JP2556410Y2 - Collective electronic components - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a method for forming a plurality of individual electrodes on a front surface of a substrate, forming a common electrode on the rear surface opposite to the individual electrodes, and connecting the individual electrodes and the common electrode to lead terminals. The present invention relates to a collective electronic component to which is attached.

[0002]

2. Description of the Related Art Conventionally, a capacitor network as an example of this kind of collective electronic component is, for example, shown in FIG.
And (b). FIG. 2 (a)
Shows the front side of the capacitor network, and FIG. 2B shows the back side thereof.

In FIG. 1, a substrate 11 is formed in a square shape having a pair of sides in a horizontal direction and a pair of sides in a vertical direction, and a plurality of individual electrodes 12 are formed on the surface thereof along the vertical sides. Are formed in parallel. Further, a common electrode 13 is formed on the back surface so as to face each of the plurality of individual electrodes 12.

The common electrode 13 has an extension 13a at one end in the left-right direction of the substrate 11 which does not face the individual electrode 12, and a lower portion excluding the extension 13a has an insulating film. 14 are formed.

[0005] A plurality of lead terminals 15 are connected and attached to the individual electrodes 12 and the common electrode 13 along one side in the left-right direction of the substrate 11, respectively. The lead terminal 15 has a bifurcated holding portion 15 at its tip.
The dielectric substrate 11 is attached to the substrate 11 by sandwiching the derivative substrate 11 in the front and back direction with the sandwiching portion 15a.

Here, the lead terminal 15 connected to the individual electrode 12 does not short-circuit the individual electrode 12 and the common electrode 13 because the insulating film 14 is formed below the common electrode 13. . The lead terminal 15 connected to the common electrode 13 is attached to the extension 13a of the common electrode 13, and the individual electrode 12 does not exist at a position facing the extension 13a. Is not short-circuited.

A capacitor network as an example of a collective electronic component configured as described above has an equivalent circuit shown in FIG.

[0008]

However, the substrate 11 of the collective electronic component configured as described above has not only the directionality in the front and back direction but also the individual electrode 12, the common electrode 13, and the insulating film 14. There is also a directionality in the vertical direction due to the formation position of.

[0009] Therefore, when mounting the lead terminals 15, the front and back directions of the substrate 11 must be aligned with the vertical direction, and there has been a problem that the assembly process of the collective electronic components becomes complicated.

The present invention has been made in view of the above problems, and has as its object to provide a collective electronic component capable of simplifying an assembling process.

[0011]

In order to achieve the above object, a collective electronic component according to the present invention comprises a substrate, a plurality of individual electrodes formed on the surface of the substrate, and a plurality of individual electrodes formed on the rear surface. A common electrode, and a plurality of lead terminals respectively connected to the individual electrode and the common electrode, and the substrate is formed in a square shape having a pair of left and right sides and a pair of vertical sides. The plurality of individual electrodes are formed in parallel along the vertical side of the substrate, and the lower part of the one end individual electrode and the upper part of the other end individual electrode are covered with an insulating film, respectively. The common electrode is formed so as to face each individual electrode, and is insulated except at least a lower portion corresponding to the one end individual electrode and an upper portion corresponding to the other end corresponding to the individual electrode. Multiple lead terminals covered with film They are arranged in parallel along one side of the lateral direction of the substrate, and is characterized in that attached by sandwiching the substrate portion of the position formed with the respective individual electrodes in the front and back direction.

[0012]

The individual electrode at one end is covered by an insulating film at the lower portion thereof and the individual electrode at the other end is covered by an insulating film, and the common electrode is at least below the position corresponding to the individual electrode at the one end. Except for the side portion and the upper portion of the other end corresponding to the individual electrode, the portion is covered with an insulating film. Therefore, even if the vertical direction of the substrate is reversed, the portion covered by the insulating film of the individual electrode and the portion not covered by the insulating film of the common electrode are located at the same position. At the time of mounting work, only the front and back directions of the substrate need be aligned.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 shows a capacitor network which is an example of the collective electronic component of the present invention. FIG. 1 (a) shows the front side and FIG. 1 (b) shows the back side.

In FIG. 1, a substrate 1 is made of a ceramic material such as barium titanate or titanium oxide, and is formed in a square shape having a pair of left and right sides and a pair of vertical sides. Ag, A on the surface of the substrate 1
A plurality of individual electrodes 2 made of a g-Pd alloy or the like are formed in parallel along a vertical side. Of the plurality of individual electrodes 2, a lower portion 2 a of the one-side individual electrode 2 and an upper portion 2 b of the other-side individual electrode 2 are respectively covered with an insulating film 3 made of glaze or the like. These two insulating films 3
Are connected by an insulating film 4 made of glaze or the like formed across the individual electrode 2 at the center of the substrate 1 in the left-right direction.

Ag, Ag-Pd is formed on the back surface of the substrate 1 so as to face each of the plurality of individual electrodes 2.
A common electrode 5 made of an alloy or the like is formed. The common electrode 5 is formed of an insulating film 6 made of glaze or the like except for a lower portion 5a at a position corresponding to the individual electrode 2 at the one end and an upper portion 5b at a position corresponding to the individual electrode 2 at the other end. Covered. That is, the portions 5a and 5b of the common electrode 5 not covered with the insulating film 6 correspond to the portions 2a and 2b of the individual electrode 2 on the surface of the substrate 1 covered with the insulating film 3.

As described above, a plurality of lead terminals 7 are arranged in parallel along one side in the left-right direction of the substrate 1 on which the individual electrodes 2 and the common electrode 5 are formed. This lead terminal 7
Has a bifurcated sandwiching portion 7a at the tip end thereof. The sandwiching portion 7a sandwiches the substrate 1 at the position where each individual electrode 2 is formed in the direction of the front and back surfaces of the substrate 1 so that the substrate 1 Mounted on Of the plurality of lead terminals 7, the lead terminals 7 sandwiching the portion 2 a of the individual electrode 2 covered with the insulating film 3 are not connected to the individual electrode 2 due to the presence of the insulating film 3, and The portion 5 a not covered with the film 6 is connected to the common electrode 5. The other lead terminals 7 are not connected to the common electrode 5 covered with the insulating film 6, but are connected to the individual electrodes 2 respectively.

The assembled electronic component configured as described above is
It has the equivalent circuit shown in FIG. 3 in the same manner as the conventional example, and if necessary, an insulating sheathing material is applied to the whole.

The insulating film 4 connecting the insulating film 3 on the surface of the substrate 1 in the above embodiment is immersed in the molten solder of the lead terminals 7 and soldered to the individual electrodes 2 and the common electrode 5. In this case, the molten solder is prevented from spreading to the upper part of the individual electrode 2, or the substrate 1 and the entire lead terminal 7 are immersed in the molten solder to connect the lead terminal 7 to the individual electrode 2 and the common electrode. In the case of soldering the insulating film 5, the insulating film 4 acts to prevent a large solder peak from being formed on the surface of the individual electrode 2, but the insulating film 4 is not always essential.

The insulating film 6 covering the common electrode 5
May be removed as necessary at portions other than the portions described in the above embodiments.

The substrate 1 may be a barium titanate-based semiconductor substrate.

Further, the present invention is not limited to the capacitor network as in the above embodiment, but may be other collective electronic components such as a positive characteristic thermistor, a negative characteristic thermistor and a varistor. In short, if a plurality of individual electrodes are formed on the surface of a substrate made of a material for obtaining the required electrical characteristics, and a common electrode facing the individual electrodes is formed on the back surface, so that a collective electronic component is formed. Good. Therefore,
As the electrode material, a material suitable for the material of the substrate is appropriately selected.

[0023]

As apparent from the above description, according to the present invention, the lower electrode portion of the electrode at one end and the upper electrode portion of the individual electrode at the other end are covered with an insulating film. Since the electrodes are covered with an insulating film except for at least the lower part of the position corresponding to the individual electrode at one end and the upper part of the position corresponding to the individual electrode at the other end,
Even if the vertical direction of the substrate is reversed, the portion covered by the insulating film of the individual electrode and the portion not covered by the insulating film of the common electrode come to the same position. Therefore, it is only necessary to align the front and back sides of the board at the time of mounting the lead terminals, and the assembly process of the collective electronic component is simplified.

[Brief description of the drawings]

FIG. 1 is a diagram showing a capacitor network according to an embodiment of the present invention, wherein FIG. 1 (a) shows the front surface side and FIG. 1 (b) shows the back surface side thereof.

FIG. 2 is a diagram showing a conventional capacitor network;
FIG. 2A shows the front side, and FIG. 2B shows the back side.

FIG. 3 is a diagram showing an equivalent circuit of the collective electronic component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Individual electrode 3, 4, 6 Insulating film 5 Common electrode 7 Lead terminal 7a Holding part

Claims (1)

(57) [Scope of request for utility model registration] 1. A substrate (1), a plurality of individual electrodes (2) formed on the surface of the substrate (1), a common electrode (5) formed on the back surface thereof, and an individual electrode (2). Common electrode (5)
The substrate (1) is formed in a square shape having a pair of sides in the left-right direction and a pair of sides in the up-down direction. The individual electrode (2) is formed in parallel along the vertical side of the substrate (1), and has a lower portion (2) at one end of the individual electrode (2).
a) and the upper part (2b) of the other end of the individual electrode (2) are respectively covered with an insulating film (3), and the common electrode (5) is formed so as to face the individual electrode (2). The insulating film (6) excluding at least a lower part (5a) corresponding to the one end individual electrode (2) and an upper part (5b) corresponding to the other end individual electrode (2). )
And the plurality of lead terminals (7) are arranged in parallel along one side in the left-right direction of the substrate (1), and the substrate () at the position where each individual electrode (2) is formed 1)
A collective electronic component characterized by being mounted by sandwiching a portion in the direction of its front and back surfaces.