JPH11102837A - Electrode component - Google Patents
Electrode componentInfo
- Publication number
- JPH11102837A JPH11102837A JP9279704A JP27970497A JPH11102837A JP H11102837 A JPH11102837 A JP H11102837A JP 9279704 A JP9279704 A JP 9279704A JP 27970497 A JP27970497 A JP 27970497A JP H11102837 A JPH11102837 A JP H11102837A
- Authority
- JP
- Japan
- Prior art keywords
- elements
- electronic component
- caps
- cap
- fitted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
Landscapes
- Details Of Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、セラミックコンデ
ンサやセラミックバリスタ等の電子部品に関するもので
ある。The present invention relates to electronic components such as ceramic capacitors and ceramic varistors.
【0002】[0002]
【従来の技術】電子回路基板に表面実装される電子部品
には、例えばセラミックコンデンサ、セラミックバリス
タなどがある。これらの電子部品には、1枚の板状のも
の、積層形、或いは板状のものを複数枚重ね合わせて使
用するものなどがあり、これらを回路基板に実装するた
めに、板状の電子部品の側面に形成された外部電極に金
属製のキャップを嵌め込み、このキャップの下部を回路
基板にはんだ付けする構成からなるものがある。例とし
て図3に従来使用されているキャップ付きセラミックコ
ンデンサの構成を示す。すなわち、2個のセラミックコ
ンデンサ素子11の両側面には外部電極12が形成され
ており、このコンデンサ素子11の下面と上面間にエポ
キシ樹脂からなる接着剤13を塗布して2個を平面接着
し、このコンデンサ素子11群に予めクリームはんだを
内面に塗布したキャップ14を嵌め合せ、乾燥・加熱し
て、クリームはんだが溶融することによって、コンデン
サ素子11の外部電極12をキャップ14に接続してい
た。なお、15は回路基板である。2. Description of the Related Art Electronic components surface-mounted on electronic circuit boards include, for example, ceramic capacitors and ceramic varistors. These electronic components include a single plate-shaped component, a laminated component, and a component in which a plurality of plate-shaped components are used by laminating them. There is a configuration in which a metal cap is fitted into an external electrode formed on a side surface of a component, and a lower portion of the cap is soldered to a circuit board. As an example, FIG. 3 shows the configuration of a conventionally used ceramic capacitor with a cap. That is, external electrodes 12 are formed on both side surfaces of the two ceramic capacitor elements 11, and an adhesive 13 made of epoxy resin is applied between the lower surface and the upper surface of the capacitor element 11, and the two are planarly bonded. Then, the cap 14 in which cream solder was previously applied to the inner surface of the capacitor element 11 was fitted to the group, and the external electrode 12 of the capacitor element 11 was connected to the cap 14 by drying and heating to melt the cream solder. . In addition, 15 is a circuit board.
【0003】しかしながら、このようなキャップ付きセ
ラミックコンデンサは、コンデンサ素子11の外部電極
12とキャップ14を接続させるために行う加熱によっ
て溶融したクリームはんだが流動性を有することとなる
ので、この流動性によってコンデンサ素子11が前面方
向及び後面方向に動き、所定の位置に固定されず、コン
デンサ素子11の前面又は後面がコ字状キャップ14の
幅よりも外側に出て所定寸法に収まらないという問題点
があった。[0003] However, in such a ceramic capacitor with a cap, the cream solder melted by heating performed to connect the external electrode 12 of the capacitor element 11 and the cap 14 has fluidity. There is a problem that the capacitor element 11 moves in the front and rear directions and is not fixed at a predetermined position, and the front or rear face of the capacitor element 11 is outside the width of the U-shaped cap 14 and does not fit within a predetermined dimension. there were.
【0004】[0004]
【発明が解決しようとする課題】以上述べたように、従
来のキャップ付き電子部品では、コンデンサ素子11と
キャップ15の接続に使用しているクリームはんだの流
動性によって、コンデンサ素子11がコ字状キャップ1
4の所定の位置に接続されないという欠点があり、電子
部品としての寸法にばらつきを生じていた。As described above, in the conventional electronic component with a cap, the capacitor element 11 has a U-shape due to the fluidity of the cream solder used to connect the capacitor element 11 and the cap 15. Cap 1
4 has a drawback that it is not connected to a predetermined position, causing variations in dimensions as electronic components.
【0005】本発明は、このような問題点を解決するも
ので、コ字状キャップの所定の位置に電子部品素子を接
続し、寸法のばらつきを無くした電子部品を提供するこ
とを目的としたものである。An object of the present invention is to solve such a problem, and an object of the present invention is to provide an electronic component in which an electronic component element is connected to a predetermined position of a U-shaped cap and a dimensional variation is eliminated. Things.
【0006】[0006]
【課題を解決するための手段】上記の課題を解決するた
めに、請求項1に記載の発明は、対の外部電極を有する
セラミック電子部品素子を内上面に嵌め込み、前記外部
電極と接続した対のコ字状キャップとからなる電子部品
において、前記コ字状キャップにセラミック電子部品素
子の前面及び後面を制止する爪を設けたことを特徴とす
る。In order to solve the above-mentioned problems, according to the present invention, a ceramic electronic component element having a pair of external electrodes is fitted on the inner upper surface and connected to the external electrodes. An electronic component comprising a U-shaped cap, wherein the U-shaped cap is provided with claws for stopping the front and rear surfaces of the ceramic electronic component element.
【0007】このような請求項1記載の電子部品では、
コ字状キャップのコ字形状によって電子部品素子の両側
面が位置決めされ、また、キャップの前面及び後面に設
けた爪によって電子部品素子の前面及び後面が制止され
るので、所定の位置に電子部品素子を収めることがで
き、寸法のばらつきを無くすことができるものである。In the electronic component according to the first aspect,
The two sides of the electronic component element are positioned by the U-shape of the U-shaped cap, and the front and rear faces of the electronic component element are restrained by the claws provided on the front and rear faces of the cap. The element can be accommodated and dimensional variations can be eliminated.
【0008】請求項2に記載の発明は、請求項1におけ
るセラミック電子部品素子が、1個の電子部品素子、又
は2個以上のセラミック電子部品素子群であることを特
徴とする。The invention according to claim 2 is characterized in that the ceramic electronic component element according to claim 1 is one electronic component element or a group of two or more ceramic electronic component elements.
【0009】したがって、キャップの前面及び後面に設
けた爪は、1個又は2個以上の電子部品素子を制止する
ように複数個でも、或いは2個以上の電子部品素子に跨
がるように設けてもよい。Therefore, a plurality of claws are provided on the front and rear surfaces of the cap so as to stop one or more electronic component elements, or are provided so as to straddle two or more electronic component elements. You may.
【0010】[0010]
【発明の実施の形態】本発明の実施の形態の一例につい
て図面を参照して説明する。図1に示すように、2個の
セラミックコンデンサ素子1は、その側面にそれぞれ外
部電極2を形成してあり、エポキシ樹脂から成る接着剤
3で接着した。An embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 1, the two ceramic capacitor elements 1 have external electrodes 2 formed on the side surfaces thereof, and are bonded with an adhesive 3 made of epoxy resin.
【0011】この接着によって接着された2個のコンデ
ンサ素子1群の両側面に、図2で示したコ字状のキャッ
プ4を左右から嵌め込んだ。このキャップ4には、その
前面及び後面に爪5を設けてあり、この爪5は嵌め込ん
だコンデンサ素子1群の前面及び後面に接するように位
置し、コンデンサ素子1群の前後の動きを制止する作用
を有する。The U-shaped cap 4 shown in FIG. 2 was fitted on both sides of the two groups of capacitor elements 1 bonded by this bonding from the left and right. The cap 4 is provided with claws 5 on the front and rear surfaces thereof, and the claws 5 are positioned so as to be in contact with the front and rear surfaces of the fitted capacitor element group 1 to prevent the capacitor element group 1 from moving back and forth. It has the effect of doing.
【0012】そして、コンデンサ素子1の外部電極2を
接続するキャップ4の内上面部分には、予めクリームは
んだを塗布しておく。このクリームはんだはコンデンサ
素子1の外部電極2に塗布しておいてもよい。Then, cream solder is applied in advance to the inner upper surface of the cap 4 connecting the external electrodes 2 of the capacitor element 1. This cream solder may be applied to the external electrodes 2 of the capacitor element 1 in advance.
【0013】以上述べたようにして、クリームはんだを
塗布しておいたキャップ4の内上面部分に嵌め込まれた
コンデンサ素子1は、乾燥・加熱されることによってク
リームはんだが溶融し、キャップ4の内上面にコンデン
サ素子1の外部電極2が接続される。このとき、キャッ
プ4に設けた爪5によって、コンデンサ素子1は前後の
動きを制止されるので、所定の位置に接続される。As described above, the capacitor element 1 fitted on the inner upper surface of the cap 4 to which the cream solder has been applied is dried and heated so that the cream solder is melted. The external electrode 2 of the capacitor element 1 is connected to the upper surface. At this time, since the forward and backward movements of the capacitor element 1 are restrained by the claws 5 provided on the cap 4, the capacitor element 1 is connected to a predetermined position.
【0014】前記実施例では、コンデンサ素子1を2個
重ね合わせた場合について述べたが、コンデンサ素子1
単体でも、3個以上重ねた場合でも同様の作用効果を得
ることができる。In the above embodiment, the case where two capacitor elements 1 are superposed has been described.
The same operation and effect can be obtained by a single unit or by stacking three or more units.
【0015】なお、キャップ4に設けた爪5は、実施例
ではキャップ4の上端に設けた場合について述べたが、
図2の5aに示すようにコ字状の垂直部に設けてもよい
し、上端と垂直部との両方に設けてもよい。また、爪の
個数や設ける位置も、電子部品素子の個数や電子部品素
子の制止位置を勘案して適宜設定することが好ましい。In the embodiment, the claw 5 provided on the cap 4 has been described as being provided on the upper end of the cap 4.
As shown in 5a of FIG. 2, it may be provided at the U-shaped vertical portion, or may be provided at both the upper end and the vertical portion. Also, it is preferable that the number and positions of the claws are appropriately set in consideration of the number of electronic component elements and the stopping position of the electronic component elements.
【0016】そして、前記実施例では、電子部品として
セラミックコンデンサの場合について述べたが、バリス
タや抵抗器、又はこれらの組み合わせになる電子部品に
も適用することができる。In the above embodiment, the case where a ceramic capacitor is used as an electronic component has been described. However, the present invention can be applied to a varistor, a resistor, or an electronic component that is a combination thereof.
【0017】[0017]
【発明の効果】以上述べたように、本発明になる電子部
品では、コ字状キャップの所定の位置に電子部品素子を
接続することができるので、電子部品の寸法のばらつき
を無くすことができる効果を得ることができる。As described above, in the electronic component according to the present invention, since the electronic component element can be connected to the predetermined position of the U-shaped cap, the dimensional variation of the electronic component can be eliminated. The effect can be obtained.
【図1】 本発明による電子部品を示す正面図。FIG. 1 is a front view showing an electronic component according to the present invention.
【図2】 本発明になるキャップの一実施例を示す斜視
図。FIG. 2 is a perspective view showing an embodiment of the cap according to the present invention.
【図3】 従来の電子部品を示す正面図。FIG. 3 is a front view showing a conventional electronic component.
1…コンデンサ素子 2…外部電極 3…接着剤 4…コ字状キャップ 5…爪 DESCRIPTION OF SYMBOLS 1 ... Capacitor element 2 ... External electrode 3 ... Adhesive 4 ... U-shaped cap 5 ... Claw
Claims (2)
品素子と、該セラミック電子部品素子を内上面に嵌め込
み前記外部電極と接続した対のコ字状キャップとからな
る電子部品において、前記コ字状キャップにセラミック
電子部品素子の前面及び後面を制止する爪を設けたこと
を特徴とする電子部品。1. An electronic component comprising: a ceramic electronic component element having a pair of external electrodes; and a pair of U-shaped caps fitted with the ceramic electronic component element on an inner upper surface and connected to the external electrodes. An electronic component, wherein a cap is provided on a cap to control a front surface and a rear surface of a ceramic electronic component element.
ック電子部品素子又は2個以上のセラミック電子部品素
子群であることを特徴とする請求項1記載の電子部品。2. The electronic component according to claim 1, wherein the ceramic electronic component element is one ceramic electronic component element or a group of two or more ceramic electronic component elements.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9279704A JPH11102837A (en) | 1997-09-25 | 1997-09-25 | Electrode component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9279704A JPH11102837A (en) | 1997-09-25 | 1997-09-25 | Electrode component |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH11102837A true JPH11102837A (en) | 1999-04-13 |
Family
ID=17614724
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9279704A Pending JPH11102837A (en) | 1997-09-25 | 1997-09-25 | Electrode component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH11102837A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002043166A (en) * | 2000-07-24 | 2002-02-08 | Matsushita Electric Ind Co Ltd | Electronic component |
JP2002313669A (en) * | 2001-04-16 | 2002-10-25 | Matsushita Electric Ind Co Ltd | Electronic component |
JP2013030746A (en) * | 2011-06-22 | 2013-02-07 | Murata Mfg Co Ltd | Ceramic electronic component |
JP2014146642A (en) * | 2013-01-28 | 2014-08-14 | Tdk Corp | Ceramic electronic component |
WO2018146990A1 (en) * | 2017-02-13 | 2018-08-16 | 株式会社村田製作所 | Laminated ceramic electronic component |
DE102019135716A1 (en) | 2018-12-25 | 2020-06-25 | Tdk Corporation | ELECTRONIC DEVICE |
KR20210018059A (en) | 2019-08-08 | 2021-02-17 | 티디케이가부시기가이샤 | Conductive terminal and electronic device |
US11140781B2 (en) | 2018-10-22 | 2021-10-05 | Tdk Corporation | Electronic device |
US11646163B2 (en) | 2020-05-27 | 2023-05-09 | Tdk Corporation | Electronic device |
DE102014203736B4 (en) | 2013-02-28 | 2024-02-22 | Denso Corporation | ELECTRONIC PART AND ELECTRONIC CONTROL UNIT |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01156502U (en) * | 1988-04-19 | 1989-10-27 | ||
JPH04324920A (en) * | 1991-04-25 | 1992-11-13 | Mitsubishi Electric Corp | Mounting method for surface mounting part |
JPH0817679A (en) * | 1994-06-30 | 1996-01-19 | Kyocera Corp | Composite ceramic capacitor |
-
1997
- 1997-09-25 JP JP9279704A patent/JPH11102837A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01156502U (en) * | 1988-04-19 | 1989-10-27 | ||
JPH04324920A (en) * | 1991-04-25 | 1992-11-13 | Mitsubishi Electric Corp | Mounting method for surface mounting part |
JPH0817679A (en) * | 1994-06-30 | 1996-01-19 | Kyocera Corp | Composite ceramic capacitor |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002043166A (en) * | 2000-07-24 | 2002-02-08 | Matsushita Electric Ind Co Ltd | Electronic component |
JP2002313669A (en) * | 2001-04-16 | 2002-10-25 | Matsushita Electric Ind Co Ltd | Electronic component |
JP4736225B2 (en) * | 2001-04-16 | 2011-07-27 | パナソニック株式会社 | Capacitor |
JP2013030746A (en) * | 2011-06-22 | 2013-02-07 | Murata Mfg Co Ltd | Ceramic electronic component |
JP2014146642A (en) * | 2013-01-28 | 2014-08-14 | Tdk Corp | Ceramic electronic component |
DE102014203736B4 (en) | 2013-02-28 | 2024-02-22 | Denso Corporation | ELECTRONIC PART AND ELECTRONIC CONTROL UNIT |
WO2018146990A1 (en) * | 2017-02-13 | 2018-08-16 | 株式会社村田製作所 | Laminated ceramic electronic component |
JP2018133355A (en) * | 2017-02-13 | 2018-08-23 | 株式会社村田製作所 | Multilayer ceramic electronic component |
US11170937B2 (en) | 2017-02-13 | 2021-11-09 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component |
US11140781B2 (en) | 2018-10-22 | 2021-10-05 | Tdk Corporation | Electronic device |
KR20200079436A (en) | 2018-12-25 | 2020-07-03 | 티디케이가부시기가이샤 | Electronic device |
US11335508B2 (en) | 2018-12-25 | 2022-05-17 | Tdk Corporation | Electronic device |
DE102019135716A1 (en) | 2018-12-25 | 2020-06-25 | Tdk Corporation | ELECTRONIC DEVICE |
KR20210018059A (en) | 2019-08-08 | 2021-02-17 | 티디케이가부시기가이샤 | Conductive terminal and electronic device |
US11367572B2 (en) | 2019-08-08 | 2022-06-21 | Tdk Corporation | Conductive terminal and electronic device |
US11646163B2 (en) | 2020-05-27 | 2023-05-09 | Tdk Corporation | Electronic device |
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