JPH0541128U - Surface mount type parallel connection cap - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a surface mounting type parallel connection cap capable of surface mounting on a printed circuit board by connecting a plurality of chip multilayer ceramic capacitors in parallel. [Structure] A parallel connection portion 2 provided with a plurality of grooves 2a for mounting a chip monolithic ceramic capacitor 5 and a surface mounting terminal 3 are integrally formed. The standing wall 4 is formed between the parallel connection part 2 and the terminal 3 to reduce the thermal influence at the time of soldering.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a surface-mount type parallel connection cap, and more particularly to a surface-mount type parallel connection cap that can connect a plurality of chip laminated ceramic capacitors in parallel.

[0002]

[Prior Art]

 Conventionally, when connecting chip monolithic ceramic capacitors in parallel to obtain a large capacity, a printed circuit board 51 with terminals for chip monolithic ceramic capacitor parallel connection is used as shown in FIG. One mounted chip multilayer ceramic capacitor 53 is arranged on each of the front surface and the back surface of the printed circuit board with terminal 51, and the chip multilayer ceramic capacitor 53 and the printed circuit board 51 are connected by soldering 54 to obtain a large capacity. Is generally obtained.

Here, the chip laminated ceramic capacitor 53 with the cap 52 is used for the purpose of mitigating the thermal effect at the time of soldering and mitigating the invasion of moisture.

[0004]

[Problems to be solved by the device]

 However, in the conventional configuration, the terminals of the printed circuit board with terminals on which the chip monolithic ceramic capacitors are mounted are used to mount them on the target printed circuit board, so the chip monolithic ceramic capacitors can be directly surface-mounted on the target printed circuit board. There wasn't.

Further, when mounting the printed circuit board with terminals on a target printed circuit board, it is necessary to pay attention to the thermal influence on the soldered portion between the printed circuit board with terminals and the cap.

An object of the present invention is to provide a surface mounting type parallel connection cap that can be surface-mounted directly on a target printed circuit board by connecting a plurality of chip multilayer ceramic capacitors in parallel.

[0007]

[Means for Solving the Problems]

 The surface mount type parallel connection cap of the present invention integrally includes a parallel connection part having a plurality of grooves for mounting the chip monolithic ceramic capacitor and a surface mount terminal.

[0008]

【Example】

 Next, the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of a surface-mount type parallel connection cap according to an embodiment of the present invention, and FIG. 2 is a perspective view showing an actual use state of the surface-mount type parallel connection cap shown in FIG.

In FIG. 1 and FIG. 2, a surface mount type parallel connection cap 1 is formed by bending a plate-shaped material having conductivity by a press method, and is formed by a parallel connection portion 2 including two grooves 2 a. A surface mounting terminal 3 continuous with the parallel connection portion 2 is integrally formed via a standing wall 4.

The groove 2a is formed with a width dimension, a depth dimension and a length dimension according to the chip monolithic ceramic capacitor 5 to be used.

The surface-mount type parallel connection cap 1 is surface-mounted on the printed circuit board by mounting the chip monolithic ceramic capacitor 5 in the groove 2a and then soldering the terminals 3 to the printed circuit board (not shown). Therefore, the standing wall 4 formed between the parallel connection portion 2 and the terminal 3 alleviates the thermal influence on the chip monolithic ceramic capacitor 5 mounted in the groove 2a when the terminal 3 is soldered, and also has an appropriate degree. It is formed with a height and shape that can secure various strengths.

A procedure for connecting a plurality of chip multilayer ceramic capacitors 5 in parallel using the surface-mounting parallel connection cap 1 configured as described above and surface-mounting them on a printed circuit board will be described.

First, the grooves 2a of the two surface-mount type parallel connection caps 1 are arranged so as to face each other, and the electrodes of the chip monolithic ceramic capacitor 5 are fitted into the grooves 2a using a conductive adhesive such as silver paste. And glue. As a result, it is possible to connect the two chip monolithic ceramic capacitors 5 in parallel by the two surface mount type parallel connection caps 1. Then, the surface mounting type parallel connection cap 1 to which the two chip monolithic ceramic capacitors 5 are adhered is arranged on the printed board, and the terminals 3 are soldered to the printed board for surface mounting.

FIG. 3 is a perspective view of a surface mounting type parallel connection cap according to another embodiment of the present invention, and FIG. 4 is a perspective view showing an actual use state of the surface mounting type parallel connection cap shown in FIG. The same parts and parts having the same functions as those in the above-described embodiment are designated by the same reference numerals and the description thereof will be omitted.

The surface-mount type parallel connection cap 11 shown in FIG. 3 is formed in the same manner as the surface-mount type parallel connection cap 1 described above, and the plurality of grooves 2 a provided in the parallel connection part 2 are 2 respectively. It is formed so that individual chip monolithic ceramic capacitors 5 can be attached.

Therefore, by using the surface mount type parallel connection cap 11 of this embodiment, as shown in FIG. 4, four chip monolithic ceramic capacitors 5 are connected in parallel and surface mounted on a printed circuit board. Is possible.

[0018]

[Effect of the device]

 As described above, in the present invention, the parallel connection part having a plurality of grooves and the surface mounting terminal are integrally formed. Therefore, the conventional printed circuit board with terminals for parallel connection of the chip multilayer ceramic capacitors should be used. Instead, multiple chip monolithic ceramic capacitors can be connected in parallel and surface-mounted on a printed circuit board.

Further, when the surface mount type parallel connection cap is soldered to the printed circuit board, since the soldering part is only the terminal and the printed circuit board, the thermal effect on the chip multilayer ceramic capacitor is higher than that of the conventional printed circuit board with the terminal. It is possible to reduce the above-mentioned problem, and further there is an effect that reliability is improved because the number of connecting portions is small.

[Brief description of drawings]

FIG. 1 is a perspective view of a surface-mount type parallel connection cap according to an embodiment of the present invention.

FIG. 2 is a perspective view showing an actual use state of the surface-mount type parallel connection cap shown in FIG.

FIG. 3 is a perspective view of a surface mount type parallel connection cap according to another embodiment of the present invention.

FIG. 4 is a perspective view showing an actual use state of the surface-mount type parallel connection cap shown in FIG.

FIG. 5 is a perspective view illustrating a conventional parallel connection state.

[Explanation of symbols]

 1,11 Surface mount type parallel connection cap 2 Parallel connection part 2a Groove 3 Terminal 4 Standing wall

Claims (1)

[Scope of utility model registration request] 1. A surface mount type parallel connection cap for connecting chip monolithic ceramic capacitors in parallel, wherein a parallel connection part having a plurality of grooves for mounting the chip monolithic ceramic capacitors and a surface mounting terminal are integrated. Characteristic surface mount type parallel connection cap.