JPH0312446B2 - - Google Patents
Info
- Publication number
- JPH0312446B2 JPH0312446B2 JP57161275A JP16127582A JPH0312446B2 JP H0312446 B2 JPH0312446 B2 JP H0312446B2 JP 57161275 A JP57161275 A JP 57161275A JP 16127582 A JP16127582 A JP 16127582A JP H0312446 B2 JPH0312446 B2 JP H0312446B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- electrode material
- electronic component
- shaped electronic
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000007772 electrode material Substances 0.000 claims description 27
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 8
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Manufacturing Of Electric Cables (AREA)
Description
【発明の詳細な説明】
本発明は、チツプ状電子部品およびその製造方
法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a chip-shaped electronic component and a method for manufacturing the same.
従来、各種電子装置の電子部品として使用され
るチツプコンデンサ、チツプ抵抗、チツプインダ
クタ、LC複合チツプ、RC複合チツプ等のチツプ
状電子部品があり、これらチツプ状電子部品は、
一般に、添付図面の第１図に概略的に示すよう
に、コンデンサやインダクタ等の目的とする電気
回路素子を内部又は表面に有するセラミツク等の
絶縁基体１の両端に、その電気回路素子の両端に
それぞれ電気的に接続するようにして銀層等の外
部端子電極２を付与した構造をとつている。この
ようなチツプ状電子部品は、電子装置の電子部品
として使用されるときには、第２図に示すよう
に、プリント回路板３上の回路導体４Ａ及び４Ｂ
間に外部端子電極２をハンダ付けすることによ
り、その回路導体４Ａ及び４Ｂ間に電気的に接続
されると共に、プリント回路板３上に固定され
る。外部端子電極２と回路導体４Ａ及び４Ｂとの
間に付与されるハンダは、一般に、第２図にて参
照番号５にて示すような状態となり、外部端子電
極２の垂直端面全体からその垂直端面とほヾ等し
い回路導体４Ａ，４Ｂの表面積に亘つて付着す
る。従つて、外部端子電極２の垂直端面の面積が
大きい程、外部端子電極２と回路導体４Ａ，４Ｂ
との間に付着するハンダ量は多くなる。従来のチ
ツプ状電子部品の如く両端面の全体に亘つて外部
端子電極を形成するような構成では、電子部品の
厚みが厚い場合には、プリント回路板への取付け
の際の前述したようなハンダ量が多くなり過ぎて
しまい、そのようにハンダ量が多過ぎると、プリ
ント回路板に曲げ力等の外部変形力が加えられた
ときに、そのハンダ付け部に割れ等が生じ易く、
しばしば接続不良等の問題を生じていた。 Conventionally, there are chip-shaped electronic components such as chip capacitors, chip resistors, chip inductors, LC composite chips, and RC composite chips that are used as electronic components in various electronic devices.
Generally, as schematically shown in FIG. 1 of the accompanying drawings, an insulating substrate 1 made of ceramic or the like having a target electric circuit element such as a capacitor or an inductor inside or on its surface is attached at both ends of the electric circuit element. The structure is such that an external terminal electrode 2 such as a silver layer is provided so as to be electrically connected to each other. When such a chip-shaped electronic component is used as an electronic component of an electronic device, as shown in FIG.
By soldering the external terminal electrode 2 therebetween, the circuit conductors 4A and 4B are electrically connected and fixed on the printed circuit board 3. The solder applied between the external terminal electrode 2 and the circuit conductors 4A and 4B is generally in a state as shown by reference numeral 5 in FIG. It adheres over approximately equal surface areas of the circuit conductors 4A and 4B. Therefore, the larger the area of the vertical end surface of the external terminal electrode 2, the larger the area of the external terminal electrode 2 and the circuit conductors 4A, 4B.
The amount of solder that adheres between the two increases. In a structure in which external terminal electrodes are formed over the entirety of both end surfaces as in conventional chip-shaped electronic components, if the electronic component is thick, it is difficult to use the solder as described above when attaching it to a printed circuit board. If the amount of solder is too large, cracks are likely to occur in the soldered parts when external deformation force such as bending force is applied to the printed circuit board.
Problems such as poor connections often occurred.
本発明の目的は、このような従来の問題点を解
消しプリント回路板等への取付けを常に強固なも
のとすることができるようなチツプ状電子部品を
提供することであり、、また、そのようなチツプ
状電子部品の製造方法を提供することである。 The purpose of the present invention is to provide a chip-shaped electronic component that can solve these conventional problems and can be firmly attached to a printed circuit board, etc. An object of the present invention is to provide a method for manufacturing such a chip-shaped electronic component.
本発明によるチツプ状電子部品は、外部端子電
極の、プリント回路板へ載置接触させる側とは反
対側の部分を、ハンダの付きにくい電極材料にて
形成したことを特徴とする。 The chip-shaped electronic component according to the present invention is characterized in that the portion of the external terminal electrode on the opposite side from the side that is placed and brought into contact with the printed circuit board is formed of an electrode material that is difficult to solder.
本発明によるチツプ状電子部品の製造方法は、
チツプ状電子部品の絶縁基体の端面の全体に、ハ
ンダの付きにくい第１の電極材料を層状に付与
し、更に、この第１の電極材料層の、プリント回
路板へ載置接触させる側の部分を覆うようにし
て、ハンダの付きやすい第２の電極材料を層状に
付与することによつて、外部端子電極を端面に形
成することを特徴とする。 The method for manufacturing chip-shaped electronic components according to the present invention includes:
A first electrode material that is difficult to solder is applied in a layer to the entire end surface of the insulating substrate of the chip-shaped electronic component, and furthermore, a portion of the first electrode material layer is placed on the side that is placed in contact with the printed circuit board. The external terminal electrode is formed on the end surface by applying a layer of a second electrode material that is easy to solder so as to cover the external terminal electrode.
次に、添付図面の第３図、第４図及び第５図に
基づいて本発明の実施例について本発明をより詳
細に説明する。 Next, the present invention will be described in more detail with regard to embodiments of the present invention based on FIGS. 3, 4, and 5 of the accompanying drawings.
第３図は、本発明の一実施例としてのチツプ状
電子部品を斜視図にて概略的に示しており、この
実施例のチツプ状電子部品は、コンデンサ等の目
的とする電気回路素子を内部に有したセラミツク
基板１の両端に、外部端子電極２０を有してい
る。この外部端子電極２０の、プリント回路板へ
載置接触させる側とは反対側の部分２１は、ハン
ダの付きにくい電極材料にて形成されており、そ
の、プリント回路板へ載置接触させる側の部分２
２は、ハンダの付き易い電極材料にて形成されて
いる。 FIG. 3 schematically shows a chip-shaped electronic component as an embodiment of the present invention in a perspective view. The ceramic substrate 1 has external terminal electrodes 20 at both ends. The portion 21 of this external terminal electrode 20 on the side opposite to the side that is placed in contact with the printed circuit board is formed of an electrode material that is difficult to solder. part 2
2 is made of an electrode material that is easily soldered.
第４図Ａ及びＢは、第３図に示すようなチツプ
状電子部品の本発明による製造方法の一実施例を
説明するための図である。 FIGS. 4A and 4B are diagrams for explaining an embodiment of the method for manufacturing a chip-shaped electronic component as shown in FIG. 3 according to the present invention.
第３図のようなチツプ状電子部品を製造するた
めには、先ず、第４図Ａに概略断面図にて示すよ
うに、セラミツク基板１の両端面の全体に亘つ
て、ハンダの付きにくい第１の電極材料をメツキ
等の方法によつて付与することによつて、第１の
電極材料層２１を形成する。 In order to manufacture a chip-shaped electronic component as shown in FIG. 3, first, as shown in the schematic cross-sectional view in FIG. The first electrode material layer 21 is formed by applying the first electrode material by a method such as plating.
この第１の電極材料としては、例えば、銀ペー
ストにホウケイ酸鉛ガラス等のガラス15％程を添
加したものが好ましい。この場合、添加するガラ
スの量が多過ぎると、セラミツク基体１内のコン
デンサ等の電気回路素子の端子との電気的接触が
悪くなるので、添加するガラスの量は、10〜20％
が適当である。この第１の電極材料の主成分とし
て銀ペーストを用いるのは、コイル（インダク
タ）チツプの場合に好ましく、コンデンサチツプ
の場合には、パラジウム単独ペーストや銀とパラ
ジウムとの合金ペーストを主成分とするほうが好
ましい。第１の電極材料において、銀ペースト等
にガラスを添加するのは、セラミツク基体１の端
面に対する接着性を増す意味もあり、その添加量
は、この観点からも適宜選定されればよい。 The first electrode material is preferably, for example, silver paste to which about 15% of glass such as lead borosilicate glass is added. In this case, if the amount of glass added is too large, the electrical contact with the terminals of electric circuit elements such as capacitors in the ceramic substrate 1 will be poor, so the amount of glass added is 10 to 20%.
is appropriate. It is preferable to use silver paste as the main component of this first electrode material in the case of a coil (inductor) chip, and in the case of a capacitor chip, it is preferable to use a palladium paste alone or an alloy paste of silver and palladium as the main component. That's preferable. In the first electrode material, the addition of glass to the silver paste or the like has the purpose of increasing the adhesion to the end surface of the ceramic substrate 1, and the amount added may be appropriately selected from this point of view as well.
次に、第４図Ｂに概略断面図にて示すように、
第１の電極材料層２１の、プリント回路板へ載置
接触させる側の部分を覆うようにして、ハンダの
付きやすい第２の電極材料をメツキ等の方法によ
つて付与することによつて、第２の電極材料層２
２を形成する。 Next, as shown in the schematic cross-sectional view in FIG. 4B,
By applying a second electrode material, which is easy to solder, by a method such as plating, so as to cover the part of the first electrode material layer 21 on the side to be placed and brought into contact with the printed circuit board, Second electrode material layer 2
form 2.
この第２の電極材料としては、例えば、銀ペー
ストにガラス7.5％以下を添加したものが好まし
い。 The second electrode material is preferably, for example, silver paste with 7.5% or less of glass added.
本発明のチツプ状電子部品は、前述したような
構造であるので、第５図に示すように、プリント
回路板３の回路導体４Ａ及び４Ｂの外部端子電極
２０をハンダ付けする場合、プリント回路板へ載
置接触させる側とは反対側の部分のハンダ付きに
くい電極材料で形成された電極材料層２１にはハ
ンダが付かないので、参照番号５Ａで示す如く極
めて少量のハンダにて回路導体４Ａ，４Ｂと外部
端子電極２０とがハンダ付けされることになる。
このようなハンダ量の少ないハンダ部５Ａは、プ
リント回路板３に曲げ力等が加えられても、それ
に応じて十分伸びることができ、従つて、ハンダ
部に割れ等の生ずるおそれは全くなくなり、結
局、回路導体と外部端子電極との接続はより強固
なものとされる。 Since the chip-shaped electronic component of the present invention has the above-described structure, when soldering the external terminal electrodes 20 of the circuit conductors 4A and 4B of the printed circuit board 3, as shown in FIG. Since no solder is applied to the electrode material layer 21 formed of a hard-to-solder electrode material on the side opposite to the side where it is placed and brought into contact with the circuit conductor 4A, as shown by the reference number 5A, a very small amount of solder is applied to the electrode material layer 21. 4B and the external terminal electrode 20 are soldered.
The solder portion 5A having such a small amount of solder can be sufficiently stretched even when a bending force or the like is applied to the printed circuit board 3, and therefore there is no risk of cracking or the like occurring in the solder portion. As a result, the connection between the circuit conductor and the external terminal electrode is made stronger.
第１図は従来のチツプ状電子部品の一例を示す
概略斜視図、第２図は第１図のチツプ状電子部品
をプリント回路板上へ取り付けた状態を示す図、
第３図は本発明の一実施例としてのチツプ状電子
部品の概略斜視図、第４図Ａ及びＢは本発明によ
るチツプ状電子部品の製造方法の一実施例を説明
するための概略断面図、第５図は第３図のチツプ
状電子部品をプリント回路板上へ取り付け固定し
た状態を示す図である。
１……セラミツク基体、３……プリント回路
板，４Ａ，４Ｂ……回路導体、５Ａ……ハンダ
部、２０……外部端子電極、２１……ハンダの付
きにくい電極材料層、２２……ハンダの付き易い
電極材料層。
FIG. 1 is a schematic perspective view showing an example of a conventional chip-shaped electronic component, and FIG. 2 is a diagram showing the chip-shaped electronic component of FIG. 1 mounted on a printed circuit board.
FIG. 3 is a schematic perspective view of a chip-shaped electronic component as an embodiment of the present invention, and FIGS. 4A and 4B are schematic sectional views for explaining an embodiment of the method for manufacturing a chip-shaped electronic component according to the present invention. , FIG. 5 is a diagram showing the state in which the chip-shaped electronic component of FIG. 3 is mounted and fixed on a printed circuit board. DESCRIPTION OF SYMBOLS 1... Ceramic substrate, 3... Printed circuit board, 4A, 4B... Circuit conductor, 5A... Solder part, 20... External terminal electrode, 21... Electrode material layer that is difficult to solder, 22... Solder Electrode material layer that adheres easily.
Claims (1)
品において、前記外部端子電極の、プリント回路
板へ載置接触させる側とは反対側の部分を、ハン
ダの付きにくい電極材料にて形成したことを特徴
とするチツプ状電子部品。 ２ チツプ状電子部品の製造方法において、チツ
プ状電子部品の絶縁基体の端面の全体に、ハンダ
の付きにくい第１の電極材料を層状に付与し、更
に、前記第１の電極材料層の、プリント回路板へ
載置接触させる側の部分を覆うようにして、ハン
ダの付きやすい第２の電極材料を層状に付与する
ことによつて、外部端子電極を端面に形成するこ
とを特徴とするチツプ状電子部品の製造方法。 ３ 前記第１の電極材料は、銀ペーストにガラス
を10〜20％添加したものであり、前記第２の電極
材料は、銀ペーストにガラスを7.5％以下添加し
たものである特許請求の範囲第２項記載のチツプ
状電子部品の製造方法。 ４ 前記第１の電極材料は、パラジウム単独ペー
スト、または銀とパラジウムとの合金ペーストに
ガラスを添加したものである特許請求の範囲第２
項記載のチツプ状電子部品の製造方法。[Scope of Claims] 1. In a chip-shaped electronic component having an external terminal electrode on the end face, a portion of the external terminal electrode on the opposite side from the side where it is placed and brought into contact with a printed circuit board is made of an electrode material that is difficult to solder. A chip-shaped electronic component characterized by being formed by 2. In a method for manufacturing a chip-shaped electronic component, a first electrode material that is difficult to solder is applied in a layer to the entire end surface of an insulating base of the chip-shaped electronic component, and further, the first electrode material layer is printed. A chip-shaped chip characterized in that an external terminal electrode is formed on an end surface by applying a layer of a second electrode material that is easy to solder so as to cover the part on the side that is to be placed and brought into contact with a circuit board. Method of manufacturing electronic components. 3. The first electrode material is made by adding 10 to 20% of glass to silver paste, and the second electrode material is made by adding 7.5% or less of glass to silver paste. 2. The method for manufacturing a chip-shaped electronic component according to item 2. 4. The first electrode material is a palladium paste alone or an alloy paste of silver and palladium to which glass is added.
A method for manufacturing a chip-shaped electronic component as described in .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57161275A JPS5950596A (en) | 1982-09-16 | 1982-09-16 | Chip type electronic part and method of producing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57161275A JPS5950596A (en) | 1982-09-16 | 1982-09-16 | Chip type electronic part and method of producing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5950596A JPS5950596A (en) | 1984-03-23 |
| JPH0312446B2 true JPH0312446B2 (en) | 1991-02-20 |
Family
ID=15732003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57161275A Granted JPS5950596A (en) | 1982-09-16 | 1982-09-16 | Chip type electronic part and method of producing same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5950596A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012235080A (en) * | 2011-04-29 | 2012-11-29 | Samsung Electro-Mechanics Co Ltd | Chip-type coil component |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61291391A (en) * | 1985-06-18 | 1986-12-22 | 山陽海運株式会社 | Hanger for pallet cargo-handling |
| JPS63190273U (en) * | 1987-05-26 | 1988-12-07 | ||
| JP2539900B2 (en) * | 1988-12-02 | 1996-10-02 | 新日本製鐵株式会社 | Automatic sling hanger |
| US6498561B2 (en) | 2001-01-26 | 2002-12-24 | Cornerstone Sensors, Inc. | Thermistor and method of manufacture |
-
1982
- 1982-09-16 JP JP57161275A patent/JPS5950596A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012235080A (en) * | 2011-04-29 | 2012-11-29 | Samsung Electro-Mechanics Co Ltd | Chip-type coil component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5950596A (en) | 1984-03-23 |
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