JP2000021675A - Lead frame and electronic component manufacturing method using the frame - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lead frame, which provides a terminal member comprised of a metal plate which is bonded with terminal electrodes formed on each terminal surface of an electronic component unit, facilitates the positional alignment of the terminal member and the electronic component unit and enables sure positional alignment. SOLUTION: This device comprises a pair of terminal members 4, formed by cutting and raising a first part of a metal plate 13 which comprises a lead frame 1 and a pair of positional alignment chips 15 formed by cutting and raising a second part of the metal plate 13. The positional alignment for the terminal members 4 is made by putting an electronic part unit 3 in between, while contacting each terminal electrode 9 and the position alignment for the position alignment chips 15 is made by putting the electronic component unit 3 in between, while making contact with two side surface 5 and 6 respectively.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame structure for providing a terminal member made of a metal plate for an electronic component, and a method for manufacturing an electronic component using the same. The present invention relates to an improvement in means for aligning with an electronic component body.

[0002]

2. Description of the Related Art For example, when a ceramic electronic component such as a multilayer ceramic capacitor is mounted on a wiring board made of aluminum having excellent heat dissipation properties, a difference in thermal expansion coefficient between the aluminum substrate and the ceramic electronic component is large. In a temperature cycle in which the temperature is repeatedly increased and decreased, there is a problem that the ceramic electronic component is likely to be broken. In particular, in the case of a multilayer ceramic capacitor using a high-capacity Pb-based ceramic dielectric required in the power supply market, this problem is more likely to occur because its bending strength is relatively low.

In order to solve the above-mentioned problem, a terminal member made of a metal plate is attached to a terminal electrode formed on an electronic component body of a ceramic electronic component, and the terminal member is soldered to a wiring board. Proposed and put into practical use.

An electronic component body for a ceramic electronic component such as the above-described multilayer ceramic capacitor is usually provided.
Since the terminal electrodes are formed on two opposite end surfaces, a pair of terminal members made of a metal plate are prepared.
When the pair of terminal members are connected to the respective terminal electrodes, they are arranged so as to sandwich the electronic component body. Further, the terminal member and the terminal electrode are joined to each other via a conductive joining material such as solder or a conductive adhesive.

[0005] Under such circumstances, the connection by the conductive bonding material and the positioning between the terminal member and the electronic component body before the bonding process can be performed efficiently, and a large number of electronic components can be formed. In order to efficiently supply a large number of terminal members, a lead frame made of a metal plate is often used.

A lead frame usually has a longitudinal shape, and a pair of terminal members is formed by cutting and raising a part of a metal plate constituting the lead frame. Are distributed in the direction. Each pair of terminal members formed on the lead frame is in contact with terminal electrodes on two end surfaces of the electronic component body, respectively.
The electronic component main body is disposed so as to be positioned with the electronic component body therebetween. Therefore, in the state where it is positioned as described above, the terminal electrodes of the electronic component main body and the respective terminal members are connected via the conductive bonding material, and then the terminal members are separated from the rest of the metal plate to obtain the desired terminal. An electronic component including the member can be efficiently obtained.

[0007]

According to the above-described lead frame, before the terminal electrodes of the electronic component body are connected to the respective terminal members, the electronic component body is interposed between the paired terminal members. It can be sandwiched and positioned. Therefore, the electronic component main body can be easily aligned with the terminal member and reliably positioned with respect to the direction of connecting the end faces.

However, the paired terminal members cannot be aligned with respect to, for example, the direction in which the side surfaces of the electronic component body are connected, and the positioning in the direction in which the side surfaces are connected is substantially performed. Cannot do it.

If a pair of terminal members are to perform a positioning function in the direction of connecting the side surfaces, if the metal plate constituting the lead frame is used,
It is also conceivable to use a thick and thick spring constant, but in this case, it is difficult for the terminal member to deform or move to absorb the stress generated due to the expansion and contraction of the wiring board in the mounted state. Therefore, the original purpose of attaching the terminal member is impaired. Also,
As described above, even if the metal plate constituting the lead frame has a large spring constant and a large thickness, it is almost impossible to perfectly perform the positioning in the direction connecting the side surfaces.

An object of the present invention is to provide a lead frame capable of solving the above-described problems and a method for manufacturing an electronic component using the same.

[0011]

According to the present invention, first, there are provided two end faces facing each other, two side faces facing each other, an upper face and a lower face facing each other, and a terminal electrode is provided on each end face. A lead frame for providing the terminal member in such an electronic component, comprising a formed chip-shaped electronic component body and a pair of terminal members made of a metal plate connected to each terminal electrode. Turned to

A lead frame according to the present invention is characterized by having the following configuration in order to solve the above-mentioned technical problem. That is, the lead frame is made of a metal plate as a whole, and by cutting and raising the first portion of the metal plate, at least one pair of terminal members is positioned while sandwiching the electronic component body while being in contact with the terminal electrodes. It is formed so that it can be done. In addition to this, by cutting and raising the second portion of the metal plate, at least one pair of positioning pieces are formed so as to be able to position the electronic component main body while being in contact with the two side surfaces, respectively. Is done. Then, the terminal members formed on the lead frame are scheduled to be separated from the rest of the metal plate after being connected to each terminal electrode.

The present invention is also directed to a method of manufacturing an electronic component including the above-described chip-shaped electronic component body and a pair of terminal members.

In the method of manufacturing an electronic component according to the present invention, first, as a first step, a step of preparing a lead frame as described above is performed. Next, in the second step, the electronic component body is inserted between the paired positioning members between the paired terminal members of the lead frame, and the electronic component body is connected to the paired terminal members and A step of positioning the pair of positioning pieces is performed, and then, as a third step, the terminal electrodes of the electronic component body and the respective terminal members are electrically connected to each other in the state of being positioned by the second step. A step of connecting via a conductive bonding material is performed, and then, as a fourth step, a step of separating the terminal member from the rest of the metal plate is performed.

As described above, in the fourth step, the terminal member is cut off from the rest of the metal plate.
When the cutting for this separation is performed, it is preferable that the positioning piece is separated from the terminal member while being held on the remaining side of the metal plate. It is preferable that the hole formed in the plate is selected to have such a shape as to enable the positioning piece to be separated from the terminal member.

[0016] In the lead frame according to the present invention, the pair of positioning pieces are provided at their free ends.
It is preferable to form guide surfaces bent in directions away from each other.

Further, the terminal member is formed so as to rise from the surface direction of the metal plate, and has a main portion for connection to each terminal electrode, and a bent portion from the main portion to extend in the surface direction of the metal plate. It is preferable that a connection terminal portion for connection to the wiring board be provided so as to extend and face the lower surface of the electronic component body.

Further, in the third step included in the method for manufacturing an electronic component according to the present invention, as the conductive bonding material,
Preferably, solder is used.

In the embodiment using the solder as described above, the end of the main part of the terminal member is bent in an inverted U shape toward the side where the connection terminal part is located, and faces outward in this bent state of the terminal member. It is preferable that the surface has a solder affinity surface that is compatible with solder, and the surface facing inward in the bent state has a solder non-affinity surface that does not adapt to solder.

Further, it is preferable that the connection terminal portion of the lead frame according to the present invention is provided with a projection projecting toward the lower surface of the electronic component body.

It is preferable that a bulging portion protruding toward the terminal electrode is formed at a main portion of the terminal member.

The method for manufacturing an electronic component according to the present invention is particularly advantageously applied when the electronic component body contains ceramic.

The method of manufacturing an electronic component according to the present invention may further include a step of joining a plurality of electronic component bodies to each other with the respective terminal electrodes facing in the same direction. In the second step, the plurality of integrated electronic component bodies are inserted between the pair of terminal members of the lead frame and between the pair of positioning pieces.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1 to 3 illustrate one embodiment of the present invention. Here, FIG.
FIG. 2 is a perspective view showing a part of the lead frame 1. FIG.
FIG. 3 shows a front view of an electronic component 2 manufactured using the lead frame 1 shown in FIG. FIG. 2 is a perspective view showing a state in which an electronic component body 3 for an electronic component 2 is incorporated in the lead frame 1 shown in FIG.

Referring mainly to FIG. 3, an electronic component 2 to be obtained includes an electronic component body 3 and a pair of terminal members 4 made of a metal plate.

The electronic component body 3 constitutes a multilayer ceramic capacitor, for example, and contains ceramic. The electronic component body 3 has two end faces facing each other, two side faces 5 and 6 facing each other, an upper face 7 and a lower face 8 facing each other, and a terminal electrode 9 is formed on each end face. I have.

The terminal member 4 is connected to each of the terminal electrodes 9 described above via, for example, a solder 10 as a conductive bonding material. The terminal member 4 includes a main portion 11 for connection to the terminal electrode 9 and a wiring board extending from the main portion 11 via a bent portion and positioned so as to face the lower surface 8 of the electronic component body. (Not shown) and a connection terminal portion 12 for connection to an L-shape.

Referring to FIGS. 1 and 2, the terminal member 4 as described above is provided by the lead frame 1. The lead frame 1 is made of a metal plate 13 as a whole, and a specific portion of the metal plate 13 is cut and raised so that the terminal members 4 form a pair. As shown in FIG. 2, the paired terminal members 4 are provided in such a manner that they can be positioned while sandwiching the electronic component body 3 while being in contact with the terminal electrodes 9. More specifically, the main part 11 of the terminal member 4 is formed so as to rise from the surface direction of the metal plate 13, and the connection terminal part 12 is formed of the metal plate 1.
3 so as to extend in the plane direction. Metal plate 13
As a result of the formation of the terminal members 4, the holes 14 are left.

Further, by cutting and raising another specific portion of the metal plate 13, a pair of positioning pieces 15 is formed. These positioning pieces 15 are, as shown in FIG.
It is formed in such a manner that it can be positioned while sandwiching the electronic component body 3 while contacting the two side surfaces 5 and 6 respectively. These paired positioning pieces 15 form guide surfaces 16 which are bent at their free ends in directions away from each other. The metal plate 13 has a positioning piece 15
As a result, a hole 17 is left.

A protruding portion 18 protruding toward the lower surface 8 of the electronic component body 3 is formed in a portion of the terminal member 4 to be the connection terminal portion 12 by processing a metal plate 13. As shown in FIG. 3, the convex portion 18 ensures that a predetermined interval is formed between the lower surface 8 of the electronic component main body 3 and the vertical direction between the electronic component main body 3 and the terminal member 4. Facilitates alignment. As long as such an object is achieved, the number, position, or shape of the protrusions 18 can be arbitrarily changed. Further, the projection 18 does not necessarily have to be in contact with the lower surface 8 of the electronic component body 3.

The end of the main part 11 of the terminal member 4 is
It is bent in an inverted U-shape to the side where the connection terminal portion 12 is located. On the surface of the terminal member 4 which faces outward in this bent state, a solder-affinity surface 19 which is compatible with solder is formed, while on the surface which faces inward in the bent state, a solder-non-affinity surface 20 which does not adapt to solder is formed. Are formed.

In order to form such a solder affinity surface 19 and a solder non-affinity surface 20, for example, a plate made of a conductive material having poor solderability such as stainless steel is used as the metal plate 13. The surface of the plate 13 is directly used as the solder non-affinity surface 20, and on the side providing the solder affinity surface 19, for example, a nickel plating layer and a copper plating layer (not shown) are formed on the metal plate 13, although not shown. The solder affinity surface 19 is provided by the surface of the latter copper plating layer.

The main part 11 of the terminal member 4 is formed with a bulge 23 projecting toward the terminal electrode 9.
The bulging portion 23 reliably forms a predetermined gap between the main portion 11 of the terminal member 4 and the terminal electrode 9, thereby facilitating the formation of the solder 10 with a uniform and predetermined thickness. . As shown in FIG. 1, such a bulging portion 23 preferably has a longitudinal rib shape extending in the up-down direction, whereby the strength of the terminal member 4 can be increased.

The lead frame 1 usually has a longitudinal shape, and a plurality of pairs of the terminal members 4 and the positioning pieces 15 are provided so as to be distributed in the longitudinal direction. Further, in order to facilitate the feeding and positioning of the lead frame 1 when performing processes such as processing for forming the terminal member 4 and the positioning piece 15 and insertion of the electronic component body 3 on the lead frame 1. , A plurality of feed holes 24 are provided along both side edges while being distributed in the longitudinal direction.

After such a lead frame 1 is prepared, as shown in FIG. 2, between the pair of terminal members 4 and between the pair of positioning pieces 15, respectively, the electronic component body is provided. 3 to insert the electronic component body 3
To the pair of terminal members 4 and the pair of positioning pieces 15
And positioned.

At this time, the paired terminal members 4 facilitate the alignment in the direction connecting the two end surfaces of the electronic component body 3, and the paired positioning pieces 15 are used for the two positioning pieces 15 of the electronic component body 3. It facilitates alignment in the direction connecting the side surfaces 5 and 6. Also, the positioning piece 15
The guide surface 16 formed in the above facilitates insertion of the electronic component body 3 between each of the pair of terminal members 4 and the pair of positioning pieces 15. In this way, the electronic component body 3 is reliably positioned with respect to the lead frame 1 both in the direction connecting the two end faces and in the direction connecting the two side faces 5 and 6. In addition, the above-mentioned convex portion 18 facilitates the positioning of the electronic component body 3 in the vertical direction.

Next, in the state of being positioned as described above, the terminal electrode 9 of the electronic component body 3 and each terminal member 4 are
They are connected via solder 10. The solder 10 is applied by, for example, an immersion method. At this time, the solder 10
Although it is provided on the solder affinity surface 19 of the terminal member 4, since a predetermined space is formed between the main portion 11 of the terminal member 4 and the terminal electrode 9 by the bulging portion 23, Such solder 10 can be applied uniformly and with a predetermined thickness.

On the other hand, the solder 10 is not applied to the solder non-affinity surface 20 side. For this reason, for example, the solder 10 does not go inside the inverted U-shaped portion of the main portion 11 of the terminal member 4, so that a bridge or the like made of the solder 10 does not occur at this portion. Further, in the connection terminal portion 12, a surface facing the lower surface 8 side of the electronic component body 3 is a solder non-affinity surface 20. Therefore,
It is difficult for the solder 10 to wrap around this portion, so that the solder 10 can hardly reach, for example, the terminal electrode 9. In particular, in this embodiment, the presence of the protrusion 18 ensures that a predetermined space is formed between the connection terminal 12 and the electronic component body 3.
Undesired wraparound can be more reliably prevented.

The prevention of the solder 10 from sneaking into an undesired portion also contributes to the smooth deformation or movement of the terminal member 4 for absorbing stress.

The solder affinity surface 19 may not be formed over the entire surface of the metal plate 13, but may be formed only on a necessary portion, that is, a portion to be the terminal member 4.

The application of the solder 10 as described above is not limited to the dipping method, but may be a reflow method. Further, a conductive adhesive may be used instead of the solder 10. Next, the terminal member 4 is cut off from the rest of the metal plate 13. Figure 1 shows this separation.
Is performed along the cutting line 28 shown in FIG. At this time, as can be seen by paying attention to the shapes of the holes 14 and 17, the positioning piece 15 is cut by cutting along the cutting line 28.
Is separated from the terminal member 4. The positioning piece 15 separated from the terminal member 4 remains held on the remaining side of the metal plate 13.

In this way, the electronic component 2 as shown in FIG.

FIG. 4 is for explaining another embodiment of the present invention. FIG. 4 shows an electronic component 2a including elements common to the electronic component 2 shown in FIG.

The electronic component 2a shown in FIG. 4 is greatly different from the electronic component 2 shown in FIG. 3 in that it has two electronic component main bodies 3. These two electronic component bodies 3 are vertically stacked with the respective terminal electrodes 9 facing in the same direction, and are joined to each other by an adhesive 29. As the terminal member 4a, a member whose main part 11a has a relatively long dimension in the vertical direction is used.

Other configurations of the electronic component 2a shown in FIG. 4 are substantially the same as those of the electronic component 2 shown in FIG. 3, and corresponding elements are denoted by the same reference numerals and are duplicated. Description is omitted.

In order to obtain the electronic component 2a shown in FIG. 4, first, a step of joining the two electronic component bodies 3 to each other with the adhesive 29 with the respective terminal electrodes 9 oriented in the same direction is performed.

On the other hand, a lead frame in which the main portion 11a of the terminal member 4a formed thereon has a size comparable to the height of the two electronic component bodies 3 is prepared. Then, the two electronic component bodies 3 integrated as described above are inserted between the pair of positioning members that are between the terminal members 4a that form the pair of lead frames, and thereafter,
Substantially the same steps as those for obtaining the electronic component 2 in FIG. 3 described above are performed, and the electronic component 2a is manufactured.

Even in the case of an electronic component having three or more electronic component bodies 3, it can be manufactured by applying substantially the same steps as described above.

While the present invention has been described with reference to the preferred embodiments illustrated, within the scope of the present invention,
In addition, various modifications are possible.

For example, although the illustrated electronic component body 3 constitutes a multilayer ceramic capacitor, it may constitute an electronic component body for an electronic component having other functions. Further, the electronic component body may not include ceramic.

Although the illustrated electronic component body 3 has the terminal electrodes 9 formed on two opposite end faces, the terminal electrodes 9 may be formed on other portions. Also, a terminal member provided by a lead frame may be connected to the latter terminal electrode.

[0052]

As described above, according to the present invention, not only at least one pair of terminal members respectively contacting the terminal electrodes of the electronic component body, but also contact with the side surfaces of the electronic component body are formed. A lead frame is also provided that also forms at least one pair of positioning pieces. In order to manufacture an electronic component using such a lead frame, the electronic component main body is guided by a pair of terminal members. When the electronic component body is inserted between the terminal members, the electronic component body is guided by the pair of positioning pieces, so that the electronic component body can be accurately positioned easily. And a pair of positioning pieces, so that both the direction connecting the two terminal electrodes and the direction connecting the two side surfaces can be accurately determined. One can be reliably positioned.

Therefore, the accuracy of the outer shape of the obtained electronic component, particularly the positional relationship between the electronic component main body and the terminal member can be improved.

In the case of positioning using only the terminal member, it is necessary to increase or increase the spring constant of the metal plate constituting the lead frame in order to improve the positioning accuracy. According to the invention, it is not necessary to rely on such means. Therefore, in a state where the obtained electronic component is mounted on the wiring board, the deformation or movement of the terminal member for absorbing the stress based on the expansion and contraction of the wiring board can be sufficiently generated.

Since the positioning piece is formed by cutting and raising a specific portion of the metal plate constituting the lead frame, similarly to the terminal member, a special material or the like for providing such a positioning piece is required. And not.

Further, since both the terminal member and the positioning piece are formed from the metal plate constituting the same lead frame, the accuracy of the positional relationship between the terminal member and the positioning piece can be increased. As a result, the accuracy of the positional relationship between the terminal member and the electronic component body can be improved.

In the metal plate constituting the lead frame according to the present invention, the shape of the hole formed as a result of the formation of the terminal member and the positioning piece is cut along a cutting line for separating the terminal member from the rest of the metal plate. When the positioning piece is selected so as to be separated from the terminal member while being held on the remaining side of the metal plate, the positioning piece that becomes unnecessary after the connection between the terminal member and the terminal electrode is referred to as the terminal member. Only by performing a cutting for separating from the rest of the metal plate, it is separated from the terminal member, and thus can be separated from the obtained electronic component. Therefore, a special cutting step for separating the positioning piece from the obtained electronic component is not required, so that the number of manufacturing steps does not increase.

Further, if the pair of positioning pieces form guide surfaces which are bent away from each other on their free ends, it is possible to insert the electronic component body between the pairing positioning pieces. This facilitates the alignment and makes the accuracy of the alignment required for insertion between the positioning piece and the electronic component body gentler.

Further, a main part for connection to each terminal electrode is formed so that a terminal member formed on the lead frame rises from the surface direction of the metal plate, and a bent part from this main part via a bent part. If a connection terminal portion for connection to a wiring board is provided extending in the surface direction of the metal plate and facing the lower surface of the electronic component body, contact between the terminal member and the terminal electrode is provided. Since the area can be sufficiently provided by the main portion, the reliability of the connection between the terminal member and the terminal electrode can be improved, and the contact area between the terminal member and the wiring board can be sufficiently provided by the connection terminal portion. Therefore, the reliability of the electrical connection between the terminal member and the wiring board can be similarly increased.

When solder is used as the conductive bonding material for connecting the terminal member and the terminal electrode, an efficient connection method such as a solder dipping method or a solder reflow method can be adopted.

When solder is used as the conductive bonding material, the end of the main portion of the terminal member is bent in an inverted U-shape to the side where the connection terminal portion is located. When a solder-affinitive surface that adapts to the solder is formed on the surface facing outward, and a solder-incompatible surface that does not adapt to the solder is formed on the surface facing inward in the folded state, a gap between the terminal member and the terminal electrode may occur. Good soldering, and good soldering between the terminal member and the wiring board, respectively, while providing the solder or the terminal member and the wiring board for connection between the terminal member and the terminal electrode. The solder applied for connection undesirably wraps around the inside of the inverted U-shaped part of the main part, and a bridge or the like by the solder between the parts located on both sides through this bent part. Raw Or between the connection terminal portion and the lower surface of the electronic component body, it is possible to prevent the solder from undesirably wrapping around and reach the electronic component body to prevent a bridge or the like caused by the solder. . Therefore, this can also prevent the stress absorbing function of the terminal member from being impaired.

In the connection terminal portion of the terminal member, if a projection protruding toward the lower surface of the electronic component body is provided, the presence of the projection causes the connection terminal portion and the lower surface of the electronic component body to be in contact with each other. A predetermined interval or more can be reliably formed therebetween. Therefore, in inserting the electronic component body between the terminal members and between the positioning pieces, the vertical positioning of the electronic component body is facilitated, and the solder as described above is applied between the connection terminal portion and the electronic component body. Thus, the formation of a bridge or the like can be more reliably prevented. This is also effective for preventing the deformation or movement of the terminal member for absorbing the stress from being hindered.

Further, if a bulge protruding toward the terminal electrode is formed in the main part of the terminal member, a predetermined distance is formed between the main part of the terminal member and the terminal electrode based on the bulge. Is reliably formed, so that a conductive bonding material such as solder provided for connection between the terminal member and the terminal electrode can be easily formed with a uniform and predetermined thickness.

In the method of manufacturing an electronic component according to the present invention, when the electronic component main body to be applied contains ceramic, the electronic component main body is relatively easily broken, so that the terminal member having the above-described functions is provided. The mounting structure is more effective.

The lead frame according to the present invention and the method of manufacturing an electronic component using the same can be advantageously applied regardless of the number of electronic component bodies, for example, an electronic component having a plurality of electronic component bodies. However, by joining these electronic component bodies in advance, the present invention can be applied substantially in the same manner as in the case of an electronic component having only one electronic component body.

[Brief description of the drawings]

FIG. 1 is a lead frame 1 according to an embodiment of the present invention.
It is a perspective view which shows a part of.

FIG. 2 is a perspective view showing a state in which an electronic component body 3 is incorporated in the lead frame 1 shown in FIG.

FIG. 3 is a front view showing an electronic component 2 manufactured using the lead frame 1 shown in FIG.

FIG. 4 is a front view illustrating an electronic component 2a obtained according to another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead frame 2, 2a Electronic component 3 Electronic component main body 4, 4a Terminal member 5, 6 Side surface 7 Upper surface 8 Lower surface 9 Terminal electrode 10 Solder (conductive bonding material) 11, 11a Main part 12 Connection terminal part 13 Metal plate 14, 17 Drilled hole 15 Positioning piece 16 Guide surface 18 Convex portion 19 Solder affinity surface 20 Solder non-affinity surface 23 Swelling portion 28 Cutting line 29 Adhesive

Continued on the front page (72) Inventor Yoshikazu Takagi 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto F-term in Murata Manufacturing Co., Ltd. (reference) 5E082 AA01 AB03 BC33 BC40 CC05 FG26 GG03 GG11 GG22 GG23 GG26 JJ07 JJ26 JJ27 LL01 LL35

Claims (14)

[Claims] 1. Two opposite end faces and two opposite end faces.
A metal plate having a chip-shaped electronic component main body having two side surfaces, opposed upper and lower surfaces, and having a terminal electrode formed on each of the end surfaces, and connected to each of the terminal electrodes. A lead frame for providing said pair of terminal members in such an electronic component, comprising: a pair of terminal members comprising: a metal plate as a whole; and cutting and raising a first portion of said metal plate Thereby, at least one pair of the terminal members is formed so as to be able to position the electronic component body therebetween while being in contact with the terminal electrodes, and by cutting and raising a second portion of the metal plate. At least one pair of positioning pieces are formed so as to be able to position the electronic component body therebetween while being in contact with the two side surfaces, respectively; A lead frame, wherein the member is scheduled to be disconnected from the rest of the metal plate after being connected to each of the terminal electrodes. 2. When the terminal member is cut along a cutting line for separating the terminal member from the remaining portion of the metal plate, the positioning piece is separated from the terminal member in a state where the positioning piece is held on the remaining side of the metal plate. 2. The lead frame according to claim 1, wherein a shape of a hole formed in said metal plate is selected. 3. The lead frame according to claim 1, wherein the positioning pieces forming a pair form, at their free ends, guide surfaces bent in directions away from each other. 4. The main body for connection to each of the terminal electrodes, the terminal member being formed so as to rise from the surface direction of the metal plate, and the metal plate being bent from the main portion via a bent portion. 4. The lead frame according to claim 1, further comprising: a connection terminal portion that extends in a surface direction of the electronic component main body and faces the lower surface of the electronic component body for connection to a wiring board. 5. . 5. An end of the main portion of the terminal member is bent in an inverted U-shape to a side where the connection terminal portion is located,
On the surface of the terminal member facing outward in the bent state, a solder-affinity surface that is compatible with solder is formed, and on the surface facing inward in the folded state, a solder-non-affinity surface that is not compatible with solder is formed. The lead frame according to claim 4, wherein 6. The connection terminal portion is provided with a projection projecting toward the lower surface of the electronic component body.
The lead frame according to claim 4. 7. The lead frame according to claim 4, wherein a bulging portion protruding toward the terminal electrode is formed in the main portion of the terminal member. 8. Two opposing end faces and two opposing end faces
A metal plate having a chip-shaped electronic component main body having two side surfaces, opposed upper and lower surfaces, and having a terminal electrode formed on each of the end surfaces, and connected to each of the terminal electrodes. A method of manufacturing such an electronic component, comprising a pair of terminal members comprising: a metal plate as a whole; and cutting and raising a first portion of the metal plate to form at least one pair of the terminals. The member is formed so as to be able to position the electronic component main body while being in contact with the terminal electrodes, and by cutting and raising the second portion of the metal plate, at least one pair of positioning pieces, A first step of preparing a lead frame, which is formed so as to be able to position the electronic component main body while being in contact with the two side surfaces, respectively; The electronic component main body is inserted between the positioning pieces forming a pair between the terminal members forming a pair of the lead frame, and the electronic component main body is formed into the pair of the terminal member and the pair. A second step in which the positioning is performed by sandwiching between the positioning pieces, and in a state where the positioning is performed in the second step, the terminal electrodes of the electronic component body and the respective terminal members are connected via a conductive bonding material. And a fourth step of separating the terminal member from the rest of the metal plate. 9. In the fourth step, when the terminal member is cut to separate it from the rest of the metal plate,
The method of manufacturing an electronic component according to claim 8, wherein the positioning piece is separated from the terminal member while being held on a remaining side of the metal plate. 10. The metal plate, wherein the terminal member is formed so as to rise from a surface direction of the metal plate for connection to each of the terminal electrodes, and the metal plate is bent from the main portion via a bent portion. 10. The method of manufacturing an electronic component according to claim 8, further comprising: a connection terminal portion that extends in a surface direction of the electronic component and faces the lower surface of the electronic component body for connection to a wiring board. . 11. The method according to claim 10, wherein in the third step, solder is used as the conductive bonding material. 12. An end of the main part of the terminal member,
The connection terminal portion is bent in an inverted U-shape to the side where the connection terminal portion is located, and a surface of the terminal member facing outward in the bent state is formed with a solder affinity surface adapted to solder, and inward in the bent state. The method for manufacturing an electronic component according to claim 11, wherein a surface which does not adapt to solder is formed on a surface facing the solder, which is not compatible with solder. 13. The method for manufacturing an electronic component according to claim 8, wherein said electronic component main body contains ceramic. 14. The method according to claim 14, further comprising the step of joining the plurality of electronic component bodies to each other with the terminal electrodes facing in the same direction, wherein the plurality of integrated electronic component bodies are integrated in the second step. 14. The method of manufacturing an electronic component according to claim 8, wherein the lead frame is inserted between the pair of terminal members and between the pair of positioning pieces.