JPH10312932A - Electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable an electronic component element soldered to a cap to be prevented from getting out of position and protected against a characteristic failure caused by a thermal shock by a method wherein the electronic component element is placed on a pawl which extends upward from the lower surface of a U-shaped cap and is connected to the cap. SOLUTION: An outer electrode 2 is provided to each side of two ceramic capacitor elements 1, and the ceramic capacitor elements 1 are bonded together with epoxy resin adhesive agent 3. The bonded capacitor element group composed of two capacitor elements 1 is laterally fitted in a space between two U-shaped caps 4 making their sides bear against the caps 4 respectively, a pawl 5 is provided to each of the caps 4 extending upward from their lower surfaces, and the bonded capacitor element group is placed and supported on the pawls 5 making its lower side face down. The outer electrodes 2 of the bonded capacitor element group are connected to the caps 4 by melting cream solder previously applied onto the inner sides of the caps 4. By this setup, an electronic component element can be prevented from getting out of position and protected against a characteristic failure caused by a thermal shock.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to electronic components such as ceramic capacitors and ceramic varistors.

[0002]

2. Description of the Related Art Electronic components surface-mounted on electronic circuit boards include, for example, ceramic capacitors and ceramic varistors. These electronic components include a laminated type, a single plate-shaped component, and a component in which a plurality of plate-shaped components are used by laminating them. There is a configuration in which a metal cap is fitted into the formed external electrode, and a lower portion of the cap is soldered to a circuit board. FIG. 4 shows a configuration of a conventionally used ceramic capacitor with a cap. That is, external electrodes 12 are formed on both side surfaces of the two ceramic capacitor elements 11, and an adhesive 1 made of epoxy resin is provided between the lower and upper surfaces of the capacitor elements 11.
3 is applied and two of them are bonded to each other in a plane.
Cap 1 with cream solder applied to the inside of one group in advance
4 was fitted, dried and heated to connect the external electrode 12 of the capacitor element 11 to the cap 14.

[0003] However, in such a ceramic capacitor with a cap, when the capacitor is mounted on the circuit board 15 by soldering, the solder between the external electrode 12 and the cap 14 may start to melt due to heating by soldering. There has been a problem that the position of the capacitor element 11 is displaced or a characteristic defect occurs due to thermal shock.

Although the thickness of the capacitor element 11 varies depending on the capacitance and the like, in order to reduce the number of types of the caps 14, if the capacitor element 11 is to be used in common regardless of the thickness of the capacitor element 11, As described above, a gap is formed on the lower surface, and the capacitor element 11 is displaced in the same manner as described above, and has a disadvantage of causing poor characteristics due to thermal shock.

[0005]

As described above, in a conventional electronic component with a cap, when an electronic component such as a capacitor is soldered to a circuit board, the electronic component such as a capacitor element is placed inside the cap. In this case, there is a problem that the position is displaced or a characteristic defect occurs.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks, and has as its object to provide an electronic component which eliminates a displacement of an electronic component element soldered to a cap and does not cause a characteristic defect due to thermal shock. It is.

[0007]

In order to solve the above-mentioned problems, the invention according to claim 1 provides a single electronic component element,
Or an electronic component element group having two or more electronic component elements bonded thereto, and a pair of U-shaped or box-shaped caps in which the electronic component elements are fitted on the inner upper surface and their external electrodes are connected. An electronic component, wherein a component element is mounted on and connected to a claw or a projection formed upward from a lower surface of the U-shaped or box-shaped cap.

In the electronic component according to the first aspect,
Even when the electronic component is soldered to the circuit board, the lower surface of the electronic component element is placed on and supported by claws or projections formed upward from the lower surface of the cap, so that the position of the electronic component element is maintained. Does not shift up and down and left and right, and since a gap is maintained between the circuit board and the lower surface of the electronic component, it is possible to eliminate poor characteristics due to thermal shock.

Further, depending on the height of the claws or projections provided on the lower surface of the cap, it is possible to have versatility to mount the lower surface of various thicknesses and various numbers of electronic component elements. There are also features that can be done.

The number of claws or projections provided on the cap is not limited to one, and two or more claws or projections may be provided in consideration of the depth of the cap.

[0011]

An embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 1, the two ceramic capacitor elements 1 have external electrodes 2 formed on the side surfaces thereof, and are bonded with an adhesive 3 made of epoxy resin. The U-shaped cap 4 shown in FIG. 2 was fitted into the two side surfaces of the two capacitor element 1 groups bonded by this bonding from the left and right. The cap 4 is provided with a claw 5 formed upward from the lower surface, and the group of capacitor elements 1 is placed on the lower surface of the claw 5 and supported. Since cream solder is applied to the inner surface of the cap 4 in advance, the cream solder comes into contact with the external electrode 2 of the capacitor element 1.

As described above, the group of capacitor elements 1 with the caps 4 fitted on both sides are dried and heated, so that the cream solder applied to the caps 4 is melted. A group of external electrodes 2 and caps 4 are connected.

The ceramic capacitor thus manufactured is surface-mounted on the electronic circuit board 6 by soldering. By this mounting, even if the solder connecting the external electrode 2 and the cap 4 melts, the group of capacitor elements 1 is mounted and supported on the lower surface of the cap 4 on the claw 5 of the cap 4, so that the displacement is reduced. No capacitor element 1
An effect that does not affect the connection between the group and the cap 4 can be obtained.

In the above-described embodiment, the configuration in which the capacitor element group 1 is mounted on the claw 5 formed upward from the lower surface of the cap 4 has been described. A similar effect can be obtained with the configuration.
The number of the claws 5 and the projections may be two or more. Further, in the embodiment, the pair of caps 4
2, the nails 5 are formed facing each other as shown in FIG. 2. However, the angles of the nails are changed by 90 degrees to form the caps from the front to the back or from the back to the front. The configuration may be as follows.

In the above embodiment, the U-shaped cap 4 is used.
Has been described, but the same effect can be obtained by using a box-shaped cap as shown in FIG.

In the above embodiment, the case where a ceramic capacitor is used as an electronic component has been described. However, the present invention can also be applied to a varistor, a resistor, or an electronic component that is a combination thereof.

[0017]

As described above, in the electronic component according to the present invention, the position of the electronic component element does not shift even by heating when the electronic component is soldered to the circuit board. Defective characteristics can be eliminated. Furthermore, it has the feature that the number of types of caps can be reduced.

[Brief description of the drawings]

FIG. 1 is a front view showing a state where an electronic component according to the present invention is mounted on a circuit board.

FIG. 2 is a perspective view showing one embodiment of a cap according to the present invention.

FIG. 3 is a perspective view showing another embodiment of the cap according to the present invention.

FIG. 4 is a front view showing a state in which an electronic component according to a conventional example is mounted on a circuit board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Capacitor element 2 ... External electrode 3 ... Adhesive 4 ... U-shaped cap 5 ... Claw

Claims (1)

[Claims] 1. An electronic component element group in which one electronic component element or two or more electronic component elements are bonded, and a pair of U-shaped or a pair in which the electronic component element is fitted on an inner upper surface and an external electrode thereof is connected. An electronic component comprising a box-shaped cap, wherein the electronic component element is mounted on a claw or a projection formed upward from a lower surface of the U-shaped or box-shaped cap.