JP3589941B2 - Semiconductor device - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a semiconductor device that can be mounted on a substrate at high density.
[0002]
[Prior art]
FIG. 3 is a perspective view showing a conventional DIP type semiconductor device, and FIG. 4 is a side view when this DIP type semiconductor device is mounted on a substrate. In the figure, reference numeral 1 denotes an insertion type semiconductor device represented by a DIP (dual in-line package) type in which input / output terminals 2 are installed in two directions.
[0003]
The input / output terminal 2 of the DIP type semiconductor device 1 is inserted into a through hole (not shown) of the substrate 3 and joined by soldering.
[0004]
FIG. 5 is a perspective view showing a conventional QFP type semiconductor device, and FIG. 6 is a side view when the QFP type semiconductor device is mounted on a substrate. In the figure, reference numeral 4 denotes a surface-mounted semiconductor device typified by a QFP (quad flat package) in which input / output terminals 5 are installed in four directions.
[0005]
The QFP type semiconductor device 4 is mounted on a substrate 6 and its input / output terminals 5 are joined to electrode portions on the surface of the substrate 6 by soldering.
[0006]
[Problems to be solved by the invention]
However, in the semiconductor device having the above configuration, particularly a DIP type semiconductor device, a through-hole must be provided in the substrate, so that a wiring pattern of the substrate cannot be provided in the portion of the through-hole.
[0007]
In the QFP semiconductor device, when the input / output terminals have the same pitch, if the number of input / output terminals is increased, the size of the resin housing of the QFP semiconductor device increases.
[0008]
As described above, there has been a problem that any method of providing the input / output terminals of the DIP type semiconductor device and the QFP type semiconductor device does not provide a satisfactory device in terms of high-density mounting on a substrate.
[0009]
The present invention provides an excellent semiconductor device in which input / output terminals are provided in a plane of a housing of the semiconductor device in order to eliminate the above-mentioned problem that high-density mounting on a substrate cannot be satisfied. Aim.
[0010]
[Means for Solving the Problems]
The following is a brief description of an outline of typical inventions disclosed in the present application.
[0011]
That is, the semiconductor device of the present invention includes a semiconductor element (7), with a member (9) for supporting the semiconductor device (7), on the surface, a bottom surface (18) and side (19) recesses with a (16) has the semiconductor element (7) and said member (9) covering the sealing resin (13), so as to expose from said sealing resin (13) at said bottom surface (18) of the recess (16) And a plurality of terminals (15) formed on the semiconductor element (7) via the member (9), and the plurality of terminals (15) are electrically connected to the semiconductor element (7) through the member (9). Each of the plurality of terminals (15) provided on the bottom surface (18) of (16) is provided at a predetermined distance from the side surface (19) of the concave portion (16).
[0012]
According to the above means, it is possible to provide a semiconductor device that can satisfy high-density mounting on a substrate.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In all the drawings for describing the embodiments of the present invention, components having the same functions are given the same reference numerals, and their repeated description will be omitted.
[0014]
1 and 2 are diagrams related to a semiconductor device according to an embodiment of the present invention. FIG. 1 shows a structure of a semiconductor device according to an embodiment of the present invention, and FIG. 2 is a partially cutaway side view when the semiconductor device of the embodiment of the present invention is mounted on a substrate.
[0015]
The semiconductor device according to the embodiment of the present invention includes a semiconductor element 7, a die pad 8 for fixing the semiconductor device 7, a conductor 10 on one surface, and a conductor 11 on the other surface. An insulating plate 9 connected to the conductor 11 by a through hole 12; a resin mold 13; a thin metal wire 14 connecting the electrode of the semiconductor element 7 to the conductor 10; one end connected to the conductor 11; And the input / output terminals 15 arranged in the recess 16 on the lower surface of the housing.
[0016]
When the semiconductor device having this configuration is mounted on the substrate 3, the input / output terminals 15 are provided in the recess 16 on the lower surface of the housing as shown in FIG. (Not shown).
[0017]
As described above, the entire area of the concave portion 16 provided on the lower surface of the housing of the semiconductor element can be used as an input / output terminal, and high-density mounting on a substrate can be performed.
[0018]
Although the invention made by the inventor has been specifically described based on the embodiments, the present invention is not limited to the above-described embodiments, and may be variously modified without departing from the gist thereof. Needless to say.
[0019]
In particular, in the above-described embodiment, the case where the input / output terminals are provided on the lower surface of the housing of the semiconductor device is described. However, the present invention is not limited to this, and the input / output terminals may be provided on the upper surface of the housing. .
[0020]
【The invention's effect】
The effects obtained by the representative inventions among the inventions disclosed in the present application will be briefly described as follows.
[0021]
According to the semiconductor device of the present invention, since the plurality of terminals as input / output terminals are provided on the upper surface or the lower surface of the sealing resin as the housing of the semiconductor device, the mounting density on the substrate can be increased. . Furthermore, the following effects can be expected by providing each of the plurality of terminals at a predetermined distance from the side surface of the concave portion of the sealing resin.
(1) Intrusion of moisture can be suppressed by the side surface portion of the concave portion, and the corrosion of the plurality of terminals provided on the bottom surface in the mounted state by moisture is reduced without impairing the degree of freedom of layout for the plurality of terminals. be able to.
(2) When mounting the mounting board, it is possible to absorb the stress due to the difference in the coefficient of thermal expansion between the package and the mounting board by the distance between the terminal and the resin, thereby reducing the possibility of the terminal being damaged by the thermal expansion. It becomes possible to reduce.
(3) When the layout of a plurality of terminals is changed with an increase in the number of terminals, the layout is performed on the bottom surface of the concave portion, so that the entire shape and size of the sealing resin do not change before and after the layout change. In addition, even when resin sealing is performed using a common mold, a free layout for terminals can be realized.
(4) Since a plurality of terminals are exposed in the bottom surface of the concave portion, it is not necessary to provide a through-hole in the board to be mounted.
(5) The electrical connection between the semiconductor device and the substrate to be mounted (for example, the portion electrically connected by the bonding material 17 in FIG. 2) is formed by forming a recess in the sealing resin. The side surface can prevent an external impact from being directly applied to the electrical connection portion, and can stably maintain the electrical connection state at the time of mounting.
[Brief description of the drawings]
FIG. 1 is a sectional view showing a semiconductor device according to an embodiment of the present invention.
FIG. 2 is a partially broken side view showing a case where the semiconductor device of FIG. 1 is mounted on a substrate.
FIG. 3 is a perspective view showing a conventional DIP type semiconductor device.
FIG. 4 is a side view showing a case where the semiconductor device of FIG. 3 is mounted on a substrate.
FIG. 5 is a perspective view showing a conventional QFP type semiconductor device.
FIG. 6 is a side view showing a case where the semiconductor device of FIG. 5 is mounted on a substrate.
[Explanation of symbols]
7 semiconductor element 8 die pad 9 insulating plate 10, 11 conductor 12 through hole 13 resin mold 15 input / output terminal
16 recesses
18 bottom
19 sides

Claims (2)

A semiconductor element;
A member for supporting the semiconductor element,
On the surface, having a recess having a bottom surface and side surfaces, a sealing resin covering the semiconductor element and the member,
A plurality of terminals formed so as to be exposed from the sealing resin at the bottom surface of the concave portion ,
Each of the plurality of terminals is electrically connected to the semiconductor element via the member, and each of the plurality of terminals provided on the bottom surface of the recess is provided at a predetermined distance from the side surface of the recess. A semiconductor device. The semiconductor device according to claim 1 Symbol mounting a semiconductor device, characterized in that said semiconductor element and said member are electrically connected by a metal thin wire.

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