JPH10224064A - Heat-generating parts device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To cope with the diversified shape of a piece of heat-generating parts and a heat conductor by arranging a heat-conductive sheet and a fixed block in contact successively and pinching the opposing both edge parts with first and second bracket covers. SOLUTION: A PGA socket 2 is placed on a printed circuit board 1 in advance. Then, while a heat-conductive sheet 4, a heat conductor 5, and a fixed block 6 are successively overlapped on a PGA package 3, they are embedded between the connection walls of a bracket cover 7 and the bracket cover 7 is fixed to the fixed block 6. Then, while a contact pressure is applied to the contacting surfaces between the fixed block 6 and the heat conductor 5 and between the heat conductor sheet 4 and the PGA package 3, the PGA package 3 is inserted into the PGA socket 2 and is screwed to the side wall of an equipment-accommodating case 12. As a result, a heat generated from the PGA package 3 passes through the heat conductor 5 via the heat-conductive sheet 4 and escapes toward the electronic equipment case 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
The present invention relates to a heat-generating component device capable of cooling a GA (Pin Grid Array) package and a resistor using a heat pipe or a heat conductor.

[0002]

2. Description of the Related Art Heretofore, there have been first to fifth examples described below in which a heat sink is fixed to a semiconductor component such as an integrated circuit to cool a PGA package. In the first example (Japanese Utility Model Publication No. 6-9517), as shown in FIG. 11, for example, a plurality of radiation fins 33a are provided on an upper surface of a semiconductor component 32 made of PGA detachably supported by a PGA socket 31. Heat sink 33
In order to mount a heat sink, there is a type using a heat sink attachment 34 made of a spring having a shape as shown in the drawing obtained by bending a wire.

[0003] In this case, the heat sink mounting member 34 includes a holding portion 34 a extending across the upper surface of the heat sink 33.
A stopper 34b formed by bending both ends of the wire at both ends of the holding portion 34a, and a wire portion forming the holding portion 34a is bent from the upper surface of the heat sink 33 so that at least one piece of the radiation fin 33a is included therein. A U-shaped bent portion 34c is provided. FIG. 11A is a front view, and FIG.
(B) is a top view.

Second example (Japanese Patent Publication No. 325024)
As shown in FIG. 12, an elastic locking hook 45 is sandwiched between an integrated module 41 such as a PGA package and an insulator plate 44 such as a PGA socket, and a heat sink (cooling body) 47 is mounted using the elastic locking hook 45. Is what you do. Specifically, an insulating plate 44 having holes 43 of a number corresponding to at least the number, size and arrangement of the connection pins 42 of the integrated module 41 and disposed below the integrated module 41, 44, for example, an M-shaped elastic locking hook 45 disposed on two opposite edges 46 of
When the elastic locking hook 45 mounts the heat sink (cooling body) 47 on the integrated module 41, the locking edge 48 of the heat sink 47 is tightened.

A third example (US Pat. No. 5,313,099)
As shown in FIG. 13, a special adapter 52 is mechanically attached to a PGA package 51, and
Heat sink 53
Is screwed into the external thread 53a formed at the bottom.

A fourth example (Japanese Patent Publication No. 34227/1991)
Connects the dedicated adapter 61 to the semiconductor 62 as shown in FIG.
To the heat sink 63 via the special adapter 61.
Is to be attached. The dedicated adapter 61 is
A notch 61a, a counterbore 61b, and a screw hole 61c are provided. 64 is a printed board, 65 is a cooling fin, and 66 is a radiation fin. In the fifth example, as shown in FIG. 15, a semiconductor 73 is sandwiched between a printed board 71 and a heat sink 72.

[0007]

The conventional examples described above have the following problems. (1) Problems of the first example a) It is necessary to use a dedicated PGA socket 31.

B) A heat sink attachment 34 made of a spring
, The heat sink 33 is connected to the semiconductor component 32.
The semiconductor component 32 and the heat sink 3
The contact thermal resistance between the three increases.

C) The pressing force for pressing the heat sink 33 against the semiconductor component 32 changes over time. d) Since the fixing force of the heat sink fixture 34 to the semiconductor component 32 is weak, the heat sink 33 is detached depending on the direction of the applied impact.

(2) Problems of the Second Example a) Since the elastic locking hook 45 uses a spring property, the pressing force against the integrated module 41 is weak.

B) The pressing force of the heat sink 47 changes over time. c) The impact resistance has direction dependency. (3) Problems of the third example a) A mold is required to manufacture the dedicated adapter 52, and the production cost increases in small-quantity production.

(4) Problems of the fourth example a) Since the dedicated adapter 61 cannot be removed from the semiconductor 62 later, the maintainability is poor.

B) The adhesive force of the special adapter 61 changes over time and the adhesive surface chemically changes. (5) Problems of Fifth Example a) Four legs 74a formed at the corners for mounting the spring bracket 74 on the printed circuit board 71
It is necessary to form four mounting holes 71a for mounting each.

B) There is a problem of direction dependency of impact resistance.
An object of the present invention is that when a heat conductor or a heat pipe is mechanically attached to a heat-generating component, no special processing is required for a printed circuit board, the direction dependency of impact resistance is small, and there is no aging. An object of the present invention is to provide a heat-generating component device which maintains a sufficient contact pressure, can flexibly cope with various shapes of heat-generating components and heat conductors, and has a low manufacturing cost.

[0015]

In order to achieve the above object, the invention according to claim 1 provides a heat conductive part having a good heat conductivity to a heat generating component mounted directly or indirectly on a printed circuit board. A sheet, a plate-like heat conductor having good heat conductivity, and a fixing block are sequentially brought into contact with each other, and the opposite ends are sandwiched between first and second bracket covers having a substantially L-shaped cross section. The first and second bracket covers are fixed to the fixed block by cover fixing means, and the end lengths respectively attached to the first and second bracket covers and the fixed block and projecting from the fixed block are: A heating component device, wherein a pressing force is applied to the heating component via the heat conductor and the heat conductive sheet in order by adjusting with a plurality of pressing means.

According to a second aspect of the present invention, there is provided a heat-generating component mounted directly or indirectly on a printed circuit board. And a fixed block are sequentially brought into contact with each other, and the opposite ends are sandwiched between first and second bracket covers having a substantially L-shaped cross section. The bracket cover is fixed to the fixing block by cover fixing means, and is attached to each of the first and second bracket covers, and the length of an end protruding from the bracket cover is adjusted by a plurality of pressing means, whereby A heating component device, wherein a pressing force is applied to the heating component sequentially through a fixed block, a heat pipe, and a heat conductive sheet.

According to a third aspect of the present invention, there is provided a heat-generating component mounted directly or indirectly on a printed circuit board. , A plate-like heat pipe, a holding member, and a fixed block are sequentially brought into contact with each other, and the opposite ends are sandwiched between first and second bracket covers having a substantially L-shaped cross section. The second bracket cover is fixed to the fixed block by cover fixing means, and is attached to the first and second bracket covers and the fixed block, and the length of the end protruding from the fixed block is adjusted by a plurality of pressing means. A heating component device characterized by applying a pressing force to the heating component through the holding member, the heat pipe, and the heat conductive sheet sequentially by adjusting.

According to a fourth aspect of the present invention, the pressing means is formed at least at a lower portion of a through hole formed in a vertical direction of the fixed block. Therefore, the heat-generating component device includes a pressing screw that is screwed into the screw portion through the bracket cover and has a screw portion formed at least only at the end portion.

According to a fifth aspect of the present invention, the pressing means is formed integrally with the upper surface of the bracket cover and has an internal thread formed on the inner peripheral surface of the hole. And a pressing screw screwed to the boss and penetrating a through hole formed in the fixing block.

According to a sixth aspect of the present invention, the pressing means is formed integrally with the upper surface of the bracket cover and has an internal thread portion formed on an inner peripheral surface of the hole. This is a heat-generating component device comprising a cylindrical boss formed with a boss and a pressing screw screwed to the boss.

According to a seventh aspect of the present invention, as a pressing means according to the first or third aspect of the present invention, a tip is inserted through a through hole formed in the bracket cover and the fixing block. This is a heat-generating component device comprising a pressing member having a hook portion having a spring property.

According to any one of the first to seventh aspects of the present invention, when a heat conductor or a heat pipe is mechanically mounted on the heat-generating component, no special processing is required on the printed circuit board. Direction dependence of impact resistance is small, sufficient contact pressure is maintained without aging, it is possible to flexibly cope with various shapes of heat generating components and heat conductors, and it is possible to reduce manufacturing costs. .

[0023]

Embodiments of the present invention will be described below with reference to the drawings. <First Embodiment> FIG. 1 is a schematic structural view showing a first embodiment of a heat generating component device of the present invention, and FIG. 2 is a side sectional view of FIG. This includes a printed board 1, a PGA socket 2, a PGA package 3, a heat conductive sheet 4, a heat conductor 5, a fixing block 6, a bracket cover 7, a cover mounting screw 8, a cover mounting nut 9, and a pressing screw 10. ,
It consists of a fixing screw 11.

The printed circuit board 1 has a desired circuit pattern (not shown) formed thereon.
The GA socket 2 is mounted and is electrically connected to the circuit pattern.

A plurality of pins 3 a project from the lower end of the PGA package 3, and each pin 3 a is configured to be able to be inserted into and removed from the PGA socket 2. The heat conductive sheet 4 is
It is made of a sheet having good thermal conductivity such as silicone rubber and is placed on the upper surface of the PGA package 3.

The heat conductor 5 is formed by bending a copper plate or an aluminum plate having good heat conductivity into an L-shape by sheet metal processing. One end of the heat conductor 5 is formed between the upper surface of the heat conductive sheet 4 and the fixing block 6. A plurality of fixing screw insertion holes 5 a for being fixed between the lower surface and the side wall of the device storage case 12 are formed at the other end. In this case, each of the fixing screw insertion holes 5a may be either a simple through hole or a female screw hole. Conversely, a plurality of female screw holes 12a are formed in the side wall of the device storage case 12.

The fixing block 6 is made of a material having a small thermal deformation caused by a temperature change, for example, a rectangular parallelepiped made of stainless steel, and has a female screw so that the pressing screw 10 penetrates in the thickness direction (vertical direction) and is screwed. A hole 6a is formed, and a cover mounting screw 8 is formed in the width direction (left-right direction) of the rectangular parallelepiped.
Are inserted in the horizontal direction, and two screw insertion holes 6b are formed.

The bracket cover 7 is formed by forming a plate material into a substantially L-shaped cross section by sheet metal working, and includes a plurality of through holes 7a into which pressing screws 10 are inserted into two plate surfaces orthogonal to each other, and a cover mounting screw. Two having a plurality of through holes 7b into which the holes 8 are inserted are used as follows.

The fixing of the heat-generating component device having such a structure to the equipment case 12 is as follows. The PGA socket 2 is mounted on the printed circuit board 1 in advance by soldering. Next, in a state in which the heat conductive sheet 4, the heat conductor 5, and the fixing block 6 are sequentially stacked on the upper surface of the PGA package 3, the upper and lower walls of one bracket cover 7 and The other bracket cover 7 is fitted to the left end of the connecting wall between the upper and lower walls.

In this state, the through hole 7b of the left bracket cover 7 in FIG. 1, the screw insertion hole 6b of the fixing block 6, and the through hole 7b of the right bracket cover 7 in FIG.
One cover mounting screw 8 is inserted, and a cover mounting nut 9 is screwed into an end of the cover mounting screw 8 protruding from the bracket cover 7. Similarly, the cover mounting screw 8 is mounted on the other cover mounting screw 8. The bracket cover 7 is fixed to the fixing block 6 by screwing the nut 9.

Next, the pressing screw 10 is inserted through the through hole 7a in the upper wall of the bracket cover 7 and the fixing block 6
Into the female screw hole 6a formed in the vertical direction of
The lower end of the pressing screw 10 is screwed until it comes into contact with the heat conductor 5, whereby the fixing block 6 and the heat conductor 5, the heat conductor 5 and the heat conductive sheet 4, the heat conductive sheet 4 and the PGA
A predetermined contact pressure is applied to the contact surfaces of the packages 3.

In this state, that is, on the bracket cover 7,
Fixed block 6, thermal conductor 5, thermal conductive sheet 4, PG
With the A package 3 fixed, the plurality of pins 3a of the PGA package 3 are inserted into the PGA socket 2, and then the fixing screws 11 are inserted into the fixing screw insertion holes 5a formed on the vertical surface of the heat conductor 5. And the fixing screw 11 is screwed into a female screw hole 12 a formed in the side wall of the device storage case 12. In this way, the heat generating component device is fixed to the equipment case 12.

As a result, the heat generated from the PGA package 3 is released to the electronic device case 12 through the heat conductor 5 via the heat conductive sheet 4, so that the PGA package 3 does not have to be forcibly air-cooled. , PGA Package 3
Can be kept at a predetermined temperature or lower.

According to the above-described first embodiment of the present invention, the PGA package 3 is attached to the printed circuit board 1 without performing the drilling process, and the PGA
It can be mechanically mounted on the package 3. For this reason, it is possible to perform cooling with excellent impact resistance. In addition, since the heat conductor 5 and the bracket cover 7 of the present embodiment can be manufactured by sheet metal processing, it contributes to a reduction in manufacturing costs for small-quantity products. Bracket cover 7 is P
The configuration is such that the GA package 3, the heat conductive sheet 4, the heat conductor 5, and the fixing block 6 are arranged on the left and right sides in a stacked state, so that the shape and dimensions of the PGA package 3 and the heat conductor 5 are slightly changed. Can also be used.

<Second Embodiment> FIG. 3 is a side sectional view showing a second embodiment of the present invention. The difference from the first embodiment is that the bracket cover 7 is attached to the fixed block 6. Configuration. More specifically, female screw holes 6c having a predetermined depth are formed on both side surfaces of the fixed block 6, and screwed into the female screw holes 6c through screw insertion holes 7c each having a cover mounting screw 13 in the bracket cover 7. It is intended to be.

As described above, since the bracket cover 7 is mounted on the fixed block 6 by the cover mounting screws 13, only a screwdriver for turning the cover mounting screws 13 is required.

<Third Embodiment> FIG. 4 is a side sectional view showing a third embodiment of the present invention. The difference from the first embodiment is that a heat conductor 5 and a heat conductive sheet 4 are provided. Via PGA
This is a configuration for pressing the package 3. Specifically, each of the left and right bracket covers 7 has a boss 1 in which a female screw hole 15a is formed on the inner peripheral surface of a cylindrical boss body.
5 is attached, and a through hole 7a is formed in the bracket cover 7.
However, a screw insertion hole 6b is formed in the fixed block 6.

The female screw hole 15 of the boss 15 having such a configuration is provided.
The pressing screw 16 is screwed into a, and the screw 16 is inserted into the fixing block 6 through the screw insertion hole 6b so that the tip of the pressing screw 16 contacts the heat conductor 5.

As a result, the same functions and effects as those of the above embodiment can be obtained. <Fourth Embodiment> FIG. 5 is a side sectional view showing a fourth embodiment of the present invention. The difference from the first embodiment is that PGA is provided via a heat conductor 5 and a heat conductive sheet 4. Package 3
This is a configuration for pressing. Specifically, a through hole 7a is formed in the left and right bracket covers 7, and a female screw hole 6a is formed in the fixing block 6, and the through hole 7a and the female screw hole 6a are screwed only at the tip end as shown in FIG. The pressing screw 17 in which the portion 17a is formed is inserted and screwed.

As described above, since the pressing screw 17 having the screw portion 17a only at the distal end is used, a constant contact pressure can be obtained without managing the stroke of the screw.
That is, in a screw having a long screw portion, the screw can be tightened over the entire length in which the screw portion exists. Therefore, an excessive pressing force may be applied to the heat conductor 5. Since the screw 17 is used, the screw cannot be tightened before a certain position, so that an excessive pressing force can be avoided.

Other functions and effects are the same as those of the above-described embodiment. <Fifth Embodiment> FIG. 7 is a side sectional view showing a fifth embodiment of the present invention. The difference from the first embodiment is that PGA is provided via a heat conductor 5 and a heat conductive sheet 4. Package 3
This is a configuration for pressing. Specifically, a through hole 7a is formed in the bracket cover 7, and a pressing component insertion hole 6e is formed in the fixed block 6, and the through hole 7a and the pressing component insertion hole 6e are formed.
The pressing part 18 shown in FIG. 8 is inserted through e. The pressing component 18 has a notch 18b formed at the distal end, and has a hook portion 18a that spreads on both sides across the notch 18b. When the pressing screw 18 is inserted into the through hole 7a and the pressing component insertion hole 6e, the hook portion 18a narrows with the notch 18b interposed therebetween, but when the hook portion 18a protrudes from the fixed block 6, the pressing screw 18a Since the distal end interval of the hook portion 18a is widened by the restoring force, the pressing component 18 does not come out of the fixed block 6, and the pressing component 1
Since the tip of the hook portion 18 a of 8 is in contact with the heat conductor 5, the heat conductor 5 and the PGA package 3 are in contact with each other at a predetermined contact pressure via the heat conductive sheet 4.

In this embodiment, since the PGA package 3 is pressed by the pressing component 18 via the heat conductor 5 and the heat conductive sheet 4, it is possible to obtain a constant contact pressure with one touch without managing the stroke. Can be. As a result, the work can be performed with one touch, so that the assembly cost can be reduced.

Except for the operation and effect described above, the same operation and effect as those of the above-described embodiment can be obtained. <Sixth Embodiment> FIG. 9 is a side sectional view showing a sixth embodiment of the present invention. The difference from the first embodiment is that a plate-like heat pipe 20 is used instead of the heat conductor 5. The heat pipe 20 is pressed by the fixing block 6.

More specifically, an elongated hole 6f having a substantially race-track cross section is formed in the fixed block 6, and a cover mounting screw 8 is inserted through the elongated hole 6f. The point at which the nut 9 is screwed is the same as in the first embodiment.

Then, on the left and right bracket covers 7,
Bosses 15 each having a female screw hole 15a are attached to the inner peripheral surface of the cylindrical boss body, and a through hole 7a is formed in the bracket cover 7.

The female screw hole 15 of the boss 15 having such a configuration
A pressing screw 16 is screwed into a, and the distal end of the pressing screw 16 comes into contact with the upper surface of the fixed block 6. Therefore, by adjusting the projecting length of the pressing screw 16, the fixed block 6 moves down along the long hole 6 f, and the heat pipe 20 can be pressed on the uniform surface of the fixed block 6. As a result, the flow of the working fluid inside the heat pipe 20 is obstructed, and the heat pipe 20 can be closely attached to the PGA package 3 via the heat conductive sheet 4 without deteriorating the cooling performance.

<Seventh Embodiment> As an embodiment of FIG. 7, the pressing screw 16 of FIG. 9 is elongated as shown in FIG. 4, and a screw insertion hole 6 b is formed in the fixed block 6. A metal plate which is a pressing member may be provided on a surface to which the pressing screw 16 contacts.

In this embodiment, the same operation and effect as in the sixth embodiment can be obtained. <Eighth Embodiment> FIG. 10 is a front sectional view showing an eighth embodiment of the present invention, which is different from the first embodiment in that a structure for attaching the heat conductor 5 to the equipment storage case 12 is provided. Only differ. That is, a substantially L-shaped fixture 21 is fixed to the device storage case 12, and the end of the heat conductor 5 is attached to the fixture 21. In this embodiment, the same functions and effects as those of the above-described embodiment can be obtained.

[0049]

According to the present invention described above, when a heat conductor or a heat pipe is mechanically mounted on a heat generating component,
No special processing is required on the printed circuit board, the direction dependency of impact resistance is small, sufficient contact pressure is maintained without aging, and it can flexibly cope with various shapes of heat-generating components and heat conductors. It is possible to provide a heat-generating component device whose production cost is low.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a first embodiment of a heat generating component device according to the present invention.

FIG. 2 is a side sectional view of FIG.

FIG. 3 is a front sectional view showing a second embodiment of the heat generating component device of the present invention.

FIG. 4 is a front sectional view showing a third embodiment of the heat generating component device of the present invention.

FIG. 5 is a front sectional view showing a fourth embodiment of the heat generating component device of the present invention.

FIG. 6 is an enlarged front view showing the pressing screw of FIG. 5;

FIG. 7 is a front sectional view showing a fifth embodiment of a heat generating component device according to the present invention.

FIG. 8 is an enlarged front view showing the pressing part of FIG. 7;

FIG. 9 is a front sectional view showing a sixth embodiment of the heat generating component device of the present invention.

FIG. 10 is a side sectional view showing a seventh embodiment of the heat generating component device of the present invention.

FIG. 11 is a view for explaining a first example of a conventional heat generating component device.

FIG. 12 is an exploded perspective view for explaining a second example of a conventional heat generating component device.

FIG. 13 is an exploded perspective view for explaining a third example of a conventional heat generating component device.

FIG. 14 is a view for explaining a fourth example of a conventional heat generating component device.

FIG. 15 is an exploded perspective view for explaining a fifth example of a conventional heat generating component device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Printed circuit board 2 ... PGA socket 3 ... PGA package 4 ... Thermal conductive sheet 5 ... Thermal conductor 6 ... Fixed block 7 ... Bracket cover 8 ... Cover mounting screw 9 ... Cover mounting nut 10 ... Pressing screw 11 ... Fixing screw 12 ... Equipment storage case 13 ... Cover mounting screw 16 ... Pressing screw 17 ... Pressing screw 18 ... Pressing part 20 ... Heat pipe 21 ... Mounting tool

Claims (7)

[Claims] A heat-generating component mounted directly or indirectly on a printed circuit board includes a heat-conductive sheet having good heat conductivity, a plate-like heat conductor having good heat conductivity, and a fixing block. The opposite ends are sandwiched between first and second bracket covers having a substantially L-shaped cross section, and the first and second bracket covers are fixed to the fixing block by cover fixing means. The heat conductor and the heat conductive sheet are respectively attached to the first and second bracket covers and the fixed block, and the length of an end protruding from the fixed block is adjusted by a plurality of pressing means. A heat-generating component device, wherein a pressing force is applied to the heat-generating component via a plurality of heat-generating components. 2. A heat-generating component mounted directly or indirectly on a printed circuit board includes a heat-conductive sheet having good heat conductivity, a plate-like heat pipe having good heat conductivity, and a fixed block. The opposite ends are sandwiched between first and second bracket covers having a substantially L-shaped cross section, and the first and second bracket covers are fixed to the fixed block by cover fixing means. The fixed block is attached to the first and second bracket covers, and the length of the end protruding from the bracket cover is adjusted by a plurality of pressing means.
A heat-generating component device, wherein a pressing force is applied to the heat-generating component via a heat pipe and a heat conductive sheet sequentially. 3. A heat-generating component mounted directly or indirectly on a printed circuit board, a heat-conductive sheet having good heat conductivity, a plate-like heat pipe having good heat conductivity, and a holding member. Fixing blocks are sequentially arranged in contact with each other, and the opposite end portions are sandwiched between first and second bracket covers having a substantially L-shaped cross section, and the first and second bracket covers are fixed to the fixing block by cover fixing means. The first and second bracket covers and the fixed block are attached to the fixed block, respectively, and the length of the end protruding from the fixed block is adjusted by a plurality of pressing means. A heat-generating component device, wherein a pressing force is applied to the heat-generating component via a heat conductive sheet sequentially. 4. The pressing means is formed in at least a lower part of a through hole formed in a vertical direction of the fixed block, and is screwed to a screw portion through the bracket cover, and is provided only at a tip portion at least. 4. The heat-generating component device according to claim 1, wherein the heat-generating component device comprises a pressing screw having a threaded portion. 5. The pressing means is integrally formed on an upper surface of the bracket cover, and has a cylindrical boss having an internal thread formed on an inner peripheral surface of the hole. 2. The heat-generating component device according to claim 1, further comprising a pressing screw penetrating a through hole formed in said fixing block. 6. The pressing means is formed integrally with the upper surface of the bracket cover, and has a cylindrical boss having an internal thread formed on an inner peripheral surface of the hole, and a pressing screw screwed to the boss. 3. The heat-generating component device according to claim 2, comprising a screw. 7. The pressing member according to claim 1, wherein the pressing means is a pressing member which is inserted into a through hole formed in the bracket cover and the fixing block and has a hook portion having a spring property at a tip. Heating component device.