JPS63172170U - - Google Patents
Info
- Publication number
- JPS63172170U JPS63172170U JP6480987U JP6480987U JPS63172170U JP S63172170 U JPS63172170 U JP S63172170U JP 6480987 U JP6480987 U JP 6480987U JP 6480987 U JP6480987 U JP 6480987U JP S63172170 U JPS63172170 U JP S63172170U
- Authority
- JP
- Japan
- Prior art keywords
- board
- circuit board
- printed circuit
- terminal
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図ａは、本考案の一実施例の斜視図、第１
図ｂは、本考案の一実施例の断面図、第２図は従
来例の断面図を示す。
１……プリント基板Ａ、２……端子Ａ、３……
段差、４……プリント基板Ｂ、６……端子Ｂ、７
……ハンダ。
FIG. 1a is a perspective view of an embodiment of the present invention;
FIG. b shows a sectional view of an embodiment of the present invention, and FIG. 2 shows a sectional view of a conventional example. 1...Printed circuit board A, 2...Terminal A, 3...
Step, 4...Printed circuit board B, 6...Terminal B, 7
...Solder.
Claims (1)
板に少なくとも１枚の他のプリント基板と接続す
る端子と少なくとも１枚の他のプリント基板を配
置するための段差とを設け、該段差に配置する他
の基板の端には、該基板と接続する端子を設け、 前記プリント基板と少なくとも１枚の他のプリ
ント基板間の接続は、該基板端の端子のハンダ付
、導電ペーストの塗布、異方性導電膜の熱圧着の
少なくとも１つの手段で行うことを特徴とするプ
リント基板の接続構造。[Claims for Utility Model Registration] In a printed circuit board on which electronic components are mounted, the circuit board is provided with a terminal for connecting to at least one other printed circuit board and a step for arranging at least one other printed circuit board, A terminal for connection to the other board is provided at the end of the other board placed on the step, and the connection between the printed board and at least one other printed board is made by soldering the terminal at the end of the board or using conductive paste. A connection structure for a printed circuit board, characterized in that the connection structure is carried out by at least one of coating the anisotropic conductive film and thermocompression bonding the anisotropic conductive film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6480987U JPS63172170U (en) | 1987-04-28 | 1987-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6480987U JPS63172170U (en) | 1987-04-28 | 1987-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63172170U true JPS63172170U (en) | 1988-11-09 |
Family
ID=30901306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6480987U Pending JPS63172170U (en) | 1987-04-28 | 1987-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63172170U (en) |
-
1987
- 1987-04-28 JP JP6480987U patent/JPS63172170U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH01168951U (en) | ||
| JPS61136576U (en) | ||
| JPH0455162U (en) | ||
| JPS596865U (en) | Electrical component | |
| JPS6265869U (en) | ||
| JPS6343352U (en) | ||
| JPH0369269U (en) | ||
| JPS6344474U (en) | ||
| JPS646029U (en) | ||
| JPS6423883U (en) | ||
| JPS6212982U (en) | ||
| JPS5878680U (en) | Printed wiring board connection device | |
| JPS6217176U (en) | ||
| JPH0167725U (en) | ||
| JPS62133382U (en) | ||
| JPH0459182U (en) | ||
| JPS6320497U (en) | ||
| JPS62135363U (en) | ||
| JPS6240884U (en) | ||
| JPS6316479U (en) | ||
| JPH01121968U (en) | ||
| JPS59125880U (en) | connection device | |
| JPS6280373U (en) | ||
| JPS5996870U (en) | printed wiring board | |
| JPH0323962U (en) |