JPH113955A - Semiconductor chip mounting board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip mounting board which can facilitate bonding of semiconductor chip for its mounting thereon. SOLUTION: In the chip mounting board, a semiconductor chip 30 is mounted on one or both sides of a substrate 22 and a plurality of external connection terminals are formed as arranged at one end edge side of the substrate 22. In this case bonded one surface of the substrate 22 is one end side of a wiring pattern film 24 which has a wiring pattern formed on a surface of an electrically insulating base film, the other end of the pattern film 24 is folded back along an outer surface of an elastomer 28 formed at one end edge of the substrate 22 and then bonded onto the other surface of the substrate 22, whereby the wiring pattern at the folded-back area of the pattern film 24 is formed on an external connection terminal 24c.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor chip mounting board in which a semiconductor chip or a semiconductor device is mounted on a board such as a memory board.

[0002]

2. Description of the Related Art FIG. 7 shows a general shape of a memory board called a SIMM or a DIMM. This memory board has devices 12 mounted on one or both sides of a substrate 10 and external connection terminals 14 arranged in parallel along one edge of the substrate. The memory board is used by being appropriately mounted on a motherboard or the like according to the addition of a RAM of a computer or the like. Conventionally, a socket is used for mounting a memory board, and the connection terminal is electrically connected to a contact of the socket by inserting an edge provided with a connection terminal of the memory board into the socket. .

[0003]

As described above, since the conventional memory board employs a system in which the board 10 is inserted into a socket and mounted, a socket is required as a structure of a connecting portion, which leads to a problem that the cost is increased. . In addition, since a printed board is used as the substrate 10 of the memory board, it is difficult to form a wiring pattern with high density, and it is difficult to adopt a semiconductor chip mounting method such as flip chip connection. Further, the device in which the semiconductor chip is sealed is mounted on the substrate 10.
However, there is a problem that the wiring is long and disadvantageous in terms of high-frequency characteristics due to the method of mounting on a semiconductor chip, and a separate heat spreader is required to dissipate heat generated in the semiconductor chip.

The present invention relates to a configuration of a semiconductor chip mounting board such as a memory board in which connection terminals for mounting are arranged along an edge of a substrate, and enables mounting without using sockets. It is an object of the present invention to provide a semiconductor chip mounting board having excellent electrical characteristics by forming wirings at high density.

[0005]

The present invention has the following arrangement to achieve the above object. That is, in a semiconductor chip mounting board in which a semiconductor chip is mounted on one or both surfaces of a substrate, and a plurality of external connection terminals are arranged on one edge side of the substrate, one surface of the substrate has an electrically insulating property. One end of a wiring pattern film having a wiring pattern formed thereon is adhered to the surface of a base film having the same, and the other end of the wiring pattern film is folded along the outer surface of the elastomer formed on one edge of the substrate. And bonding to the other surface of the substrate, and a wiring pattern at a folded portion of the wiring pattern film is formed on an external connection terminal. Also, a wiring pattern film is adhered to a folded portion of one surface of the substrate and one edge of the substrate, and the other surface of the substrate is exposed. Further, the semiconductor chip and the wiring pattern are electrically connected via bonding wires. Further, the semiconductor chip is sealed with a resin by potting. Further, the semiconductor chip and the wiring pattern are flip-chip connected and electrically connected. Further, a concave portion is provided in a portion of the substrate corresponding to a region where the semiconductor chip is mounted, and the concave portion is filled with an elastomer. Further, a through hole is provided in a portion of the substrate corresponding to a region where the semiconductor chip is mounted, and the through hole is filled with an elastomer. Further, the substrate is a metal plate or a ceramic plate. Further, the external connection terminal is plated with hard gold.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a semiconductor chip mounting board according to the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a front view showing a configuration of a first embodiment of a semiconductor chip mounting board 20, and FIG. 2 is a side sectional view. 1 and 2 show a state in which the semiconductor chip mounting board 20 is mounted on the mounting board 16, and FIG. 1 shows the semiconductor chip 30 as seen through from the front for the sake of explanation.

The semiconductor chip mounting board 20 of the present embodiment
The substrate 22 supporting the semiconductor chip 30 is formed using a material having good thermal conductivity such as copper, aluminum, and aluminum nitride. This is because the substrate 22 also functions as a heat spreader to dissipate heat from the semiconductor chip 30 mounted on the substrate 22. The heat generated from the semiconductor chip for memory is usually not so large. However, there is a possibility that products that generate a large amount of heat will be used in the future even for semiconductor chips for memory. It is effective to use a high substrate 22.

In order to mount the semiconductor chip 30 on the substrate 22, in the present embodiment, a wiring pattern film 24 is adhered to substantially the entire surface on one surface of the substrate 22, and the wiring pattern film 24 is bonded from one edge of the substrate 22. The end portion is extended, the extended portion is folded back to the other surface side of the substrate 22, and the folded portion is adhered to the substrate 22 and supported. 26 is an adhesive for bonding the wiring pattern film 24 to the substrate 22. The wiring pattern film 24 is formed by forming a wiring pattern 24b on the surface of an electrically insulating base film 24a such as a polyimide film.

External connection terminals 24c are formed on the wiring pattern 24b so as to make contact with the connection pads 18 formed on the surface of the mounting board 16 when the semiconductor chip mounting board 20 is mounted on the mounting board 16. As shown in FIG.
The external connection terminal 24c is connected to the semiconductor chip mounting board 20.
And are formed side by side along the edge pressed against the mounting board 16. The arrangement intervals of these external connection terminals 24 c are provided so as to match the arrangement intervals of the connection pads 18.

The external connection terminal 24c is formed so as to pass through a portion folded at the edge of the substrate 22, and as shown in FIG. 2, the external connection terminal 2c provided on the outer surface of the folded portion.
4c is formed so as to be pressed against the connection pad 18 formed on the mounting board 16. In the semiconductor chip mounting board 20 of the embodiment, a flexible elastomer 28 is filled between the end face 22a of the substrate 22 and the back surface of the wiring pattern film 24, and the wiring pattern film 24 is bonded via the elastomer 28.

The elastomer 28 fills the gap between the end surface of the substrate 22 and the back surface of the wiring pattern film 24 so that the wiring pattern film 24 is smoothly folded back. The external connection terminal 24c
Is formed so as to protrude outward from the end face of the substrate 22. As described above, by projecting the external connection terminals 24c outward from the end surface 22a of the substrate 22, the external connection terminals 24c are securely pressed against the connection pads 18 when the semiconductor chip mounting board 20 is mounted on the mounting board 16. Electrical connection between the external connection terminal 24c and the connection pad 18 is ensured.

The wiring pattern 24b provided on the wiring pattern film 24 protrudes from the surface of the base film by the thickness of the conductor layer (copper foil). Therefore, the external connection terminal 24c abuts on the connection pad 18 simply by aligning and pressing the semiconductor chip mounting board 20 with the mounting board 16. The elastomer 28 is the semiconductor chip mounting board 20
The substrate 2 is pressed by a pressing force when the substrate 2 is mounted on the mounting board 16.
The external connection terminal 24c which protrudes in an arc shape in a side surface shape from the end face 2 is slightly flattened so that the external connection terminal 24c reliably presses the connection pad 18 against the connection pad 18. Even if there is a variation in the height of the external connection terminals 24c or the connection pads 18, the buffering action of the elastomer 28 absorbs these variations to enable reliable connection. Further, even when the semiconductor chip mounting board 20 is detached from the mounting board 16 and re-attached several times, required durability is maintained so that the external connection terminals 24c and the connection pads 18 are securely pressed against each other. Has an action.

The wiring pattern 24b formed on the wiring pattern film 24 includes the above-mentioned external connection terminals 24c, and wiring wiring 24d for connection between the external connection terminals 24c and the semiconductor chip 30. In the present embodiment, since the semiconductor chip 30 and the wiring pattern 24d are connected by wire bonding, a bonding portion is formed at an end of the wiring pattern 24d. Reference numeral 32 denotes a bonding wire that connects the bonding portion and the semiconductor chip 30. The semiconductor chip 30 is mounted on the wiring pattern film 24 by bonding with a conductive resin or the like. The wire bonding connection between the semiconductor chip 30 and the bonding portion is performed by a normal wire bonding method.

After the semiconductor chip 30 and the wiring pattern 24d are wire-bonded, the semiconductor chip 30 and the wire-bonded portion are resin-sealed. Although the resin sealing method is not particularly limited, in the present embodiment, a potting method is used. 34 is a potting resin. When performing resin sealing, the external connection terminals 24c may not be covered. In this manner, the semiconductor chip 30 and the external connection terminals 24c are electrically connected via the wiring patterns 24b, and the semiconductor chip mounting board 20 mounted upright on the mounting board 16 is obtained.

As a method of mounting the semiconductor chip 30, there are a method of bonding the semiconductor chip 30 to the wiring pattern film 24 as in the above example and a method of mounting the semiconductor chip 30 directly on the substrate 22. When there is no restriction on the potential when the semiconductor chip 30 is mounted, or when the back potential of the semiconductor chip 30 is positively set to the ground potential, the semiconductor chip 30 is preferably mounted directly on the substrate 22. By directly bonding the semiconductor chip 30 to the substrate 22, heat dissipation from the semiconductor chip 30 can be improved.

When assembling the substrate 22 and the wiring pattern film 24, the wiring pattern film 24 on which the semiconductor chip 30 is mounted and resin-sealed may be bonded to the substrate 22, or the wiring pattern film 24 may be attached to the substrate 22. After bonding, the semiconductor chip 30 may be mounted and resin-sealed. Semiconductor chip 30 directly on substrate 22
In the case of mounting, follow the latter method.

The elastomer 28 filled between the end face 22a of the substrate 22 and the wiring pattern film 24 can be filled when the wiring pattern film 24 is bonded to the substrate 22. A slit for filling the elastomer 28 is provided in advance in the substrate in accordance with the position of the end face of the substrate 22, and the elastomer 28 is filled in the slit and solidified.
It is efficient to cut out to two.

The wiring pattern film 24 used in the semiconductor chip mounting board 20 can be manufactured by a method similar to a method of manufacturing a TAB tape or the like. That is,
A wiring having a wiring pattern 24b is obtained by using a single-sided copper-clad film in which a copper foil is applied as a conductor layer on one surface of a base film such as a polyimide film and etching the copper foil of the copper-clad film into a predetermined pattern. The pattern film 24 is obtained.

The outer surfaces of the external connection terminals 24c formed on the wiring pattern film 24 are preferably plated with hard gold for protection. This is to maintain the stability of the coating at the connection portion and to ensure the electrical connection even when the semiconductor chip mounting board 20 is removed and re-attached several times. The wiring pattern film 24 has an advantage that the wiring pattern 24b can be easily formed at a very high density due to the manufacturing method, and the semiconductor chip mounting board 20 on which the multi-pin semiconductor chip 30 is mounted can be easily manufactured.

In the above-described embodiment, the wiring pattern film 24 adhered to the substrate 22 has a configuration in which the wiring pattern 24b is provided only on the surface exposed to the outside, but the wiring pattern 24b is provided on both surfaces of the base film. It is also possible to use the wiring pattern film 24 provided. That is, the wiring patterns 24 are formed on both sides of the base film.
b, and a wiring pattern film 24 in which a wiring pattern 24b between both surfaces is electrically connected by a via or the like may be used. In this case, the wiring pattern 24b is also located on the side of the wiring pattern film 24 that is in contact with the substrate 22, so that the wiring pattern 24b and the substrate 22 are electrically insulated by the adhesive 26 or electrically insulative as the substrate 22. You just have to use something. When the substrate 22 is used as a common ground potential, the wiring pattern 24b
It does not matter that the substrate and the substrate 22 are electrically connected.

In the semiconductor chip mounting board 20 shown in FIGS. 1 and 2, the semiconductor chip 30 is mounted only on one surface of the substrate 20, and the other surface of the substrate 20 is exposed to the outside. By exposing the other surface of the substrate 22 in this manner, the semiconductor chip mounting board 20 is a product having extremely excellent heat dissipation.

As shown in FIG. 3, it is of course possible to mount the semiconductor chips 30 on both sides of the substrate 22. When the semiconductor chips 30 are mounted on both sides as described above, there is an advantage that the mounting efficiency of the semiconductor chips 30 can be improved. Since the semiconductor chip 30 is mounted on the semiconductor chip mounting board 20 of the present embodiment using the wiring pattern film 24, the mounting of the plurality of semiconductor chips 30 allows the wiring pattern 24 to be mounted.
Even when b has a complicated pattern, it can be easily manufactured.

In FIG. 1, reference numeral 40 denotes a semiconductor chip mounting board 20.
Is a clip jig for mounting on the mounting board 16. On the side surface of the substrate 22, an engagement recess 23 is provided in which the claw of the clip jig 40 is engaged. The clip jig 40 has a spring property, and the semiconductor chip mounting board 20 is mounted on the mounting board 1.
6 and the semiconductor chip mounting board 20
The semiconductor chip mounting board 20 is mounted on the mounting board 16
Can be attached to

FIGS. 4, 5, and 6 show a semiconductor chip mounting board 20 on which a semiconductor chip 30 is mounted by a flip chip method.
An embodiment will be described. When the semiconductor chip 30 is mounted by the flip chip method, the wiring pattern 24b is formed by being drawn into the mounting area of the semiconductor chip 30. The configuration in which a metal or the like having good heat conductivity is used as the substrate 22 and the configuration in which the wiring pattern film 24 is bonded to the substrate 22 are exactly the same as those in the above embodiment. After the semiconductor chip 30 is flip-chip connected, the joining surface between the semiconductor chip 30 and the wiring pattern film 24 is sealed with a sealing resin 36.

In the embodiment shown in FIG. 4, a semiconductor chip 30 is mounted by simply bonding a wiring pattern film 24 to the surface of a substrate 22. In the embodiment shown in FIG. 5, a concave portion 22b is provided in the substrate 22 corresponding to the region where the semiconductor chip 30 is mounted, and the concave portion 22b is filled with an elastomer 38. The embodiment shown in FIG.
A through-hole 22c is provided in the substrate 22 corresponding to the area where 0 is mounted, and the through-hole 22c is filled with the elastomer 38.

The embodiment shown in FIGS. 4 and 5 is a case where a large semiconductor chip 30 is mounted.
This is a configuration suitable for a case where the difference in thermal expansion coefficient between the semiconductor chip 30 and the metal plate used for the substrate 22 is large and excessive thermal stress acts on the semiconductor chip 30 when the semiconductor chip 30 is mounted on the substrate 22. . Since the elastomer 38 has flexibility, the semiconductor 22 is filled by filling the substrate 22 with the elastomer 38 in the same or slightly larger area as the mounting area of the semiconductor chip 30 and supporting the semiconductor chip 30 via the elastomer 38. The thermal stress acting on the chip 30 can be reduced.

Also in the case of this embodiment, when the substrate 22 is filled with the elastomer 38, the concave portion 22b or the through hole 22c is provided at the stage of the large-sized substrate in accordance with the position of the substrate 22, and the concave portion 22b or the through hole 22c is provided. After filling and solidifying the elastomer 38 in the substrate 22c, the individual substrates 2
By cutting into two, the substrate 22 can be efficiently created. In the embodiments shown in FIGS. 4, 5 and 6, the semiconductor chip 30 is mounted on only one surface of the substrate 22, but the semiconductor chip 30 is connected to both surfaces of the substrate 22 by flip-chip connection in the same manner as shown in FIG. It is also possible to mount it.

[0028]

As described above, in the semiconductor chip mounting board according to the present invention, the wiring pattern film is folded at one edge of the substrate, and the wiring pattern at the folded portion of the wiring pattern film is formed on the external connection terminal. Accordingly, the semiconductor chip mounting board can be mounted simply by pressing the mounting board against the mounting board, and the semiconductor chip mounting board can be easily mounted without using a socket or the like. Further, it is possible to easily manufacture a semiconductor chip mounting board having a high-density wiring pattern, and it is possible to suitably cope with high integration and the like. Further, by using a metal plate or a ceramic plate for the substrate, it is possible to provide a semiconductor chip mounting board having an excellent heat dissipation property.

[Brief description of the drawings]

FIG. 1 is a front view of a state where a semiconductor chip mounting board according to the present invention is mounted on a mounting board.

FIG. 2 is a side sectional view showing a state where the semiconductor chip mounting board according to the present invention is mounted on a mounting board.

FIG. 3 is a side sectional view of an embodiment in which semiconductor chips are mounted on both surfaces of a substrate.

FIG. 4 is a side sectional view showing an embodiment of a semiconductor chip mounting board on which semiconductor chips are mounted by a flip chip method.

FIG. 5 is a side sectional view showing another embodiment of a semiconductor chip mounting board on which a semiconductor chip is mounted by a flip chip method.

FIG. 6 is a side sectional view showing still another embodiment of a semiconductor chip mounting board on which a semiconductor chip is mounted by a flip chip method.

FIG. 7 is a perspective view of a conventionally used memory board.

[Explanation of symbols]

 14 external connection terminal 16 mounting board 18 connection pad 20 semiconductor chip mounting board 22 substrate 22a end face 22b recess 22c through hole 23 engagement recess 24 wiring pattern film 24a base film 24b wiring pattern 24c external connection terminal 24d wiring pattern 26 adhesive 28 Elastomer 30 Semiconductor chip 32 Bonding wire 34 Sealing resin 36 Sealing resin 38 Elastomer

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification symbol FI H01L 23/12 H (72) Inventor Takehiko Arai 711 Kurita, Shata, Nagano City, Nagano Prefecture Inside Shinko Electric Industries Co., Ltd.

Claims (9)

[Claims] 1. A semiconductor chip mounting board in which a semiconductor chip is mounted on one or both surfaces of a substrate, and a plurality of external connection terminals are formed side by side on one edge side of the substrate. One end of a wiring pattern film in which a wiring pattern is formed is adhered to the surface of a base film having electrical insulation, and the other end of the wiring pattern film is attached to the outer surface of an elastomer formed on one edge of the substrate. A semiconductor chip mounting board, wherein the wiring pattern is folded back and adhered to the other surface of the substrate, and a wiring pattern of a folded portion of the wiring pattern film is formed on an external connection terminal. 2. The substrate according to claim 1, wherein a wiring pattern film is adhered to one surface of the substrate and a folded portion of one edge of the substrate, and the other surface of the substrate is exposed. Semiconductor chip mounting board. 3. The semiconductor chip mounting board according to claim 1, wherein said semiconductor chip and said wiring pattern are electrically connected via bonding wires. 4. The semiconductor chip mounting board according to claim 3, wherein said semiconductor chip is resin-sealed by potting. 5. The semiconductor chip mounting board according to claim 1, wherein said semiconductor chip and said wiring pattern are flip-chip connected and electrically connected. 6. The semiconductor chip mounting board according to claim 5, wherein a concave portion is provided in a portion of the substrate corresponding to a region where the semiconductor chip is mounted, and the concave portion is filled with an elastomer. 7. The semiconductor chip mounting board according to claim 5, wherein a through hole is provided in a portion of the substrate corresponding to a region where the semiconductor chip is mounted, and the through hole is filled with an elastomer. 8. The semiconductor chip mounting board according to claim 1, wherein said substrate is a metal plate or a ceramic plate. 9. The external connection terminal according to claim 1, wherein hard gold plating is applied to the external connection terminal.
9. The semiconductor chip mounting board according to 7 or 8.