JP2936845B2 - Integrated circuit mounting structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for mounting an integrated circuit on a substrate.

[0002]

2. Description of the Related Art Conventionally, as a mounting structure of an integrated circuit, FIG.
And FIG. 9 are known.

FIG. 8 is a cross-sectional view of an example of a conventional integrated circuit mounting structure. As shown in FIG.
After the electrodes are mounted on the leads 54 and the electrodes of the integrated circuit 52 and the leads 54 are connected by wire bonding, the integrated circuit package 5 is formed by transfer molding with a resin 53.
It becomes 5. Then, the substrate 51 of the integrated circuit package 55
Is mounted by soldering at the leads 54.

FIG. 9 is a cross-sectional view of another example of a conventional integrated circuit mounting structure. As shown in FIG.
Is soldered with a socket lead 71 of a socket 70. An integrated circuit package 65 similar to that shown in FIG. 8 is mounted on the substrate 61 by inserting the leads 64 into the socket 70.

[0005]

However, of the above-mentioned prior arts, in which the integrated circuit package is directly soldered to the substrate, the heat for melting the solder when the integrated circuit package is attached to or detached from the substrate. Need to be added. For this reason, there is a problem that the integrated circuit and the substrate are adversely affected depending on the heating conditions, and the integrated circuit may be broken in the worst case.

Further, in the case of mounting using an socket, mounting the integrated circuit package on the substrate simply involves inserting the leads into the socket. Therefore, the integrated circuit package must be attached and detached without worrying about thermal destruction of the integrated circuit. However, the mounting height of the integrated circuit package is increased by the socket. For this reason, if the components mounted on the board are cooled by a fan, the components mounted on the leeward side of the socket will not be cooled sufficiently because the flow of air by the fan will be poor and will not be cooled sufficiently. However, there is a problem that the reliability may decrease. This problem is particularly remarkable when components having a large amount of heat are mounted at high density.

An object of the present invention is to provide an integrated circuit mounting structure that does not use solder when mounting and removing the integrated circuit on and from a substrate, and that does not increase the mounting height.

[0008]

According to the present invention, there is provided an integrated circuit having an electrode on a circuit surface, and a wiring pattern having terminals at both ends provided from one end to the other end of one surface. A terminal at one end of the pattern is connected to an electrode of the integrated circuit, a wiring tape electrically connected with the one surface facing the non-circuit surface, and the other end of the wiring tape is inserted into one surface. And a substrate on which a non-circuit surface of the integrated circuit is detachably fixed, and a terminal on the bottom surface of the groove and a terminal at the other end of the wiring tape inserted into the groove. A board-side external terminal provided at a portion, a portion excluding the other end portion of the wiring tape and a space not in contact with the integrated circuit are formed, which are arranged to face one surface of the substrate, Wiring on the surface facing the substrate And the other end portion of the tape has a pressing member abutting, and a fixing means for pressing and fixing the pressing member to the substrate.

An integrated circuit having electrodes on a circuit surface;
Wiring tapes whose both ends are terminals are provided from one end to the other end of both surfaces, and each terminal at one end of each wiring pattern is electrically connected to an electrode of the integrated circuit. A groove into which the other end of the wiring tape is inserted, and a substrate to which the non-circuit surface of the integrated circuit is detachably fixed; and a bottom surface of the groove for wiring inserted into the groove. A board-side external terminal provided at a portion facing the terminal at the other end of one surface of the tape, and a board-side connection terminal provided on one surface of the board and corresponding to a terminal on the other surface of the wiring tape, A portion of the wiring tape excluding the other end and a space not in contact with the integrated circuit are formed facing the one surface of the substrate, and the wiring tape is formed on a surface facing the substrate. The other end of A pressing member, a pressing member-side external terminal provided at a portion of the surface of the pressing member facing the substrate opposite to a terminal at the other end of the other surface of the wiring tape; and A holding member-side connection terminal electrically connected to the holding member-side external terminal, provided on a surface facing the substrate and facing the board-side connection terminal; and pressing and fixing the holding member to the substrate. And fixing means for causing the fixing means to be fixed.

Further, an integrated circuit having an electrode on a circuit surface and a wiring pattern having terminals at both ends are provided from one end to the other end of one surface, and a terminal at one end of the wiring pattern is connected to an electrode of the integrated circuit. A wiring tape electrically connected with the one surface facing the circuit side, a substrate having a groove formed on one surface into which the other end of the wiring tape is inserted, and a bottom surface of the groove, A board-side external terminal provided at a portion facing the terminal at the other end of the wiring tape inserted into the groove portion, and is disposed so as to face one surface of the substrate, and the surface facing the substrate has the A portion excluding the other end of the wiring tape and a concave portion in which the integrated circuit is stored are formed, and a non-circuit surface of the integrated circuit is fixed to a bottom surface of the concave portion, and a surface facing the substrate. To the wiring tape A pressing member having an end abutting thereon, and a fixing device for fixing the pressing member to the substrate by pressing, and the concave portion has a hole formed in the pressing member and the pressing member, It may be formed by a heat sink integrally provided so as to close the hole.

[0011]

According to the first aspect of the present invention, the integrated circuit to which the wiring tape is connected is detachably fixed to one surface of the substrate, and the other end of the wiring tape is connected to the substrate. It is inserted into the groove. In this state, the pressing member having a portion excluding the other end portion of the wiring tape and a void that does not contact the integrated circuit is disposed facing one surface of the substrate, and the pressing member is fixed by the fixing means. When pressed and fixed to the substrate, the terminal at the other end of the wiring tape is pressed by the substrate-side external terminal provided in the groove of the substrate. As a result, the electrical connection between the integrated circuit and the substrate is made without using solder.

[0012]

Next, the mounting structure of the integrated circuit of the present invention will be described with reference to the drawings.

(First Embodiment) FIG. 1 is a sectional view of a first embodiment of a mounting structure of an integrated circuit according to the present invention. As shown in FIG. 1, an integrated circuit 2 is provided on a first substrate 1 with an adhesive layer 4 interposed therebetween.
Is provided, and the circuit surface 2a of the integrated circuit 2 is directed upward in the figure. The adhesive layer 4 is for fixing the integrated circuit 2 to the first substrate 1, but has a weak adhesive force.
The integrated circuit 2 is detachable from the first substrate 1 as needed. The integrated circuit 2 has a circuit surface 2a.
The wiring tape 3 is electrically connected in advance to a plurality of electrodes (not shown) arranged in parallel at the right end and the left end, respectively. As shown in FIG. 2, the wiring tape 3 is provided with a wiring pattern 3b corresponding to each of the electrodes on one surface of an insulating tape 3a having elasticity, and a portion excluding both ends thereof is covered with an insulating film 3c. Things.
One end of the wiring pattern 3b is connected to the integrated circuit side terminal 3d.
Are connected to the respective electrodes of the integrated circuit 2. Also,
The other end of the wiring pattern 3b is a substrate-side terminal 3e, which is electrically connected to a pad described later.

On the other hand, as shown in FIG.
On the surface to which the integrated circuit 2 is fixed, two grooves 1a are formed along the direction in which the electrodes are arranged. The depth of each groove 1a is smaller than the thickness of the wiring tape 3, and each groove 1a has a substrate-side terminal 3e of the wiring tape 3 respectively.
(See FIG. 2) is inserted. As shown in the enlarged cross-sectional view of FIG. 3, a pad 1b as a substrate-side external terminal is provided on the bottom surface of the groove 1a so as to face the substrate-side terminal 3e.

Further, on the surface of the first substrate 1 to which the integrated circuit 2 is fixed, there is disposed a pressing member 5 having a uniformly flat lower surface. The holding member 5 is formed with a hole 5a as a void at a portion facing the portion of the integrated circuit 2 and the wiring tape 3 except for the substrate-side terminal 3e.
Is fixed to the first substrate 1 by bolts 6 and nuts 7 as fixing means. When the holding member 5 is tightened to the first substrate 1 with the bolts 6 and the nuts 7, the board-side terminals 3 e of the wiring tape 3 are connected to the first substrate 1 and the holding member 5.
And the substrate-side terminals 3e of the wiring tape 3 are fixed by the pressing members 5 and pressed against the pads 1b of the first substrate 1 to electrically connect the integrated circuit 2 to the first substrate 1. Is made.

With the above configuration, the integrated circuit 2
And the first substrate 1 are connected without using solder.
When the nut 7 is loosened and the pressing of the wiring tape 3 against the first substrate 1 by the pressing member 5 is released, the integrated circuit 2 is released.
Can be removed together with the wiring tape 3 simply by peeling it off from the adhesive layer 4, which facilitates replacement of the integrated circuit 2. Furthermore, since the mounting height can be reduced as compared with the mounting using a conventional socket, when cooling the components mounted on the board with a fan, the air generated by the fan on the leeward side of the integrated circuit 2 is also used. The flow is not impaired, and the adverse effects of cooling on surrounding components are reduced.

(Second Embodiment) FIG. 4 is a sectional view of a main part of a second embodiment of the integrated circuit mounting structure of the present invention.
FIG. 5 is a plan view and a cross-sectional view of the wiring tape illustrated in FIG. 4. As shown in FIGS. 4 and 5, in the present embodiment, the integrated circuit 12 in which the integrated circuit side terminal 13 d of the wiring tape 13 is connected to the circuit surface 12 a is attached to the first substrate 11 via the adhesive layer 14. The substrate side terminal 13e of the wiring tape 13 is detachably provided, and the pad 11 provided on the first substrate 11
b to make electrical connection between the integrated circuit 12 and the first substrate 11 in the same manner as in the first embodiment, but the following points are different from those in the first embodiment. Is different.

(1) As shown in FIG. 5, the wiring tape 13 has the same wiring pattern 13b as that of the first embodiment.
Further, the insulating film 13c is provided on both surfaces of the insulating tape 13a, and the integrated circuit terminal 13d and the substrate terminal 13e are provided on both surfaces of the wiring tape 13, respectively.

(2) Holding member 5 (see FIGS. 1 and 3)
Instead, a second substrate 15 having the same shape as the holding member 5 is used. On a surface of the second substrate 15 facing the first substrate 11 and facing the substrate-side terminal 13e on the second substrate 15, a pad 1 as a pressing member-side external terminal is provided.
5b is provided.

(3) First substrate 11 and second substrate 1
5 are provided with connection pads 11c and 15c as board-side connection terminals and holding member-side connection terminals, respectively. The connection pads 15c provided on the second substrate 15 are independently and electrically connected to the pads 15b provided on the second substrate 15, respectively. As a result, the connection pads 11c provided on the first substrate 11 and the connection pads 15c provided on the second substrate 15 come into contact with each other. , The substrate-side terminal 13 e facing the second substrate 15 is connected to the first terminal 13 via the second substrate 15.
Electrically connected to the substrate 11.

Based on the configuration described above, the second substrate 1
The electrical connection between the integrated circuit 12 and the first substrate 11 is made by fixing the first substrate 11 to the first substrate 11 in a pressed state. Also, by providing the wiring patterns 13b on both sides of the wiring tape 13 and connecting one of the wiring patterns 13b to the first substrate 11 via the second substrate 15,
Twice the number of terminals can be accommodated by wiring patterns having the same pitch.

(Third Embodiment) FIG. 6 is a sectional view of a third embodiment of the integrated circuit mounting structure of the present invention. In the integrated circuit 22 used in this embodiment, the same wiring tape 23 as that used in the first embodiment is electrically connected with the wiring pattern directed toward the circuit surface 22a (the lower surface in the drawing). It is a thing. The pressing member 25 has a concave portion 25a having a shape similar to that of the hole 5a (see FIGS. 1 and 3) formed in the pressing member used in the first embodiment on a surface facing the first substrate 21. The metal plating layer 28 is formed on the bottom surface of the concave portion 25a. The non-circuit surface of the integrated circuit 22 is fixed to the bottom surface of the concave portion 25a via the adhesive layer 24. It is preferable that the adhesive layer 24 has good thermal conductivity. For other configurations,
Since the configuration may be the same as that of the first embodiment, the description is omitted.

Based on the configuration described above, the integrated circuit 22
Is fixed to the first base 32 so that the substrate-side terminal of the wiring tape 23 is inserted into the groove 21a.
When the first substrate 21 and the holding member 25 are tightened by the bolts 26 and the nuts 27, the holding member 25 causes the board-side terminals of the wiring tape 23 to be connected to the pads ( (Not shown). Thus, the integrated circuit 22 is electrically connected to the first substrate 21.

When replacing the integrated circuit 22, the bolt 26 and the nut 27 are loosened and the holding member 25 is removed, so that the integrated circuit 22 is replaced together with the holding member 25.

As described above, the integrated circuit 22 is held by the holding member 25.
Is fixed to the recess 25a, the heat of the integrated circuit 22 easily escapes through the holding member 25, the heat dissipation of the integrated circuit 22 is improved, and the integrated circuit 22
5 and the handling of the integrated circuit 22 is facilitated.

In this embodiment, the integrated circuit 22 is
5, the integrated circuit 22 is not completely fixed, as in the first and second embodiments, and only the integrated circuit 22 with the integrated wiring tape 23 is fixed. May be exchangeable.

(Fourth Embodiment) FIG. 7 is a sectional view of a fourth embodiment of the integrated circuit mounting structure of the present invention. As shown in FIG. 7, a hole 35a is formed in the holding member 35,
A heat sink 39 is provided on the surface of the pressing member 35 opposite to the surface facing the first substrate 31 so as to close the hole 35a. Then, the integrated circuit 32 is connected to the heat sink 3.
9 is fixed via a bonding layer 34 to a portion that becomes the bottom surface of the concave portion formed by closing the hole 35a. The other configuration may be the same as that of the third embodiment, and a description thereof will be omitted.

By fixing the integrated circuit 32 to the heat sink 39 as in the present embodiment, the heat dissipation of the integrated circuit 32 is improved more than that of the third embodiment.

In each of the embodiments described above, examples using bolts and nuts as the fixing means have been described. However, the present invention is not limited to this, and clips and other means may be used.

[0030]

Since the present invention is configured as described above, the following effects can be obtained.

According to the first aspect of the present invention, since the substrate to which the integrated circuit to which the wiring tape is connected is fixed, and the holding member, the terminal at the other end of the wiring tape is held by the holding member. Since the integrated circuit is pressed by the external terminal on the substrate side, electrical connection between the integrated circuit and the substrate is made without using solder, and it is possible to eliminate adverse effects on the integrated circuit due to heat when attaching and detaching the integrated circuit. Further, since the integrated circuit is detachably fixed to the substrate, the integrated circuit can be easily attached and detached. Furthermore, since the mounting height of the integrated circuit can be reduced as compared with mounting using a conventional socket, adverse effects on cooling of surrounding components can be reduced.

According to the second aspect of the present invention, the wiring pattern is provided on both sides of the wiring tape, and the terminals on the other side of the wiring tape are connected to the substrate via the pressing member, so that the wiring with the same pitch is provided. Twice the number of terminals can be accommodated in the pattern.

According to the third aspect of the present invention, by fixing the integrated circuit in the recess of the holding member, the heat dissipation of the integrated circuit is improved and the handling of the integrated circuit is facilitated.

According to the fourth aspect of the present invention, a heat sink is provided integrally with the holding member, and the integrated circuit is fixed to the heat sink. Performance can be improved.

[Brief description of the drawings]

FIG. 1 is a sectional view of a first embodiment of a mounting structure of an integrated circuit according to the present invention.

FIG. 2 shows the wiring tape shown in FIG. 1 (A).
Is a plan view thereof, and FIG. 2B is a sectional view thereof.

FIG. 3 is an enlarged sectional view of a connection portion between a first substrate and a wiring tape shown in FIG. 1;

FIG. 4 is a sectional view of a main part of a second embodiment of the mounting structure of the integrated circuit of the present invention.

5 shows a diagram of the wiring tape shown in FIG. 4, wherein FIG. 5 (A) is a plan view thereof and FIG. 5 (B) is a sectional view thereof.

FIG. 6 is a sectional view of a third embodiment of the integrated circuit mounting structure of the present invention.

FIG. 7 is a sectional view of a fourth embodiment of the integrated circuit mounting structure of the present invention.

FIG. 8 is a cross-sectional view of an example of a conventional integrated circuit mounting structure.

FIG. 9 is a cross-sectional view of another example of a conventional integrated circuit mounting structure.

[Explanation of symbols]

 1, 21, 31 First substrate 1a, 11a, 21a Groove 1b, 11b, 15b Pad 2, 12, 22, 32 Integrated circuit 2a, 12a, 22a Circuit surface 3, 13, 23 Wiring tape 3a, 13a Insulation Tape 3b, 13b Wiring pattern 3c, 13c Insulating film 3d, 13d Integrated circuit side terminal 3e, 13e Substrate side terminal 4, 14, 24, 34 Adhesive layer 5, 25, 35 Holding member 5a, 15a, 35a Hole 6, 26 Bolt 7, 27 Nut 11c, 15c Connection pad 15 Second substrate 25a Depression 28 Metal plating layer 39 Heat sink

Claims (4)

(57) [Claims] An integrated circuit having an electrode on a circuit surface, and a wiring pattern having terminals at both ends are provided from one end to the other end of one surface, and a terminal at one end of the wiring pattern is connected to an electrode of the integrated circuit. A wiring tape electrically connected with the one surface facing the non-circuit surface; and a groove formed on one surface into which the other end of the wiring tape is inserted. A circuit board on which a circuit surface is detachably fixed; a board-side external terminal provided on a bottom surface of the groove portion, a portion facing a terminal at the other end of the wiring tape inserted into the groove portion; A portion other than the other end of the wiring tape is disposed to face one surface, and a space that does not contact the integrated circuit is formed, and the other end of the wiring tape is formed on the surface facing the substrate. A pressing member against which a portion abuts; And having a fixing means for pressing and fixing the member to the substrate, the mounting structure of the integrated circuit. 2. An integrated circuit having an electrode on a circuit surface, and a wiring pattern having terminals at both ends are provided from one end to the other end of both surfaces, and each terminal at one end of each wiring pattern is provided on the integrated circuit. A wiring tape electrically connected to each of the electrodes, a substrate having a groove formed on one surface into which the other end of the wiring tape is inserted, and a non-circuit surface of the integrated circuit being detachably fixed; A board-side external terminal provided on a bottom surface of the groove, opposite to a terminal on the other end of one surface of the wiring tape inserted into the groove; and the wiring terminal provided on one surface of the substrate. A board-side connection terminal corresponding to a terminal on the other surface of the tape, and a space that is arranged to face one surface of the substrate and that does not come into contact with the integrated circuit, other than the other end of the wiring tape. Is formed, and A pressing member in which the other end of the wiring tape abuts on a surface facing the plate; and a portion of the surface of the pressing member facing the substrate, which faces a terminal on the other end of the other surface of the wiring tape. And a pressing member side external terminal provided on a surface of the pressing member facing the substrate, which is electrically connected to the pressing member side external terminal provided at a portion facing the substrate side connection terminal. A mounting structure for an integrated circuit, comprising: a holding member side connection terminal; and fixing means for pressing and fixing the holding member to the substrate. 3. An integrated circuit having electrodes on a circuit surface, and a wiring pattern having terminals at both ends is provided from one end to the other end of one surface, and a terminal at one end of the wiring pattern is connected to an electrode of the integrated circuit. A wiring tape electrically connected with the one surface facing the circuit surface side; a substrate having a groove formed on one surface into which the other end of the wiring tape is inserted; and a bottom surface of the groove A substrate-side external terminal provided at a portion facing the terminal at the other end of the wiring tape inserted into the groove, and disposed on one surface of the substrate, and a surface facing the substrate has A portion excluding the other end of the wiring tape and a concave portion for storing the integrated circuit are formed, and a non-circuit surface of the integrated circuit is fixed to a bottom surface of the concave portion and faces the substrate. Of the wiring tape And an end portion having a pressing member abutting, and a fixing means for pressing and fixing the pressing member to the substrate, the mounting structure of the integrated circuit. 4. The integrated circuit according to claim 3, wherein the concave portion is formed by a hole formed in the pressing member, and a heat sink integrally provided in the pressing member so as to cover the hole. Mounting structure.