JP2707899B2 - Hybrid integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly to a surface mount type hybrid integrated circuit device having a case.

[0002]

2. Description of the Related Art In general, a hybrid integrated circuit device having a conventional case is prepared by inserting an assembled hybrid integrated circuit board (hereinafter, referred to as a circuit board) into a rectangular box-shaped plastic case and sealing resin. After filling and thermal curing, the leads are shaped to form a surface-mounted hybrid integrated circuit device, or a structure is provided in which a case as a cap is simply mechanically fitted to an assembled circuit board. doing.
In the latter case, a relatively light-weight hybrid integrated circuit device can be realized without using a sealing resin.However, since the reliability such as moisture resistance is slightly inferior, in a high-frequency band where the influence of the dielectric constant of the resin is disliked. It is used only in the hybrid integrated circuit device used.

[0003]

In this conventional hybrid integrated circuit device, first, due to the inner diameter of the case and the margin of the outer shape of the circuit board, the positional tolerance between the outer shape of the case and the external terminals drawn out from the circuit board becomes large. However, there has been a problem in positioning during automatic mounting. Second, due to the resin sealed in the case, the weight of the hybrid integrated circuit device as a whole has increased. Third, after the case is sealed, the external terminals are shaped to have a surface mounting structure, so that the thickness dimension is a normal DIP (Dual In-Line Package).
There was a problem that it became large compared with.

[0004]

SUMMARY OF THE INVENTION A hybrid integrated circuit device according to the present invention comprises an insulating case having at least a pair of opposing inner walls inclined outwardly, and a clip terminal attached to a peripheral end of the case. A hybrid integrated circuit board positioned in contact with the inclined inner side wall and mounted in the case; and a sealing resin applied to the lower surface of the hybrid integrated circuit board and fixing the case and the hybrid integrated circuit board. Be composed.

[0005]

Next, embodiments of the present invention will be described with reference to the drawings.

FIGS. 1A and 1B are a schematic sectional view and a partially cutaway side view showing a first embodiment of the present invention.

As shown in FIGS. 1 (a) and 1 (b), an IC chip is mounted on the upper surface, and a chip component is formed on the lower surface of a 1.0 mm thick circuit board 1 provided with a chip coat 2 on the surface including the IC chip. 3 are mounted, and 66 pins are attached to the opposite peripheral ends of the circuit board 1 at a pitch of 1.27 mm.
The lead of the clip terminal 4 is drawn obliquely outward, the lead is shaped so that the tip is horizontal to the mounting surface, and then fitted into the high heat resistant plastic case 5. Here, in the lateral direction, it is positioned by the inclined portion of the lead of the clip terminal 4, and in the longitudinal direction, it is defined by the pair of opposed inner walls 6 of the plus chip case 5 and the end of the circuit board 1. Positioned. Next, the silicon-based sealing resin 7 is applied to the lower surface of the circuit board 1 and also applied to and fixed to the fitting portion between the case 5 and the circuit board 1.
A flat package type surface mount hybrid integrated circuit device is configured. Here, the sealing resin does not go around on the upper surface side of the circuit board 1 and is in a hollow state.

FIGS. 2A and 2B are a plan view and a schematic sectional view showing a second embodiment of the present invention.

As shown in FIGS. 2 (a) and 2 (b), similar to the first embodiment, a clip terminal is provided at the peripheral end of each side of a square circuit board 1 provided with a chip coat 2 and a chip component 3. 4
Are mounted at a pitch of 1.27 mm, and after lead shaping, inserted into a high heat-resistant case 5a having a truncated pyramid shape, a silicone-based sealing resin 7 is applied to the lower surface of the circuit board 1, and the case 5a and the circuit board 1 are bonded. By doing so, QFP (Quad
(Flat Package) type surface integrated hybrid integrated circuit device. In this embodiment, the inclined inner side wall 6 of the case 5a is supported by the inclined portion of the lead of the clip terminal 4, and a positional accuracy of about ± 0.3 mm is obtained.

[0010]

As described above, the present invention employs a structure in which at least two opposite sides of the inner wall of the case are inclined and the clip terminal is pulled out obliquely, whereby the position of the terminal position with respect to the case end surface is improved. This has the effect of improving the accuracy and being able to cope with automatic mounting based on the case outline. In addition, the case and the circuit board are adhered to each other by a sealing resin applied to the lower surface of the circuit board, and the surface of the circuit board can be made hollow, thereby reducing the weight of the hybrid integrated circuit device itself. Having. Further, since the case is supported by the terminal, the thickness of the hybrid integrated circuit device can be reduced by about 0.5 mm as compared with a case where the case is sealed and leads are shaped.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view and a partially cutaway side view showing a first embodiment of the present invention.

FIG. 2 is a plan view and a schematic cross-sectional view showing a second embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Circuit board 2 Chip coat 3 Chip component 4 Clip terminal 5, 5a High heat-resistant plastic case 6 Inclined inner wall 7 Silicon-based sealing resin

Claims (2)

(57) [Claims] An insulative case having at least a pair of opposing inner walls inclined outwardly, and a clip terminal attached to a peripheral end thereof is positioned by contacting the inclined inner wall of the case. A hybrid integrated circuit device, comprising: a hybrid integrated circuit board mounted on the substrate; and a sealing resin applied to a lower surface of the hybrid integrated circuit board and fixing the case and the hybrid integrated circuit board. 2. The hybrid integrated circuit according to claim 1, wherein the insulating case is a high heat resistant plastic case.