JP4665920B2 - Electronic component, method for manufacturing the same, and inverter device - Google Patents

Description

  The present invention relates to an electronic component, a manufacturing method thereof, and an inverter device.

Conventionally, a cylindrical element body having a pair of opposing main surfaces, a pair of electrodes formed on each main surface of the element body, a pair of flat lead terminals respectively connected to each electrode, A surface-mount type capacitor is known that includes an element body, each electrode, and an exterior body that covers a part of each lead terminal and is electrically insulating, and each lead terminal and element body are separated by a predetermined distance. It has been. (For example, see Patent Document 1)
Japanese Patent Laid-Open No. 5-101975

  However, in the conventional capacitor described in Patent Document 1, the exterior body directly covers the element body, each electrode, and part of each lead terminal. Therefore, since the thermal expansion coefficient (linear expansion coefficient) of the element body made of ceramic or the like and the coefficient of thermal expansion of the outer body element made of resin or the like are greatly different, the outer body is easily peeled off from the element body. It was.

  Further, in a conventional capacitor, an exterior body is formed by transfer molding in which a lead frame on which an element body is mounted is placed in a mold and a resin is injected into the mold. At this time, a release material may be included in the resin to facilitate removal of the outer package from the mold. Therefore, also from this point, the exterior body is easily peeled off from the base body.

  Therefore, in the conventional capacitor, the exterior body may be peeled off from the element body, and a space may be formed between the element body and the exterior body. When such a capacitor is used at a high voltage, creeping discharge may occur at the portion where the outer package is peeled off from the element body, which may cause dielectric breakdown. Therefore, the conventional capacitor has a problem that the operating voltage is limited to a low voltage.

  An object of this invention is to provide the electronic component which can improve a withstand voltage, its manufacturing method, and an inverter apparatus.

  An electronic component according to the present invention has a first main surface and a second main surface that face each other and has dielectric properties. The first main surface includes a first region, a second region, the first region, and the first region. A third region located between the second regions, the second main surface includes the first region, the second region, and the first region and the third region located between the second region. A first electrode disposed in a third region of the first main surface, a second electrode disposed in the third region of the second main surface and facing the first electrode, and a first electrode A first lead conductor disposed in the first region of the main surface and electrically connected to the first electrode; and a first portion disposed in the first region of the second main surface. And a second lead conductor electrically connected to the second electrode, a first lead terminal electrically connected to the first lead conductor, and a second lead conductor electrically The second lead surface, the second main surface so as to cover at least the second region of the second main surface, the portion arranged on the first main surface so as to cover at least the second region of the first main surface, An insulating film having at least a portion disposed on the substrate, an element body, a first electrode, a second electrode, a first lead conductor, a second lead conductor, a part of the first lead terminal, a part of the second lead terminal, and And an exterior body having electrical insulation, which is disposed so as to cover the insulating film.

  In the electronic component according to the present invention, the second region of the first main surface and the second region of the second main surface are covered with the insulating film. Therefore, when there is no insulating film, in each second region of the element body in which the outer body comes into direct contact with the element body, the element body and the insulating film are in close contact, and the insulating film and the outer body are in close contact with each other. Become. As a result, a space is hardly formed between the element body and the exterior body, so that creeping discharge is suppressed and the withstand voltage can be improved.

  Preferably, the first portion of the first lead conductor and the first portion of the second lead conductor are not opposed to each other when viewed from the opposing direction of the first main surface and the second main surface, and the second lead conductor The position where the first portion is drawn from the second electrode is set to a position where the linear distance from the position where the first portion of the first lead conductor is drawn from the first electrode is the longest. In this case, the distance between the first lead conductor and the second lead conductor is increased. As a result, the dielectric breakdown voltage increases and the withstand voltage can be further improved.

  Preferably, the element body extends so as to connect the first main surface and the second main surface and connects the first side surface and the second side surface facing each other, and the first main surface and the second main surface. A first side of the first lead conductor and a first part of the second lead conductor are opposed to the first main surface and the second main surface. Viewed from the top, the first portion of the first lead conductor includes a portion extending from the first electrode toward the third side surface and a portion extending from the third side surface toward the first side surface. The first portion of the second lead conductor has a portion extending from the second electrode toward the fourth side surface and a portion extending from the fourth side surface toward the second side surface. In this case, the distance between the first lead conductor and the second lead conductor becomes larger. As a result, the dielectric breakdown voltage is further increased, and the withstand voltage can be further improved.

  Preferably, the element body has a first side surface and a second side surface that extend so as to connect the first main surface and the second main surface and face each other, and the first portion of the first lead conductor includes at least one first portion. The first portion of the second lead conductor extends at least partially toward the second side surface, and the element body includes the first electrode on the first main surface and the first electrode. A recess and / or a protrusion is provided in a region between the second side surface and a region between the second electrode and the first side surface on the second main surface. In this case, the creepage distance between the first electrode and the second lead conductor and the creepage distance between the second electrode and the first lead conductor are increased. As a result, the dielectric breakdown voltage increases and the withstand voltage can be further improved.

  Preferably, the first electrode and the second electrode have a rounded shape. When corners exist in the first electrode and the second electrode, local electric field concentration tends to occur in the corners. On the other hand, if the first electrode and the second electrode have a rounded shape, the above-described electric field concentration is suppressed. As a result, the dielectric breakdown voltage increases and the withstand voltage can be further improved.

  Preferably, the element body has a first side surface and a second side surface that extend so as to connect the first main surface and the second main surface and face each other, and the first lead terminal is a first lead conductor of the first lead conductor. A first portion connected to the first portion; and a second portion facing the first main surface and extending in the facing direction of the first side surface and the second side surface. The second lead terminal is formed of the second lead conductor. A first portion connected to the first portion; and a second portion facing the first main surface and extending in a facing direction of the first side surface and the second side surface. In this case, when the electronic component is manufactured, the element body can be reliably held by the first lead terminal and the second lead terminal in a direction intersecting with the opposing direction of the first main surface and the second main surface. Become.

  Preferably, the element body has a first side surface and a second side surface that extend so as to connect the first main surface and the second main surface and face each other, and the first lead conductor is disposed on the first side surface. The second lead portion is electrically connected to the first lead terminal by connecting the second portion and the first lead terminal, and the second lead conductor is disposed on the second side surface. The second part is electrically connected to the second lead terminal by connecting the second part and the second lead terminal, and the first lead terminal is a second lead conductor of the first lead conductor. A first portion connected to the portion, and a second portion facing the first main surface and extending in the facing direction of the first side surface and the second side surface, and the second lead terminal is a second lead conductor of the second lead conductor. The first portion connected to the two portions, the first side surface and the second side while facing the first main surface And a second portion extending in the opposite direction. In this case as well, the element body can be reliably held by the first lead terminal and the second lead terminal in the direction intersecting the opposing direction of the first main surface and the second main surface when the electronic component is manufactured. It becomes.

  Preferably, the first lead terminal and the second lead terminal are each pulled out from the exterior body, and the drawing position of the first lead terminal pulled out from the exterior body and the drawing position of the second lead terminal pulled out from the exterior body are provided. Are located on a virtual plane substantially parallel to the first main surface and the second main surface.

  An inverter device according to the present invention includes any one of the electronic components described above.

  On the other hand, the method of manufacturing an electronic component according to the present invention has a first main surface and a second main surface that face each other and has dielectric properties. The first main surface has a first region, a second region, A first region and a third region located between the second region, and the second main surface is located between the first region, the second region, and the first region and the second region. An element body including a third region; a first electrode disposed in the third region of the first main surface; and a second electrode disposed in the third region of the second main surface and facing the first electrode. An electrode, a first lead conductor having a first portion disposed in the first region of the first main surface and electrically connected to the first electrode, and disposed in the first region of the second main surface A second lead conductor having a first portion and electrically connected to the second electrode, and a portion disposed on the first main surface so as to cover at least the second region of the first main surface An intermediate preparation step of preparing an intermediate comprising an insulating film having at least a portion disposed on the second main surface so as to cover at least the second region of the second main surface; and a first having the first portion A lead frame preparing step of preparing a lead frame including a terminal portion and a second terminal portion having a first portion; electrically connecting the first portion of the first terminal portion and the first lead conductor; A mounting step in which the first part of the two terminal portions and the second lead conductor are electrically connected to mount the intermediate body on the lead frame, and the form frame in which the lead frame on which the intermediate body is mounted is disposed By injecting and curing resin, the element body, the first electrode, the second electrode, the first lead conductor, the second lead conductor, a part of the first terminal part, a part of the second terminal part, and insulation Electrical insulation that is placed over the membrane An exterior body is formed by cutting an exterior body forming step of forming a body, a portion of the first terminal portion that is pulled out from the exterior body, and a portion of the second terminal portion that is pulled out of the exterior body. And a cutting step of separating the intermediate body from the lead frame.

  In the method of manufacturing an electronic component according to the present invention, an intermediate body in which the second region of the first main surface and the second region of the second main surface are covered with an insulating film is used. And the exterior body is formed so that the circumference | surroundings of this intermediate body may be covered. Therefore, when there is no insulating film, in each second region of the element body in which the outer body comes into direct contact with the element body, the element body and the insulating film are in close contact, and the insulating film and the outer body are in close contact with each other. Become. As a result, a space is hardly formed between the element body and the exterior body, and creeping discharge is suppressed, so that the withstand voltage can be improved.

  Preferably, in the mounting step, solder is applied to the first portion of the first terminal portion and the first portion of the second terminal portion, respectively, and the intermediate body is the first portion of the first terminal portion and the first terminal portion of the second terminal portion. After being inserted between the first and second portions, the first portion of the first terminal portion and the first portion of the first lead conductor are soldered by heat treatment, and the first portion and the second portion of the second terminal portion are secondly soldered. Solder the first part of the lead conductor. In this case, the first portion of the first terminal portion and the first portion of the first lead conductor, and the first portion of the second terminal portion and the first portion of the second lead conductor are reliably and electrically connected by solder. It becomes possible to connect.

  Preferably, the element body has a first side surface and a second side surface that extend so as to connect the first main surface and the second main surface and face each other, and the first lead conductor is disposed on the first side surface. The second lead conductor has a second portion disposed on the second side surface, and the first portion of the first terminal portion and the first portion of the second terminal portion are Each of the opposing surfaces is opposed to each other by a distance corresponding to the width of the element body in the opposing direction of the first side surface of the element body and the second side surface of the element body. Solder is applied to each of the opposing surfaces of the first portion and the first portion of the second terminal portion, and the first lead conductors are arranged between the opposing surface of the first portion of the first terminal portion and the first side surface of the element body. The second lead conductor is located between the opposing surface of the first portion of the second terminal portion and the second side surface of the element body. After the intermediate body is inserted between the first portion of the first terminal portion and the first portion of the second terminal portion so that the two portions are positioned, the first portion of the first terminal portion is heated. And the second portion of the first lead conductor, and the first portion of the second terminal portion and the second portion of the second lead conductor are soldered. In this case, the first portion of the first terminal portion and the second portion of the first lead conductor, and the first portion of the second terminal portion and the second portion of the second lead conductor are reliably and electrically connected by solder. It becomes possible to connect.

  Preferably, at least a part of the first terminal portion is disposed closer to the second terminal portion than the first portion of the first terminal portion, and the first portion of the first terminal portion and the first portion of the second terminal portion. A second portion extending along a direction connecting the portions, and the second terminal portion is disposed at least partially on the first terminal portion side with respect to the first portion of the second terminal portion and is first A second portion extending along a direction connecting the first portion of the terminal portion and the first portion of the second terminal portion. In the mounting step, the first main surface of the element body is the first terminal portion. The intermediate body is placed on the second part of the first terminal part and the second part of the second terminal part so as to face the second part and the second part of the second terminal part, and the first terminal part first The portion and the first portion of the first lead conductor are electrically connected, and the first portion of the second terminal portion and the first portion of the second lead conductor are electrically connected. It is, mounting the intermediate lead frame. In this case, the intermediate body can be reliably held by the first terminal portion and the second terminal portion in the opposing direction of the first main surface and the second main surface.

  Preferably, the element body has a first side surface and a second side surface that extend so as to connect the first main surface and the second main surface and face each other, and the first lead conductor is disposed on the first side surface. The second lead conductor has a second portion disposed on the second side surface, and the first portion of the first terminal portion and the first portion of the second terminal portion are Each of the first terminal portions is spaced apart by a distance corresponding to the width of the element body in the opposing direction of the first side surface of the element body and the second side surface of the element body. A second portion that is at least partially disposed on the second terminal portion side than the one portion and that extends in a direction opposite to the first portion of the first terminal portion and the first portion of the second terminal portion; The terminal portion is at least partially disposed closer to the first terminal portion than the first portion of the second terminal portion, and the first terminal portion The first portion and the second terminal portion have a second portion extending in a direction opposite to the first portion, and in the mounting process, the first main surface of the element body is the second portion and the second terminal of the first terminal portion. The intermediate body is placed on the second portion of the first terminal portion and the second portion of the second terminal portion so as to face the second portion of the first portion, and the first portion of the first terminal portion and the first lead conductor The intermediate part is mounted on the lead frame by electrically connecting the second part and electrically connecting the first part of the second terminal portion and the second part of the second lead conductor. Also in this case, the intermediate body can be reliably held by the first terminal portion and the second terminal portion in the opposing direction of the first main surface and the second main surface.

  ADVANTAGE OF THE INVENTION According to this invention, the electronic component which can improve a withstand voltage, its manufacturing method, and an inverter apparatus can be provided.

  Preferred embodiments of the present invention will be described with reference to the drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and a duplicate description is omitted.

(First embodiment)
First, the structure of the surface mount electronic component 1 according to the first embodiment will be described with reference to FIGS. FIG. 1 is a perspective view showing a surface mount electronic component according to the first embodiment. FIG. 2 is a perspective view of the surface-mount electronic component according to the first embodiment viewed from the main surface side of the dielectric body. FIG. 3 is a perspective view of the surface-mount electronic component according to the first embodiment viewed from the side surface side of the dielectric body. The surface-mounted electronic component 1 according to the first embodiment is obtained by applying the present invention to a surface-mounted capacitor.

  As shown in FIGS. 1 to 3, the surface-mount electronic component 1 includes a dielectric body 12 (element body having dielectric characteristics), electrodes 14 and 16, lead conductors 18 and 20, and a pair of leads. Terminals 26 and 28 and an exterior body 32 are provided.

  As shown in FIGS. 2 and 3, the dielectric element body 12 has a substantially rectangular parallelepiped shape, and has principal surfaces 12a and 12b facing each other, side surfaces 12c and 12d facing each other, and side surfaces 12e facing each other. , 12f. The main surface 12a includes a region A11, a region A12, and a region A13 located between the region A11 and the region A12 (see FIGS. 2 and 3). The main surface 12b includes a region A21, a region A22, and a region A23 located between the regions A21 and A22 (see FIGS. 2 and 3). The side surfaces 12c and 12d extend so as to connect the main surfaces 12a and 12b and the side surfaces 12e and 12f, and the side surfaces 12e and 12f extend so as to connect the main surfaces 12a and 12b and the side surfaces 12c and 12d. The dielectric body 12 can be formed of, for example, a dielectric ceramic material in which Ti, Ba, Sr, Ca, Nd, La or the like as a main component is added with other rare earth elements as subcomponents.

  Electrodes 14 and 16 and lead conductors 18 and 20 are disposed on the dielectric body 12. The electrode 14 is disposed in the region A13 of the main surface 12a, and the electrode 16 is disposed in the region A23 of the main surface 12b. The lead conductor 18 is disposed in the region A11 of the main surface 12a and is electrically connected to the electrode 14. The lead conductor 20 is disposed in the region A21 of the main surface 12b and is electrically connected to the electrode 16.

  The electrodes 14 and 16 have portions 14a and 16a that overlap each other when viewed from the opposing direction of the main surfaces 12a and 12b. Depending on the facing area of the overlapping portions 14a and 16a of the electrodes 14 and 16 and the distance between the electrodes 14 and 16 (that is, the thickness of the dielectric body 12), the static electricity as a capacitor of the surface mount electronic component 1 can be obtained. The capacity is specified.

  The lead conductor 18 is drawn from a portion near the side surface 12d of the electrode 14 and extends toward the side surface 12d. The electrode 14 has a substantially semicircular shape in a portion on the side from which the lead conductor 18 is not drawn (portion near the side surface 12c). In the first embodiment, the electrode 14 and the lead conductor 18 are integrally formed.

  The lead conductor 20 is drawn from a portion of the electrode 16 near the side surface 12c and extends toward the side surface 12c. The electrode 16 has a substantially semicircular shape in a portion on the side where the lead conductor 20 is not drawn (portion near the side surface 12d). In the first embodiment, the electrode 16 and the lead conductor 20 are integrally formed.

  When viewed from the opposing direction of the main surfaces 12a and 12b, the lead conductors 18 and 20 extend in opposite directions with respect to the electrodes 14 and 16, and do not oppose each other. The position where the lead conductor 20 is drawn from the electrode 16 is set to a position where the linear distance from the position where the lead conductor 18 is drawn from the electrode 14 is the longest.

  A solder resist 22 is disposed on the main surface 12a so as to cover the entire electrode 14 and a part of the lead conductor 18. Therefore, in the first embodiment, the solder resist 22 is disposed in the region A12 of the main surface 12a (the region closer to the side surface 12c than the electrode 14). A solder resist 24 is disposed on the main surface 12b so as to cover the entire electrode 16 and a part of the lead conductor 20. Therefore, in the first embodiment, the solder resist 24 is disposed in the region A22 of the main surface 12b (the region closer to the side surface 12d than the electrode 16). The solder resists 22 and 24 are insulating materials having heat resistance, and solder adheres to the main surfaces 12a and 12b, the electrodes 14 and 16 and the lead conductors 18 and 20 covered by the solder resists 22 and 24. It is provided to prevent and maintain moisture resistance and insulation resistance.

  The lead terminal 26 includes a first portion 26a, a second portion 26b, and third portions 26c to 26e. The first portion 26a faces the main surface 12b and is connected to the lead conductor 20 by solder (not shown). As a result, the lead terminal 26 is electrically connected to the lead conductor 20. The first portion 26 a has a plate shape for improving the ground contact area with the lead conductor 20. As a result, the first portion 26 a has a facing surface that faces the main surface 12 b of the dielectric body 12.

  The third portion 26c has a part of one end continuous to (integrally formed with) one end of the first portion 26a, and faces the side surfaces 12c and 12d from one end of the first portion 26a and the side surface 12c. It stretches away from the direction. The other end of the third portion 26c is bifurcated. The pair of third portions 26d are continuous (integrally formed) with the other ends of the third portion 26c, each end of which is bifurcated. Each third portion 26d extends from each other end of the third portion 26c in a direction opposite to the main surfaces 12a and 12b and in a direction away from the dielectric element body 12.

  One end of each of the pair of third portions 26e is continuous (integrally formed) with each other end of each third portion 26d. Each third portion 26e extends from each other end of each third portion 26d in a direction opposite to the side surfaces 12c and 12d and in a direction approaching the side surface 12c. Accordingly, the portion (third portion 26d and third portion 26e) of the lead terminal 26 exposed from the exterior body 32 is divided into two. For this reason, when the lead terminal 26 and the signal electrode 102 of the circuit board 100 described later are soldered, the lead terminal 26 and the signal electrode 102 can be firmly joined by the wedge effect.

  The pair of second portions 26b are respectively continuous (integrally formed) with a part of one end of the third portion 26c. Each second portion 26b protrudes in a direction opposite to the side surfaces 12c and 12d and in a direction opposite to the third portion 26c. Each second portion 26b is opposed to the main surface 12b and is in contact with the main surface 12b. Therefore, the second portion 26 b fulfills a function of supporting the dielectric body 12 during the manufacture of the surface mount electronic component 1.

  The lead terminal 28 includes first portions 28a and 28g, a second portion 28b, and third portions 28c to 28e. The first portion 28a faces the main surface 12a and is connected to the lead conductor 18 by solder (not shown). As a result, the lead terminal 28 is electrically connected to the lead conductor 18. The first portion 28 a has a plate shape for improving the ground contact area with the lead conductor 18. As a result, the first portion 28 a has a facing surface that faces the main surface 12 a of the dielectric body 12. One end of the first portion 28g is continuous (integrally formed) with one end of the first portion 28a, and extends from one end of the first portion 28a to the main surface 12b in a direction opposite to the main surfaces 12a and 12b. It extends toward the approaching direction (along the side surface 12d).

  A part of one end of the third portion 28c is continuous (integrally formed) with the lower end of the first portion 28g, and the side surface 12d is opposed to the side surfaces 12c and 12d from the lower end of the first portion 28g. It stretches away from the direction. The other end of the third portion 28c is bifurcated. The pair of third portions 28d are continuous (integrally formed) with the other ends of the third portion 28c, each end of which is bifurcated. Each third portion 28d extends from each other end of the third portion 28c in a direction opposite to the main surfaces 12a and 12b and in a direction away from the dielectric body 12.

  One end of each of the pair of third portions 28e is continuous (integrally formed) with each other end of each third portion 28d. Each third portion 28e extends from each other end of each third portion 28d in a direction opposite to the side surfaces 12c and 12d and in a direction approaching the side surface 12d. Therefore, portions of the lead terminal 28 exposed from the exterior body 32 (the third portion 28d and the third portion 28e) are divided into two. For this reason, when the lead terminal 28 and the signal electrode 104 of the circuit board 100 to be described later are soldered, the lead terminal 28 and the signal electrode 104 can be firmly joined by the wedge effect.

  The pair of second parts 28b are respectively continuous (integrally formed) with a part of one end of the third part 28c. Each second portion 28b protrudes in a direction opposite to the side surfaces 12c and 12d and in a direction opposite to the third portion 28c. Each second portion 28 b is in contact with the solder resist 24 and faces the main surface 12 b of the dielectric element body 12. Therefore, the second portion 28b fulfills the function of supporting the dielectric body 12 when the surface mount electronic component 1 is manufactured.

  The exterior body 32 includes the dielectric body 12, electrodes 14 and 16, lead conductors 18 and 20, solder resists 22 and 24, part of the lead terminal 26 (first to third portions 26a to 26c of the lead terminal 26), It arrange | positions so that a part of lead terminal 28 (1st-3rd part 28a-28c of the lead terminal 28) may be covered. From the exterior body 32, the third portions 28d and 28e of the lead terminal 26 and the third portions 28d and 28e of the lead terminal 28 are drawn out, respectively. The third portions 26 d, 26 e, 28 d, 28 e of the lead terminals 26, 28 drawn out from the exterior body 32 are respectively along the external shape of the exterior body 32. The lead-out position 26f of the third portion 26c of the lead terminal 26 drawn out from the outer body 32 and the lead-out position 28f of the third portion 28c of the lead terminal 28 drawn out from the outer body 32 are substantially parallel to the main surfaces 12a and 12b. It is located on the virtual plane S1 (see FIG. 3). The exterior body 32 is made of an insulating material having heat resistance.

  Next, a mounting structure between the surface-mount electronic component 1 having the above-described configuration and a circuit board will be described with reference to FIG.

  The circuit board 100 is a so-called printed circuit board on which wiring is formed by a large number of signal electrodes including the signal electrodes 102 and 104 and a ground electrode (not shown). It constitutes a part of the device 150. In the surface-mount electronic component 1, the third portions 26d and 26e of the lead terminal 26 and the signal electrode 102 of the circuit board 100 are connected by solder, and the third portions 28d and 28e of the lead terminal 28 and the signal electrode of the circuit board 100 are connected. 104 is connected to the circuit board 100 by being connected with solder. The surface mounting type electronic component 1 can be soldered to the circuit board 100 by, for example, a reflow soldering method.

  Then, with reference to FIGS. 1-10, the manufacturing method of the surface mount-type electronic component 1 is demonstrated. FIG. 4 is a flowchart for explaining a manufacturing process of the surface mount electronic component according to the first embodiment. FIG. 5 is a diagram for explaining each step of the manufacturing process of the surface mount electronic component. FIG. 6 is a diagram for explaining a process subsequent to FIG. FIG. 7 is a diagram for explaining a process subsequent to FIG. FIG. 8 is a diagram for explaining a process subsequent to FIG. FIG. 9 is a diagram for explaining a process subsequent to FIG. FIG. 10 is a diagram for explaining a process subsequent to FIG. 9. In the flowchart shown in FIG. 4, step is abbreviated as S.

  First, in step 101, a dielectric body material that is a raw material of the dielectric body 12 is manufactured. Specifically, a raw material containing barium titanate or strontium titanate as a main component and another rare earth element as an auxiliary component is kneaded, calcined at a predetermined temperature, and the calcined raw material is pulverized and manufactured. It is obtained by granulating.

  Subsequently, in step 102, the dielectric element material obtained in step 101 is press-molded into a desired shape. Specifically, a molded body having a substantially rectangular parallelepiped shape having the main surfaces 12a and 12b and the side surfaces 12c to 12f is obtained by press molding.

  Subsequently, in step 103, the molded body obtained in step 102 is fired at a predetermined temperature (for example, about 1100 ° C. to 1500 ° C.) to obtain the dielectric body 12 (see FIG. 5A).

  Subsequently, in step 104, the electrodes 14 and 16 and the lead conductors 18 and 20 are formed (see FIG. 5B). Here, first, the conductive paste that becomes the electrode 14 and the lead conductor 18 is screen-printed in the regions A11 and A13 of the main surface 12a. In addition, the conductive paste that becomes the electrode 16 and the lead conductor 20 is screen-printed in the regions A21 and 23 of the main surface 12b. Then, the screen-printed conductive paste is baked at a predetermined temperature (for example, about 800 ° C.). As the conductive paste, a metal powder (for example, Ag, Cu, Ni, etc.) mixed with an organic binder, an organic solvent, or the like is used.

  Subsequently, in step 105, solder resists 22 and 24 are formed (see FIG. 5C). Here, first, the solder resist 22 is formed so as to cover the region A12 of the main surface 12a, the region A22 of the main surface 12b, the entire electrode 14 and part of the lead conductor 18, and the whole electrode 16 and part of the lead conductor 20. , 24 is printed on the main surface 12a and the main surface 12b. Then, the solder resist paste printed and formed is heated (cured) at a predetermined temperature (for example, about 100 ° C. to 160 ° C.). For the solder resist paste, an epoxy paint or a phenol resin is used. The intermediate body 50 (refer FIG.5 (c)) is obtained by the above process.

  Subsequently, in step 106, the lead frame 40 is processed into a desired shape by, for example, pressing. The lead frame 40 is made of, for example, a metal material in which brass or copper is plated with Sn or Ag. Specifically, the lead frame 40 includes a pair of terminal portions 46 and 48 as shown in FIG.

  The terminal portion 46 includes a first portion 46a, a second portion 46b, and third portions 46c and 46d. The first portion 46 a is a portion that becomes the first portion 26 a of the lead terminal 26. The first portion 46a is plate-shaped and has a facing surface S2 that faces the main surface 12b of the dielectric body 12.

  The third portion 46 c is a portion that becomes the third portion 26 c of the lead terminal 26. The third portion 46c has a part of one end continuous (integrally formed) with one end of the first portion 46a, and extends from one end of the first portion 46a in the longitudinal direction of the lead frame 40 and the terminal portion 48. It stretches away from the direction. The other end of the third portion 46c is bifurcated. The pair of third portions 46 d are portions that become the third portions 26 d and 26 e of the lead terminal 26. Each of the third portions 46d is continuous (integrally formed) with each of the other ends of the third portion 46c branched at one end. The pair of second portions 46 b is a portion that becomes the second portion 26 b of the lead terminal 26. Each of the second portions 46b is continuous (integrally formed) with a part of one end of the third portion 46c. Each of the second portions 46 b protrudes in a direction facing the side surfaces 12 c and 12 d and in a direction approaching the terminal portion 48.

  The terminal portion 48 includes first portions 48a and 48e, a second portion 48b, and third portions 48c and 48d. The first portion 48 a is a portion that becomes the first portion 28 a of the lead terminal 28. The first portion 48 a is plate-shaped and has a facing surface S 2 that faces the main surface 12 a of the dielectric element body 12. The first portion 48 e is a portion that becomes the first portion 28 g of the lead terminal 28. One end of the first portion 48 e is continuous (integrally formed) with one end of the first portion 48 a, and extends in the vertical direction toward the lead frame 40.

  The third portion 48 c is a portion that becomes the third portion 28 c of the lead terminal 28. The third portion 48c has a portion of one end continuous (integrally formed) with the lower end of the first portion 48e, and extends from the lower end of the first portion 48e in the longitudinal direction of the lead frame 40 and the terminal portion 46. It stretches away from the direction. The other end of the third portion 48c is bifurcated. The pair of third portions 48 d are portions that become the third portions 28 d and 28 e of the lead terminal 28. Each of the third portions 48d is continuous (integrally formed) with each of the other ends of the third portion 48c branched at one end. The pair of second portions 48 b is a portion that becomes the second portion 28 b of the lead terminal 28. Each second portion 48b is continuous (integrally formed) with a part of one end of the third portion 48c. Each second portion 48b protrudes in a direction opposite to the side surfaces 12c and 12d and in a direction approaching the terminal portion 46.

  Subsequently, in step 107, the intermediate body 50 is mounted on the lead frame 40 (see FIG. 7). Here, first, cream solder is applied to the facing surfaces S2 of the terminal portions 46 and 48, respectively. As the cream solder, for example, high-temperature cream solder can be used. The lead conductor 20 is interposed between the opposing surface S2 of the first portion 46a of the terminal portion 46 and the main surface 12b of the dielectric body 12, and the opposing surface S2 of the first portion 48a of the terminal portion 48 and the dielectric material. The intermediate body 50 is inserted between the first portion 46 a of the terminal portion 46 and the first portion 48 a of the terminal portion 48 so that the lead conductor 18 is interposed between the main surface 12 a of the element body 12. Further, the first portion 46a of the terminal portion 46 and the lead conductor 20 and the first portion 48a of the terminal portion 48 and the lead conductor 18 are soldered by, for example, a reflow soldering method, and the intermediate body 50 is attached to the lead frame 40. Secure.

  Subsequently, in step 108, the exterior body 32 is formed. Here, first, the lead frame 40 to which the intermediate body 50 is fixed in Step 107 is disposed between a pair of molds 60 molded so as to have a desired shape of the exterior body 32 (arrow A in FIG. 8). reference). And a pair of metal mold | dies 60 are closed (refer arrow B of FIG. 9), the space for inject | pouring resin with respect to each intermediate body 50 is each formed, and in each space formed by a pair of metal mold | die 60 The resin is injected while being pressurized (see FIG. 9). The pressure at this time can be set to about 2 MPa to 10 MPa, for example. Furthermore, after injecting the resin into the space between the pair of molds 60 and before opening the molds, heat treatment (temporary curing) is performed at a predetermined temperature (for example, about 150 ° C.). As the resin, for example, a resin for transfer molding such as an epoxy resin can be used. Thereafter, the pair of molds 60 is opened (see arrow C in FIG. 10), and the lead frame 40 including the intermediate body 50 and the molded body 52 in which the resin is molded into a predetermined shape is taken out from the mold 60. Then, heat treatment (main curing) is performed at a predetermined temperature (for example, about 150 ° C.) for a predetermined time (for example, about 2 hours) to remove unnecessary burrs.

  Subsequently, in step 109, lead terminals 26 and 28 are formed (see FIGS. 1 to 3). Here, first, portions of the terminal portion 46 drawn from the exterior body 32 (third portions 46c and 46d of the terminal portion 46) and portions of the terminal portion 48 drawn from the exterior body 32 (terminal portion 48). The third portions 48c and 48d) are cut off, and each of the intermediate bodies 50 in which the outer package 32 is formed (covered by the outer package 32) is separated from the lead frame 40. Then, the third portions 46 c and 46 d of the terminal portion 46 and the third portions 48 c and 48 d of the terminal portion 48 are bent in a direction away from the main surface 12 a of the dielectric body 12.

  As described above, in the first embodiment, the solder resist 22 is disposed so as to cover at least the region A12 of the main surface 12a (the region closer to the side surface 12c than the electrode 14), and the region of the main surface 12b. The solder resist 24 is disposed so as to cover at least A22 (region closer to the side surface 12d than the electrode 16). Therefore, in the regions A12 and A22 of the main surfaces 12a and 12b of the dielectric body 12 in which the exterior body 32 is in direct contact with the dielectric body 12 when the solder resists 22 and 24 are not provided, the dielectric body. 12 and the solder resists 22 and 24 are brought into close contact with each other, and the solder resists 22 and 24 and the exterior body 32 are brought into close contact with each other. Therefore, the solder resists 22 and 24 are hardly peeled off from the dielectric body 12, and the exterior body 32 is formed. It becomes difficult to peel off from the solder resists 22, 24. As a result, a space is hardly formed between the dielectric element body 12 and the exterior body 32, so that creeping discharge is suppressed and the withstand voltage can be improved. In addition, since the dielectric body 12, the solder resists 22, 24, and the exterior body 32 are in close contact with each other as described above, it is possible to maintain moisture resistance and to prevent the occurrence of a migration phenomenon. .

  In the first embodiment, the lead conductor 18 and the lead conductor 20 do not face each other when viewed from the facing direction of the main surfaces 12a and 12b. Further, the position where the lead conductor 20 is drawn from the electrode 16 is set to a position where the linear distance from the position where the lead conductor 18 is drawn from the electrode 14 is the longest. Therefore, the distance between the lead conductor 18 and the lead conductor 20 is large. As a result, the dielectric breakdown voltage is increased, and the withstand voltage can be further improved.

  In the first embodiment, the electrode 14 has a substantially semicircular shape on the side not integrally formed with the lead conductor 18, and the electrode 16 is on the side not formed integrally with the lead conductor 20. It has a substantially semicircular shape, and the electrodes 14 and 16 are rounded. Therefore, the occurrence of electric field concentration is suppressed, the dielectric breakdown voltage is increased, and the withstand voltage can be further improved.

  In the first embodiment, the lead terminal 26 has a second portion 26 b that protrudes toward the lead terminal 28, and the lead terminal 28 has a second portion 28 b that protrudes toward the lead terminal 26. . For this reason, when the surface-mounted electronic component 1 is manufactured, the element body can be reliably held by the lead terminals 26 and 28 in the direction intersecting the opposing direction of the main surface 14 and the main surface 16.

(Second Embodiment)
Next, the surface mount electronic component 2 according to the second embodiment will be described with reference to FIGS. 11 and 12. FIG. 11 is a perspective view of the dielectric body of the surface-mount electronic component according to the second embodiment as viewed from the main surface side. FIG. 12 is a perspective view of the surface-mount type electronic component according to the second embodiment as viewed from the side of the dielectric body. Below, it demonstrates centering around difference with the surface mount-type electronic component 1 which concerns on 1st Embodiment, and the overlapping description is abbreviate | omitted.

  As shown in FIGS. 12 and 13, the surface mount electronic component 2 includes a dielectric body 12, electrodes 14 and 16, lead conductors 18 and 20, solder resists 22 and 24, a pair of lead terminals 26 and 28, and And an exterior body 32.

  The dielectric element body 12 has a pair of grooves 38A and 38B extending in the opposing direction of the side surfaces 12e and 12f on the main surface 12a side. The dielectric element body 12 has a pair of grooves 38C and 38D extending in the opposing direction of the side surfaces 12e and 12f on the main surface 12b side.

  The electrode 14 has a substantially circular shape and is located between the groove portions 38A and 38B. The electrode 16 has a substantially circular shape and is located between the groove portions 38C and 38D. The electrodes 14 and 16 overlap each other when viewed from the opposing direction of the main surfaces 12a and 12b. The lead conductor 18 extends so as to be drawn from the electrode 14 (portion of the electrode 14 near the side surface 12f). The lead conductor 20 extends so as to be drawn from the electrode 16 (a portion of the electrode 16 near the side surface 12e). The position where the lead conductor 18 is drawn from the electrode 14 and the position where the lead conductor 20 is drawn from the electrode 16 are positions facing each other across the center of the electrodes 14, 16 when viewed from the opposing direction of the electrodes 14, 16. Is set. In the second embodiment, the electrodes 14 and 16 and the corresponding lead conductors 18 and 20 are integrally formed.

  The lead conductor 18 has first portions 18a to 18d. The first portions 18 a to 18 d are disposed in the region A <b> 11 of the main surface 12 a and are electrically connected to the electrode 14. In the second embodiment, the first portions 18a to 18d are integrally formed.

  One end of the first portion 18a is connected to the electrode 14, and extends from the electrode 14 toward the side surface 12f. One end of the first portion 18b is continuous (integrally formed) with the other end of the first portion 18a, and the side from the other end of the first portion 18a so as to be substantially parallel to the side surfaces 12e and 12f. It extends toward 12d. One end of the first portion 18c is continuous (integrally formed) with the other end of the first portion 18b, and extends from the other end of the first portion 18b toward the first portion 28a of the lead terminal 28. ing. One end of the first portion 18d is continuous (integrally formed) with the other end of the first portion 18c, and the side of the first portion 18c extends from the other end of the first portion 18c so as to be substantially parallel to the side surfaces 12e and 12f. It extends toward 12d. That is, the lead conductor 18 is disposed on the main surface 12a so as to bypass the groove 38B.

  The lead conductor 20 has first portions 20a to 20b. The first portions 20a to 20d are disposed in the region A21 of the main surface 12b and are electrically connected to the electrode 16. In the second embodiment, the first portions 20a to 20d are integrally formed.

  One end of the first portion 20a is connected to the electrode 16 and extends from the electrode 16 toward the side surface 12e. One end of the first portion 20b is continuous (integrally formed) with the other end of the first portion 20a, and from the other end of the first portion 20a to the side surface so as to be substantially parallel to the side surfaces 12e and 12f. It extends toward 12c. One end of the first portion 20c is continuous (integrally formed) with the other end of the first portion 20b, and extends from the other end of the first portion 20b toward the first portion 26a of the lead terminal 26. ing. One end of the first portion 20d is continuous (integrally formed) with the other end of the first portion 20c, and the side of the first portion 20c from the other end of the first portion 20c is substantially parallel to the side surfaces 12e and 12f. It extends toward 12c. That is, the lead conductor 20 is disposed on the main surface 12b so as to bypass the groove 38C.

  The first portion 26a of the lead terminal 26 is electrically and physically connected to a part of the first portion 20c of the lead electrode 20 and the first portion 20d by solder (not shown). The first portion 28a of the lead terminal 28 is electrically and physically connected to a part of the first portion 18c of the lead electrode 18 and the first portion 18d by solder (not shown).

  The solder resist 22 is disposed so as to cover the electrodes 14 and the first portions 18 a and 18 b and the first portion 18 c of the extraction electrode 18. The solder resist 24 is disposed so as to cover a part of the electrode 16 and the first portions 20a and 20b and the first portion 20c of the extraction electrode 20.

  As described above, in the second embodiment, the solder resist 22 is disposed so as to cover at least the region A12 of the main surface 12a (the region closer to the side surface 12c than the electrode 14), and the region of the main surface 12b. The solder resist 24 is disposed so as to cover at least A22 (region closer to the side surface 12d than the electrode 16). Therefore, in the regions A12 and A22 of the main surfaces 12a and 12b of the dielectric body 12 in which the exterior body 32 is in direct contact with the dielectric body 12 when the solder resists 22 and 24 are not provided, the dielectric body. 12 and the solder resists 22 and 24 are brought into close contact with each other, and the solder resists 22 and 24 and the exterior body 32 are brought into close contact with each other. Therefore, the solder resists 22 and 24 are hardly peeled off from the dielectric body 12, and the exterior body 32 is formed. It becomes difficult to peel off from the solder resists 22, 24. As a result, a space is hardly formed between the dielectric element body 12 and the exterior body 32, so that creeping discharge is suppressed and the withstand voltage can be improved. In addition, since the dielectric body 12, the solder resists 22, 24, and the exterior body 32 are in close contact with each other as described above, it is possible to maintain moisture resistance and to prevent the occurrence of a migration phenomenon. .

  In the second embodiment, the position where the lead conductor 18 is drawn from the electrode 14 and the position where the lead conductor 20 is drawn from the electrode 16 are the centers of the electrodes 14 and 16 when viewed from the opposing direction of the electrodes 14 and 16. It is set at a position facing each other with the interposition. The lead conductor 18 is disposed on the main surface 12a so as to bypass the groove 38B, and the lead conductor 20 is disposed on the main surface 12b so as to bypass the groove 38C. Therefore, the distance between the lead conductor 18 and the lead conductor 20 is large. As a result, the dielectric breakdown voltage is increased, and the withstand voltage can be further improved.

  In the second embodiment, the substantially circular electrode 14 is disposed on the main surface 12a so as to be positioned between the groove portions 38A and 38B, and the substantially circular electrode is positioned so as to be positioned between the groove portions 38C and 38D. 16 is arranged on the main surface 12b. That is, the groove portion 38A is disposed between the electrode 14 and the side surface 12c, and the groove portion 38D is disposed between the electrode 16 and the side surface 12d. Therefore, the creeping distance between the electrode 14 and the portion of the lead conductor 20 formed on the side surface 12c and the creeping distance between the electrode 16 and the portion of the lead conductor 18 formed on the side surface 12d are increased. As a result, the dielectric breakdown voltage is increased, and the withstand voltage can be further improved.

  In the second embodiment, the electrodes 14 and 16 have a substantially circular shape. Therefore, electric field concentration is suppressed, the dielectric breakdown voltage is increased, and the withstand voltage can be further improved.

(Third embodiment)
Subsequently, the surface mount electronic component 3 according to the third embodiment will be described with reference to FIGS. FIG. 13 is a perspective view showing the surface-mounted electronic component according to the third embodiment with a part cut away. FIG. 14 is a perspective view of the surface-mount type electronic component according to the third embodiment viewed from the main surface side of the dielectric body. FIG. 15 is a perspective view of the surface-mount type electronic component according to the third embodiment as viewed from the side surface side of the dielectric body. Below, it demonstrates centering around difference with the surface mount-type electronic component 1 which concerns on 1st Embodiment, and the overlapping description is abbreviate | omitted.

  As shown in FIGS. 13 to 15, the surface mount electronic component 3 includes a dielectric body 12, electrodes 14 and 16, lead conductors 18 and 20, solder resists 22 and 24, a pair of lead terminals 26 and 28, and And an exterior body 32.

  The lead conductor 18 has a first portion 18a and a second portion 18b. The second portion 18b is disposed on the side surface 12d. The second portion 18b extends in the opposing direction of the main surfaces 12a and 12b. The first portion 18a is disposed in the region A11 of the main surface 12a so as to electrically connect the second portion 18b and the electrode 14. In the third embodiment, the first portion 18a and the second portion 18b are integrally formed.

  The lead conductor 20 has a first portion 20a and a second portion 20b. The second portion 20b is disposed on the side surface 12c. The second portion 20b extends in the opposing direction of the main surfaces 12a and 12b. The first portion 20a is disposed in the region A21 of the main surface 12b so as to electrically connect the second portion 20b and the electrode 16. In the third embodiment, the first portion 20a and the second portion 20b are integrally formed.

  The solder resist 22 is disposed on the main surface 12a so as to cover most of the electrode 14 and the second portion 18b of the lead conductor 18. The solder resist 24 is disposed on the main surface 12b so as to cover most of the electrode 16 and the second portion 20b of the lead conductor 20.

  The lead terminal 26 includes a first portion 26a, a second portion 26b, and third portions 26c to 26e. The first portion 26a faces the side surface 12c and is connected to the second portion 20b of the lead conductor 20 by solder (not shown). As a result, the lead terminal 26 is electrically connected to the lead conductor 20. The first portion 26a has a plate shape in order to improve the ground contact area with the second portion 20b of the lead conductor 20. As a result, the first portion 26 a has a facing surface that faces the side surface 12 c of the dielectric body 12.

  The lead terminal 28 includes a first portion 28a, a second portion 28b, and third portions 28c to 28e. The first portion 28a faces the side surface 12d and is connected to the second portion 20b of the lead conductor 18 by solder (not shown). As a result, the lead terminal 28 is electrically connected to the lead conductor 18. The first portion 28a has a plate shape for improving the ground contact area between the lead conductor 18 and the second portion 18b. As a result, the first portion 28 a has a facing surface that faces the side surface 12 d of the dielectric body 12.

  As described above, the surface-mount electronic component 3 according to the third embodiment also has the same effects as the surface-mount electronic component 1 according to the first embodiment.

  In the third embodiment, the first portion 26a of the lead terminal 26 is connected to the second portion 20b of the lead conductor 20 disposed on the side surface 12c, and the lead terminal 28 is disposed on the side surface 12d. 18 is connected to the second portion 18b. Therefore, unlike the conventional surface mount type electronic component, the lead terminals 26 and 28 are not arranged so as to wrap around the periphery of the dielectric element body 12 along the outer shape of the dielectric element body 12. As a result, the surface mount electronic component 3 can be downsized.

  In the third embodiment, when the surface-mount type electronic component 3 is manufactured, the intermediate body 50 in which the electrodes 14 and 16, the lead conductors 18 and 20, and the solder resists 22 and 24 are arranged on the dielectric body 12, The lead frame 40 can be supplied from above. Therefore, it is possible to simplify the manufacturing equipment for the surface-mounted electronic component 3.

(Fourth embodiment)
Subsequently, the surface mount electronic component 4 according to the fourth embodiment will be described with reference to FIGS. 16 to 18. FIG. 16 is a perspective view showing the surface-mounted electronic component according to the fourth embodiment with a part cut away. FIG. 17 is a perspective view of the surface-mount type electronic component according to the fourth embodiment viewed from the main surface side of the dielectric body. FIG. 18 is a perspective view of the surface-mount type electronic component according to the fourth embodiment viewed from the side surface side of the dielectric body. Below, it demonstrates centering around difference with the surface mount-type electronic component 1 which concerns on 1st Embodiment, and the overlapping description is abbreviate | omitted.

  As shown in FIGS. 16 to 18, the surface mount electronic component 4 includes a dielectric body 12, electrodes 14 and 16, lead conductors 18 and 20, solder resists 22 and 24, a pair of lead terminals 26 and 28, and An exterior body 32 is provided.

  The lead conductor 18 has a first portion 18a and a second portion 18b. The second portion 18b is disposed on the side surface 12d. The second portion 18b extends in the opposing direction of the main surfaces 12a and 12b. The first portion 18a is disposed in the region A11 of the main surface 12a so as to electrically connect the second portion 18b and the electrode 14. In the fourth embodiment, the first portion 18a and the second portion 18b are integrally formed.

  The lead conductor 20 has a first portion 20a and a second portion 20b. The second portion 20b is disposed on the side surface 12c. The second portion 20b extends in the opposing direction of the main surfaces 12a and 12b. The first portion 20a is disposed in the region A21 of the main surface 12b so as to electrically connect the second portion 20b and the electrode 16. In the fourth embodiment, the first portion 20a and the second portion 20b are integrally formed.

  The solder resist 22 is disposed on the main surface 12a so as to cover most of the electrode 14 and the second portion 18b of the lead conductor 18. The solder resist 24 is disposed on the main surface 12b so as to cover most of the electrode 16 and the second portion 20b of the lead conductor 20.

  The lead terminal 26 includes a first portion 26a, a second portion 26b, and third portions 26c to 26e. The first portion 26a faces the side surface 12c and is connected to the second portion 20b of the lead conductor 20 by solder (not shown). As a result, the lead terminal 26 is electrically connected to the lead conductor 20. The first portion 26a has a plate shape in order to improve the ground contact area with the second portion 20b of the lead conductor 20. As a result, the first portion 26 a has a facing surface that faces the side surface 12 c of the dielectric body 12.

  The second portion 26b is continuous (integrally formed) with one end of the first portion 26a. The second portion 26b protrudes in a direction opposite to the side surfaces 12c and 12d and in a direction opposite to the first portion 26a. The second portion 26 b is in contact with the solder resist 24 and faces the main surface 12 b of the dielectric element body 12. Therefore, the second portion 26 b fulfills the function of supporting the dielectric body 12 during the manufacture of the surface mount electronic component 4.

  The lead terminal 28 includes a first portion 28a, a second portion 28b, and third portions 28c to 28e. The first portion 28a faces the side surface 12d and is connected to the second portion 20b of the lead conductor 18 by solder (not shown). As a result, the lead terminal 28 is electrically connected to the lead conductor 18. The first portion 28a has a plate shape for improving the ground contact area between the lead conductor 18 and the second portion 18b. As a result, the first portion 28 a has a facing surface that faces the side surface 12 d of the dielectric body 12.

  The second portion 28b is continuous (integrally formed) with one end of the first portion 28a. The second portion 28b protrudes in the opposite direction of the side surfaces 12c and 12d and in the opposite direction to the first portion 28a. The second portion 28 b is in contact with the solder resist 24 and faces the main surface 12 b of the dielectric element body 12. Therefore, the second portion 28b fulfills the function of supporting the dielectric body 12 during the manufacture of the surface mount electronic component 4.

  As described above, the surface-mount electronic component 4 according to the fourth embodiment also has the same effects as the surface-mount electronic component 1 according to the first embodiment.

  In the fourth embodiment, the first portion 26a of the lead terminal 26 is connected to the second portion 20b of the lead conductor 20 disposed on the side surface 12c, and the lead terminal 28 is disposed on the side surface 12d. 18 is connected to the second portion 18b. Therefore, unlike the conventional surface mount type electronic component, the lead terminals 26 and 28 are not arranged so as to wrap around the periphery of the dielectric element body 12 along the outer shape of the dielectric element body 12. As a result, the surface mount electronic component 4 can be reduced in size.

  In the fourth embodiment, when the surface-mount type electronic component 4 is manufactured, the intermediate body 50 in which the electrodes 14 and 16, the lead conductors 18 and 20, and the solder resists 22 and 24 are arranged on the dielectric body 12, The lead frame 40 can be supplied from above. Therefore, it is possible to simplify the manufacturing equipment for the surface-mounted electronic component 4.

(Fifth embodiment)
Then, with reference to FIGS. 19-21, the surface-mount type electronic component 5 which concerns on 5th Embodiment is demonstrated. FIG. 19 is a perspective view of the surface-mount type electronic component according to the fifth embodiment with a part cut away. FIG. 20 is a perspective view of the surface-mount electronic component according to the fifth embodiment viewed from the main surface side of the dielectric body. FIG. 21 is a perspective view of the surface-mount electronic component according to the fifth embodiment viewed from the side surface side of the dielectric body. Below, it demonstrates centering around difference with the surface mount-type electronic component 1 which concerns on 1st Embodiment, and the overlapping description is abbreviate | omitted.

  As shown in FIGS. 19 to 21, the surface-mount electronic component 5 includes a dielectric body 12, electrodes 14 and 16, lead conductors 18 and 20, solder resists 22 and 24, a pair of lead terminals 26 and 28, and An exterior body 32 is provided.

  The lead conductor 18 has a first portion 18a and a second portion 18b. The second portion 18b is disposed on the side surface 12d. The second portion 18b extends in the opposing direction of the main surfaces 12a and 12b. The first portion 18a is disposed on the main surface 12a so as to electrically connect the second portion 18b and the electrode 14. In the fifth embodiment, the first portion 18a and the second portion 18b are integrally formed.

  The lead conductor 20 has a first portion 20a and a second portion 20b. The second portion 20b is disposed on the side surface 12c. The second portion 20b extends in the opposing direction of the main surfaces 12a and 12b. The first portion 20a is disposed on the main surface 12b so as to electrically connect the second portion 20b and the electrode 16. In the fifth embodiment, the first portion 20a and the second portion 20b are integrally formed.

  The solder resist 22 is disposed on the main surface 12a so as to cover most of the electrode 14 and the second portion 18b of the lead conductor 18. The solder resist 24 is disposed on the main surface 12b so as to cover most of the electrode 16 and the second portion 20b of the lead conductor 20.

  The lead terminal 26 includes a first portion 26a, a second portion 26b, and third portions 26c to 26e. The first portion 26a is warped so as to protrude toward the dielectric body 12 (lead terminal 28), and is substantially C-shaped when viewed from the opposing direction of the side surfaces 12e and 12f of the dielectric body 12. Yes. Therefore, the first portion 26a is urged toward the protruding direction. The first portion 26a faces the side surface 12c and is connected to the second portion 20b of the lead conductor 20 by solder (not shown). As a result, the lead terminal 26 is electrically connected to the lead conductor 20. The first portion 26a has a plate shape in order to improve the ground contact area with the second portion 20b of the lead conductor 20. As a result, the first portion 26 a has a facing surface that faces the side surface 12 c of the dielectric body 12.

  The lead terminal 28 includes a first portion 28a, a second portion 28b, and third portions 28c to 28e. The first portion 28a is warped so as to protrude toward the dielectric body 12 (lead terminal 26), and is substantially C-shaped when viewed from the opposing direction of the side surfaces 12e and 12f of the dielectric body 12. Yes. Therefore, the first portion 28a is urged toward the protruding direction. The first portion 28a faces the side surface 12d and is connected to the second portion 20b of the lead conductor 18 by solder (not shown). As a result, the lead terminal 28 is electrically connected to the lead conductor 18. The first portion 28a has a plate shape for improving the ground contact area between the lead conductor 18 and the second portion 18b. As a result, the first portion 28 a has a facing surface that faces the side surface 12 d of the dielectric body 12.

  As described above, the surface-mount electronic component 5 according to the fifth embodiment also has the same effects as the surface-mount electronic component 1 according to the first embodiment.

  In the fifth embodiment, the first portion 26a of the lead terminal 26 is connected to the second portion 20b of the lead conductor 20 disposed on the side surface 12c, and the lead terminal 28 is disposed on the side surface 12d. 18 is connected to the second portion 18b. Therefore, unlike the conventional surface mount type electronic component, the lead terminals 26 and 28 are not arranged so as to wrap around the periphery of the dielectric element body 12 along the outer shape of the dielectric element body 12. As a result, the surface mount electronic component 5 can be downsized.

  In the fifth embodiment, when the surface-mount type electronic component 5 is manufactured, the intermediate body 50 in which the electrodes 14 and 16, the lead conductors 18 and 20, and the solder resists 22 and 24 are arranged on the dielectric body 12, The lead frame 40 can be supplied from above. Therefore, it is possible to simplify the manufacturing equipment for the surface-mounted electronic component 5.

  In the fifth embodiment, the first portion 26 a of the lead terminal 26 is biased toward the lead terminal 28, and the first portion 28 a of the lead terminal 28 is biased toward the lead terminal 26. Therefore, when the surface mount type electronic component 5 is manufactured, when the intermediate body 50 is supplied to the lead frame 40, the intermediate body 50 is sandwiched between the lead terminals 26 and 28. As a result, the intermediate body 50 (dielectric body 12) can be reliably held when the surface-mounted electronic component 5 is manufactured.

  Although the preferred embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments. For example, in the second embodiment, the second portion 18c of the lead conductor 18 is substantially parallel to the side surfaces 12e and 12f, and the second portion 20c of the lead conductor 20 is substantially parallel to the side surfaces 12e and 12f. Not limited to this. If the lead conductor 18 is formed from the electrode 14 to the side surface 12d so as to bypass the groove portion 38B, and the lead conductor 20 is formed from the electrode 16 to the side surface 12c so as to bypass the groove portion 38C, the lead conductors 18, 20 are formed. The shape of is not particularly limited.

  In the second embodiment, the dielectric element body 12 has the groove portions 38A, 38B, 38C, and 38D. However, the dielectric element body 12 is not limited to this, and may have a protrusion portion. May be combined.

  In the first to fifth embodiments, the present invention is applied to a surface mount type capacitor, but may be applied to a surface mount type varistor. In this case, a varistor element body is provided instead of the dielectric element body 12. The varistor element body has dielectric characteristics and voltage non-linear characteristics (varistor characteristics), and is made of a varistor material (including ZnO as a main component and a rare earth element or Bi as a subcomponent).

  In the first to fifth embodiments, the cream solder is applied to the facing surface S2 of the terminal portions 46 and 48 before the intermediate body 50 is mounted on the lead frame 40. However, the present invention is not limited to this. Specifically, it is only necessary that the terminal portions 46 and 48 and the lead conductors 18 and 20 can be electrically connected. For example, an adhesive in which metal powder is kneaded is used, and the adhesive is used. The terminal portions 46 and 48 and the lead conductors 18 and 20 can be electrically connected by thermosetting.

  In the first to fifth embodiments, the solder resist 22 is arranged on the main surface 12a of the dielectric element body 12 and the solder resist 24 is arranged on the main surface 12b of the dielectric element body 12, but this is not limitative. Absent. That is, a portion of the main surface 12a that is disposed on the main surface 12a so as to cover at least a region opposite to the lead conductor 18 with respect to the electrode 14 (region closer to the side surface 12c than the electrode 14), and the main surface 12b If at least a portion disposed on the main surface 12b so as to cover at least the region opposite to the lead conductor 20 (the region closer to the side surface 12d than the electrode 16) across the electrode 16 is dielectric, One solder resist may be arranged so as to make one round of the outer surface of the body element body 12. Further, the solder resists 22 and 24 may not be arranged on the main surfaces 12a and 12b.

It is a see-through | perspective perspective view which shows the surface mount-type electronic component which concerns on 1st Embodiment. It is the perspective view which looked at the surface mount type electronic component concerning a 1st embodiment from the principal surface side of a dielectric element body. It is the perspective view which looked at the surface mount type electronic component concerning a 1st embodiment from the side of the dielectric body. It is a flowchart for demonstrating the manufacturing process of the surface mount-type electronic component which concerns on 1st Embodiment. It is a figure for demonstrating each process of the manufacturing process of a surface mount-type electronic component. FIG. 6 is a diagram for explaining a process subsequent to FIG. 5. It is a figure for demonstrating the subsequent process of FIG. FIG. 8 is a diagram for explaining a step subsequent to FIG. 7. FIG. 9 is a diagram for explaining a step subsequent to FIG. 8. FIG. 10 is a diagram for explaining a step subsequent to FIG. 9. It is the perspective view which looked at the dielectric body of the surface mount type electronic component concerning a 2nd embodiment from the principal surface side. It is the perspective view which looked at the surface mounting type electronic component concerning a 2nd embodiment from the side of the dielectric body. It is a perspective view which notches and shows the surface-mount type electronic component which concerns on 3rd Embodiment. It is the perspective view which looked at the surface mount type electronic component concerning a 3rd embodiment from the principal surface side of a dielectric element body. It is the perspective view which looked at the surface mounting type electronic component concerning a 3rd embodiment from the side of the dielectric body. It is a perspective view which notches and shows a part of surface mounting type electronic component which concerns on 4th Embodiment. It is the perspective view which looked at the surface mounting type electronic component concerning a 4th embodiment from the principal surface side of a dielectric element body. It is the perspective view which looked at the surface mounting type electronic component concerning a 4th embodiment from the side of the dielectric body. It is a perspective view which cuts and shows a part of surface mounting type electronic component concerning a 5th embodiment. It is the perspective view which looked at the surface mounting type electronic component which concerns on 5th Embodiment from the main surface side of the dielectric body. It is the perspective view which looked at the surface-mount type electronic component concerning a 5th embodiment from the side of the dielectric body.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1-5 ... Surface mount type electronic component, 12 ... Dielectric body, 12a, 12b ... Main surface, 12c-12f ... Side surface, 12A, 12B ... Projection, 14, 16 ... Electrode, 18, 20 ... Lead-out conductor, 22, 24 ... Solder resist, 26, 28 ... Lead terminal, 32 ... Exterior body, 100 ... Circuit board, 150 ... Inverter device, 38A-38D ... Groove, 39A, 39B ... Depression, S1 ... Virtual plane, S2 ... Opposite surface.

Claims (11)

The first main surface has a first main surface and a second main surface facing each other and has a dielectric property, and the first main surface is located between the first region, the second region, and the first region and the second region. An element body including the first region, the second region, and the third region located between the first region and the second region; ,
A first electrode disposed in the third region of the first main surface;
A second electrode disposed in the third region of the second main surface and facing the first electrode;
A first lead conductor having a first portion disposed in the first region of the first main surface and electrically connected to the first electrode;
A second lead conductor having a first portion disposed in the first region of the second main surface and electrically connected to the second electrode;
A first lead terminal electrically connected to the first lead conductor;
A second lead terminal electrically connected to the second lead conductor;
A portion disposed on the first main surface so as to cover at least the second region of the first main surface, and disposed on the second main surface so as to cover at least the second region of the second main surface. An insulating film having at least a portion
Cover the element body, the first electrode, the second electrode, the first lead conductor, the second lead conductor, a part of the first lead terminal, a part of the second lead terminal, and the insulating film. And an exterior body having electrical insulation disposed in
The element body extends to connect the first main surface and the second main surface and connects the first side surface and the second side surface facing each other, and connects the first main surface and the second main surface. And having a third side surface and a fourth side surface facing each other,
The first portion of the first lead conductor and the first portion of the second lead conductor are not opposed to each other when viewed from the opposing direction of the first main surface and the second main surface,
The first portion of the first lead conductor has a portion extending from the first electrode toward the third side surface and a portion extending from the third side surface toward the first side surface. ,
The first portion of the second lead conductor is that has a portion extending toward the portion and the fourth side surface extending toward the second electrode in the direction of the fourth side surface in the direction of the second side An electronic component characterized by that. The element body has depressions in a region between the first electrode and the second side surface on the first main surface and a region between the second electrode and the first side surface on the second main surface. The electronic component according to claim 1, wherein a portion and / or a protrusion is provided. Electronic component according to claim 1 or 2, characterized in that a shape of the first electrode and the second electrode is rounded. The first lead terminal is opposed to the first portion connected to the first portion of the first lead conductor and the first main surface, and extends in a facing direction of the first side surface and the second side surface. Two parts,
The second lead terminal is opposed to the first portion connected to the first portion of the second lead conductor and the first main surface, and extends in a facing direction of the first side surface and the second side surface. It has 2 parts, The electronic component as described in any one of Claims 1-3 characterized by the above-mentioned. The first lead terminal and the second lead terminal are each pulled out from the exterior body,
The drawing position of the first lead terminal drawn out from the outer package and the drawing position of the second lead terminal drawn from the outer package are virtual planes substantially parallel to the first main surface and the second main surface. The electronic component according to any one of claims 1 to 4, wherein the electronic component is located above. An inverter device comprising the electronic component according to any one of claims 1 to 5 . The first main surface has a first main surface and a second main surface facing each other and has a dielectric property, and the first main surface is located between the first region, the second region, and the first region and the second region. An element body including the first region, the second region, and the third region located between the first region and the second region; A first electrode disposed in the third region of the first main surface, a second electrode disposed in the third region of the second main surface and opposed to the first electrode, and the first A first lead conductor having a first portion disposed in the first region of the main surface and electrically connected to the first electrode; and a first conductor disposed in the first region of the second main surface. The first main surface so as to cover at least the second lead conductor having one portion and electrically connected to the second electrode, and the second region of the first main surface; An intermediate preparation step of preparing an intermediate including a portion to be arranged and an insulating film having at least a portion arranged on the second main surface so as to cover at least the second region of the second main surface; ,
A lead frame preparation step of preparing a lead frame including a first terminal portion having a first portion and a second terminal portion having a first portion;
Electrically connecting the first portion of the first terminal portion and the first lead conductor, and electrically connecting the first portion of the second terminal portion and the second lead conductor; A mounting step of mounting the intermediate body on the lead frame;
The element body, the first electrode, the second electrode, and the first lead conductor are formed by injecting and curing a resin into a mold in which the lead frame on which the intermediate body is mounted is disposed. , An exterior body forming step of forming an exterior body having electrical insulation disposed so as to cover the second lead conductor, a part of the first terminal part, a part of the second terminal part, and the insulating film When,
The intermediate body in which the exterior body is formed is cut by cutting a portion of the first terminal portion that is pulled out from the exterior body and a portion of the second terminal portion that is pulled out of the exterior body. A method of manufacturing an electronic component, comprising: a cutting step of separating from a lead frame. In the mounting step, solder is applied to each of the first portion of the first terminal portion and the first portion of the second terminal portion, and the intermediate body is connected to the first portion of the first terminal portion and the first portion. Soldering the first part of the first terminal part and the first part of the first lead conductor by heat treatment after being inserted between the first part of the two terminal parts, The method for manufacturing an electronic component according to claim 7 , wherein the first portion of the second terminal portion and the first portion of the second lead conductor are soldered. The element body has a first side surface and a second side surface that extend so as to connect the first main surface and the second main surface and face each other;
The first lead conductor has a second portion disposed on the first side surface,
The second lead conductor has a second portion disposed on the second side surface;
The first portion of the first terminal portion and the first portion of the second terminal portion have opposing surfaces that face each other, and the first side surface of the element body and the second portion of the element body. Separated by a distance corresponding to the width of the element body in the opposing direction of the side surfaces;
In the mounting step, solder is applied to each of the opposing surfaces of the first portion of the first terminal portion and the first portion of the second terminal portion, and the first portion of the first terminal portion is coated with the solder. The second portion of the first lead conductor is located between the opposing surface and the first side surface of the element body, and the opposing surface of the first portion of the second terminal portion and the first portion of the element body. The intermediate body is placed between the first portion of the first terminal portion and the first portion of the second terminal portion so that the second portion of the second lead conductor is positioned between two side surfaces. Then, the first portion of the first terminal portion and the second portion of the first lead conductor are soldered by heat treatment, and the first portion of the second terminal portion The second lead conductor is soldered to the second portion. Method of manufacturing an electronic component according to Motomeko 7. The first terminal portion is at least partially disposed closer to the second terminal portion than the first portion of the first terminal portion, and the first portion and the second terminal of the first terminal portion. A second portion extending along a direction connecting the first portion of the portion,
The second terminal portion is at least partially disposed closer to the first terminal portion than the first portion of the second terminal portion, and the first portion and the second terminal of the first terminal portion. A second portion extending along a direction connecting the first portion of the portion,
In the mounting step, the intermediate body is moved to the first terminal portion so that the first main surface of the element body faces the second portion of the first terminal portion and the second portion of the second terminal portion. The second portion of the first terminal portion and the second portion of the second terminal portion are electrically connected to electrically connect the first portion of the first terminal portion and the first portion of the first lead conductor. In addition, the intermediate body is mounted on the lead frame by electrically connecting the first portion of the second terminal portion and the first portion of the second lead conductor. 7. A method for producing an electronic component described in item 7 . The element body has a first side surface and a second side surface that extend so as to connect the first main surface and the second main surface and face each other;
The first lead conductor has a second portion disposed on the first side surface,
The second lead conductor has a second portion disposed on the second side surface;
The first portion of the first terminal portion and the first portion of the second terminal portion have opposing surfaces that face each other, and the first side surface of the element body and the second portion of the element body. Spaced apart by a distance corresponding to the width of the element body in the opposing direction of the side surfaces,
The first terminal portion is at least partially disposed closer to the second terminal portion than the first portion of the first terminal portion, and the first portion and the second terminal of the first terminal portion. A second portion extending in a direction opposite to the first portion of the portion,
The second terminal portion is at least partially disposed closer to the first terminal portion than the first portion of the second terminal portion, and the first portion and the second terminal of the first terminal portion. A second portion extending in a direction opposite to the first portion of the portion,
In the mounting step, the intermediate body is moved to the first terminal portion so that the first main surface of the element body faces the second portion of the first terminal portion and the second portion of the second terminal portion. The second portion of the first terminal portion and the second portion of the second terminal portion are electrically connected to the first portion of the first terminal portion and the second portion of the first lead conductor. The intermediate body is mounted on the lead frame by electrically connecting the first portion of the second terminal portion and the second portion of the second lead conductor. 7. A method for producing an electronic component described in item 7 .

Images