JP4173717B2 - Temperature sensor mounting structure for driving integrated circuit - Google Patents

Temperature sensor mounting structure for driving integrated circuit Download PDF

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Publication number
JP4173717B2
JP4173717B2 JP2002318283A JP2002318283A JP4173717B2 JP 4173717 B2 JP4173717 B2 JP 4173717B2 JP 2002318283 A JP2002318283 A JP 2002318283A JP 2002318283 A JP2002318283 A JP 2002318283A JP 4173717 B2 JP4173717 B2 JP 4173717B2
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temperature sensor
integrated circuit
driving integrated
mounting structure
hole
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JP2004151009A (en
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誠二 福井
仁史 増田
俊生 矢吹
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Daikin Industries Ltd
Panasonic Corp
Panasonic Holdings Corp
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Daikin Industries Ltd
Panasonic Corp
Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Measuring Temperature Or Quantity Of Heat (AREA)

Description

【０００１】
【発明の属する技術分野】
この発明は、駆動用集積回路の温度センサ取付構造に関する。
【０００２】
【従来の技術】
従来、駆動用集積回路の温度センサ取付構造としては、図３に示すものがある。この駆動用集積回路の温度センサ取付構造は、図示しない複数の放熱フィンを有するヒートシンク７１と、駆動用集積回路としてのインテリジェントパワーモジュール（以下、ＩＰＭという）７２と、プリント配線基板７３と、温度センサ７４とを備える。
【０００３】
上記ＩＰＭ７２の一面を、ヒートシンク７１の一面に密着させて固定すると共に、ＩＰＭ７２の他面から延びる複数のリードピン７７を、プリント配線基板７３のリードピン用取付穴に挿入して、ハンダ７８でプリント配線基板７３の配線に電気接続している。このようにして、上記ＩＰＭ７２をヒートシンク７１で冷却すると共に、プリント配線基板７３に実装している。
【０００４】
一方、上記温度センサ７４は、センサ本体８０と、このセンサ本体８０の一端に連なる取付部８１と、センサ本体８０の他端から延びるリード線８２と、このリード線８２が連結されているコネクタ８３とを有する。上記温度センサ７４の取付部８１を、上記ヒートシンク７１の上記一面上、かつ、上記ＩＰＭ７２近傍にビス８５で固定して、上記センサ本体８０を上記ヒートシンク７１の上記一面に密着させている。また、図示しないが、上記コネクタ８３を、プリント配線基板７３のヒートシンク７１側の面に搭載して、ハンダ７８で配線に電気接続している。
【０００５】
上記温度センサ７４は、ヒートシンク７１の温度を測ることによって、ＩＰＭ７２の温度を間接的に測定している。
【０００６】
また、図示しないが、プリント配線基板にセンサを取り付けるセンサ取付構造としては、配線基盤に固定された熱容量の大きなブロック体の凹所に赤外線センサを収容して、この赤外線センサの周りをブロック体の内壁面で囲むと共に、この赤外線センサを台座部を介して、プリント配線基板に取り付けたものがある（特開平１１−２３７３３４号公報参照。）。
【０００７】
【特許文献１】
特開平１１−２３７３３４号公報（第１図）
【０００８】
【発明が解決しようとする課題】
しかしながら、図３に示す上記従来の駆動用集積回路の温度センサ取付構造では、故障等によって温度センサ７４を取り代える必要性が生じた場合、温度センサ７４がヒートシンク７１とプリント配線基板７３との間の狭い空間に配置されているため、温度センサ７４の取り外し作業の邪魔になるプリント配線基板７３をヒートシンク７１から引き離さなければならない。そのため、上記プリント配線基板７３の配線に接続されているＩＰＭ７２の多数のリードピン７７の全てをプリント配線基板７３からハンダ７８を溶かして取り外さなければならない。このように、上記従来の駆動用集積回路の温度センサ取付構造では、温度センサ７４を取り代えるために、ＩＰＭ７２の多数のリードピン７７のハンダ７８を溶かさなければならないため、温度センサ７４の取り代えに多大な労力を要して取り代えのコストが高くなるという問題がある。
【０００９】
また、上記温度センサ７４は、ヒートシンク７１の温度を測ることによって、ＩＰＭ７２の温度を間接的に測定するので、ＩＰＭ７２の温度を精密に測定できないという問題もある。
【００１０】
一方、上記特許文献１のセンサ取付構造は、赤外線センサ用で、しかも、ブロック体および台座部を有するため、駆動用集積回路の温度測定をするための温度センサには適用できないという問題がある。
【００１１】
そこで、この発明の目的は、簡単安価に温度センサを取り代えることができると共に、駆動用集積回路の温度を精密に測定できる駆動用集積回路の温度センサ取付構造を提供することにある。
【００１２】
【課題を解決するための手段】
上記目的を達成するため、請求項１の発明の駆動用集積回路の温度センサ取付構造は、
放熱手段に一面が固定された駆動用集積回路と、
上記駆動用集積回路が、その駆動用集積回路の他面が対向するようにして実装される一方、上記駆動用集積回路の上記他面に対向する貫通穴と、この貫通穴の側方に位置するリードピン用取付穴とを有するプリント配線基板と、
上記貫通穴に、上記プリント配線基板の上記駆動用集積回路側の表面の法線方向に間隔をおいて対向すると共に上記貫通穴に挿通可能な寸法を有し、かつ、上記駆動用集積回路の上記他面に直接または間接的に接触しているセンサ本体と、上記センサ本体につながっていると共に、上記リードピン用取付穴に挿入されて上記プリント配線基板の上記放熱手段側とは反対側の表面に形成された配線に電気接続されたリードピンとを有する温度センサと
を備えたことを特徴としている。
【００１３】
尚、この明細書で「間接的に接触」とは、２つの部材の間に樹脂層、薄い金属層および接着層等が存して、その層を介して２つの部材が互いに接続されていることを言う。
【００１４】
上記請求項１の発明の駆動用集積回路の温度センサ取付構造において、駆動用集積回路の温度センサ取付構造を組み立てるときには、例えば、上記駆動用集積回路の一面を上記放熱手段に固定する一方、上記駆動用集積回路の他面を上記プリント配線基板の上記貫通穴および上記プリント配線基板に対向させて、上記駆動用集積回路を上記プリント配線基板に実装する。次に、上記プリント配線基板の上記駆動用集積回路側と反対側から、上記温度センサのセンサ本体を、上記貫通穴を挿通させて、上記駆動用集積回路の他面に直接または間接的に接触させた状態で、上記プリント配線基板の上記リードピン用取付穴に上記温度センサのリードピンを挿入して配線にハンダ等で固定して、上記プリント配線基板の配線に上記リードピンを電気接続する。
【００１５】
また、上記駆動用集積回路の温度センサ取付構造から温度センサを取り換えるときには、例えば、ハンダ等でプリント配線基板に固定されている温度センサのリードピンをプリント配線基板から取り外した上で、駆動用集積回路に接触している温度センサのセンサ本体を上記貫通穴を通して駆動用集積回路から取り外して、プリント配線基板および駆動用集積回路から温度センサを取り外す。次に、上記プリント配線基板における駆動用集積回路側と反対側から、新しい温度センサのセンサ本体を、上記貫通穴を挿通させて、上記駆動用集積回路の一面に直接または間接的に接触させた状態で、新しい温度センサのリードピンを上記リードピン取付穴に挿入してプリント配線基板の配線にハンダ等で固定して、上記リードピンを配線に電気接続する。
【００１６】
上記請求項１の発明の駆動用集積回路の温度センサ取付構造によれば、駆動用集積回路の温度センサ取付構造から温度センサを取り代えるときに、従来の駆動用集積回路の温度センサ取付構造のように、プリント配線基板に実装されている駆動用集積回路を、プリント配線基板から取り外す必要がなくて、温度センサのリードピンをプリント配線基板から取り外すと共に、温度センサのセンサ本体を駆動用集積回路から取り外して上記貫通穴を通して取り出すだけで、駆動用集積回路から温度センサを取り外すことができる。また、新しい温度センサのセンサ本体を、上記貫通穴を挿通させて、駆動用集積回路に接触させた状態で、温度センサのリードピンを上記リードピン取付穴に挿入してハンダ等で固定するだけで、新しい温度センサを駆動用集積回路に取り付けることができる。したがって、温度センサを取り代えるときの労力とコストを大幅に低減できる。
【００１７】
また、上記請求項１の発明の駆動用集積回路の温度センサ取付構造によれば、上記温度センサは、被温度測定物である駆動用集積回路に直接または間接的に接触するので、放熱手段の温度を介して駆動用集積回路の温度を間接的に測定する従来例と比較して、駆動用集積回路の温度を精密に測定できる。
【００１８】
また、上記請求項１の発明の駆動用集積回路の温度センサ取付構造によれば、放熱手段、駆動用集積回路、プリント配線基板および温度センサのみが必要で、コネクタが不要なので、部品点数が少なくなり、コストを低減できる。
【００１９】
また、請求項２の発明の駆動用集積回路の温度センサ取付構造は、請求項１に記載の駆動用集積回路の温度センサ取付構造において、上記リードピン用取付穴は、上記貫通穴に連通していることを特徴としている。
【００２０】
上記請求項２の発明の駆動用集積回路の温度センサ取付構造によれば、上記リードピン用取付穴は、上記貫通穴に連通しているので、温度センサのセンサ本体をプリント配線基板の反駆動用集積回路側から駆動用集積回路側へ貫通穴を挿通して、上記リードピンを、貫通穴からその貫通穴に連通しているリードピン用取付穴に移動させるか、あるいは、リードピン用取付穴に直接挿通してリードピン用取付穴に配置できる。したがって、リードピンを、単純かつ安価な例えばＬ字型であっても、簡単にリードピン用取付穴に挿通できて、温度センサおよび駆動用集積回路の温度センサ取付構造のコストを低減できる。
【００２１】
また、請求項３の発明の駆動用集積回路の温度センサ取付構造は、請求項１または２に記載の駆動用集積回路の温度センサ取付構造において、上記温度センサのセンサ本体を上記駆動用集積回路の上記他面に固定する絶縁部材を備えたことを特徴としている。
【００２２】
上記請求項３の発明の駆動用集積回路の温度センサ取付構造によれば、上記温度センサのセンサ本体を上記駆動用集積回路の上記他面に固定する絶縁部材を備えたので、上記センサ本体を上記駆動用集積回路に確実に機械的に固定できると共に、温度センサおよび駆動用集積回路の絶縁性を向上できる。
【００２３】
また、上記請求項３の発明の駆動用集積回路の温度センサ取付構造によれば、上記温度センサのセンサ本体が絶縁部材で被覆されているので、駆動用集積回路からセンサ本体への熱伝導が向上し、かつ、熱容量が少なくなって温度測定精度が向上する。
【００２４】
尚、この発明で利用できるプリント配線基板の温度センサ取付構造としては、
貫通穴と、この貫通穴の側方に位置するリードピン用取付穴とを有するプリント配線基板と、
このプリント配線基板の貫通穴に対向すると共に上記貫通穴に挿通可能な寸法を有し、かつ、上記プリント配線基板の一方の側に露出するセンサ本体と、上記センサ本体から延びて上記リードピン用取付穴に挿入されて、上記プリント配線基板の配線と電気接続されるリードピンとを有する温度センサと
を備えたものがある。
【００２５】
上記プリント配線基板の温度センサ取付構造によれば、上記プリント配線基板の一方の側に露出する温度センサのセンサ本体の露出面を、駆動用集積回路等の被温度測定物の温度測定面に直接または間接的に接触固定して、被温度測定物の温度測定を行うことができる。したがって、被温度測定物にセンサ本体を直接または間接的に接触させた状態で被温度測定物の温度測定ができるので、被温度測定物の温度を正確に測定できる。
【００２６】
また、上記プリント配線基板の温度センサ取付構造のセンサ本体を、駆動用集積回路等の被温度測定物に直接または間接的に接触させた状態で、この被温度測定物をプリント配線基板に実装して被温度測定物の温度センサ取付構造を構成すれば、上記発明の駆動用集積回路の温度センサ取付構造と同様に、この被温度測定物の温度センサ取付構造から温度センサを簡単安価に取り代えることができる。
【００２７】
また、この発明で利用できるプリント配線基板の温度センサ取付構造としては、上記プリント配線基板の温度センサ取付構造において、上記リードピン用取付穴は、上記貫通穴に連通しているものがある。
【００２８】
上記プリント配線基板の温度センサ取付構造によれば、上記リードピン用取付穴は、上記貫通穴に連通しているので、プリント配線基板に温度センサを固定するとき、上記請求項２の発明の駆動用集積回路の温度センサ取付構造と同様に、上記温度センサのリードピンを、貫通穴からその貫通穴に連通しているリードピン用取付穴に移動させるか、あるいは、リードピン用取付穴に直接挿通してリードピン用取付穴に配置できて、リードピンを単純かつ安価な例えばＬ字型にすることができる。したがって、簡単にリードピン用取付穴にリードピンを挿通できて、温度センサおよび駆動用集積回路の温度センサ取付構造のコストを低減できる。
【００２９】
【発明の実施の形態】
図１（Ａ）は、この発明の一実施形態の駆動用集積回路の温度センサ取付構造の断面図である。
【００３０】
図１（Ａ）に示すように、この駆動用集積回路の温度センサ取付構造は、放熱手段の一例としてのヒートシンク１と、駆動用集積回路の一例としてのインテリジェントパワーモジュール（以下、ＩＰＭという）２と、温度センサ５と、プリント配線基板１０と、絶縁部材の一例としてのシリコン樹脂１５とを備える。
【００３１】
上記プリント配線基板１０は、図２（Ａ）に示す略楕円形状の貫通穴４と、この貫通穴４に連通する２つの略スリット形状のリードピン用取付穴９,９とを有する。このリードピン用取付穴９,９は、互いに対向している。
【００３２】
上記ＩＰＭ２は、図１（Ａ）に示すように、略直方体形状をしていて、ＩＰＭ２の一面は、ヒートシンク１に密着した状態で固定しており、他面は、貫通穴４を覆うようにプリント配線基板１０の非配線側に対向している。上記ＩＰＭ２の複数のリードピン３,３,３・・・・・を、プリント配線基板の図示しない穴に挿通して図示しない配線にハンダ８で電気接続している。これにより、上記ＩＰＭ２をプリント配線基盤１０に機械的に固定している。
【００３３】
一方、上記温度センサ５は、図２（Ｂ）に示すように、略直方体形状で上記貫通穴４に挿通できる大きさのセンサ本体６と、このセンサ本体６の両側から延びる略Ｌ字形状の２本のリードピン７からなる。上記温度センサ５のセンサ本体６を、上記ＩＰＭ２の上記他面の貫通穴４に対向する部分に密着させた状態で、二本の略Ｌ字状のリードピン７,７を上記リードピン用取付穴９,９に挿入している。そして、上記リードピン７,７の先端をハンダ８でプリント配線基板１０の図示しない配線と電気接続している。また、上記温度センサ５のセンサ本体６を絶縁部材の一例としてのシリコン樹脂１５でコーティングして、温度センサ５をＩＰＭ２に機械的に固定すると共に、絶縁保護している。
【００３４】
このシリコン樹脂１５は、図１（Ａ）および図１（Ｂ）に示すように、シリコン樹脂１５がセンサ本体６とＩＰＭ２との間に存在しない状態でセンサ本体６を被覆している。もっとも、上記シリコン樹脂１５の薄い層がセンサ本体６とＩＰＭ２との間に存在しても良い。
【００３５】
上記構成において、故障等によって駆動用集積回路の温度センサ取付構造から温度センサ５のみを取り代える必要性が生じたときには、プリント配線基板１０にハンダ８で固定されている温度センサ５のリードピン７を、ハンダ８を溶かしてリードピン取付穴９から取り外して、ヒートシンク１に接触している温度センサ５のセンサ本体６を貫通穴４を通してＩＰＭ２からシリコン樹脂１５ごと取り外す。その後、プリント配線基板１０のリードピン取付穴９付近に残っているハンダを取り除くと共に、ＩＰＭ２の表面に残ったシリコン樹脂１５をきれいに取り除く。
【００３６】
次に、上記プリント配線基板１０におけるＩＰＭ２に対向していない側から、新しい温度センサのセンサ本体を、上記略楕円形の貫通穴４を挿通させて、ＩＰＭ２に接触させた状態で、新しい温度センサのリードピンをリードピン取付穴９に挿入してハンダ等で固定して、上記リードピンをプリント配線基板１０の配線に電気接続する。その後、新しい温度センサのセンサ本体の周りをシリコン樹脂等の絶縁部材でコーティングして、新しい温度センサのセンサ本体をＩＰＭ２に直接または間接的に接触固定する。
【００３７】
上記実施形態の駆動用集積回路の温度センサ取付構造によれば、故障等によって駆動用集積回路の温度センサ取付構造から温度センサ５のみを取り代えるときに、従来の駆動用集積回路の温度センサ取付構造とは違って、プリント配線基板１０の複数のＩＰＭ実装用のリードピン用取付穴にハンダ付けされているＩＰＭ２の多数のリードピン３を、ハンダ８を溶かしてプリント配線基板１０から取り外す必要がなくて、プリント配線基板１０からＩＰＭ２を引き離す必要がなくて、温度センサ５の２本のリードピン７をプリント配線基板１０から取り外すと共に、温度センサ５のセンサ本体１０をシリコン樹脂１５と共に貫通穴４を通してＩＰＭ２から取り外すだけで、駆動用集積回路の温度センサ取付構造から温度センサ５を取り外すことができる。また、新しい温度センサのセンサ本体を貫通穴を４挿通させてＩＰＭ２の一面に接触させた状態で、新しい温度センサのリードピンをスリット形状のリードピン取付穴９に挿入してハンダ等で固定するだけで、駆動用集積回路の温度センサ取付構造に新しい温度センサを取り付けることができる。したがって、温度センサ５を取り代えるときの労力とコストを大幅に低減できる。
【００３８】
また、上記実施形態の駆動用集積回路の温度センサ取付構造によれば、温度センサ５は、被温度測定物であるＩＰＭ２に直接的に接触しているので、ヒートシンクの温度を測ることによってＩＰＭの温度を間接的に測定する従来例と比較して、ＩＰＭ２の温度を正確に測定できる。
【００３９】
また、上記実施形態の駆動用集積回路の温度センサ取付構造によれば、ヒートシンク１、ＩＰＭ２、プリント配線基板１０および温度センサ５のみが必要で、コネクタが不要なので、部品点数が少なくなり、コストを低減できる。
【００４０】
また、上記実施形態の駆動用集積回路の温度センサ取付構造によれば、温度センサ５のセンサ本体６をプリント配線基板１０の配線側から駆動用集積回路側へ貫通穴４を挿通して、温度センサ５のリードピン７をプリント配線基板１０の配線側から貫通穴４に連通しているリードピン用取付穴９に挿通配置できるので、リードピン７を、この実施形態のように単純で安価なＬ字型等の形状をしていても、簡単にリードピン用取付穴９,９に挿通できる。したがって、温度センサ５および駆動用集積回路の温度センサ取付構造のコストを低減できる。
【００４１】
また、上記実施形態の駆動用集積回路の温度センサ取付構造によれば、センサ本体６をシリコン樹脂１５でコーティングしたので、センサ本体６をＩＰＭ２に確実に接触させて固定できると共に、温度センサ５およびＩＰＭ２の絶縁性を向上できる。また、上記ＩＰＭ２からセンサ本体６への伝導性が上記シリコン樹脂１５で向上するから温度測定精度が向上する。
【００４２】
尚、上記実施形態の駆動用集積回路の温度センサ取付構造では、温度センサ５のセンサ本体６を、プリント配線基板１０の配線側から駆動用集積回路側へ貫通穴４を挿通すると共に、温度センサ５のＬ字形状のリードピン７を、リードピン用取付穴９に挿通配置した後、ハンダ８で固定してプリント配線基板１０の配線に電気接続したが、温度センサ５のセンサ本体６を、プリント配線基板１０の配線側から駆動用集積回路側へ貫通穴４を挿通して、温度センサのＬ字形状のリードピン７を、貫通穴４からその貫通穴４に連通しているリードピン用取付穴９に移動させた後、ハンダ８で固定してプリント配線基板１の配線に電気接続しても良い。
【００４３】
また、上記実施形態の駆動用集積回路の温度センサ取付構造では、上記シリコン樹脂１５がセンサ本体６とＩＰＭ２との間に存在しない状態で、温度センサ５のセンサ本体６をＩＰＭ２に直接的に接触させたが、シリコン樹脂がセンサ本体とＩＰＭとの間に薄い層となって存在した状態で、温度センサのセンサ本体をＩＰＭ２に間接的に接触させても良い。また、センサ本体とＩＰＭを、接着層または薄い金属層を介して間接的に接触させても良い。
【００４４】
また、上記実施形態の駆動用集積回路の温度センサ取付構造では、図２（Ａ）に示すように、スリット形状のリードピン取付穴９を略楕円形状の貫通穴４に連通させていたが、図２（Ｃ）に示すように、プリント配線基板の貫通穴３４と、この貫通穴３４の側方の二つのリードピン取付穴３９とを連通しないようにすると共に、夫々略楕円形状と略丸穴形状にして、図２（Ｄ）に示す温度センサ５５のセンサ本体５６の側面から延びる鉤形状のリードピン５７の先端部を、プリント配線基板の配線側からリードピン取付穴３９に挿入して固定しても良い。
【００４５】
また、上記実施形態の駆動用集積回路の温度センサ取付構造では、プリント配線基板１０の貫通穴４を略楕円形状にすると共に、リードピン取付穴９をスリット形状にしたが、この発明の駆動用集積回路の温度センサ取付構造では、プリント配線基板のセンサ本体用の貫通穴とこの貫通穴の側方の二つのリードピン取付穴は、楕円、丸穴、スリット形状に限らずどのような形状であっても良い。
【００４６】
また、上記実施形態の駆動用集積回路の温度センサ取付構造では、絶縁部材としてシリコン樹脂１５を用いたが、絶縁部材としてガラス樹脂やエポキシ樹脂等を用いても良い。
【００４７】
また、上記実施形態の駆動用集積回路の温度センサ取付構造では、温度センサ５をシリコン樹脂１５でコーティングしたが、必ずしもシリコン樹脂等の絶縁部材でコーティングする必要はない。
【００４８】
図１（Ａ）において、ＩＰＭ２およびシリコン樹脂１５を取り除いた状態にすると、プリント配線基板の温度センサ取付構造になる。
【００４９】
このプリント配線基板の温度センサ取付構造を用いれば、センサ本体６をＩＰＭ等の被温度測定物に直接または間接的に接触させた状態で、ＩＰＭ等の被温度測定物の温度測定ができるので、被温度測定物の温度を正確かつ簡単に測定できて有益である。
【００５０】
また、このプリント配線基板の温度センサ取付構造によれば、温度センサを簡単安価に取り代えることができる。
【００５１】
上記実施形態では、プリント配線基板１０のＩＰＭ２に面する側と反対側を配線側としたが、プリント配線基板の両側に配線を設けても良い。
【００５２】
上記実施形態では、放熱手段の一例としてヒートシンクを述べたが、放熱手段は、熱を運んで放熱するヒートパイプ等の伝熱手段であっても良い。
【００５３】
【発明の効果】
以上より明らかなように、請求項１の発明の駆動用集積回路の温度センサ取付構造によれば、駆動用集積回路の一面を放熱手段に固定する一方、駆動用集積回路の他面がプリント配線基板の貫通穴に対向した状態で駆動用集積回路をプリント配線基板に実装した上で、この貫通穴に挿通可能な寸法を有する温度センサのセンサ本体を、上記駆動用集積回路の上記他面に直接または間接的に接触させて、上記プリント配線基板のリードピン用取付穴に温度センサのリードピンを挿入固定したので、駆動用集積回路の温度センサ取付構造から温度センサを取り代えるときに、プリント配線基板に実装されている駆動用集積回路をプリント配線基板から取り外す必要がなくて、温度センサのリードピンをプリント配線基板から取り外すと共に、温度センサのセンサ本体を放熱手段から取り外して上記貫通穴を通して取り出すだけで、駆動用集積回路の温度センサ取付構造から温度センサを取り外すことができ、また、取り外すときの逆の動作を行って駆動用集積回路の温度センサ取付構造に新しい温度センサを取り付けることができる。したがって、温度センサを取り代えるときの労力とコストを大幅に低減できる。
【００５４】
また、請求項１の発明の駆動用集積回路の温度センサ取付構造によれば、温度センサは、被温度測定物である駆動用集積回路に直接または間接的に接触するので、放熱手段の温度を測ることによって駆動用集積回路の温度を間接的に測定する場合と比較して、駆動用集積回路の温度を精密に測定できる。
【００５５】
また、上記請求項１の発明の駆動用集積回路の温度センサ取付構造によれば、放熱手段、駆動用集積回路、プリント配線基板および温度センサのみが必要で、コネクタが不要なので、部品点数が少なくなり、コストを低減できる。
【００５６】
また、請求項２の発明の駆動用集積回路の温度センサ取付構造によれば、上記リードピン用取付穴は、上記貫通穴に連通しているので、温度センサのセンサ本体をプリント配線基板の反駆動用集積回路側から駆動用集積回路側へ貫通穴を挿通して、温度センサのリードピンを、貫通穴からその貫通穴に連通しているリードピン用取付穴に移動させるか、あるいは、直接リードピン用取付穴に挿通してリードピン用取付穴に配置できる。したがって、リードピンを例えばＬ字形状のような単純かつ安価な形状であっても、温度センサおよび駆動用集積回路の温度センサ取付構造のコストを低減できる。
【００５７】
また、請求項３の発明の駆動用集積回路の温度センサ取付構造によれば、上記温度センサのセンサ本体を上記駆動用集積回路の上記他面に固定する絶縁部材を備えたので、上記センサ本体を上記駆動用集積回路に確実に固定できると共に、温度センサおよび駆動用集積回路の絶縁性を向上でき、また、温度測定精度を向上できる。
【００５８】
また、上記記載のプリント配線基板の温度センサ取付構造によれば、プリント配線基板の貫通穴に挿通可能な寸法を有する温度センサのセンサ本体の一面を、上記プリント配線基板の貫通穴の一方の側から露出させた状態で、上記温度センサのリードピンを、上記プリント配線基板のリードピン用取付穴に挿入固定して、温度センサのリードピンと上記プリント配線基板の配線とを電気接続したので、センサ本体を被温度測定物に直接または間接的に接触させることができて、被温度測定物の温度を正確に測定できる。
【００５９】
また、上記記載のプリント配線基板の温度センサ取付構造によれば、温度センサを簡単安価に取り代えることができる。
【００６０】
また、上記記載のプリント配線基板の温度センサ取付構造によれば、上記リードピン用取付穴は、上記貫通穴に連通しているので、プリント配線基板に温度センサを固定するとき、温度センサのリードピンを、貫通穴からその貫通穴に連通しているリードピン用取付穴に移動させるか、あるいは、直接リードピン用取付穴に挿通してリードピン用取付穴に配置して固定できる。したがって、リードピンを例えばＬ字形状のような単純かつ安価な形状にできて、温度センサおよび駆動用集積回路の温度センサ取付構造のコストを低減できる。
【図面の簡単な説明】
【図１】 図１（Ａ）は、この発明の一実施形態の駆動用集積回路の温度センサ取付構造の断面図である。図１（Ｂ）は、図１（Ａ）の駆動用集積回路の温度センサ取付構造の平面図である。
【図２】 図２（Ａ）は、上記実施形態の駆動用集積回路の温度センサ取付構造のプリント配線基板の貫通穴とリードピン用取付穴の形状を示す図であり、図２（Ｂ）は、上記実施形態の駆動用集積回路の温度センサ取付構造の温度センサを示す図である。図２（Ｃ）は、この発明の他の実施形態の駆動用集積回路の温度センサ取付構造のプリント配線基板の貫通穴とリードピン用取付穴の形状を示す図であり、図２（Ｄ）は、上記他の実施形態の駆動用集積回路の温度センサ取付構造の温度センサを示す図である。
【図３】 従来の駆動用集積回路の温度センサ取付構造の断面図である。
【符号の説明】
１ ヒートシンク
２ ＩＰＭ
４,３４ 貫通穴
５,５５ 温度センサ
６,５６ センサ本体
７,５７ リードピン
９,３９ リードピン用取付穴
１０ プリント配線基板
１５ シリコン樹脂[0001]
BACKGROUND OF THE INVENTION
The present invention provides a temperature sensor mounting structure for a driving integrated circuit. To make Related.
[0002]
[Prior art]
Conventionally, a temperature sensor mounting structure for a driving integrated circuit is shown in FIG. The temperature sensor mounting structure of the driving integrated circuit includes a heat sink 71 having a plurality of heat radiating fins (not shown), an intelligent power module (hereinafter referred to as IPM) 72 as a driving integrated circuit, a printed wiring board 73, and a temperature sensor. 74.
[0003]
The one surface of the IPM 72 is fixed in close contact with the one surface of the heat sink 71, and a plurality of lead pins 77 extending from the other surface of the IPM 72 are inserted into the lead pin mounting holes of the printed wiring board 73. 73 is electrically connected to the wiring. In this way, the IPM 72 is cooled by the heat sink 71 and mounted on the printed wiring board 73.
[0004]
On the other hand, the temperature sensor 74 includes a sensor body 80, a mounting portion 81 connected to one end of the sensor body 80, a lead wire 82 extending from the other end of the sensor body 80, and a connector 83 to which the lead wire 82 is connected. And have. The mounting portion 81 of the temperature sensor 74 is fixed on the one surface of the heat sink 71 and in the vicinity of the IPM 72 with screws 85 so that the sensor body 80 is in close contact with the one surface of the heat sink 71. Although not shown, the connector 83 is mounted on the surface of the printed wiring board 73 on the heat sink 71 side and is electrically connected to the wiring by solder 78.
[0005]
The temperature sensor 74 indirectly measures the temperature of the IPM 72 by measuring the temperature of the heat sink 71.
[0006]
Although not shown, as a sensor mounting structure for attaching a sensor to a printed wiring board, an infrared sensor is accommodated in a recess of a block body having a large heat capacity fixed to a wiring board, and the block body is surrounded by the infrared sensor. There is one in which the infrared sensor is attached to a printed wiring board through a pedestal portion while being surrounded by an inner wall surface (see JP-A-11-237334).
[0007]
[Patent Document 1]
JP-A-11-237334 (FIG. 1)
[0008]
[Problems to be solved by the invention]
However, in the conventional temperature sensor mounting structure of the driving integrated circuit shown in FIG. 3, if the temperature sensor 74 needs to be replaced due to a failure or the like, the temperature sensor 74 is interposed between the heat sink 71 and the printed wiring board 73. Therefore, the printed wiring board 73 that obstructs the removal work of the temperature sensor 74 must be pulled away from the heat sink 71. Therefore, all of the many lead pins 77 of the IPM 72 connected to the wiring of the printed wiring board 73 must be removed from the printed wiring board 73 by melting the solder 78. As described above, in the temperature sensor mounting structure of the conventional driving integrated circuit, the solder 78 of the numerous lead pins 77 of the IPM 72 must be melted in order to replace the temperature sensor 74. There is a problem that a great deal of labor is required and the replacement cost becomes high.
[0009]
Further, since the temperature sensor 74 indirectly measures the temperature of the IPM 72 by measuring the temperature of the heat sink 71, there is a problem that the temperature of the IPM 72 cannot be measured accurately.
[0010]
On the other hand, since the sensor mounting structure of Patent Document 1 is for an infrared sensor and has a block body and a pedestal, there is a problem that it cannot be applied to a temperature sensor for measuring the temperature of a driving integrated circuit.
[0011]
Accordingly, an object of the present invention is to provide a temperature sensor mounting structure for a driving integrated circuit that can easily and inexpensively replace the temperature sensor and can accurately measure the temperature of the driving integrated circuit. Make It is to provide.
[0012]
[Means for Solving the Problems]
In order to achieve the above object, the temperature sensor mounting structure of the driving integrated circuit according to the invention of claim 1 comprises:
A driving integrated circuit having one surface fixed to the heat dissipation means;
The driving integrated circuit is mounted so that the other surface of the driving integrated circuit faces, and a through hole facing the other surface of the driving integrated circuit is positioned on the side of the through hole. A printed wiring board having a lead pin mounting hole to be
In the through hole , Spaced in the normal direction of the surface of the printed circuit board on the driving integrated circuit side A sensor body facing and having a dimension capable of being inserted into the through hole, and in direct or indirect contact with the other surface of the driving integrated circuit; While connected to the sensor body, The printed wiring board is inserted into the lead pin mounting hole. Formed on the surface opposite to the heat dissipation means A temperature sensor having a lead pin electrically connected to the wiring;
It is characterized by having.
[0013]
In this specification, “indirect contact” means that a resin layer, a thin metal layer, an adhesive layer, and the like exist between two members, and the two members are connected to each other through the layers. Say that.
[0014]
In the temperature sensor mounting structure of the driving integrated circuit according to the first aspect of the invention, when assembling the temperature sensor mounting structure of the driving integrated circuit, for example, one surface of the driving integrated circuit is fixed to the heat dissipation means, The driving integrated circuit is mounted on the printed wiring board with the other surface of the driving integrated circuit facing the through hole of the printed wiring board and the printed wiring board. Next, from the side opposite to the driving integrated circuit side of the printed circuit board, the sensor body of the temperature sensor is directly or indirectly brought into contact with the other surface of the driving integrated circuit through the through hole. In this state, the lead pin of the temperature sensor is inserted into the lead pin mounting hole of the printed wiring board and fixed to the wiring with solder or the like, and the lead pin is electrically connected to the wiring of the printed wiring board.
[0015]
Further, when replacing the temperature sensor from the temperature sensor mounting structure of the driving integrated circuit, for example, after removing the lead pin of the temperature sensor fixed to the printed wiring board with solder or the like from the printed wiring board, the driving integrated circuit The temperature sensor main body in contact with the sensor is removed from the driving integrated circuit through the through hole, and the temperature sensor is removed from the printed circuit board and the driving integrated circuit. Next, from the opposite side of the printed circuit board to the driving integrated circuit side, the sensor body of the new temperature sensor was inserted through the through hole and brought into direct or indirect contact with one surface of the driving integrated circuit. In this state, a lead pin of a new temperature sensor is inserted into the lead pin mounting hole and fixed to the wiring of the printed wiring board with solder or the like, and the lead pin is electrically connected to the wiring.
[0016]
According to the temperature sensor mounting structure of the driving integrated circuit of the first aspect of the present invention, when the temperature sensor is replaced from the temperature sensor mounting structure of the driving integrated circuit, the temperature sensor mounting structure of the conventional driving integrated circuit is changed. Thus, there is no need to remove the driving integrated circuit mounted on the printed wiring board from the printed wiring board, and the lead pin of the temperature sensor is removed from the printed wiring board, and the sensor body of the temperature sensor is removed from the driving integrated circuit. The temperature sensor can be removed from the driving integrated circuit simply by removing and taking out through the through hole. In addition, with the sensor body of the new temperature sensor inserted through the through hole and in contact with the driving integrated circuit, the lead pin of the temperature sensor is simply inserted into the lead pin mounting hole and fixed with solder or the like. A new temperature sensor can be attached to the driving integrated circuit. Therefore, labor and cost when replacing the temperature sensor can be greatly reduced.
[0017]
Further, according to the temperature sensor mounting structure of the driving integrated circuit of the first aspect of the invention, the temperature sensor directly or indirectly contacts the driving integrated circuit which is a temperature measurement object. Compared with the conventional example in which the temperature of the driving integrated circuit is indirectly measured via the temperature, the temperature of the driving integrated circuit can be measured more precisely.
[0018]
Further, according to the temperature sensor mounting structure of the driving integrated circuit of the first aspect of the invention, only the heat radiating means, the driving integrated circuit, the printed wiring board and the temperature sensor are required, and the connector is not required, so the number of parts is small. Therefore, the cost can be reduced.
[0019]
According to a second aspect of the invention, there is provided the temperature sensor mounting structure for a driving integrated circuit according to the first aspect, wherein the lead pin mounting hole communicates with the through hole. It is characterized by being.
[0020]
According to the temperature sensor mounting structure of the driving integrated circuit of the second aspect of the invention, the lead pin mounting hole communicates with the through hole, so that the sensor body of the temperature sensor is used for the anti-driving of the printed wiring board. Insert the through hole from the integrated circuit side to the driving integrated circuit side and move the lead pin from the through hole to the lead pin mounting hole communicating with the through hole, or directly through the lead pin mounting hole. And can be placed in the lead pin mounting hole. Accordingly, even if the lead pin is simple and inexpensive, for example, L-shaped, the lead pin can be easily inserted into the lead pin mounting hole, and the cost of the temperature sensor and the temperature sensor mounting structure of the driving integrated circuit can be reduced.
[0021]
According to a third aspect of the present invention, there is provided a temperature sensor mounting structure for a driving integrated circuit according to the first or second aspect, wherein the sensor main body of the temperature sensor is connected to the driving integrated circuit. An insulating member that is fixed to the other surface is provided.
[0022]
According to the temperature sensor mounting structure of the driving integrated circuit of the third aspect of the invention, since the insulating member for fixing the sensor main body of the temperature sensor to the other surface of the driving integrated circuit is provided, the sensor main body is mounted. It can be reliably fixed mechanically to the driving integrated circuit, and the insulation of the temperature sensor and the driving integrated circuit can be improved.
[0023]
According to the temperature sensor mounting structure of the driving integrated circuit of the third aspect of the invention, since the sensor main body of the temperature sensor is covered with the insulating member, heat conduction from the driving integrated circuit to the sensor main body is prevented. In addition, the heat capacity is reduced and the temperature measurement accuracy is improved.
[0024]
still Can be used in this invention Printed circuit board temperature sensor mounting structure As Is
A printed wiring board having a through hole and a lead pin mounting hole located on the side of the through hole;
A sensor body facing the through hole of the printed wiring board and having a dimension that can be inserted into the through hole, and exposed on one side of the printed wiring board, and the lead pin mounting extending from the sensor body A temperature sensor having a lead pin inserted into the hole and electrically connected to the wiring of the printed wiring board;
With There is something .
[0025]
Up Record According to the temperature sensor mounting structure of the lint wiring board, the exposed surface of the sensor body of the temperature sensor exposed on one side of the printed wiring board is directly or directly on the temperature measuring surface of a temperature measurement object such as a driving integrated circuit. The temperature of the object to be measured can be measured by indirectly fixing the contact. Therefore, since the temperature of the temperature measurement object can be measured in a state where the sensor body is in direct or indirect contact with the temperature measurement object, the temperature of the temperature measurement object can be accurately measured.
[0026]
Also on Record With the sensor body of the temperature sensor mounting structure of the lint wiring board in direct or indirect contact with the temperature measurement object such as an integrated circuit for driving, the temperature measurement object is mounted on the printed wiring board and is subjected to the temperature. If the temperature sensor mounting structure for the object to be measured is configured, the temperature sensor can be easily and inexpensively replaced from the temperature sensor mounting structure for the object to be temperature measured in the same manner as the temperature sensor mounting structure of the driving integrated circuit of the present invention. .
[0027]
Also, Available in this invention Printed circuit board temperature sensor mounting structure As Is the above In the temperature sensor mounting structure of a printed wiring board, the lead pin mounting hole communicates with the through hole. There is something .
[0028]
Up Record According to the temperature sensor mounting structure of the lint wiring board, since the lead pin mounting hole communicates with the through hole, when the temperature sensor is fixed to the printed wiring board, the driving integration according to the invention of claim 2 Similar to the temperature sensor mounting structure of the circuit, move the lead pin of the above temperature sensor from the through hole to the lead pin mounting hole communicating with the through hole, or directly through the lead pin mounting hole for the lead pin. The lead pin can be arranged in the mounting hole, and the lead pin can be made simple and inexpensive, for example, L-shaped. Therefore, the lead pin can be easily inserted into the lead pin mounting hole, and the cost of the temperature sensor and the temperature sensor mounting structure of the driving integrated circuit can be reduced.
[0029]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1A is a cross-sectional view of a temperature sensor mounting structure of an integrated circuit for driving according to an embodiment of the present invention.
[0030]
As shown in FIG. 1A, the temperature sensor mounting structure of the driving integrated circuit includes a heat sink 1 as an example of heat dissipation means and an intelligent power module (hereinafter referred to as IPM) 2 as an example of the driving integrated circuit. And a temperature sensor 5, a printed wiring board 10, and a silicon resin 15 as an example of an insulating member.
[0031]
The printed wiring board 10 includes a substantially elliptical through hole 4 shown in FIG. 2A and two substantially slit-shaped lead pin mounting holes 9 and 9 communicating with the through hole 4. The lead pin mounting holes 9, 9 face each other.
[0032]
As shown in FIG. 1A, the IPM 2 has a substantially rectangular parallelepiped shape, one surface of the IPM 2 is fixed in close contact with the heat sink 1, and the other surface covers the through hole 4. It faces the non-wiring side of the printed wiring board 10. The plurality of lead pins 3, 3, 3,... Of the IPM 2 are inserted into holes (not shown) of the printed wiring board and electrically connected to the wiring (not shown) with solder 8. Thereby, the IPM 2 is mechanically fixed to the printed wiring board 10.
[0033]
On the other hand, as shown in FIG. 2 (B), the temperature sensor 5 has a substantially rectangular parallelepiped-shaped sensor body 6 that can be inserted into the through hole 4 and a substantially L-shaped sensor body 6 extending from both sides of the sensor body 6. It consists of two lead pins 7. In a state where the sensor body 6 of the temperature sensor 5 is in close contact with the portion of the IPM 2 facing the through hole 4 on the other surface, the two substantially L-shaped lead pins 7 are connected to the lead pin mounting holes 9. , 9. The tips of the lead pins 7 are electrically connected to the wiring (not shown) of the printed wiring board 10 by the solder 8. In addition, the sensor body 6 of the temperature sensor 5 is coated with a silicon resin 15 as an example of an insulating member so that the temperature sensor 5 is mechanically fixed to the IPM 2 and insulated and protected.
[0034]
As shown in FIGS. 1A and 1B, the silicon resin 15 covers the sensor main body 6 in a state where the silicon resin 15 does not exist between the sensor main body 6 and the IPM 2. However, a thin layer of the silicon resin 15 may exist between the sensor body 6 and the IPM 2.
[0035]
In the above configuration, when it becomes necessary to replace only the temperature sensor 5 from the temperature sensor mounting structure of the driving integrated circuit due to a failure or the like, the lead pin 7 of the temperature sensor 5 fixed to the printed wiring board 10 with the solder 8 is attached. The solder 8 is melted and removed from the lead pin mounting hole 9, and the sensor body 6 of the temperature sensor 5 in contact with the heat sink 1 is removed from the IPM 2 together with the silicon resin 15 through the through hole 4. Thereafter, the solder remaining in the vicinity of the lead pin mounting hole 9 of the printed wiring board 10 is removed, and the silicon resin 15 remaining on the surface of the IPM 2 is removed cleanly.
[0036]
Next, from the side of the printed wiring board 10 not facing the IPM 2, a new temperature sensor is inserted into the sensor body of the new temperature sensor through the substantially elliptical through hole 4 and in contact with the IPM 2. The lead pins are inserted into the lead pin mounting holes 9 and fixed with solder or the like, and the lead pins are electrically connected to the wiring of the printed wiring board 10. Thereafter, the sensor body of the new temperature sensor is coated with an insulating member such as silicon resin, and the sensor body of the new temperature sensor is directly or indirectly contact-fixed to the IPM 2.
[0037]
According to the temperature sensor mounting structure of the driving integrated circuit of the above embodiment, when only the temperature sensor 5 is replaced from the temperature sensor mounting structure of the driving integrated circuit due to a failure or the like, the temperature sensor mounting of the conventional driving integrated circuit is performed. Unlike the structure, it is not necessary to remove the multiple lead pins 3 of the IPM 2 soldered to the mounting holes for the lead pins for mounting a plurality of IPMs on the printed wiring board 10 from the printed wiring board 10 by melting the solder 8. There is no need to separate the IPM 2 from the printed circuit board 10, and the two lead pins 7 of the temperature sensor 5 are removed from the printed circuit board 10, and the sensor body 10 of the temperature sensor 5 is removed from the IPM 2 through the through hole 4 together with the silicon resin 15. Simply remove the temperature sensor 5 from the temperature sensor mounting structure of the driving integrated circuit. It can be. Also, with the sensor body of the new temperature sensor inserted through four through-holes and in contact with one surface of the IPM 2, the new temperature sensor lead pin is inserted into the slit-shaped lead pin mounting hole 9 and fixed with solder or the like. A new temperature sensor can be attached to the temperature sensor mounting structure of the driving integrated circuit. Therefore, labor and cost when replacing the temperature sensor 5 can be greatly reduced.
[0038]
In addition, according to the temperature sensor mounting structure of the driving integrated circuit of the above embodiment, the temperature sensor 5 is in direct contact with the IPM 2 that is the object to be measured, so that the temperature of the heat sink can be measured by measuring the temperature of the heat sink. Compared to the conventional example in which the temperature is indirectly measured, the temperature of the IPM 2 can be accurately measured.
[0039]
In addition, according to the temperature sensor mounting structure of the driving integrated circuit of the above embodiment, only the heat sink 1, the IPM 2, the printed wiring board 10 and the temperature sensor 5 are necessary, and no connector is required. Can be reduced.
[0040]
Further, according to the temperature sensor mounting structure of the driving integrated circuit of the above embodiment, the sensor body 6 of the temperature sensor 5 is inserted through the through hole 4 from the wiring side of the printed wiring board 10 to the driving integrated circuit side, and the temperature is increased. Since the lead pin 7 of the sensor 5 can be inserted and arranged in the lead pin mounting hole 9 communicating with the through hole 4 from the wiring side of the printed wiring board 10, the lead pin 7 can be simply and inexpensively L-shaped like this embodiment. Even if it is shaped like the above, it can be easily inserted into the lead pin mounting holes 9, 9. Therefore, the cost of the temperature sensor 5 and the temperature sensor mounting structure of the driving integrated circuit can be reduced.
[0041]
Further, according to the temperature sensor mounting structure of the driving integrated circuit of the above embodiment, since the sensor main body 6 is coated with the silicon resin 15, the sensor main body 6 can be securely contacted and fixed to the IPM 2, and the temperature sensor 5 and The insulation of IPM2 can be improved. Further, since the conductivity from the IPM 2 to the sensor body 6 is improved by the silicon resin 15, the temperature measurement accuracy is improved.
[0042]
In the temperature sensor mounting structure of the driving integrated circuit of the above embodiment, the sensor body 6 of the temperature sensor 5 is inserted through the through hole 4 from the wiring side of the printed wiring board 10 to the driving integrated circuit side, and the temperature sensor. After the L-shaped lead pin 7 of 5 is inserted and arranged in the lead pin mounting hole 9, it is fixed by the solder 8 and electrically connected to the wiring of the printed wiring board 10, but the sensor body 6 of the temperature sensor 5 is connected to the printed wiring. The through hole 4 is inserted from the wiring side of the substrate 10 to the driving integrated circuit side, and the L-shaped lead pin 7 of the temperature sensor is connected to the lead pin mounting hole 9 communicating with the through hole 4 from the through hole 4. After being moved, it may be fixed with solder 8 and electrically connected to the wiring of the printed wiring board 1.
[0043]
In the temperature sensor mounting structure of the driving integrated circuit according to the embodiment, the sensor body 6 of the temperature sensor 5 is directly in contact with the IPM 2 in a state where the silicon resin 15 is not present between the sensor body 6 and the IPM 2. However, the sensor body of the temperature sensor may be indirectly contacted with the IPM 2 in a state where the silicon resin is present as a thin layer between the sensor body and the IPM. Further, the sensor main body and the IPM may be contacted indirectly via an adhesive layer or a thin metal layer.
[0044]
In the temperature sensor mounting structure of the driving integrated circuit of the above embodiment, the slit-shaped lead pin mounting hole 9 is communicated with the substantially elliptical through-hole 4 as shown in FIG. As shown in FIG. 2 (C), the through hole 34 of the printed wiring board and the two lead pin mounting holes 39 on the side of the through hole 34 are not communicated with each other. 2D, even if the tip of the hook-shaped lead pin 57 extending from the side surface of the sensor body 56 of the temperature sensor 55 shown in FIG. 2D is inserted into the lead pin mounting hole 39 from the wiring side of the printed wiring board and fixed. good.
[0045]
In the temperature sensor mounting structure of the driving integrated circuit of the above embodiment, the through hole 4 of the printed wiring board 10 has a substantially elliptical shape and the lead pin mounting hole 9 has a slit shape. In the circuit temperature sensor mounting structure, the through hole for the sensor body of the printed wiring board and the two lead pin mounting holes on the side of the through hole are not limited to an ellipse, a round hole, and a slit shape. Also good.
[0046]
In the temperature sensor mounting structure of the driving integrated circuit of the above embodiment, the silicon resin 15 is used as the insulating member, but glass resin, epoxy resin, or the like may be used as the insulating member.
[0047]
Further, in the temperature sensor mounting structure of the driving integrated circuit of the above embodiment, the temperature sensor 5 is coated with the silicon resin 15, but it is not always necessary to coat with the insulating member such as silicon resin.
[0048]
In FIG. 1A, when the IPM 2 and the silicon resin 15 are removed, a temperature sensor mounting structure for a printed wiring board is obtained.
[0049]
By using the temperature sensor mounting structure of this printed wiring board, the temperature of the temperature measurement object such as the IPM can be measured in a state where the sensor body 6 is in direct or indirect contact with the temperature measurement object such as the IPM. It is useful to be able to accurately and easily measure the temperature of the object to be measured.
[0050]
Further, according to the temperature sensor mounting structure of the printed wiring board, the temperature sensor can be easily and inexpensively replaced.
[0051]
In the above embodiment, the side opposite to the side facing the IPM 2 of the printed wiring board 10 is the wiring side, but wiring may be provided on both sides of the printed wiring board.
[0052]
In the above embodiment, the heat sink has been described as an example of the heat radiating means. However, the heat radiating means may be a heat transfer means such as a heat pipe that carries heat and radiates heat.
[0053]
【The invention's effect】
As apparent from the above, according to the temperature sensor mounting structure of the driving integrated circuit of the first aspect of the invention, one side of the driving integrated circuit is fixed to the heat radiating means, while the other side of the driving integrated circuit is printed wiring. After mounting the driving integrated circuit on the printed wiring board in a state facing the through hole of the substrate, the sensor body of the temperature sensor having a dimension that can be inserted into the through hole is mounted on the other surface of the driving integrated circuit. Since the lead pin of the temperature sensor is inserted and fixed in the mounting hole for the lead pin of the above printed wiring board in direct or indirect contact, when the temperature sensor is replaced from the temperature sensor mounting structure of the driving integrated circuit, the printed wiring board It is not necessary to remove the driving integrated circuit mounted on the printed circuit board from the printed circuit board. By simply removing the sensor body from the heat dissipation means and taking it out through the through hole, the temperature sensor can be removed from the temperature sensor mounting structure of the integrated circuit for driving, and the integrated operation for driving can be performed by performing the reverse operation. A new temperature sensor can be attached to the temperature sensor mounting structure of the circuit. Therefore, labor and cost when replacing the temperature sensor can be greatly reduced.
[0054]
Further, according to the temperature sensor mounting structure of the driving integrated circuit of the first aspect of the invention, the temperature sensor directly or indirectly contacts the driving integrated circuit which is the object to be measured, so that the temperature of the heat radiating means is controlled. By measuring the temperature of the driving integrated circuit, the temperature of the driving integrated circuit can be measured more accurately than in the case of indirectly measuring the temperature of the driving integrated circuit.
[0055]
Further, according to the temperature sensor mounting structure of the driving integrated circuit of the first aspect of the invention, only the heat radiating means, the driving integrated circuit, the printed wiring board and the temperature sensor are required, and the connector is not required, so the number of parts is small. Therefore, the cost can be reduced.
[0056]
According to the temperature sensor mounting structure of the driving integrated circuit of the second aspect of the present invention, since the lead pin mounting hole communicates with the through hole, the sensor main body of the temperature sensor is counter-driven to the printed wiring board. Insert the through hole from the integrated circuit side to the driving integrated circuit side and move the lead pin of the temperature sensor from the through hole to the lead pin mounting hole that communicates with the through hole, or directly attach the lead pin It can be inserted into the hole and placed in the lead pin mounting hole. Therefore, even if the lead pin has a simple and inexpensive shape such as an L shape, the cost of the temperature sensor and the temperature sensor mounting structure of the driving integrated circuit can be reduced.
[0057]
According to the temperature sensor mounting structure of the driving integrated circuit of the third aspect of the invention, the sensor main body includes the insulating member for fixing the sensor main body of the temperature sensor to the other surface of the driving integrated circuit. Can be reliably fixed to the driving integrated circuit, the insulation of the temperature sensor and the driving integrated circuit can be improved, and the temperature measurement accuracy can be improved.
[0058]
Also, Above description According to the temperature sensor mounting structure of the printed wiring board, one surface of the sensor body of the temperature sensor having a dimension that can be inserted into the through hole of the printed wiring board is exposed from one side of the through hole of the printed wiring board. In this state, the lead pin of the temperature sensor is inserted and fixed in the lead pin mounting hole of the printed wiring board, and the lead pin of the temperature sensor and the wiring of the printed wiring board are electrically connected. The temperature of the object to be measured can be accurately measured.
[0059]
Also, Above description According to the temperature sensor mounting structure of the printed wiring board, the temperature sensor can be easily and inexpensively replaced.
[0060]
Also, Above description According to the temperature sensor mounting structure of the printed wiring board, the lead pin mounting hole communicates with the through hole. Therefore, when fixing the temperature sensor to the printed wiring board, the lead pin of the temperature sensor is removed from the through hole. It can be moved to the lead pin mounting hole that communicates with the through hole, or can be directly inserted into the lead pin mounting hole and disposed in the lead pin mounting hole. Therefore, the lead pin can be formed into a simple and inexpensive shape such as an L-shape, for example, and the cost of the temperature sensor and the temperature sensor mounting structure of the driving integrated circuit can be reduced.
[Brief description of the drawings]
FIG. 1A is a cross-sectional view of a temperature sensor mounting structure of an integrated circuit for driving according to an embodiment of the present invention. FIG. 1B is a plan view of the temperature sensor mounting structure of the driving integrated circuit of FIG.
FIG. 2A is a diagram showing the shapes of through holes and lead pin mounting holes of a printed wiring board of the temperature sensor mounting structure of the driving integrated circuit of the above embodiment, and FIG. It is a figure which shows the temperature sensor of the temperature sensor mounting structure of the integrated circuit for a drive of the said embodiment. FIG. 2C is a diagram showing the shapes of through holes and lead pin mounting holes of the printed circuit board of the temperature sensor mounting structure of the driving integrated circuit according to another embodiment of the present invention, and FIG. FIG. 5 is a diagram showing a temperature sensor of a temperature sensor mounting structure for a driving integrated circuit according to another embodiment.
FIG. 3 is a cross-sectional view of a temperature sensor mounting structure of a conventional driving integrated circuit.
[Explanation of symbols]
1 Heat sink
2 IPM
4,34 Through hole
5,55 Temperature sensor
6,56 Sensor body
7,57 Lead pin
9,39 Lead pin mounting hole
10 Printed circuit board
15 Silicone resin

Claims (3)

放熱手段（１）に一面が固定された駆動用集積回路（２）と、
上記駆動用集積回路（２）が、その駆動用集積回路（２）の他面が対向するようにして実装される一方、上記駆動用集積回路（２）の上記他面に対向する貫通穴（４,３４）と、この貫通穴の側方に位置するリードピン用取付穴（９,３９）とを有するプリント配線基板（１０）と、
上記貫通穴（４,３４）に、上記プリント配線基板（１０）の上記駆動用集積回路（２）側の表面の法線方向に間隔をおいて対向すると共に上記貫通穴（４,３４）に挿通可能な寸法を有し、かつ、上記駆動用集積回路（２）の上記他面に直接または間接的に接触しているセンサ本体（６,５６）と、上記センサ本体（６ , ５６）につながっていると共に、上記リードピン用取付穴（９,３９）に挿入されて上記プリント配線基板（１０）の上記放熱手段（１）側とは反対側の表面に形成された配線に電気接続されたリードピン（７,５７）とを有する温度センサ（５,５５）と
を備えたことを特徴とする駆動用集積回路の温度センサ取付構造。A driving integrated circuit (2) whose one surface is fixed to the heat dissipation means (1);
The driving integrated circuit (2) is mounted so that the other surface of the driving integrated circuit (2) is opposed to the through integrated circuit (2). 4, 34) and a printed wiring board (10) having lead pin mounting holes (9, 39) located on the sides of the through holes,
It faces the through hole (4, 34) with a space in the normal direction of the surface of the printed circuit board (10) on the side of the integrated circuit for driving (2) at a distance from the through hole (4, 34). A sensor main body (6 , 56) having a dimension capable of being inserted and directly or indirectly contacting the other surface of the driving integrated circuit (2), and the sensor main body (6 , 56). And connected to the wiring formed on the surface of the printed wiring board (10) opposite to the heat dissipating means (1) side by being inserted into the lead pin mounting holes (9, 39). A temperature sensor mounting structure for a driving integrated circuit, comprising a temperature sensor (5, 55) having a lead pin (7, 57). 請求項１に記載の駆動用集積回路の温度センサ取付構造において、
上記リードピン用取付穴（９）は、上記貫通穴（４）に連通していることを特徴とする駆動用集積回路の温度センサ取付構造。In the temperature sensor mounting structure of the driving integrated circuit according to claim 1,
The temperature sensor mounting structure for a driving integrated circuit, wherein the lead pin mounting hole (9) communicates with the through hole (4). 請求項１または２に記載の駆動用集積回路の温度センサ取付構造において、
上記温度センサ（５）のセンサ本体（６）を上記駆動用集積回路（２）の上記他面に固定する絶縁部材（１５）を備えたことを特徴とする駆動用集積回路の温度センサ取付構造。In the temperature sensor mounting structure of the driving integrated circuit according to claim 1 or 2,
A temperature sensor mounting structure for a driving integrated circuit, comprising an insulating member (15) for fixing the sensor body (6) of the temperature sensor (5) to the other surface of the driving integrated circuit (2). .
JP2002318283A 2002-10-31 2002-10-31 Temperature sensor mounting structure for driving integrated circuit Expired - Fee Related JP4173717B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002318283A JP4173717B2 (en) 2002-10-31 2002-10-31 Temperature sensor mounting structure for driving integrated circuit

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JP4173717B2 true JP4173717B2 (en) 2008-10-29

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103035169A (en) * 2011-10-04 2013-04-10 乐金显示有限公司 Display device, driver assembly, and method for transferring heat

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7679915B2 (en) * 2004-09-17 2010-03-16 Kabushiki Kaisha Yaskawa Denki Motor control apparatus and method of assembling motor control apparatus
JP4677848B2 (en) * 2005-08-02 2011-04-27 ダイキン工業株式会社 Temperature sensor mounting structure for driving integrated circuit
JP2008232527A (en) * 2007-03-20 2008-10-02 Matsushita Electric Ind Co Ltd Air conditioner

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103035169A (en) * 2011-10-04 2013-04-10 乐金显示有限公司 Display device, driver assembly, and method for transferring heat
CN103035169B (en) * 2011-10-04 2016-03-09 乐金显示有限公司 The method of display device and actuator assembly and transmission heat

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