JP2008227100A - Electronic component and manufacturing method thereof, and inverter device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component that can be miniaturized. <P>SOLUTION: A surface mount type electronic component 1 comprises: a dielectric element body 12; electrodes 14, 16; extraction conductors 18, 20; and lead terminals 26, 28. The dielectric element body 12 has main surfaces 12a, 12b and sides 12c-12f. The electrode 14 is formed on the main surface 12a, the electrode 16 is formed on the main surface 12b, and the electrodes 14, 16 oppose each other. A first section 18a in the extraction conductor 18 is arranged on the side 12d. A first section 20a in the extraction conductor 20 is arranged on the side 12c. The lead terminal 26 has a planar first section 26a, and the first section 26a is connected to the first section 18a of the extraction conductor 18. The lead terminal 28 has a planar first section 28a, and the first section 28a is connected to the first section 20a of the extraction conductor 20. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component, a manufacturing method thereof, and an inverter device.

Conventionally, a cylindrical element body having a pair of opposing main surfaces, a pair of electrodes formed on each main surface of the element body, a pair of flat lead terminals respectively connected to each electrode, A surface-mount type capacitor is known that includes an element body, each electrode, and an exterior body that covers a part of each lead terminal and is electrically insulating, and each lead terminal and element body are separated by a predetermined distance. It has been.
Japanese Patent Laid-Open No. 5-101975

  However, when manufacturing a conventional capacitor as described in Patent Document 1, in order to connect the electrodes on each main surface and lead terminals, each element body is separated by two lead frames each serving as a lead terminal. It was pinched on the main surface. In order to hold the element body between the two lead frames in this way, first, the two lead frames are separated so that the distance between them is larger than the thickness of the element body, and then the element body is supplied from the horizontal direction. In other words, a process of disposing an element body between two lead frames and then sandwiching the element body between the two lead frames is necessary. For this reason, a mechanism for separating and bringing the two lead frames apart and a mechanism for supplying the element body from the horizontal direction are required, resulting in complicated facilities and increased man-hours.

  Further, in the conventional capacitor manufacturing process, if the element body is simply sandwiched between two lead frames, the element body may be displaced from the lead frame by an external force from the resin when forming the exterior body by transfer molding. Therefore, it is necessary to process the surface of the electrodes arranged on each main surface chemically or physically so that the element body is not easily displaced from the lead frame even by external force from the resin. Was inviting.

  Furthermore, in the conventional capacitor manufactured by the conventional manufacturing method, the lead terminal is arranged so as to wrap around the element body along the outer shape of the element body, but the high voltage applied to the lead terminal In order to prevent the occurrence of a short circuit between the lead terminal and the side surface of the element body, it is necessary to increase the distance between each lead terminal and the element body. This has led to an increase in product size.

  An object of the present invention is to provide an electronic component that can be reduced in size, an electronic component manufacturing method that can easily manufacture a small electronic component, and an inverter device.

  An electronic component according to the present invention includes a first main surface and a second main surface facing each other, a first side surface and a second side surface extending to connect the first main surface and the second main surface and facing each other. An element body having dielectric properties, a first electrode disposed on the first main surface of the element body, a second electrode disposed on the second main surface of the element body and facing the first electrode; A first lead conductor including a facing surface facing the first side surface and electrically connected to the first electrode; and a first lead conductor including a facing surface facing the second side surface and electrically connected to the second electrode. Two lead conductors, a first lead terminal electrically connected to the first lead conductor, and a second lead terminal electrically connected to the second lead conductor, wherein the first lead conductor has a first side surface. The first part is disposed on the first part, and the first part and the first lead terminal are connected to each other. And the second lead conductor has a first portion disposed on the second side surface, and the first portion and the second lead terminal are connected to each other. It is electrically connected to the second lead terminal.

  In the electronic component according to the present invention, the first portion of the first lead terminal is connected to the first portion of the first lead conductor disposed on the first side surface, and the second lead terminal is disposed on the second side surface. The second lead conductor is connected to the first portion. Therefore, unlike the conventional capacitor, the lead terminals are not arranged so as to wrap around the element body along the outer shape of the element body. As a result, it is possible to reduce the size of the electronic component.

  Preferably, the first lead terminal includes a first portion connected to the first portion of the first lead conductor, a second portion facing the first main surface and extending in a facing direction of the first side surface and the second side surface. The second lead terminal has a first portion connected to the first portion of the second lead conductor, and a second portion facing the first main surface and extending in the facing direction of the first side surface and the second side surface And have. In this case, when the electronic component is manufactured, the element body can be reliably held by the first lead terminal and the second lead terminal in a direction intersecting with the opposing direction of the first main surface and the second main surface. Become.

  Preferably, the battery pack further includes an electrically insulating outer body disposed to cover at least the element body, the first electrode, the second electrode, a part of the first lead terminal, and a part of the second lead terminal, The 1 lead terminal and the 2nd lead terminal are each pulled out from the exterior body. The lead position of the first lead terminal pulled out from the exterior body and the lead out position of the second lead terminal pulled out from the exterior body are the first It is located on a virtual plane substantially parallel to the main surface and the second main surface.

  Preferably, the first lead terminal has a first part connected to the first part of the first lead conductor, and the second lead terminal has a first part connected to the first part of the second lead conductor. The element body and the first portions of the first lead terminal and the second lead terminal are fitted to each other. In this case, the element body can be reliably held by the first lead terminal and the second lead terminal in a direction intersecting the opposing direction of the first main surface and the second main surface. For this reason, for example, even when an external force is applied from the resin when the exterior body is formed by transfer molding, it is difficult for the element body to come off from the first lead terminal and the second lead terminal.

  More preferably, the first side surface and the second side surface have a shape having a protruding and / or recessed region, and the first portion of the first lead terminal is bent into a shape corresponding to the first side surface. The first portion of the first lead conductor is engaged with the first side surface, and the first portion of the second lead terminal is bent into a shape corresponding to the second side surface, and the second lead conductor The second side surface is engaged through the first portion. In this case, it is possible to reliably realize a configuration for fitting the element body with the first portions of the first lead terminal and the second lead terminal.

  Preferably, the first lead conductor has a second portion disposed on the first main surface so as to electrically connect the first portion of the first lead conductor and the first electrode, and the second lead conductor. Has a second portion disposed on the second main surface so as to electrically connect the first portion of the second lead conductor and the second electrode, and the first lead conductor and the first lead conductor An insulating film having at least a portion disposed on the first main surface so as to cover the second portion and a portion disposed on the second main surface so as to cover the second portion of the second electrode and the second lead conductor; In addition. In this case, when soldering the first part of the first lead terminal and the first part of the first lead conductor, and the first part of the second lead terminal and the first part of the second lead conductor, respectively, the insulating film This makes it difficult for the solder attached to the first portions of the first lead conductor and the second lead conductor to enter the first main surface and the second main surface from the first side surface and the second side surface. As a result, a flat state can be maintained in the region corresponding to the first main surface and the region corresponding to the second main surface of the outer surface of the electronic component.

  Preferably, the first lead conductor has a second portion disposed on the first main surface so as to electrically connect the first portion of the first lead conductor and the first electrode, and the second lead conductor. Has a second portion disposed on the second main surface so as to electrically connect the first portion of the second lead conductor and the second electrode, and the second portion of the first lead conductor, The second portion of the second lead conductor is not opposed to each other when viewed from the opposing direction of the first main surface and the second main surface, and the second portion of the second lead conductor is drawn from the second electrode. The position is set to a position where the linear distance from the position where the second portion of the first lead conductor is drawn from the first electrode is the longest. In this case, the distance between the first lead conductor and the second lead conductor is increased. As a result, the dielectric breakdown voltage increases and the withstand voltage can be improved.

  Preferably, the element body has a third side surface and a fourth side surface that extend so as to connect the first main surface and the second main surface and face each other, and the first lead conductor is the first lead conductor. The second lead conductor has a second part disposed on the first main surface so as to electrically connect the first part and the first electrode, and the second lead conductor includes the first part of the second lead conductor and the second electrode. And the second portion of the first lead conductor and the second portion of the second lead conductor include the first main surface and the second portion of the second lead conductor. The second main conductor surfaces are not opposed to each other when viewed from the opposing direction, and the second portion of the first lead conductor extends from the first electrode toward the third side surface, and the second portion of the second lead conductor Extends from the second electrode toward the fourth side surface. In this case, the distance between the first lead conductor and the second lead conductor is further increased. As a result, the dielectric breakdown voltage is further increased, and the withstand voltage can be further improved.

  Preferably, the element body includes a recess and / or a region in the first main surface between the first electrode and the second side surface and a region in the second main surface between the second electrode and the first side surface. A protrusion is provided. In this case, the creepage distance between the first electrode and the first portion of the second lead conductor and the creepage distance between the second electrode and the first portion of the first lead conductor are increased. As a result, the dielectric breakdown voltage increases and the withstand voltage can be improved.

  Preferably, the first electrode and the second electrode have a rounded shape. When corners exist in the first electrode and the second electrode, local electric field concentration tends to occur in the corners. On the other hand, if the first electrode and the second electrode have a rounded shape, the above-described electric field concentration is suppressed. As a result, the dielectric breakdown voltage increases and the withstand voltage can be improved.

  An inverter device according to the present invention includes any one of the electronic components described above.

  On the other hand, in the method for manufacturing an electronic component according to the present invention, the first main surface and the second main surface facing each other, and the first side surfaces extending to connect the first main surface and the second main surface and facing each other. And an element body having dielectric characteristics, a first electrode disposed on the first main surface of the element body, and disposed on the second main surface of the element body and facing the first electrode A second lead conductor electrically connected to the first electrode, and a second lead conductor electrically connected to the second electrode, wherein the first lead conductor is provided on the first side surface. An intermediate body preparing step of preparing an intermediate body having a first portion disposed on the second side surface; and a second lead conductor having a first portion disposed on the second side surface. 1 terminal portion and a second terminal portion having a first portion, the first portion of the first terminal portion and the first portion of the second terminal portion, A lead frame preparation step of preparing lead frames each having a facing surface facing each other and spaced apart by a distance corresponding to the width of the element body in the facing direction of the first side surface of the element body and the second side surface of the element body; The first portion of the first terminal portion and the first portion of the first lead conductor are electrically connected, and the first portion of the second terminal portion and the first portion of the second lead conductor are electrically connected. Then, a mounting step of mounting the intermediate body on the lead frame, and a resin is injected into the mold in which the lead frame on which the intermediate body is mounted is placed and cured, so that at least the first body, An exterior body forming step of forming an exterior body having electrical insulation disposed so as to cover the electrode, the second electrode, a part of the first terminal part, and a part of the second terminal part; The part pulled out from the exterior body and the second By cutting a portion which is withdrawn from the outer body of the terminal portion, characterized in that it comprises a cutting step of disconnecting the intermediate outer body is formed from the lead frame.

  In the method for manufacturing an electronic component according to the present invention, the first electrode and the second electrode facing each other are formed on the first main surface and the second main surface, respectively, and the second portion of the first lead conductor is the first element body. The first terminal portion and the second terminal portion are provided on the side surface, and the second portion of the second lead conductor is formed on the second side surface of the element body. One lead frame is used in which one portion and the first portion of the second terminal portion have opposing surfaces that face each other. Therefore, just by inserting the element body between the first portion of the first terminal portion and the first portion of the second terminal portion without separating and approaching the two lead frames as in the conventional manufacturing method, The element body is held by the first terminal portion and the second terminal portion. In the electronic component manufacturing method according to the present invention, the first portion of the first terminal portion is connected to the first portion of the first lead conductor, and the first portion of the second terminal portion is the first portion of the second lead conductor. Connected with the part. Therefore, in the electronic component manufactured by the manufacturing method according to the present invention, the terminal portion is not arranged so as to wrap around the element body along the outer shape of the element body, unlike the conventional capacitor. As a result, a small electronic component can be easily manufactured.

  Preferably, in the mounting step, solder is applied to each of the opposing surfaces of the first portion of the first terminal portion and the first portion of the second terminal portion, and the opposing surface of the first portion of the first terminal portion and the element body The first portion of the first lead conductor is located between the first side surface and the first portion of the second lead conductor is located between the opposing surface of the first portion of the second terminal portion and the second side surface of the element body. After the intermediate body is inserted between the first portion of the first terminal portion and the first portion of the second terminal portion so as to be positioned, the first portion of the first terminal portion and the first portion are subjected to heat treatment. The first portion of the lead conductor is soldered, and the first portion of the second terminal portion and the first portion of the second lead conductor are soldered. In this case, the first portion of the first terminal portion and the first portion of the first lead conductor, and the first portion of the second terminal portion and the first portion of the second lead conductor are reliably and electrically connected by solder. It becomes possible to connect.

  Preferably, at least a part of the first terminal portion is disposed closer to the second terminal portion than the first portion of the first terminal portion, and the first portion of the first terminal portion and the first of the second terminal portion. A second portion extending in an opposing direction of the portion, and the second terminal portion is at least partially disposed closer to the first terminal portion than the first portion of the second terminal portion, and the second terminal portion 1 part and the 2nd part extended in the opposing direction of the 1st part of the 2nd terminal part, and in the mounting process, the 1st principal surface of an element body is the 2nd part of the 1st terminal part, and the 2nd terminal part The intermediate body is placed on the second portion of the first terminal portion and the second portion of the second terminal portion so as to face the second portion. In this case, the element body can be reliably held by the first terminal portion and the second terminal portion in the opposing direction of the first main surface and the second main surface.

  Preferably, in the mounting step, the element body and the first portions of the first terminal portion and the second terminal portion are fitted. In this case, the element body can be reliably held by the first lead terminal and the second lead terminal in a direction intersecting the opposing direction of the first main surface and the second main surface. Therefore, in the step of forming the exterior body, for example, even when an external force is applied from the resin when the exterior body is formed by transfer molding, the element body is difficult to come off from the first lead terminal and the second lead terminal.

  Preferably, the first side surface and the second side surface of the element body have a shape having a protruding and / or recessed region, and the first portion of the first terminal portion is bent into a shape corresponding to the first side surface. The first portion of the second terminal portion is bent into a shape corresponding to the second side surface. In the mounting step, the first side surface of the element body and the first portion of the first terminal portion are connected to the first lead conductor. The first portion is engaged through the first portion, and the second side surface of the element body and the first portion of the second terminal portion are engaged through the first portion of the second lead conductor. In this case, it is possible to reliably realize a configuration for fitting the element body with the first portions of the first lead terminal and the second lead terminal.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of an electronic component and the inverter apparatus which can manufacture an electronic component which can aim at size reduction and a small electronic component simply can be provided.

  Preferred embodiments of the present invention will be described with reference to the drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.

(First embodiment)
First, the structure of the surface mount electronic component 1 according to the first embodiment will be described with reference to FIGS. FIG. 1 is a perspective view of the surface mount electronic component according to the first embodiment, with a part cut away. FIG. 2 is a perspective view of the surface-mount electronic component according to the first embodiment viewed from the main surface side of the dielectric body. FIG. 3 is a perspective view of the surface-mount electronic component according to the first embodiment viewed from the side surface side of the dielectric body. The surface-mounted electronic component 1 according to the first embodiment is obtained by applying the present invention to a surface-mounted capacitor.

  As shown in FIGS. 1 to 3, the surface-mount electronic component 1 includes a dielectric body 12 (element body having dielectric characteristics), electrodes 14 and 16, lead conductors 18 and 20, and a pair of leads. Terminals 26 and 28 and an exterior body 32 are provided.

  As shown in FIGS. 2 and 3, the dielectric element body 12 has a substantially rectangular parallelepiped shape, and has principal surfaces 12a and 12b facing each other, side surfaces 12c and 12d facing each other, and side surfaces 12e facing each other. , 12f. The side surfaces 12c and 12d extend so as to connect the main surfaces 12a and 12b and the side surfaces 12e and 12f, and the side surfaces 12e and 12f extend so as to connect the main surfaces 12a and 12b and the side surfaces 12c and 12d. The dielectric body 12 can be formed of, for example, a dielectric ceramic material in which Ti, Ba, Sr, Ca, Nd, La or the like as a main component is added with other rare earth elements as subcomponents.

  The dielectric element body 12 has, on the side surface 12c, a protrusion 12A that protrudes outward from the dielectric element body 12 and extends in a direction opposite to the main surfaces 12a and 12b. Thereby, the side surface 12c will exhibit the shape which has the area | region which protruded. The dielectric element body 12 has, on the side surface 12d, a protrusion 12B that protrudes outward from the dielectric element body 12 and extends in a direction opposite to the main surfaces 12a and 12b. Thereby, the side surface 12d exhibits a shape having a protruding region.

  Electrodes 14 and 16 and lead conductors 18 and 20 are disposed on the dielectric body 12. The electrode 14 is disposed on the main surface 12a, and the electrode 16 is disposed on the main surface 12b. The lead conductor 18 is disposed over the main surface 12 a and the side surface 12 d and is electrically connected to the electrode 14. The lead conductor 20 is disposed over the main surface 12 b and the side surface 12 c and is electrically connected to the electrode 16.

  The electrodes 14 and 16 have portions 14a and 16a that overlap each other when viewed from the opposing direction of the main surfaces 12a and 12b. Depending on the facing area of the overlapping portions 14a and 16a of the electrodes 14 and 16 and the distance between the electrodes 14 and 16 (that is, the thickness of the dielectric body 12), the static electricity as a capacitor of the surface mount electronic component 1 can be obtained. The capacity is specified.

  The lead conductor 18 extends so as to be drawn from a portion of the electrode 14 near the side surface 12d. The electrode 14 has a substantially semicircular shape in a portion where the lead conductor 18 is not drawn (a portion near the side surface 12c), and a portion where the lead conductor 18 is drawn (a portion near the side surface 12d). The width becomes narrower toward the lead conductor 18 in FIG. In the first embodiment, the electrode 14 and the lead conductor 18 are integrally formed.

  The lead conductor 20 extends so as to be drawn from a portion of the electrode 16 near the side surface 12c. The electrode 16 has a substantially semicircular shape in a portion where the lead conductor 20 is not drawn (portion near the side surface 12d), and a portion where the lead conductor 20 is drawn (portion near the side surface 12c). The width becomes narrower toward the lead conductor 20 in FIG. In the first embodiment, the electrode 16 and the lead conductor 20 are integrally formed.

  The lead conductor 18 has a first portion 18a and a second portion 18b. The first portion 18a is disposed on the side surface 12d (projection 12B). The first portion 18a extends in the direction facing the main surfaces 12a and 12b. The second portion 18b is disposed on the main surface 12a so as to electrically connect the first portion 18a and the electrode 14, that is, to be drawn from the electrode 14 and reach the first portion 18a. In the first embodiment, the first portion 18a and the second portion 18b are integrally formed.

  The lead conductor 20 has a first portion 20a and a second portion 20b. The first portion 20a is disposed on the side surface 12c (projection 20A). The first portion 20a extends in the direction facing the main surfaces 12a and 12b. The second portion 20b is disposed on the main surface 12b so as to electrically connect the first portion 20a and the electrode 16, that is, is drawn from the electrode 16 and reaches the first portion 20a. In the first embodiment, the first portion 20a and the second portion 20b are integrally formed.

  The second portions 18b and 20b of the lead conductors 18 and 20 extend in opposite directions with respect to the electrodes 14 and 16 when viewed from the opposing direction of the main surfaces 12a and 12b, and do not oppose each other. It has become. The position where the second portion 20b of the lead conductor 20 is drawn from the electrode 16 is set to a position where the linear distance from the position where the second portion 18b of the lead conductor 18 is drawn from the electrode 14 is the longest. .

  A solder resist 22 is disposed on the main surface 12 a so as to cover most of the electrode 14 and the second portion 18 b of the lead conductor 18. A solder resist 24 is disposed on the main surface 12b so as to cover most of the electrode 16 and the second portion 20b of the lead conductor 20. The solder resists 22 and 24 are heat-resistant insulating materials that prevent solder from adhering to the electrodes 14 and 16 and the second portions 18b and 20b of the lead conductors 18 and 20 and have moisture resistance and insulation resistance. Provided to maintain.

  The lead terminal 26 includes a first portion 26a, a second portion 26b, and third portions 26c to 26e. The first portion 26a is bent into a shape (substantially C-shaped) corresponding to the shape of the side surface 12c of the dielectric body 12 (the shape having a protruding region). The dielectric body 12 and the first portion 26a are fitted, and the first portion 26a is engaged with the side surface 12c of the dielectric body 12 through the first portion 20a of the lead conductor 20. Yes. The first portion 26a is connected to the first portion 20a of the lead conductor 20 by solder (not shown). As a result, the lead terminal 26 is electrically connected to the lead conductor 20. The first portion 26 a has a plate shape for improving the ground contact area with the lead conductor 20. As a result, the first portion 26 a has a facing surface that faces the side surface 12 c of the dielectric body 12.

  A part of one end of the third part 26c is continuous (integrally formed) with the lower end of the first part 26a, and the side part 12c is opposed to the side surfaces 12c and 12d from the lower end of the first part 26a. It stretches away from the direction. The other end of the third portion 26c is bifurcated. The pair of third portions 26d are continuous (integrally formed) with the other ends of the third portion 26c, each end of which is bifurcated. Each third portion 26d extends from each other end of the third portion 26c in a direction opposite to the main surfaces 12a and 12b and in a direction away from the first portion 26a.

  One end of each of the pair of third portions 26e is continuous (integrally formed) with each other end of each third portion 26d. Each third portion 26e extends from each other end of each third portion 26d in a direction opposite to the side surfaces 12c and 12d and in a direction approaching the side surface 12c. Accordingly, the portion (third portion 26d and third portion 26e) of the lead terminal 26 exposed from the exterior body 32 is divided into two. For this reason, when the lead terminal 26 and the signal electrode 102 of the circuit board 100 described later are soldered, the lead terminal 26 and the signal electrode 102 can be firmly joined by the wedge effect.

  The pair of second portions 26b are respectively continuous (integrally formed) with a part of one end of the third portion 26c. Each second portion 26b protrudes in a direction opposite to the side surfaces 12c and 12d and in a direction opposite to the third portion 26c. Each second portion 26 b is in contact with the solder resist 24 and faces the main surface 12 b of the dielectric element body 12. Therefore, the second portion 26 b fulfills a function of supporting the dielectric body 12 during the manufacture of the surface mount electronic component 1.

  The lead terminal 28 includes a first portion 28a, a second portion 28b, and third portions 28c to 28e. The first portion 28a is bent into a shape (substantially C-shaped) corresponding to the shape of the side surface 12d of the dielectric body 12 (the shape having a protruding region). The dielectric body 12 and the first portion 28a are fitted, and the first portion 28e is engaged with the side surface 12c of the dielectric body 12 through the second portion 18b of the lead conductor 18. Yes. The first portion 28a is connected to the second portion 18b of the lead conductor 18 by solder (not shown). As a result, the lead terminal 28 is electrically connected to the lead conductor 18. The first portion 28 a has a plate shape for improving the ground contact area with the lead conductor 18. As a result, the first portion 28 a has a facing surface that faces the side surface 12 d of the dielectric body 12.

  A part of one end of the third portion 28c is continuous (integrally formed) with the lower end of the first portion 28a, and the side surface 12d is opposed to the side surfaces 12c and 12d from the lower end of the first portion 28a. It stretches away from the direction. The other end of the third portion 28c is bifurcated. The pair of third portions 28d are continuous (integrally formed) with the other ends of the third portion 28c, each end of which is bifurcated. Each of the third portions 28d extends from the other end of the third portion 28c in a direction facing the main surfaces 12a and 12b and away from the first portion 28a.

  One end of each of the pair of third portions 28e is continuous (integrally formed) with each other end of each third portion 28d. Each third portion 28e extends from each other end of each third portion 28d in a direction opposite to the side surfaces 12c and 12d and in a direction approaching the side surface 12d. Therefore, portions of the lead terminal 28 exposed from the exterior body 32 (the third portion 28d and the third portion 28e) are divided into two. For this reason, when the lead terminal 28 and the signal electrode 104 of the circuit board 100 to be described later are soldered, the lead terminal 28 and the signal electrode 104 can be firmly joined by the wedge effect.

  The pair of second parts 28b are respectively continuous (integrally formed) with a part of one end of the third part 28c. Each second portion 28b protrudes in a direction opposite to the side surfaces 12c and 12d and in a direction opposite to the third portion 28c. Each second portion 28 b is in contact with the solder resist 24 and faces the main surface 12 b of the dielectric element body 12. Therefore, the second portion 28 b fulfills the function of supporting the dielectric body 12 during the manufacture of the surface mount electronic component 10.

  The exterior body 32 includes the dielectric body 12, electrodes 14 and 16, lead conductors 18 and 20, solder resists 22 and 24, part of the lead terminal 26 (first to third parts 26a to 26c of the lead terminal 26), and It arrange | positions so that a part of lead terminal 28 (1st-3rd part 28a-28c of the lead terminal 28) may be covered. From the exterior body 32, the third portions 28d and 28e of the lead terminal 26 and the third portions 28d and 28e of the lead terminal 28 are drawn out, respectively. The third portions 26 d, 26 e, 28 d, 28 e of the lead terminals 26, 28 drawn out from the exterior body 32 are respectively along the external shape of the exterior body 32. The lead-out position 26f of the third portion 26c of the lead terminal 26 drawn out from the outer body 32 and the lead-out position 28f of the third portion 28c of the lead terminal 28 drawn out from the outer body 32 are substantially parallel to the main surfaces 12a and 12b. It is located on the virtual plane S1 (see FIG. 3). The exterior body 32 is made of an insulating material having heat resistance.

  Next, a mounting structure between the surface-mounting electronic component 1 having the above-described configuration and the circuit board 100 will be described with reference to FIG.

  The circuit board 100 is a so-called printed circuit board on which wiring is formed by a large number of signal electrodes including the signal electrodes 102 and 104 and a ground electrode (not shown). It constitutes a part of the device 150. In the surface-mount electronic component 1, the third portions 26d and 26e of the lead terminal 26 and the signal electrode 102 of the circuit board 100 are connected by solder, and the third portions 28d and 28e of the lead terminal 28 and the signal electrode of the circuit board 100 are connected. 104 is connected to the circuit board 100 by being connected with solder. The surface mounting type electronic component 1 can be soldered to the circuit board 100 by, for example, a reflow soldering method.

  Then, with reference to FIGS. 1-10, the manufacturing method of the surface mount-type electronic component 1 is demonstrated. FIG. 4 is a flowchart for explaining a manufacturing process of the surface mount electronic component according to the first embodiment. FIG. 5 is a diagram for explaining each step of the manufacturing process of the surface mount electronic component. FIG. 6 is a diagram for explaining a process subsequent to FIG. FIG. 7 is a diagram for explaining a process subsequent to FIG. FIG. 8 is a diagram for explaining a process subsequent to FIG. FIG. 9 is a diagram for explaining a process subsequent to FIG. FIG. 10 is a diagram for explaining a process subsequent to FIG. 9. In the flowchart shown in FIG. 4, step is abbreviated as S.

  First, in step 101, a dielectric body material that is a raw material of the dielectric body 12 is manufactured. Specifically, a raw material containing barium titanate or strontium titanate as a main component and another rare earth element as an auxiliary component is kneaded, calcined at a predetermined temperature, and the calcined raw material is pulverized and manufactured. It is obtained by granulating.

  Subsequently, in step 102, the dielectric element material obtained in step 101 is press-molded into a desired shape. Specifically, it has a substantially rectangular parallelepiped shape having the main surfaces 12a and 12b and the side surfaces 12c to 12f by press molding, and has the protruding portions 12A and the protruding portions 12B, that is, the side surfaces 12c and 12d are A molded body having a shape having the above-described protruding region is obtained.

  Subsequently, in step 103, the molded body obtained in step 102 is fired at a predetermined temperature (for example, about 1100 ° C. to 1500 ° C.) to obtain the dielectric body 12 (see FIG. 5A).

  Subsequently, in step 104, the electrodes 14 and 16 and the lead conductors 18 and 20 are formed (see FIG. 5B). Here, first, the conductive paste to be the electrode 14 is screen-printed on the main surface 12a, and the conductive paste to be the lead conductor 18 is screen-printed so as to hang from the main surface 12a to the side surface 12d. Further, the conductive paste to be the electrode 16 is screen-printed on the main surface 12b, and the conductive paste to be the lead conductor 20 is screen-printed so as to hang from the main surface 12b to the side surface 12c. Then, the screen-printed conductive paste is baked at a predetermined temperature (for example, about 800 ° C.). As the conductive paste, a metal powder (for example, Ag, Cu, Ni, etc.) mixed with an organic binder, an organic solvent, or the like is used. Note that the screen printing of the conductive paste on the side surfaces 12d and 12c may be performed separately instead of simultaneously with the screen printing of the conductive paste on the main surfaces 12a and 12b as described above.

  Subsequently, in step 105, solder resists 22 and 24 are formed (see FIG. 5C). Here, first, the solder which becomes the solder resists 22 and 24 so as to cover most of the electrode 14 and the first portion 18 a of the lead conductor 18 and to cover most of the electrode 16 and the second portion 20 b of the lead conductor 20. A resist paste is printed on the main surface 12a and the main surface 12b. Then, the solder resist paste printed and formed is heated (cured) at a predetermined temperature (for example, about 100 ° C. to 160 ° C.). For the solder resist paste, an epoxy paint or a phenol resin is used. The intermediate body 50 (refer FIG.5 (c)) is obtained by the above process.

  Subsequently, in step 106, the lead frame 40 is processed into a desired shape by, for example, pressing. The lead frame 40 is made of, for example, a metal material in which brass or copper is plated with Sn or Ag. Specifically, the lead frame 40 includes a pair of terminal portions 46 and 48 as shown in FIG.

  The terminal portion 46 includes a first portion 46a, a second portion 46b, and third portions 46c and 46d. The first portion 46a is a portion that becomes the first portion 26a of the lead terminal 26, and is bent into a shape (substantially C-shaped) corresponding to the shape of the side surface 12c of the dielectric body 12 (the shape having a protruding region). Has been. The first portion 46a has a plate shape.

  The third portion 46 c is a portion that becomes the third portion 26 c of the lead terminal 26. The third portion 46c has a part of one end continuous to (integrally formed with) the lower end of the first portion 46a, and extends from the lower end of the first portion 46a in the longitudinal direction of the lead frame 40 and to the terminal portion 48. It stretches away from the direction. The other end of the third portion 46c is bifurcated. The pair of third portions 46 d are portions that become the third portions 26 d and 26 e of the lead terminal 26. The third portion 46d is continuous (integrally formed) with each other end of the third portion 46c, one end of which is bifurcated. The pair of second portions 46 b is a portion that becomes the second portion 26 b of the lead terminal 26. Each of the second portions 46b is continuous (integrally formed) with a part of one end of the third portion 46c. Each of the second portions 46 b protrudes in a direction facing the side surfaces 12 c and 12 d and in a direction approaching the terminal portion 48.

  The terminal portion 48 includes a first portion 48a, a second portion 48b, and third portions 48c and 48d. The first portion 48a is a portion that becomes the first portion 28a of the lead terminal 28, and is bent into a shape (substantially C-shaped) corresponding to the shape of the side surface 12d of the dielectric body 12 (the shape having a protruding region). Has been. The first portion 48a has a plate shape.

  The third portion 48 c is a portion that becomes the third portion 28 c of the lead terminal 28. The third portion 48c has a part of one end continuous to (integrally formed with) the lower end of the first portion 48a, and extends from the lower end of the first portion 48a in the longitudinal direction of the lead frame 40 and to the terminal portion 46. It stretches away from the direction. The other end of the third portion 48c is bifurcated. The pair of third portions 48 d are portions that become the third portions 28 d and 28 e of the lead terminal 28. The third portion 48d is continuous (integrally formed) with each other end of the third portion 48c where one end of the third portion 48d is bifurcated. The pair of second portions 48 b is a portion that becomes the second portion 28 b of the lead terminal 28. Each second portion 48b is continuous (integrally formed) with a part of one end of the third portion 48c. Each second portion 48b protrudes in a direction opposite to the side surfaces 12c and 12d and in a direction approaching the terminal portion 46.

  The first portion 46a of the terminal portion 46 and the first portion 48a of the terminal portion 48 have opposing surfaces S2 that face each other. The first portion 46a of the terminal portion 46 and the first portion 48a of the terminal portion 48 are separated by a distance corresponding to the width of the dielectric body 12 in the facing direction of the side surfaces 12c and 12d.

  Subsequently, in step 107, the intermediate body 50 is mounted on the lead frame 40 (see FIG. 7). Here, first, cream solder is applied to the facing surfaces S2 of the terminal portions 46 and 48, respectively. As the cream solder, for example, high-temperature cream solder can be used. The first portion 20a of the lead conductor 20 is interposed between the facing surface S2 of the first portion 46a of the terminal portion 46 and the side surface 12d of the dielectric element body 12, and the facing surface of the first portion 48a of the terminal portion 48. The intermediate body 50 is connected to the first portion 46a of the terminal portion 46 and the first portion 48a of the terminal portion 48 so that the first portion 18a of the lead conductor 18 is interposed between S2 and the side surface 12c of the dielectric body 12. Insert between. Further, the first portion 46a of the terminal portion 46 and the first portion 20a of the lead conductor 20, and the first portion 48a of the terminal portion 48 and the first portion 18a of the lead conductor 18 are soldered by, for example, reflow soldering. Then, the intermediate body 50 is fixed to the lead frame 40.

  Subsequently, in step 108, the exterior body 32 is formed. Here, first, the lead frame 40 to which the intermediate body 50 is fixed in Step 107 is disposed between a pair of molds 60 molded so as to have a desired shape of the exterior body 32 (arrow A in FIG. 8). reference). And a pair of metal mold | dies 60 are closed (refer arrow B of FIG. 9), the space for inject | pouring resin with respect to each intermediate body 50 is each formed, and in each space formed by a pair of metal mold | die 60 The resin is injected while being pressurized (see FIG. 9). The pressure at this time can be set to about 2 MPa to 10 MPa, for example. Furthermore, after injecting the resin into the space between the pair of molds 60 and before opening the molds, heat treatment (temporary curing) is performed at a predetermined temperature (for example, about 150 ° C.). As the resin, for example, a resin for transfer molding such as an epoxy resin can be used. Thereafter, the pair of molds 60 is opened (see arrow C in FIG. 10), and the lead frame 40 including the intermediate body 50 and the molded body 52 in which the resin is molded into a predetermined shape is taken out from the mold 60. Then, heat treatment (main curing) is performed at a predetermined temperature (for example, about 150 ° C.) for a predetermined time (for example, about 2 hours) to remove unnecessary burrs.

  Subsequently, in step 109, lead terminals 26 and 28 are formed (see FIGS. 1 to 3). Here, first, portions of the terminal portion 46 drawn from the exterior body 32 (third portions 46c and 46d of the terminal portion 46) and portions of the terminal portion 48 drawn from the exterior body 32 (terminal portion 48). The third portions 48c and 48d) are cut off, and each of the intermediate bodies 50 in which the outer package 32 is formed (covered by the outer package 32) is separated from the lead frame 40. Then, the third portions 46 c and 46 d of the terminal portion 46 and the third portions 48 c and 48 d of the terminal portion 48 are bent in a direction away from the first portion 46 a of the terminal portion 46 and the first portion 48 a of the terminal portion 48.

(Conventional surface mount capacitor)
Here, a conventional surface mount capacitor 200 will be described with reference to FIG. FIG. 11 is a cross-sectional view showing a conventional surface mount electronic component.

  The conventional surface mount capacitor 200 includes a dielectric body 212, electrodes 214 and 216, lead terminals 226 and 228, and an exterior body 232. The dielectric body 212 has opposing main surfaces 212a and 212b and has a cylindrical shape. The electrode 214 is disposed on the main surface 212a, and the electrode 216 is disposed on the main surface 212b.

  The lead terminal 226 has a first portion 226a and a second portion 226b. The first portion 226a is electrically connected to the electrode 214 at one end, and is spaced apart from the dielectric element body 212 so as to have a predetermined interval, while surrounding the dielectric element body 212 along the outer shape of the dielectric element body 212. It is bent so as to go around. The second portion 226b is connected to the other end of the first portion 226a, and the other end is connected to a signal electrode of the circuit board.

  The lead terminal 228 has a first portion 228a and a second portion 228b. The first portion 228a is electrically connected to the electrode 216 at one end, and is spaced apart from the dielectric body 212 so as to have a predetermined distance. It is bent so as to go around. The second portion 228b is continuous (integrally formed) with the other end of the first portion 228a, and the other end is connected to the signal electrode of the circuit board.

  The exterior body 232 is disposed so as to cover the dielectric body 212, the electrodes 214 and 216, a part of the lead terminal 226, and a part of the lead terminal 228.

  However, in such a conventional surface mount capacitor 200, the electrodes 214 and 216 arranged on the main surfaces 212a and 212b are connected to the lead terminals 226 and 228, respectively. The dielectric body 212 is sandwiched between the main surfaces 212a and 212b by two lead frames. In order to hold the dielectric element body 212 between the two lead frames in this way, first, the two lead frames are separated so that the distance between them is larger than the thickness of the dielectric element body 212, and then the dielectric body A process of supplying the element body 212 from the horizontal direction, disposing the dielectric element body 212 between the two lead frames, and then sandwiching the dielectric element body 212 by the two lead frames is necessary. For this reason, a mechanism for separating and approaching the two lead frames and a mechanism for supplying the dielectric element body 212 from the horizontal direction are required, resulting in complicated facilities and increased man-hours.

  Further, in the manufacturing process of the conventional surface mount capacitor 200, the dielectric element body 212 can be obtained by external force from the resin when forming the exterior body 232 by transfer molding simply by sandwiching the dielectric element body 212 between the two lead frames. 212 sometimes deviated from the lead frame. For this reason, the surfaces of the electrodes 214 and 216 disposed on the main surfaces 212a and 212b are chemically or physically roughened so that the dielectric body 212 is not easily displaced from the lead frame even by an external force from the resin. Processing was necessary.

  Further, in the manufacturing process of the conventional surface mount capacitor 200, the dielectric element body 212 can be obtained by external force from the resin when forming the exterior body 232 by transfer molding simply by sandwiching the dielectric element body 212 between the two lead frames. In some cases, the lead frame sandwiching 212 is separated from the dielectric body 212. Therefore, in some cases, it is necessary to process a slit or a hole in the lead frame in the vicinity of the connection portion between the lead frame and the electrodes 214 and 216 that easily receive an external force from the resin.

  In the conventional surface mount capacitor 200, the lead terminals 226 and 228 are connected to the electrodes 214 and 216 arranged on the main surfaces 212a and 212b. Therefore, when the lead terminals 226 and 228 and the electrodes 214 and 216 are soldered, a step of inverting the dielectric body 212 may be required.

  In the conventional surface mount capacitor 200, the dielectric element body 212 is bent so as to wrap around the outer shape of the dielectric element body 212 while being spaced apart from the dielectric element body 212 at a predetermined interval. Therefore, in order to prevent a short circuit from occurring between the lead terminals 226 and 228 and the side surface 212c of the dielectric body 212 due to a high voltage applied to the lead terminals 226 and 228, It was necessary to separate the body element body 212 from the body element by a predetermined distance. For this reason, the device has been increased in size.

  Further, in the conventional surface mount capacitor 200, the lead terminals 226, 228 and the dielectric element body 212 are separated from each other by a predetermined distance as described above, but the lead terminals 226, 228 and the dielectric element body 212 are separated. The distance between the lead frame and the dielectric body 212 is difficult to enter when forming the exterior body 232 by transfer molding. For this reason, the withstand voltage may be locally lowered in a portion not filled with the resin. On the other hand, in order to reliably fill the resin in the portion where the distance between the lead terminals 226 and 228 and the dielectric body 212 is narrow, it is necessary to inject the resin over a long time.

  Further, in the conventional surface mount capacitor 200, when a material mainly composed of Ag is used as the material of the electrodes 214 and 216 in order to improve the bonding force between the electrodes 214 and 216 and the lead terminals 226 and 228, migration is performed. Is likely to occur. For this reason, a double structure in which a layer mainly composed of Zn that covers the electrodes 214 and 216 is formed on the outer periphery of the electrodes 214 and 216 may be required, resulting in an increase in cost.

  However, in the first embodiment, the first portion 26a of the lead terminal 26 is connected to the first portion 20a of the lead conductor 20 disposed on the side surface 12c, and the lead terminal 28 is disposed on the side surface 12d. Is connected to the first portion 18a. Therefore, unlike the conventional surface mount capacitor 200, the lead terminals 26 and 28 are not arranged so as to wrap around the periphery of the dielectric element body 12 along the outer shape of the dielectric element body 12. As a result, the surface mount electronic component 1 can be downsized.

  In the first embodiment, the lead terminal 26 has a second portion 26 b that protrudes toward the lead terminal 28, and the lead terminal 28 has a second portion 28 b that protrudes toward the lead terminal 26. Therefore, when manufacturing the surface mount electronic component 1, the intermediate body 50 (dielectric body 12) is reliably held by the lead terminals 26 and 28 in the direction intersecting the opposing direction of the main surface 14 and the main surface 16. It becomes possible to do.

  In the first embodiment, the dielectric body 12 and the first portions 26a, 28a of the lead terminals 26, 28 are fitted. Therefore, the dielectric body 12 can be reliably held by the lead terminals 26 and 28 in the direction intersecting the opposing direction of the main surfaces 14 and 16. As a result, for example, even when an external force is applied from the resin when the exterior body 32 is formed by transfer molding, the dielectric body 12 is difficult to come off from the lead terminals 26 and 28.

  In the first embodiment, the side surfaces 12c and 12d have a shape having a protruding region. The first portion 26a of the lead terminal 26 is bent into a shape corresponding to the side surface 12c and is engaged with the side surface 12c. The first portion 28a of the lead terminal 28 is bent into a shape corresponding to the side surface 12d and is engaged with the side surface 12d. Accordingly, it is possible to reliably realize a configuration for fitting the dielectric body 12 and the first portions 26a and 28 of the lead terminals 26 and 28 together.

  In the first embodiment, the surface-mount electronic component 1 includes solder resists 22 and 24. Therefore, when soldering the first portion 26a of the lead terminal 26 and the first portion 20a of the lead conductor 20, and the first portion 28a of the lead terminal 28 and the first portion 20a of the lead conductor 20, respectively, the solder resist 22 is used. , 24 makes it difficult for the solder attached to the first portions 18a, 20a of the lead conductors 18, 20 to enter the main surfaces 14, 16 from the side surfaces 12c, 12d. As a result, it becomes possible to maintain a flat state in the region corresponding to the main surface 12a in the outer surface of the surface-mount type electronic component 1 (exterior body 32). Further, since the exterior body 32 formed so as to further cover the solder resists 22 and 24 is in close contact with the solder resists 22 and 24, the solder resists 22 and 24 are hardly peeled off from the dielectric body 12, and the exterior body 32 becomes the solder. It becomes difficult to peel off from the resists 22 and 24, so that moisture resistance and voltage resistance can be maintained. Accordingly, it is not necessary to provide the electrode with a double structure of Ag and Zn or to further provide an undercoat or the like. As a result, it is possible to suppress the increase in cost while ensuring the withstand voltage performance and preventing the occurrence of the migration phenomenon.

  In the first embodiment, the first portion 18b of the lead conductor 18 and the second portion 20b of the lead conductor 20 do not face each other when viewed from the opposing direction of the main surfaces 12a and 12b. The position where the first portion 20a of the lead conductor 20 is drawn from the electrode 16 is set to a position where the linear distance from the position where the second portion 18a of the lead conductor 18 is drawn from the electrode 14 is the largest. ing. Therefore, the distance between the lead conductor 18 and the lead conductor 20 is large. As a result, the dielectric breakdown voltage increases and the withstand voltage can be improved.

  In the first embodiment, the electrode 14 has a substantially semicircular shape on the side that is not integrally formed with the lead conductor 18, and the electrode 16 is substantially on the side that is not integrally formed with the lead conductor 20. It has a semicircular shape, and the electrodes 14 and 16 are rounded. Therefore, the occurrence of electric field concentration is suppressed, the dielectric breakdown voltage is increased, and the withstand voltage can be improved.

  In the first embodiment, when the surface-mount type electronic component 1 is manufactured, the intermediate body 50 in which the electrodes 14 and 16, the lead conductors 18 and 20 and the solder resists 22 and 24 are arranged on the dielectric body 12 is moved upward. To the lead frame 40. Therefore, it is possible to simplify the manufacturing equipment for the surface-mounted electronic component 1.

  In the first embodiment, unlike the conventional surface mount capacitor 200, the lead terminals 26 and 28 are not bent so as to go around the dielectric element body 12 along the outer shape of the dielectric element body 12. Therefore, the interval between the lead terminals 26 and 28 and the dielectric body 12 is not locally narrowed, and the first force of the terminal portion 46 is generated by an external force from the resin when the exterior body 232 is formed by transfer molding. The portion 46 a and the first portion 48 a of the terminal portion 48 are hardly displaced from or separated from the dielectric body 12. As a result, it is not necessary to make a slit or a hole in the lead frame 40, the resin can be injected in a short time, and the surface mount electronic component 1 can be further reduced in size.

(Second Embodiment)
Next, the surface mount electronic component 2 according to the second embodiment will be described with reference to FIGS. 12 and 13. FIG. 12 is a perspective view of the dielectric body of the surface mount electronic component according to the second embodiment as viewed from the main surface side. FIG. 13 is a perspective view of the surface-mount type electronic component according to the second embodiment viewed from the side surface side of the dielectric body. Below, it demonstrates centering around difference with the surface mount-type electronic component 1 which concerns on 1st Embodiment, and the overlapping description is abbreviate | omitted.

  As shown in FIGS. 12 and 13, the surface mount electronic component 2 includes a dielectric body 12, electrodes 14 and 16, lead conductors 18 and 20, solder resists 22 and 24, a pair of lead terminals 26 and 28, and And an exterior body 32.

  The dielectric element body 12 has a pair of grooves 38A and 38B extending in the opposing direction of the side surfaces 12e and 12f on the main surface 12a side. The dielectric element body 12 has a pair of grooves 38C and 38D extending in the opposing direction of the side surfaces 12e and 12f on the main surface 12b side.

  The electrode 14 has a substantially circular shape and is located between the groove portions 38A and 38B. The electrode 16 has a substantially circular shape and is located between the groove portions 38C and 38D. The electrodes 14 and 16 overlap each other when viewed from the opposing direction of the main surfaces 12a and 12b. The lead conductor 18 extends so as to be drawn from the electrode 14 (portion of the electrode 14 near the side surface 12f). The lead conductor 20 extends so as to be drawn from the electrode 16 (a portion of the electrode 16 near the side surface 12e). The position where the lead conductor 18 is drawn from the electrode 14 and the position where the lead conductor 20 is drawn from the electrode 16 are positions facing each other across the center of the electrodes 14, 16 when viewed from the opposing direction of the electrodes 14, 16. Is set. In the second embodiment, the electrodes 14 and 16 and the corresponding lead conductors 18 and 20 are integrally formed.

  The lead conductor 18 has first and second portions 18a to 18e. The first portion 18a is disposed on the side surface 12d (projection 12B). The first portion 18a extends in the direction facing the main surfaces 12a and 12b. The second portions 18b to 18e are arranged on the main surface 12a so as to electrically connect the first portion 18a and the electrode 14. In the second embodiment, the first and second portions 18a to 18e are integrally formed.

  The second portion 18b has one end connected to the electrode 14 and extends from the electrode 14 toward the side surface 12f. One end of the second portion 18c is continuous (integrally formed) with the other end of the second portion 18b, and the side of the second portion 18b extends from the other end of the second portion 18b so as to be substantially parallel to the side surfaces 12e and 12f. It extends toward 12d. One end of the second portion 18d is continuous (integrally formed) with the other end of the second portion 18c, and extends from the other end of the second portion 18c toward the protrusion 12B. One end of the second portion 18e is continuous (integrally formed) with the other end of the second portion 18d, and protrudes from the other end of the second portion 18d so as to be substantially parallel to the side surfaces 12e and 12f. It extends toward the part 12B. One end of the first portion 18a is continuous (integrally formed) with the other end of the second portion 18e. That is, the lead conductor 18 is arranged so as to bypass the groove 38B and to wrap around from the main surface 12a to the side surface 12d.

  The lead conductor 20 has first and second portions 20a to 20e. The first portion 20a is disposed on the side surface 12c (projection 12A). The first portion 20a extends in the direction facing the main surfaces 12a and 12b. The second portions 20b to 20e are arranged on the main surface 12b so as to electrically connect the first portion 20a and the electrode 16. In the second embodiment, the first and second portions 20a to 20e are integrally formed.

  One end of the second portion 20b is connected to the electrode 16 and extends from the electrode 16 toward the side surface 12e. One end of the second portion 20c is continuous (integrally formed) with the other end of the second portion 20b, and from the other end of the second portion 20b so as to be substantially parallel to the side surfaces 12e and 12f. It extends toward 12c. One end of the second portion 20d is continuous (integrally formed) with the other end of the second portion 20c, and extends from the other end of the second portion 20 toward the protrusion 12A. One end of the second portion 20e is continuous (integrally formed) with the other end of the second portion 20d, and protrudes from the other end of the second portion 20d so as to be substantially parallel to the side surfaces 12e and 12f. It extends toward the part 12A. One end of the second portion 20e is continuous (integrally formed) with the other end of the second portion 20e. That is, the lead conductor 20 is arranged so as to bypass the groove portion 38C and to wrap around from the main surface 12b to the side surface 12c.

  The first portion 26a of the lead terminal 26 is electrically and physically connected to the first portion 20a of the extraction electrode 20 by solder (not shown). The first portion 28a of the lead terminal 28 is electrically and physically connected to the first portion 18a of the extraction electrode 18 by solder (not shown).

  The solder resist 22 is disposed so as to cover the electrodes 14 and the second portions 18 b to 18 d of the extraction electrode 18. The solder resist 24 is disposed so as to cover the electrodes 16 and the second portions 20 b to 20 d of the extraction electrode 20.

  As described above, in the second embodiment, the first portion 26a of the lead terminal 26 is connected to the first portion 20a of the lead conductor 20 disposed on the side surface 12c, and the lead terminal 28 is disposed on the side surface 12d. The lead conductor 18 is connected to the first portion 18a. Therefore, unlike the conventional surface mount capacitor 200, the lead terminals 26 and 28 are not arranged so as to wrap around the periphery of the dielectric element body 12 along the outer shape of the dielectric element body 12. As a result, the surface mount electronic component 2 can be reduced in size.

  In the second embodiment, the position where the lead conductor 18 is drawn from the electrode 14 and the position where the lead conductor 20 is drawn from the electrode 16 sandwich the center of the electrodes 14, 16 when viewed from the opposing direction of the electrodes 14, 16. Are set at positions facing each other. The lead conductor 18 bypasses the groove 38B and is disposed so as to wrap around the main surface 12a to the side surface 12c. The lead conductor 20 bypasses the groove 38C and wraps around the main surface 12b to the side surface 12c. Is arranged. Therefore, the distance between the lead conductor 18 and the lead conductor 20 is large. As a result, the dielectric breakdown voltage increases and the withstand voltage can be improved.

  In the second embodiment, the substantially circular electrode 14 is arranged on the main surface 12a so as to be positioned between the groove portions 38A and 38B, and the substantially circular electrode 16 is positioned so as to be positioned between the groove portions 38C and 38D. Is disposed on the main surface 12b. That is, the groove portion 38A is disposed between the electrode 14 and the side surface 12c, and the groove portion 38D is disposed between the electrode 16 and the side surface 12d. Therefore, the creeping distance between the electrode 14 and the portion of the lead conductor 20 formed on the side surface 12c and the creeping distance between the electrode 16 and the portion of the lead conductor 18 formed on the side surface 12d are increased. As a result, the dielectric breakdown voltage increases and the withstand voltage can be improved.

  In the second embodiment, the electrodes 14 and 16 have a substantially circular shape. Therefore, electric field concentration is suppressed, the dielectric breakdown voltage is increased, and the withstand voltage can be improved.

  Although the preferred embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments.

  The configuration in which the dielectric body 12 and the first portions 26a, 28a of the lead terminals 26, 28 are fitted is not limited to the configuration shown in the first and second embodiments. For example, as in the surface-mounted electronic component 3 shown in FIG. 14, the first portion 26 a of the lead terminal 26 is engaged with the side surface 12 c of the dielectric body 12 via the first portion 20 a of the lead conductor 20. The first portion 28 a of the lead terminal 28 may be engaged with the side surface 12 d of the dielectric element body 12 through the first portion 18 a of the extraction electrode 18. That is, the dielectric body 12 has a recess 12A on the side surface 12c that is recessed inward of the dielectric body 12 and that extends in a direction opposite to the main surfaces 12a and 12b. Thereby, the side surface 12c will exhibit the shape which has the recessed area | region. In addition, the dielectric body 12 has a recessed portion 12B that is recessed toward the inner side of the dielectric body 12 and extends in the opposing direction of the main surfaces 12a and 12b on the side surface 12d. Thereby, the side surface 12d exhibits a shape having a recessed region. The first portion 26a of the lead terminal 26 is bent into a shape (substantially C shape) corresponding to the side surface 12c. The first portion 28a of the lead terminal 28 is bent into a shape (substantially C shape) corresponding to the side surface 12d.

  In the second embodiment, the second portion 18c of the lead conductor 18 is substantially parallel to the side surfaces 12e and 12f, and the second portion 20c of the lead conductor 20 is substantially parallel to the side surfaces 12e and 12f. Not limited to. If the lead conductor 18 is formed from the electrode 14 to the side surface 12d so as to bypass the groove portion 38B, and the lead conductor 20 is formed from the electrode 16 to the side surface 12c so as to bypass the groove portion 38C, the lead conductors 18, 20 are formed. The shape of is not particularly limited.

  In the second embodiment, the dielectric element body 12 has the groove portions 38A, 38B, 38C, and 38D. However, the dielectric element body 12 is not limited to this, and may have a protrusion portion. May be combined.

  In the first and second embodiments, the present invention is applied to a surface mount type capacitor, but may be applied to a surface mount type varistor. In this case, a varistor element body is provided instead of the dielectric element body 12. The varistor element body has dielectric characteristics and voltage non-linear characteristics (varistor characteristics), and is made of a varistor material (including ZnO as a main component and a rare earth element or Bi as a subcomponent).

  In the first and second embodiments, the cream solder is applied to the facing surface S2 of the terminal portions 46 and 48 before the intermediate body 50 is mounted on the lead frame 40. However, the present invention is not limited to this. Specifically, it is only necessary to be able to electrically connect the terminal portions 46 and 48 and the first portions 18a and 20a of the lead conductors 18 and 20, for example, an adhesive in which metal powder is kneaded. The terminal portions 46 and 48 and the first portions 18a and 20a of the lead conductors 18 and 20 can be electrically connected by using and curing the adhesive.

  In the first and second embodiments, the solder resist 22 is disposed on the main surface 12a of the dielectric element body 12 and the solder resist 24 is disposed on the main surface 12b of the dielectric element body 12, but this is not limitative. Absent. That is, the main part is arranged to cover most of the electrode 14 and the second part 18b of the lead conductor 18 so as to cover most of the second part 18b of the electrode 16 and the lead conductor 20. As long as it has at least a portion arranged on the surface 12b, one solder resist may be arranged so as to make one round of the outer surface of the dielectric body 12. Further, the solder resists 22 and 24 may not be arranged on the main surfaces 12a and 12b.

1 is a perspective view showing a partially cutaway surface-mounted electronic component according to a first embodiment. It is the perspective view which looked at the surface mount type electronic component concerning a 1st embodiment from the principal surface side of a dielectric element body. It is the perspective view which looked at the surface mount type electronic component concerning a 1st embodiment from the side of the dielectric body. It is a flowchart for demonstrating the manufacturing process of the surface mount-type electronic component which concerns on 1st Embodiment. It is a figure for demonstrating each process of the manufacturing process of a surface mount-type electronic component. FIG. 6 is a diagram for explaining a process subsequent to FIG. 5. It is a figure for demonstrating the subsequent process of FIG. FIG. 8 is a diagram for explaining a step subsequent to FIG. 7. FIG. 9 is a diagram for explaining a step subsequent to FIG. 8. FIG. 10 is a diagram for explaining a step subsequent to FIG. 9. It is sectional drawing which shows the conventional surface mount-type electronic component. It is the perspective view which looked at the dielectric body of the surface mount type electronic component concerning a 2nd embodiment from the principal surface side. It is the perspective view which looked at the surface mounting type electronic component concerning a 2nd embodiment from the side of the dielectric body. It is the perspective view which looked at the dielectric body of the surface mount type electronic component concerning a 3rd embodiment from the principal surface side.

Explanation of symbols

  1, 2, 3 ... Surface mount type electronic component, 12 ... Dielectric body, 12a, 12b ... Main surface, 12c to 12f ... Side, 12A, 12B ... Protrusion, 14,16 ... Electrode, 18, 20 ... Leader Conductor, 22, 24 ... solder resist, 26, 28 ... lead terminal, 32 ... exterior body, 100 ... circuit board, 150 ... inverter device, 38A to 38D ... groove, S1 ... virtual plane, S2 ... facing surface.

Claims (16)

A first main surface and a second main surface facing each other; a first side surface and a second side surface extending to connect the first main surface and the second main surface; An element body having
A first electrode disposed on the first main surface of the element body;
A second electrode disposed on the second main surface of the element body and facing the first electrode;
A first lead conductor electrically connected to the first electrode;
A second lead conductor electrically connected to the second electrode;
A first lead terminal including a facing surface facing the first side surface and electrically connected to the first lead conductor;
A second lead terminal including a facing surface facing the second side surface and electrically connected to the second lead conductor;
The first lead conductor has a first portion disposed on the first side surface, and the first lead terminal is electrically connected to the first lead terminal by connecting the first portion and the first lead terminal. Connected,
The second lead conductor has a first portion disposed on the second side surface, and the first lead portion and the second lead terminal are connected to electrically connect the second lead terminal. An electronic component characterized by being connected. The first lead terminal is opposed to the first portion connected to the first portion of the first lead conductor and the first main surface, and extends in a facing direction of the first side surface and the second side surface. Two parts,
The second lead terminal is opposed to the first portion connected to the first portion of the second lead conductor and the first main surface, and extends in a facing direction of the first side surface and the second side surface. The electronic component according to claim 1, comprising two parts. The battery further comprises an electrically insulating outer body disposed to cover at least the element body, the first electrode, the second electrode, a part of the first lead terminal, and a part of the second lead terminal. ,
The first lead terminal and the second lead terminal are each pulled out from the exterior body,
The drawing position of the first lead terminal drawn out from the outer package and the drawing position of the second lead terminal drawn from the outer package are virtual planes substantially parallel to the first main surface and the second main surface. The electronic component according to claim 1, wherein the electronic component is located above. The first lead terminal has a first portion connected to the first portion of the first lead conductor;
The second lead terminal has a first portion connected to the first portion of the second lead conductor;
2. The electronic component according to claim 1, wherein the element body, the first lead terminal, and the first portions of the second lead terminal are fitted. The first side surface and the second side surface have a shape having a protruding and / or recessed region,
The first portion of the first lead terminal is bent into a shape corresponding to the first side surface, and is engaged with the first side surface through the first portion of the first lead conductor,
The first portion of the second lead terminal is bent into a shape corresponding to the second side surface, and is engaged with the second side surface via the first portion of the second lead conductor. The electronic component according to claim 4. The first lead conductor has a second portion disposed on the first main surface so as to electrically connect the first portion of the first lead conductor and the first electrode;
The second lead conductor has a second portion disposed on the second main surface so as to electrically connect the first portion of the second lead conductor and the second electrode;
A portion disposed on the first main surface so as to cover the second portion of the first electrode and the first lead conductor, and a second portion of the second electrode and the second lead conductor. The electronic component according to claim 1, further comprising an insulating film having at least a portion disposed on the second main surface. The first lead conductor has a second portion disposed on the first main surface so as to electrically connect the first portion of the first lead conductor and the first electrode;
The second lead conductor has a second portion disposed on the second main surface so as to electrically connect the first portion of the second lead conductor and the second electrode;
The second portion of the first lead conductor and the second portion of the second lead conductor are not opposed to each other when viewed from the opposing direction of the first main surface and the second main surface,
The position at which the second portion of the second lead conductor is drawn from the second electrode is the straight line distance from the position at which the second portion of the first lead conductor is drawn from the first electrode. The electronic component according to claim 1, wherein the electronic component is set at a far position. The element body has a third side surface and a fourth side surface that extend so as to connect the first main surface and the second main surface and face each other.
The first lead conductor has a second portion disposed on the first main surface so as to electrically connect the first portion of the first lead conductor and the first electrode;
The second lead conductor has a second portion disposed on the second main surface so as to electrically connect the first portion of the second lead conductor and the second electrode;
The second portion of the first lead conductor and the second portion of the second lead conductor are not opposed to each other when viewed from the opposing direction of the first main surface and the second main surface,
The second portion of the first lead conductor extends from the first electrode toward the third side surface;
2. The electronic component according to claim 1, wherein the second portion of the second lead conductor extends from the second electrode toward the fourth side surface. 3.   The element body has depressions in a region between the first electrode and the second side surface on the first main surface and a region between the second electrode and the first side surface on the second main surface. The electronic component according to claim 1, wherein a portion and / or a protrusion is provided.   The electronic component according to claim 1, wherein the first electrode and the second electrode have a rounded shape.   The inverter apparatus provided with the electronic component as described in any one of Claims 1-10. A first main surface and a second main surface facing each other; a first side surface and a second side surface extending to connect the first main surface and the second main surface; An element body, a first electrode disposed on the first main surface of the element body, a second electrode disposed on the second main surface of the element body and facing the first electrode, A first lead conductor electrically connected to the first electrode; and a second lead conductor electrically connected to the second electrode, wherein the first lead conductor is disposed on the first side surface. An intermediate body preparing step of preparing an intermediate body having the first portion disposed on the second side surface;
A first terminal portion having a first portion; and a second terminal portion having a first portion, wherein the first portion of the first terminal portion and the first portion of the second terminal portion are opposed to each other. A lead frame for preparing a lead frame having a facing surface and spaced apart by a distance corresponding to a width of the element body in a facing direction of the first side surface of the element body and the second side surface of the element body; Process,
The first portion of the first terminal portion and the first portion of the first lead conductor are electrically connected and the first portion of the second terminal portion and the first portion of the second lead conductor are electrically connected. A mounting step of electrically connecting a portion and mounting the intermediate body on the lead frame;
At least the element body, the first electrode, the second electrode, and the first terminal by injecting and curing resin into a mold in which the lead frame on which the intermediate body is mounted is disposed. An exterior body forming step for forming an exterior body having electrical insulation disposed so as to cover a part of the part and a part of the second terminal part;
The intermediate body in which the exterior body is formed is cut by cutting a portion of the first terminal portion that is pulled out from the exterior body and a portion of the second terminal portion that is pulled out of the exterior body. A method of manufacturing an electronic component, comprising: a cutting step of separating from a lead frame.   In the mounting step, solder is applied to each of the opposing surfaces of the first portion of the first terminal portion and the first portion of the second terminal portion, and the first portion of the first terminal portion is coated with the solder. The first portion of the first lead conductor is located between the opposing surface and the first side surface of the element body, and the opposing surface of the first portion of the second terminal portion and the first portion of the element body. The intermediate body is placed between the first portion of the first terminal portion and the first portion of the second terminal portion so that the first portion of the second lead conductor is located between two side surfaces. Then, the first portion of the first terminal portion and the first portion of the first lead conductor are soldered by heating, and the first portion of the second terminal portion The second lead conductor is soldered to the first portion. Process for the preparation of an electronic component according to Motomeko 12. The first terminal portion is at least partially disposed closer to the second terminal portion than the first portion of the first terminal portion, and the first portion and the second terminal of the first terminal portion. A second portion extending in a direction opposite to the first portion of the portion,
The second terminal portion is at least partially disposed closer to the first terminal portion than the first portion of the second terminal portion, and the first portion and the second terminal of the first terminal portion. A second portion extending in a direction opposite to the first portion of the portion,
In the mounting step, the intermediate body is moved to the first terminal portion so that the first main surface of the element body faces the second portion of the first terminal portion and the second portion of the second terminal portion. The electronic component manufacturing method according to claim 12, wherein the electronic component is placed on the second portion of the second terminal portion and the second portion of the second terminal portion.   13. The method of manufacturing an electronic component according to claim 12, wherein in the mounting step, the element body and the first portions of the first terminal portion and the second terminal portion are fitted. The first side surface and the second side surface of the element body have a shape having a protruding and / or recessed region,
The first portion of the first terminal portion is bent into a shape corresponding to the first side surface,
The first portion of the second terminal portion is bent into a shape corresponding to the second side surface;
In the mounting step, the first side surface of the element body and the first portion of the first terminal portion are engaged via the first portion of the first lead conductor, and the second portion of the element body is engaged. The method of manufacturing an electronic component according to claim 15, wherein a side surface and the first portion of the second terminal portion are engaged through the first portion of the second lead conductor.

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