13 and 14 on the side face 10a. Alternatively, a configuration may be adopted in which the multilayer ceramic capacitor 10 is sandwiched between one lead terminal alone.

Returning to FIG. 4, the mounting portions 13d and 14d are preferably exposed from the surfaces of the exterior material 15 facing each other, so that the distance between the lead terminals 13 and 14 outside the exterior material 15 is increased as much as possible. Is preferred.

It is preferable that the maximum distance M5 between the mounting portions 13d and 14d and the exterior material 15 is 0.05 mm or more. For example, even if the circuit board on which the electronic component is mounted is bent and stress is applied to the joint between the electronic component and the circuit board, at least the mounting portions 13d and 14d deflect the stress, and the circuit board and the mounting portions 13d and 14d Or the opposing parts 13e, 14e
The stress applied to the connection between the electronic component and the circuit board can be reduced, and cracks and the like can be prevented from entering the connection between the electronic component and the circuit board. At this time, the mounting parts 13d, 14
In order to allow d to bend, it is most preferable that the above-mentioned maximum gap M5 is 0.05 mm or more.

At least one of the side facing parts 13a, 14a or the end face facing parts 13b, 14b and the terminal part 11,
12 uses a bonding material having a melting point of 230 ° C., for example, a high-temperature cream solder, so that even if heat is applied to the electronic component by reflow or the like, at least one of the side facing parts 13a, 14a or the end face facing parts 13b, 14b. There is no problem in the electrical connection between the one and the terminal portions 11 and 12, and it is possible to prevent the characteristic deterioration and the like.

The stray capacitance Cp mainly formed between the lead terminals 13 and 14 is preferably 0.1 pF to 5.0 pF. When Cp is larger than 5.0 pF, the capacitance variation becomes very large when an electronic component is formed,
It is a bug. Further, if Cp is smaller than 0.1 pF, a manufacturing defect occurs. That is, for example, when the capacitance desired as an electronic component is C1 and the capacitance of the multilayer capacitor 10 is C2, ideally, C1 = C2 + Cp
It is preferable that C2 and Cp have some variations, so that the characteristics actually vary somewhat more than C1. Therefore, when C2 + Cp is slightly larger than C1, the outer material 1 of the lead terminals 13 and 14 is not required.
5 to reduce the facing area by reducing the length of the wiring, or trimming the lead terminals 13 and 14 to make some adjustments to reduce the capacitance and facilitate the adjustment. When it becomes smaller than C1, it is difficult to increase the capacity with a simple configuration.
By configuring the capacitor to have Cp of 0.1 pF or more, even if C2 is slightly smaller than the predetermined capacitance, Cp can compensate for it, so that C1 is smaller than the predetermined capacitance and adjustment is difficult. It is possible to suppress the production of a complicated electronic component in manufacturing, and to improve the productivity.

Since the lead terminals 13 and 14 have substantially the same shape as each other, the number of parts can be reduced, the productivity can be improved, and the lead terminals 13 and 14 can be used as the exterior material 1.
5, since it can be derived from substantially the same height, an electronic component with good symmetry can be provided.

Next, the exterior material 15 will be described.

As the exterior material 15, an epoxy resin such as optocresol novolac, biphenyl, and pentadiene is preferably used. The exterior material 15 embeds the multilayer capacitor 10 and a part of the lead terminals 13 and 14 (side-facing portions 13a and 14a, end-face facing portions 13b and 14b, and extending portions 13b and 14b).

The minimum value of the distance between the surface of the exterior material 15 and the surface of the multilayer capacitor 10 (the thickness of the thinnest portion of the exterior material 15; for example, M6 in FIG. 4) is 0.1 mm or more. By doing so, it is possible to improve the outer pressure resistance.

The lead terminals 13 and 14 of the exterior material 15
Is protruded more than the other parts, and the roots of the mounting parts 13d and 14d can be reinforced by such a configuration.
Since the outer material 15 can be made thicker at the lead-out portions of the lead terminals 13 and 14 where moisture can enter most easily, weather resistance can be improved.

Next, an example of a method of manufacturing the electronic component configured as described above will be described.

First, the terminal portion 1 of the multilayer capacitor 10
Lead terminals 13 and 14 are connected to 1 and 12, respectively.
Next, using the molding material or the like,
All of the multilayer capacitor 10 and the lead terminals 13 and 14
Cover part of Next, the lead terminals 13 and 14 protruding from the exterior material 15 are bent along the outer shape of the exterior material 15 as shown in FIGS.

In this embodiment, the lead terminals 1
The end faces 13b, 14b and the extending parts 13c, 14c are provided on the end faces 3, 14 respectively, but as shown in FIG. 14, the end face opposing parts 13b, 14b and the extending parts 13c, 14 are provided.
By providing the shared portions 13h and 14h which also serve as c, the number of bending of the lead terminals 13 and 14 can be reduced and the structure is simplified, so that the productivity of the lead terminals 13 and 14 is improved, and furthermore, electronic components Overall productivity is improved.
For example, as shown in FIG. 4, the dual-purpose portions 13 h and 14 h are inclined (inclined so as to gradually move away from the end surface of the multilayer capacitor 10) from the side facing portions 13 a and 14 a to the outside of the exterior material 15. It extends and is connected to the mounting portions 13d and 14d outside the exterior material 15.

[0073]

The present invention comprises a pair of lead terminals connected to a pair of terminal portions of a multilayer capacitor, and an exterior material covering at least a part of the lead terminals and the multilayer capacitor. Each of the terminals has a side facing portion facing the side surface of the multilayer capacitor, an end facing portion connected to the side facing portion and facing both end surfaces of the multilayer capacitor, and a terminal connected to the end facing portion, and has With a configuration that has an extension part extended to the extension part and a mounting part connected to the extension part and serving as an external terminal, the capacity range can be extremely widened while being small, and the capacity can be increased from low to high. Since it is possible to assort products up to the capacity, and since the multilayer capacitor is supported at the side-facing portion, variations in characteristics due to variations in the orientation of the multilayer capacitor in the exterior material can be suppressed.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an electronic component according to an embodiment of the present invention.

FIG. 2 is a perspective view of a multilayer capacitor used in an electronic component according to an embodiment of the present invention.

FIG. 3 is a side sectional view of a multilayer capacitor used for an electronic component according to an embodiment of the present invention.

FIG. 4 is a side sectional view showing an electronic component according to one embodiment of the present invention.

FIG. 5 is a perspective view showing an electronic component according to one embodiment of the present invention.

FIG. 6 is a perspective view showing an electronic component according to one embodiment of the present invention.

FIG. 7 is a perspective view showing an electronic component according to one embodiment of the present invention.

FIG. 8 is a perspective view showing an electronic component according to one embodiment of the present invention.

FIG. 9 is a perspective view showing an electronic component according to one embodiment of the present invention.

FIG. 10 is a side sectional view showing an electronic component according to another embodiment of the present invention.

FIG. 11 is a perspective view showing an electronic component according to another embodiment of the present invention.

FIG. 12 is a side sectional view showing an electronic component according to another embodiment of the present invention.

FIG. 13 is a perspective view showing an electronic component according to another embodiment of the present invention.

FIG. 14 is a side sectional view showing an electronic component according to another embodiment of the present invention.

FIG. 15 is a side sectional view showing a conventional electronic component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Multilayer capacitor 11, 12 Terminal part 13, 14 Lead terminal 13a, 13f, 14a, 14f Side facing part 13b, 14b End face facing part 13c, 14c Extension part 13d, 14d Mounting part 15 Exterior material 17, 18 Internal electrode

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Masuhiro Yamamoto 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Masamori Kakiuchi 1006 Odaka Kadoma Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. F term (reference) 5E082 AA02 AB03 BC38 BC39 EE04 EE23 EE26 EE35 FG26 GG08 GG23 HH27 HH48

Claims (8)

[Claims] 1. A multilayer capacitor having an internal electrode embedded in a dielectric substrate and having a pair of terminals at both ends, a pair of lead terminals connected to the pair of terminals, and at least one of the lead terminals. A part and an exterior material covering the multilayer capacitor; and the pair of lead terminals respectively connected to a side facing part facing the side of the multilayer capacitor and the side facing part, and An end face opposing part opposing both end faces of the capacitor, an extended part connected to the end face opposing part, extending outside the exterior part, and a mounting part connected to the extending part and serving as an external terminal. An electronic component comprising: 2. An end face opposing portion of each of a pair of lead terminals is provided in the same direction, and a side face opposing portion of each of the pair of lead terminals opposes the same side surface of the multilayer capacitor. The electronic component according to claim 1. 3. An end face opposing portion of each of a pair of lead terminals is provided in an opposite direction, and a side face opposing portion of each of the pair of lead terminals opposes a different side face of the multilayer capacitor. The electronic component according to claim 1, wherein: 4. The electronic component according to claim 1, wherein a plurality of side facing portions are provided at the end facing portion. 5. The electronic device according to claim 1, wherein another side facing portion is provided on both sides of the side facing portion so that the side facing portion faces a plurality of adjacent side surfaces of the multilayer capacitor. parts. 6. An end face opposing portion provided in a direction opposite to the extending portion, and a side face opposing portion provided on the end face opposing portion, so that the side face opposing portion provided on one of the lead terminals is a laminated type. 2. The electronic component according to claim 1, wherein the electronic component faces both sides of the capacitor. 7. A dual-purpose part which also serves as an extension part and an end-face facing part, a side facing part is provided at one end of the dual-purpose part, and a mounting part is provided at the other end of the dual-purpose part. The electronic component according to claim 1, wherein: 8. The electronic component according to claim 1, wherein the electrical connection between the terminal portion of the multilayer capacitor and the pair of lead terminals is a non-tip portion of the side facing portion.