JPH06283301A - Composite chip electronic parts and their manufacture - Google Patents

Abstract

PURPOSE:To mount chip type electronic parts on a board with a few man-hours with a further increased packing density, to prevent the electrodes of each parts from being eroded by solder so as to improve the surface mountability of the parts, and to easily manufacture the parts. CONSTITUTION:This electronic parts are constituted by uniting parallelepiped chip type electronic parts 11 and 12 in one body respectively having terminal electrodes 11b and 11c and 12b and 12c at their both end faces and the same shape and same size at one faces other than the end faces. The composite electronic parts are provided with a junction body 1 formed by jointing the chip type electronic parts with each other after putting together so that the terminal electrodes can be flushed in one plane and the faces having the same shape and size can be brought into contact with each other and lead frames 13 and 13 which are electrically connected to the terminal electrodes so that the frames 13 and 13 can collectively cover the terminal electrodes on the junction body 14. These chip type electronic parts include two or more kinds of electronic parts selected from among a chip type resistor 11, chip type thermistor 12, chip type capacitor, chip type varister, etc.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip type composite electronic component in which a plurality of chip type electronic components are joined. More specifically, the present invention relates to a chip-type composite electronic component in which two or more types of chip-type electronic components selected from the group consisting of a chip-type thermistor, a chip-type resistor, a chip-type capacitor, a chip-type varistor and the like are joined, and a method for manufacturing the same.

[0002]

2. Description of the Related Art Chip-type electronic components such as chip-type thermistors, chip-type resistors, chip-type capacitors, and chip-type varistor are commercially available as surface mount components to be mounted on a printed circuit board. In these chip-type electronic components, terminal electrodes formed on both end faces in a leadless manner are directly connected to printed wiring on the substrate. Therefore, the chip-type electronic component occupies a small space for mounting, which greatly contributes to downsizing of electronic devices. These chip-type electronic components are separately mounted on a conventional printed circuit board. For example, when a temperature compensation circuit is assembled on a board, a chip thermistor and a chip capacitor are individually mounted on the circuit board in addition to the chip thermistor.

[0003]

Therefore, when a plurality of chip-type electronic components are mounted on the substrate, the number of man-hours for assembling the electronic components on the substrate is required, and the mounting density of the components on the substrate is further increased. It was an obstacle to the above.

An object of the present invention is to reduce the number of parts when assembling an electronic circuit on a printed circuit board, to mount the electronic circuit on the board with a small number of assembling steps, and to further increase the mounting density on the board. It is to provide a composite electronic component. Another object of the present invention is to provide a chip-type composite electronic component which is free from electrode erosion due to the solder of the chip-type electronic component that is a component and has excellent surface mountability. Still another object of the present invention is to provide a method capable of easily manufacturing a chip-type composite electronic component.

[0005]

A configuration of the present invention for achieving the above object will be described with reference to FIG. 1 corresponding to an embodiment. The chip-type composite electronic component 10 of the present invention has a plurality of chip-type rectangular parallelepipeds each having terminal electrodes 11b, 11c, 12b, 12c on both end faces and having the same shape and the same size on any face other than these end faces. Electronic parts 11 and 12 are integrated, and a plurality of chips are arranged such that a plurality of terminal electrodes 11b and 12b or 11c and 12c are on the same surface and surfaces of the same shape and size are in contact with each other. And a plurality of terminal electrodes 11b, 11c, 1 in which the bonded body 14 is aligned.
2b and 12c are collectively provided with lead frames 13 and 13 electrically connected to these terminal electrodes. The characteristic configuration is that these chip type electronic components are selected from the group consisting of a chip type resistor 11, a chip type thermistor 12, a chip type capacitor and a chip type varistor.
There are more than one type of chip-type electronic component.

A method for manufacturing a chip-type composite electronic component of the present invention is a method of integrating two or more kinds of rectangular parallelepiped chip-type electronic components, and a plurality of terminal electrodes 11b, 12b or 11c, 12c are the same. A plurality of chip-type electronic components 11 and 12 are aligned so as to form a surface, and a plurality of chip-type electronic components are overlapped so that the surfaces of the same shape and the same size are in contact with each other to form a bonded body 14, and the surface is solder-plated. The lead frames 13 and 13 are fixed by fixing the lead frames 13 and 13 collectively covering the plurality of terminal electrodes 11b, 11c, 12b and 12c of the joined body 14
This is a method of melting each solder plating of the bonded body 14 and the lead frames 13, 13 to bond the lead frame to the bonded body.

[0007]

Since the lead frames 13, 13 collectively serve as external electrodes, the number of surface mounting steps can be reduced. Since the lead frame is solder-plated when soldered to the board, it has excellent solder wettability and is easily mounted on the board. In addition, the lead frame prevents the terminal electrodes of the chip-type electronic components 11 and 12 from being damaged by the solder, and relaxes the stress on the electronic components when the temperature changes.

[0008]

Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 shows a chip type composite electronic component 10 according to a first embodiment of the present invention. In this example, as shown in FIG. 1, the chip-type composite electronic component 10 comprises a chip-type resistor 11, a chip-type thermistor 12, and lead frames 13, 13. Figure 1
As shown in (a), the chip-type resistor 11 has a rectangular parallelepiped bare chip 11a in which a resistance film (not shown) is provided on the surface of a high dielectric material such as alumina, and both ends of this bare chip 11a include Ag. The conductive paste is applied, dried, and baked to form the terminal electrodes 11b and 11c. The chip type thermistor 12 has a rectangular parallelepiped bare chip 12a having the same shape and size as the bare chip 11a, which is made from ceramic powder for thermistor made of oxide powder such as Mn, Co, Ni, Fe, etc. as a starting material. A conductive paste containing Ag is applied to both end surfaces of the electrode, dried, and baked to form the terminal electrodes 12b and 12c.

These terminal electrodes 11b, 11c, 12
Solder plating is applied to each surface of b and 12c.
As shown in (b), the chip type resistor 11 and the chip type thermistor 12 are aligned so that these terminal electrodes 11b, 12b or 11c, 12c are on the same plane, and these are arranged in the vertical direction, that is, the same size and the same size. The lower surface and the upper surface are superposed so that they are in contact with each other. Here, it is preferable to apply an adhesive agent of a thermosetting resin such as an epoxy resin to the surfaces in contact with each other and join them. The lead frames 13 and 13 are formed, for example, by bending a Cu plate into a U-shape, and the entire surface thereof is previously subjected to solder plating. This lead frame 1
3 and 13 are a chip type resistor 11 and a chip type thermistor 12.
It has such a size that it is fitted into both ends of the bonded body 14 and covers both ends of the bonded body 14.

As shown in FIG. 1C, after applying high temperature cream solder to the inner surfaces of the lead frames 13 and 13 to fit the lead frames 13 and 13 into both ends of the joined body 14, the joined body 14 is joined. The terminal electrodes 11b, 11c, 12b, 12c are soldered to the lead frames 13, 13 by putting them in a heating furnace and melting the cream solder. The chip-type composite electronic component 10 thus obtained constitutes the equivalent circuit shown in FIG. 3, the same symbols as in FIG. 1 indicate the same components.

FIG. 2 shows a chip type composite electronic component 20 according to the second embodiment of the present invention. 2, the same symbols as in FIG. 1 indicate the same components. In this example, the chip-type composite electronic component 20
Is composed of a chip type capacitor 16, a chip type thermistor 12, and lead frames 13, 13. The chip type capacitor 16 is a chip type multilayer ceramic capacitor,
The bare chip 16a is a sintered body obtained by alternately laminating internal electrodes and barium titanate-based or lead-based dielectric layers and then firing the layers. The terminal electrodes 16b and 16c are formed by applying a conductive paste containing Ag onto both end surfaces of the bare chip, drying and baking the same, and the surface of the terminal electrodes is subjected to solder plating.

Chip-type capacitor 1 as in the first embodiment
6 and the chip type thermistor 12 are superposed and joined, and the lead frames 13 and 13 are fitted to both ends of the joined body 24, and then the joined body 24 is put into a heating furnace to melt the cream solder and to make the terminal electrodes 16b and 16c. , 12b, 12c
Are soldered to the lead frames 13, 13. The chip-type composite electronic component 20 thus obtained constitutes the equivalent circuit shown in FIG. 4, the same reference numerals as those in FIG. 2 indicate the same components.

FIG. 6 shows a chip type composite electronic component 30 according to a third embodiment of the present invention. 6, the same reference numerals as those in FIGS. 1 and 2 denote the same components. In this example, the chip-type composite electronic component 30 includes a chip-type resistor 31 and a chip-type thermistor 32.
And chip type capacitor 36 and lead frames 33, 33
Consists of. These bare chips 31a, 32a, 36a
Is thicker and narrower than the bare chips of the first and second embodiments. Terminal electrodes 31b, 31c, 32b, 3
2c, 36b, and 36c are solder-plated on their respective surfaces, and then these terminal electrodes 31b, 32b, 36b, or 31
The thermistor 32 and the capacitor 36 are arranged on both sides of the resistor 31 so that c, 32c, and 36c are on the same plane, and the three chip-type electronic components are aligned in the horizontal direction so that side surfaces of the same shape and size contact each other. Overlaid on. Here, as in the first embodiment, three chip-type electronic components 3 are formed with an adhesive.
2, 31, 36 are joined.

Thereafter, the lead frames 33, 33 bent into a U-shape as in the above-described embodiment are fitted into both ends of the joined body 34, and then the joined body 34 is put in a heating furnace to melt the cream solder and to make a terminal. Electrodes 31b, 32b, 36b,
31c, 32c, 36c are soldered to the lead frames 33, 33. The chip-type composite electronic component 30 thus obtained constitutes the equivalent circuit shown in FIG. 5, the same symbols as in FIG. 6 indicate the same components.

In the above example, the chip-type electronic component is a chip-type resistor, a chip-type thermistor, or a chip-type capacitor, but the component parts of the present invention may be other chip-type electronic components such as a chip-type varistor. Can be used. Further, although the lead frame having a U-shaped cross section is illustrated, the lead frame may have an L-shaped cross section. The material is C
Not limited to u, another conductive metal plate may be used. Furthermore, the number of chip-type electronic components to be combined is not limited to two or three, and may be four or more. The stacking method is not limited to a single direction, and the vertical direction and the horizontal direction may be combined. Good.

[0016]

As described above, the present invention has the following excellent effects. (a) When assembling a predetermined electronic circuit on a printed circuit board,
Since the number of chip-type electronic components is integrated, the number of man-hours for assembling the components can be reduced, and the area occupied by the board is reduced, thus saving space. (b) By providing the external electrodes by the lead frame, when soldering the chip-type composite electronic component to the board, the molten solder does not directly contact each terminal electrode in the lead frame, and the terminal electrodes are not corroded by the solder. We do not occur. This does not impair the characteristics of each electronic component. (c) By providing the external electrodes by the lead frame, the stress on each electronic component is relieved even in the temperature cycle test. (d) By using high-temperature solder for joining each terminal electrode and the lead frame, reflow soldering by eutectic cream solder is possible and productivity is improved.

[Brief description of drawings]

FIG. 1 is a perspective view showing manufacturing of a chip-type composite electronic component according to a first embodiment of the present invention.

FIG. 2 is a perspective view of a chip-type composite electronic component of a second embodiment of the present invention.

3 is an equivalent circuit diagram of the chip-type composite electronic component shown in FIG.

FIG. 4 is an equivalent circuit diagram of the chip-type composite electronic component shown in FIG.

FIG. 5 is an equivalent circuit diagram of the chip-type composite electronic component of the third embodiment of the present invention.

FIG. 6 is a perspective view showing its manufacture.

[Explanation of symbols]

10, 20, 30 Chip type composite electronic component 11, 31 Chip type resistor 12, 32 Chip type thermistor 13, 33 Lead frame 14, 24, 34 Joint body 16, 36 Chip type capacitor 11b, 11c, 12b, 12c, 16b, 16c terminal electrode 31b, 31c, 32b, 32c, 36b, 36c terminal electrode

Claims (2)

[Claims] 1. Terminal electrodes (11b, 11c, 12) on both end faces, respectively.
b, 12c, 16b, 16c), and a plurality of chip-type electronic components (1
1,12,16) is a chip-type composite electronic component (10,20) integrated, wherein the plurality of terminal electrodes (11b, 11c, 12b, 12c, 16b, 16c) are on the same surface. A joined body (14, 24) obtained by stacking and joining the plurality of chip type electronic components so that the surfaces of the same shape and the same size are in contact with each other, and the joined body (14, 2)
4) Aligned multiple terminal electrodes (11b, 11c, 12b, 12c, 16b, 16c)
And a lead frame (13, 13) electrically connected to the terminal electrodes so as to collectively cover, the plurality of chip-type electronic components are chip-type resistors (11), chip-type thermistors (12), A chip-type composite electronic component, which is two or more types of chip-type electronic components selected from the group of chip-type capacitors (16) and chip-type varistor. 2. A chip type resistor having terminal electrodes (11b, 11c, 12b, 12c, 16b, 16c) each of which is plated with solder on both end faces and having the same shape and the same size on the faces other than the both end faces ( 11), a chip type thermistor (12), a chip type capacitor (16), and a chip type composite electronic component (10, 10) that integrates two or more rectangular parallelepiped chip type electronic components selected from the group of a chip varistor.
20) manufacturing method, wherein the plurality of chip-type electronic components (1b, 11c, 12b, 12c, 16b, 16c) so that each of the plurality of terminal electrodes (11b, 11c, 12b, 12c, 16b, 16c) are on the same plane.
1,12,16) are aligned, and the chip-shaped electronic components are stacked so that the same-sized and same-sized surfaces are in contact with each other to form a bonded body (14, 24), and the surface is solder-plated. Lead frame (13,13)
By the plurality of terminal electrodes (11b,
(11c, 12b, 12c, 16b, 16c) are fixed together to fix the lead frame (13, 13), and the solder plating of the joint body (14, 24) and the lead frame (13, 13) Is melted and the lead frame is bonded to the bonded body.