JPH034019Y2 - - Google Patents
Info
- Publication number
- JPH034019Y2 JPH034019Y2 JP1984070841U JP7084184U JPH034019Y2 JP H034019 Y2 JPH034019 Y2 JP H034019Y2 JP 1984070841 U JP1984070841 U JP 1984070841U JP 7084184 U JP7084184 U JP 7084184U JP H034019 Y2 JPH034019 Y2 JP H034019Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- lead wires
- parallel
- resin layer
- exterior resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 30
- 238000005452 bending Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【考案の詳細な説明】
本考案はチツプ形電解コンデンサに関するもの
で、特にその外部端子の形状に係るものである。[Detailed Description of the Invention] The present invention relates to a chip-type electrolytic capacitor, and particularly relates to the shape of its external terminal.
従来、第２図Ａ，Ｂに示すようにチツプ形電解
コンデンサ１として、アルミニウムケース２内に
少なくともコンデンサ素子３を組込み、ゴム封口
体４にて封口した丸形のアルミニウム電解コンデ
ンサ５全体を外装樹脂層６にて被覆し、ゴム封口
体４および外装樹脂層６を介して導出されたコン
デンサ素子３からのリード線７，８を折曲加工に
より外部端子としたものがある。このチツプ形電
解コンデンサ１の外装樹脂の形成にあたつては、
通常は製造コストの引下げとの関係で液体浸漬法
あるいは粉体流動浸漬法により行なわれるため、
チツプ形電解コンデンサ１は丸形となり、また折
曲加工されたリード線７，８の同電解コンデンサ
１本体部分の折曲部分、つまりプリント配線基板
の導体部に半田付けされる部分が短いために、同
電解コンデンサ１をプリント配線基板上に載置し
た場合、不安定となつてしまう欠点がある。ま
た、リード線７，８が棒状の線材であるために、
半田付け後の半田接着強度が充分に満足し得ない
こともあつた。 Conventionally, as shown in FIGS. 2A and 2B, as a chip-type electrolytic capacitor 1, at least a capacitor element 3 is built into an aluminum case 2, and the entire round aluminum electrolytic capacitor 5 sealed with a rubber sealing body 4 is packaged with an exterior resin. There is one in which lead wires 7 and 8 from a capacitor element 3 covered with a layer 6 and led out through a rubber sealing body 4 and an exterior resin layer 6 are bent to form external terminals. When forming the exterior resin of this chip type electrolytic capacitor 1,
Usually, liquid immersion method or powder fluid immersion method is used to reduce manufacturing costs.
The chip-type electrolytic capacitor 1 has a round shape, and the bent portions of the bent lead wires 7 and 8 on the main body of the electrolytic capacitor 1, that is, the portions that are soldered to the conductor portion of the printed wiring board, are short. However, when the electrolytic capacitor 1 is mounted on a printed wiring board, it has the disadvantage of becoming unstable. In addition, since the lead wires 7 and 8 are rod-shaped wire rods,
In some cases, the solder adhesive strength after soldering was not fully satisfactory.
しかるに、本考案は基板上に載置あるいは実装
した場合に、安定性が優れ、かつ半田付け後の接
着強度の向上をはかつたチツプ形電解コンデンサ
を提供するものである。 However, the present invention provides a chip-type electrolytic capacitor that has excellent stability when placed or mounted on a board and has improved adhesive strength after soldering.
第１図Ａ，Ｂに本考案に係る実施例を示す。こ
こでは特に上述した従来例と異なる箇所について
のみ説明するが、その余の箇所は従来例と同様で
あるので、その説明は省略する。また、従来例と
同一の箇所は同一符号を付す。 Embodiments of the present invention are shown in FIGS. 1A and 1B. Here, only the parts that are different from the conventional example described above will be explained, but the remaining parts are the same as the conventional example, so the explanation thereof will be omitted. Further, the same parts as in the conventional example are given the same reference numerals.
第１図Ａ，Ｂに示したチツプ形電解コンデンサ
１Ａにおいて、ゴム封口体４および外装樹脂層６
を介して導出されたコンデンサ素子３からのリー
ド線７，８は従来例と同様に外装樹脂層６から導
出された箇所で同電解コンデンサ１Ａ本体の周側
（底面）に向けて互いにほぼ平行に第１折曲加工
P1され、その周側端（底面の一側）で同様にそ
の平行状態を保ち、かつ周側（底面）に沿うよう
に第２折曲加工P2され、さらに周側（底面）の
適当な箇所、ここでは中央部で同リード線７，８
の平行間隔が幅広くなるように、「八」の字形に
第３折曲加工P3され、さらに同リード線７，８
が同電解コンデンサ１Ａの両側から突出すること
なく、かつ互いに平行になるように第４折曲加工
P4されている。また、上記周側端と相対する他
端（底面の他端）付近に位置しているリード線
７，８の先端付近は互いに相対向する内側にほぼ
90゜の角度で第５折曲加工P5され、折返部７ａ，
８ａを形成する。 In the chip type electrolytic capacitor 1A shown in FIGS. 1A and 1B, the rubber sealing body 4 and the exterior resin layer 6
The lead wires 7 and 8 from the capacitor element 3 led out through the capacitor element 3 run almost parallel to each other toward the circumferential side (bottom surface) of the electrolytic capacitor 1A body at the point where they are led out from the exterior resin layer 6, as in the conventional example. 1st bending process
P 1 , the circumferential edge (one side of the bottom surface) similarly maintains its parallel state, and a second bending process P 2 is performed along the circumferential side (bottom surface), and then an appropriate bending process on the circumferential side (bottom surface) In this case, the same lead wires 7 and 8 are connected at the central part.
The third bending process P 3 is made in the shape of an "eight" so that the parallel interval between the lead wires 7 and 8 becomes wider, and the lead wires 7 and 8 are
The fourth bending process is performed so that the lines do not protrude from both sides of the electrolytic capacitor 1A and are parallel to each other.
P4 has been. Further, the tips of the lead wires 7 and 8 located near the other end (the other end of the bottom surface) facing the circumferential end are approximately located inside facing each other.
A fifth bending process P5 is performed at an angle of 90°, and the folded part 7a,
Form 8a.
なお、チツプ形電解コンデンサ１Ａにおいて、
リード線７，８の折返部７ａ，８ａの折曲角度は
上述した90゜に限定されることはなく、任意の角
度で良い。ところで、周側（底面）に位置してい
るリード線７，８および折返部７ａ，８ａが同一
平面上にあることは勿論のことである。 In addition, in the chip type electrolytic capacitor 1A,
The bending angles of the folded portions 7a and 8a of the lead wires 7 and 8 are not limited to the above-mentioned 90 degrees, but may be any angle. By the way, it goes without saying that the lead wires 7, 8 and the folded portions 7a, 8a located on the circumferential side (bottom surface) are on the same plane.
以上にて述べたように、本考案においては２本
のリード線７，８はチツプ形電解コンデンサの本
体部分（底面）において、途中まで平行で、適当
な箇所で同リード線７，８の平行間隔が幅広くな
るように「八」の字形に第３折曲加工P3され、
さらに両リード線７，８が同電解コンデンサの両
側から突出することなく、かつ互いに平行になる
ように第４折曲加工P4されていると共に、上記
周側端と相対する他端（底面の他端）付近に位置
しているリード線７，８の先端付近が互いに相対
向する内側に第５折曲加工P5されているという
ように、リード線７，８がチツプ形電解コンデン
サの本体部分（底面）のほぼ全長にわたつて形成
され、かつその先端付近には折返部７ａ，８ａが
形成されているために、基板上に載置あるいは実
装した場合、接触面積が多くとれ、その安定性お
よび半田接着性が優れたものとなる。 As mentioned above, in the present invention, the two lead wires 7 and 8 are parallel halfway in the main body (bottom surface) of the chip electrolytic capacitor, and the lead wires 7 and 8 are parallel to each other at an appropriate point. The third bending process P 3 is made in the shape of an "eight" so that the interval becomes wider,
Further, both lead wires 7 and 8 are bent in a fourth direction P4 so that they do not protrude from both sides of the electrolytic capacitor and are parallel to each other, and the other end facing the circumferential end (on the bottom The lead wires 7 and 8 are connected to the main body of the chip electrolytic capacitor so that the tips of the lead wires 7 and 8 located near the other end are bent in a fifth direction P5 on the inside facing each other. It is formed over almost the entire length of the part (bottom surface), and the folded parts 7a and 8a are formed near the tip, so when placed or mounted on a board, a large contact area is obtained and its stability is improved. This results in excellent solderability and solder adhesion.
第１図Ａ，Ｂは本考案に係る実施例を示す底面
図と正面図、第２図Ａ，Ｂはそれぞれ従来例を示
す側断面図と正面図である。
図中、１，１Ａ……チツプ形電解コンデンサ、
２……アルミニウムケース、３……コンデンサ素
子、４……ゴム封口体、５……アルミニウム電解
コンデンサ、６……外装樹脂層、７，８……リー
ド線、７ａ，８ａ……折返部、P1……第１折曲
加工、P2……第２折曲加工、P3……第３折曲加
工、P4……第４折曲加工、P5……第５折曲加工。
1A and 1B are a bottom view and a front view showing an embodiment of the present invention, and FIGS. 2A and 2B are a side sectional view and a front view, respectively, showing a conventional example. In the figure, 1,1A...chip type electrolytic capacitor,
2...Aluminum case, 3...Capacitor element, 4...Rubber sealing body, 5...Aluminum electrolytic capacitor, 6...Exterior resin layer, 7, 8...Lead wire, 7a, 8a...Folded part, P 1 ...First bending process, P2 ...Second bending process, P3 ... Third bending process, P4 ...Fourth bending process, P5 ...Fifth bending process.
Claims (1)
素子を組込み、ゴム封口体にて封口したアルミニ
ウム電解コンデンサ全体を外装樹脂層にて被覆
し、ゴム封口体および外装樹脂層を介して導出さ
れたコンデンサ素子からのリード線を折曲加工に
より外部端子としたチツプ形電解コンデンサにお
いて、２本のリード線は外装樹脂層から導出され
た箇所で同電解コンデンサ本体の周側（底面）に
向けて互いにほぼ平行に第１折曲加工され、その
周側端（底面の一側）で同様にその平行状態を保
ち、かつ周側（底面）に沿うように第２折曲加工
され、さらに周側（底面）の適当な箇所で同リー
ド線の平行間隔が幅広くなるように「八」の字形
に第３折曲加工され、さらに両リード線が同電解
コンデンサの両側から突出することなく、かつ互
いに平行になるように第４折曲加工されていると
共に、上記周側端と相対する他端（底面の他端）
付近に位置しているリード線の先端付近が互いに
相対向する内側に第５折曲加工されて折返部が形
成されていることを特徴とするチツプ形電解コン
デンサ。 At least a capacitor element is assembled in an aluminum case, the entire aluminum electrolytic capacitor is sealed with a rubber sealing body, and the entire aluminum electrolytic capacitor is covered with an exterior resin layer, and the lead wire from the capacitor element led out through the rubber sealing body and the exterior resin layer is In chip-type electrolytic capacitors with external terminals made by bending, the two lead wires are bent for the first time almost parallel to each other toward the circumferential side (bottom surface) of the electrolytic capacitor body at the point where they are led out from the exterior resin layer. Similarly, the parallel state is maintained at the circumferential edge (one side of the bottom surface), and a second bending process is performed along the circumferential side (bottom surface), and then at an appropriate location on the circumferential side (bottom surface). The lead wires are folded a third time in a figure-eight shape so that the parallel distance between them becomes wider, and the lead wires are folded a fourth time so that they do not protrude from both sides of the electrolytic capacitor and are parallel to each other. The other end (the other end of the bottom surface) that is curved and faces the above circumferential end
A chip-type electrolytic capacitor characterized in that the tips of adjacent lead wires are bent inwardly facing each other in a fifth direction to form folded portions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7084184U JPS60183428U (en) | 1984-05-15 | 1984-05-15 | Chip type electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7084184U JPS60183428U (en) | 1984-05-15 | 1984-05-15 | Chip type electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60183428U JPS60183428U (en) | 1985-12-05 |
| JPH034019Y2 true JPH034019Y2 (en) | 1991-02-01 |
Family
ID=30607790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7084184U Granted JPS60183428U (en) | 1984-05-15 | 1984-05-15 | Chip type electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60183428U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5624129B2 (en) * | 1975-05-12 | 1981-06-04 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5499056U (en) * | 1977-12-26 | 1979-07-12 | ||
| JPS5624129U (en) * | 1979-07-30 | 1981-03-04 | ||
| JPS5658845U (en) * | 1979-10-09 | 1981-05-20 | ||
| JPS58138326U (en) * | 1982-03-10 | 1983-09-17 | ニチコン株式会社 | Electrolytic capacitor |
-
1984
- 1984-05-15 JP JP7084184U patent/JPS60183428U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5624129B2 (en) * | 1975-05-12 | 1981-06-04 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60183428U (en) | 1985-12-05 |
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