CN210328388U - Power device heat radiation assembly - Google Patents
Power device heat radiation assembly Download PDFInfo
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- CN210328388U CN210328388U CN201920960923.XU CN201920960923U CN210328388U CN 210328388 U CN210328388 U CN 210328388U CN 201920960923 U CN201920960923 U CN 201920960923U CN 210328388 U CN210328388 U CN 210328388U
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Abstract
An embodiment of the utility model provides a power device radiator unit relates to the power electronic equipment field. The assembly comprises a heat dissipation section bar and at least one power device mounting module, wherein the power device mounting module comprises an insulating bracket and a heat conduction substrate; the heat dissipation section comprises a first heat conduction surface and a second heat conduction surface; the heat conducting substrate comprises a third heat conducting surface and a fourth heat conducting surface; the insulating support is provided with a fixing buckle used for fixing the insulating support to the heat dissipation section bar and at least one mounting position used for mounting the power device, when the insulating support is fixed to the heat dissipation section bar, the heating surface of the power device at the mounting position is attached to the third heat conduction surface of the heat conduction substrate, the fourth heat conduction surface of the heat conduction substrate is attached to the second heat conduction surface of the heat dissipation section bar, and the first heat conduction surface of the heat dissipation section bar is attached to an external radiator. The embodiment of the utility model provides a when improving power device radiating efficiency realized overall structure's modularization, reduced the assembly degree of difficulty and need not to carry out the insulation processing design, improved space utilization.
Description
Technical Field
The embodiment of the utility model provides a relate to power electronic equipment field, more specifically say, relate to a power device radiator unit.
Background
The power device is a power semiconductor device, and is mainly an electronic device with high power in the aspects of electric energy conversion and control circuits of power equipment. Moreover, due to the continuous improvement of the requirements of electronic products and energy efficiency, the market of power devices in China always keeps a higher development speed. However, since the power device has a loss in its application and generates a large amount of heat, it is necessary to give priority to the heat dissipation problem of the power device in designing.
At present, in a vehicle-mounted charger, a power device is mainly compressed and fixed on a radiating piece through an elastic sheet made of a metal material for radiating, but the fixing mode of compressing the power device through the elastic sheet has the following defects:
1) the elastic sheet is too long in pressing time, so that the aging risk exists, the elastic sheet can be deformed and loosened and even damaged by fatigue, a power device cannot be reliably fixed for a long time, and the stability is poor;
2) the elastic sheet is a metal conductor, and when a structural mode of compressing the elastic sheet is adopted, in order to meet the safety requirements, insulation treatment design is required, so that the structure is complicated, the designability of the whole structure volume is limited, and the utilization rate of an installation space is reduced;
3) the spring plate can not position the pins of the power device at the same time when the power device is tightly pressed, and a tool component is required to be additionally arranged to position the pins of the power device, so that the practicability is low, and the installation and the assembly are not facilitated; when the power device is assembled on the circuit board, pins of the power device cannot be accurately and efficiently inserted on the circuit board, the installation and maintenance difficulty is high, and the operability is insufficient.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a to above-mentioned current power device adopt the stability of the fixed mode that the shell fragment compressed tightly relatively poor, the shell fragment has ageing risk to unable long-time reliable fixed power device, and need carry out the insulation treatment design, cause the structure to complicate and restrict the designability of overall structure volume, space utilization is low and the installation is great with the maintenance degree of difficulty, the problem that maneuverability is not enough provides a power device radiator unit.
The embodiment of the utility model provides a solve above-mentioned technical problem's technical scheme is, provide a power device radiator unit, including heat dissipation section bar and at least one power device installation module, power device installation module includes insulating support and heat conduction substrate, wherein: the heat dissipation profile comprises a first heat conduction surface and a second heat conduction surface; the heat conducting substrate comprises a third heat conducting surface and a fourth heat conducting surface; the insulating support is provided with a fixing buckle used for fixing the insulating support to the heat dissipation section bar and at least one mounting position used for mounting a power device, when the insulating support is fixed to the heat dissipation section bar, the heating surface of the power device at the mounting position is attached to the third heat conduction surface of the heat conduction substrate, the fourth heat conduction surface of the heat conduction substrate is attached to the second heat conduction surface of the heat dissipation section bar, and the first heat conduction surface of the heat dissipation section bar is attached to an external radiator.
Preferably, each mounting position of the insulating support is provided with a positioning column and a limit buckle, and when the insulating support is fixed to the heat dissipation profile, the positioning column is inserted into a positioning hole of the power device in the mounting position, and the limit buckle is inserted between pins of the power device in the mounting position.
Preferably, the insulating bracket is provided with a plurality of mounting positions, and the mounting positions are arranged side by side along the length direction of the heat dissipation profile; the heat conduction substrate is provided with a plurality of mounting grooves corresponding to the mounting positions respectively, and the third heat conduction surface is formed by the bottom walls of the mounting grooves; when the insulating support is fixed to the heat dissipation section bar, the power devices on the insulating support are respectively embedded into one of the mounting grooves.
Preferably, the insulating support is provided with a plurality of limiting tables distributed at intervals along the length direction of the heat dissipation profile, and when the insulating support is fixed to the heat dissipation profile, one side of the heat conduction substrate abuts against the limiting tables.
Preferably, the heat dissipation profile comprises a clamping groove and a clamping strip which are respectively arranged along the length direction of the heat dissipation profile, the clamping groove is positioned at the bottom of the second heat conduction surface, and the clamping strip is positioned at the top of the second heat conduction surface; the insulating support is fixed to the heat dissipation section bar in a mode that the fixing buckles are buckled to the clamping grooves and the clamping strips.
Preferably, the heat dissipation profile comprises a support part arranged along the length direction of the heat dissipation profile, and the support part is provided with a support surface vertically intersected with the second heat conduction surface; when the insulating support is fixed to the heat dissipation profile, one edge of the heat conduction substrate abuts against the supporting surface.
Preferably, the heat dissipation profile is provided with at least one positioning groove, the insulating support is provided with at least one positioning pin, and the positioning pin is embedded into the positioning groove when the insulating support is fixed to the heat dissipation profile.
Preferably, the insulating support is provided with at least one circuit board hanging buckle, and the orientation of the circuit board hanging buckle is the same as the orientation of the pins of the power device in the mounting position.
Preferably, the insulating support is provided with an inspection window which is respectively arranged corresponding to each mounting position.
Preferably, heat conduction curing glue is respectively arranged between the heating surface of the power device and the third heat conduction surface of the heat conduction substrate, and between the fourth heat conduction surface of the heat conduction substrate and the second heat conduction surface of the heat dissipation profile;
the power device heat dissipation assembly comprises a plurality of power device installation modules, and the power device installation modules are arranged on the second heat conduction surface of the heat dissipation section bar side by side along the length direction of the heat dissipation section bar.
The utility model discloses power device radiator unit has following beneficial effect: by arranging the power device installation module and the heat dissipation profile, the modularization of the whole structure can be realized while the heat dissipation effect of the power device is improved, the structure is simpler and more practical, the installation and maintenance operation are convenient, the assembly difficulty is reduced, and the operability is stronger; and, through setting up insulating support at power device installation module, need not to carry out the insulation processing design, can effectively reduce the space volume, improve the designability of overall structure volume and installation space's utilization ratio.
Furthermore, the utility model discloses power device radiator unit is still through setting up draw-in groove and card strip at the heat dissipation section bar to and set up corresponding fixed the knot at insulating support, and detain draw-in groove and card strip respectively by fixed and fix power device installation module on the heat dissipation section bar, installation and dismantlement convenient operation, and simple structure is practical, structural connection's stability and reliability height.
Drawings
Fig. 1 is a schematic structural diagram of a power device heat dissipation assembly provided in an embodiment of the present invention;
fig. 2 is a schematic view of an installation structure of a heat dissipation assembly of a power device according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram illustrating a power device mounting module assembly provided by an embodiment of the present invention;
fig. 4 is an exploded schematic view of a heat dissipation assembly of a power device according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of an insulating support provided by an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a heat dissipation profile provided by an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1, it is the embodiment of the present invention provides a structural schematic diagram of a power device heat dissipation assembly, which can be applied to the field of power electronic devices, especially to the application of a vehicle-mounted charger. Referring to fig. 2, the power device heat dissipation assembly in the present embodiment includes a heat dissipation profile 2 and at least one power device mounting module 1, and each power device mounting module 1 includes an insulating support 11 (which may be made of plastic) and a heat conductive substrate 12. In practical applications, the heat conducting substrate 12 may be a high heat conducting silicon nitride substrate, which has the characteristics of high heat conductivity coefficient, high hardness, high strength and small thermal expansion coefficient, and can be insulated while improving the heat transfer efficiency, without adding a safety gap to meet the safety requirements, and has high practicability.
As shown in fig. 3 and 4, the heat dissipation profile 2 includes a first heat conduction surface 21 and a second heat conduction surface 22 respectively disposed along the length direction of the heat dissipation profile 2, and exchanges heat with the chassis directly or indirectly through the first heat conduction surface 21, and exchanges heat with the power device mounting module 1 through the second heat conduction surface 22. Specifically, the heat dissipation profile 2 may be in a shape of a Chinese character 'tu', the first heat conduction surface 21 is located at the bottom of the shape of the Chinese character 'tu', the second heat conduction surface 22 is a side surface of the upper part of the shape of the Chinese character 'tu', and the first heat conduction surface 21 is perpendicular to the second heat conduction surface 22; therefore, the heat transfer efficiency of the heat dissipation section bar 2 can be ensured by setting the heat dissipation section bar 2 to be in a convex structural mode, the heat dissipation effect of the heat dissipation section bar 2 is improved, the structure is simple, and the processing is convenient.
Further, the heat conductive substrate 12 includes a third heat conductive surface 121 and a fourth heat conductive surface 122, and the third heat conductive surface 121 and the fourth heat conductive surface 122 are disposed oppositely. In addition, the insulating support 11 has a fixing buckle 111 for fixing the insulating support 11 to the heat dissipation profile 2 and at least one mounting position for accommodating the power device 3, and when the insulating support 11 is fixed to the heat dissipation profile 2, the heat generating surface of the power device 3 in the mounting position is attached to the third heat conducting surface 121 of the heat conducting substrate 12, and the fourth heat conducting surface 122 of the heat conducting substrate 12 is attached to the second heat conducting surface 22 of the heat dissipation profile 2. In practical application, the heat dissipation profile 2 is provided with a buckle structure corresponding to the fixing buckle 111, and the shape and size of each mounting position are matched with the power device 3, so that the mounting stability of the power device 3 can be improved, and the heat dissipation effect is prevented from being influenced by play.
Specifically, when the power device 3 generates a large amount of heat during operation, the heat on the power device 3 can be transferred and dispersed to the heat conducting substrate 12 through the third heat conducting surface 121 via the heat generating surface, then the heat on the heat conducting substrate 12 is transferred and dispersed to the heat dissipation profile 2 through the second heat conducting surface 22 via the fourth heat conducting surface 122, and finally the heat is transferred and dispersed to an external component (e.g., a housing) via the first heat conducting surface 21 on the heat dissipation profile 2. The whole heat dissipation process is stable and efficient, the heat transfer efficiency of each part is high, heat generated by the power device 3 can be quickly transferred and dispersed, and the power device 3 is cooled in time, so that the power device 3 can be protected, high-temperature damage is avoided, and the service life of the power device is prolonged.
The power device heat dissipation assembly is provided with the power device installation module 1 and the heat dissipation section bar 2, so that the heat dissipation effect of the power device 3 is improved, and the modularization of the whole structure is realized; be different from current power device and compress tightly fixed structural style through the shell fragment, the power device radiator unit's of this embodiment structure is simple and practical more, is favorable to installation and maintenance operation, reduces the assembly degree of difficulty and maneuverability is stronger, improves work efficiency.
And, power device installation module 1 need not to carry out the insulation processing design for satisfying the ann rule demand through setting up insulating support 11 and heat conduction substrate 12, can effectively reduce the space volume, improves the designability of overall structure volume, and the utilization ratio in space is higher.
In practical application, the heat dissipation section bar 2 can be cut out according to actual demand to obtain corresponding length dimension, can satisfy in different application demands to make part structure's commonality stronger, and reducible part's type, simplify structural design, easy to assemble and maintenance dismantlement operation.
As shown in fig. 5, each mounting position of the insulating support 11 has a positioning post 112 and a position-limiting buckle 113, and the power device 3 has a positioning hole matching with the insulating support 11. And when the insulating support 11 is fixed to the heat dissipation profile 2, the positioning column 112 on the insulating support 11 is inserted into the positioning hole of the power device 3 in the mounting position, and the limit buckle 113 is inserted between the pins 31 of the power device 3 in the mounting position. Therefore, the power device 3 can be completely positioned and fixed at the mounting position of the insulating bracket 11, the mounting stability of the power device 3 is improved, and the mounting and maintenance operation are convenient; be different from current power device and compress tightly fixed structural style through the shell fragment and need set up the pin 31 of frock component location power device 3 in addition, the power device radiator unit's of this embodiment insulating support 11's practicality is higher, and the structure is simple more reasonable.
Of course, in practical applications, the power device positioning structure (the positioning column 112 and the position-limiting buckle 113) in each mounting position of the insulating support 11 can be adjusted according to the shape structure of the power device 3 in practical use.
Specifically, the insulating support 11 has a plurality of mounting positions for mounting and fixing the power device 3, and the mounting positions are arranged side by side along the length direction of the heat dissipation profile 2. Accordingly, the heat conducting substrate 12 has a plurality of mounting grooves 123 corresponding to the mounting positions of the insulating support 11, and the third heat conducting surface 121 is formed by the bottom walls of the mounting grooves 123. And, the power devices 3 on the insulating holders 11 are fitted into one of the mounting grooves 123, respectively, when the insulating holders 11 are fixed to the heat dissipation profile 2. Simple structure, installation convenient operation is swift, and can enclose each power device 3 of installing the installation position of insulating support 11 and close the protection and get up to guarantee that each power device 3 can be stable carry out the heat transfer dispersion heat through heat conduction support 11, thereby dispel the heat and cool down.
In order to improve the convenience of installation, the insulating support 11 is provided with a plurality of limiting tables 114 distributed at intervals along the length direction of the heat dissipation profile 2, and when the insulating support 11 is fixed to the heat dissipation profile 2, one side of the heat conduction substrate 12 abuts against the plurality of limiting tables 114. Namely, when assembling, the heat conducting substrate 12 can be positioned on the limit table 114 of the insulating support 11 first, so that the heat conducting substrate 12 can be assembled to be limited, the simple structural design can improve the stability of the operation and reduce the assembly difficulty, and the working efficiency is improved.
As shown in fig. 6, the heat dissipation profile 2 includes a clamping groove 24 and a clamping strip 23 respectively arranged along the length direction of the heat dissipation profile 2, wherein: the clamping groove 24 is located at the bottom of the second heat conduction surface 22 (i.e. at the side of the second heat conduction surface 22 close to the first heat conduction surface 21), and the opening end of the clamping groove 24 faces the first heat conduction surface 21.
Specifically, the clamping strip 23 is located on the top of the second heat conducting surface 22 (i.e. located on the opposite side of the side where the second heat conducting surface 22 and the clamping groove 24 are located, and may be specifically located on the end surface facing away from the free end of the first heat conducting surface 21), and the clamping strip 23 is disposed in a protruding manner in the direction away from the first heat conducting surface 21. At this time, the insulating holder 11 can be fixed to the heat dissipation profile 2 by providing the locking groove 24 and the locking strip 23 in opposite directions and respectively fastening the fixing buckle 111 of the insulating holder 11 to the locking groove 24 and the locking strip 23 of the heat dissipation profile 2.
Correspondingly, the fixing buckle 111 can be an upper hook arm and a lower hook arm which are respectively in a hook shape, the hook portions of the upper hook arm and the lower groove arm, which are located at the head, are oppositely arranged, the upper hook arm is matched with the clamping strip 23, the lower hook arm is matched with the clamping groove 24, and therefore the clamping strip 23 and the clamping groove 24 can be buckled through the upper hook arm, and the insulating support 11 is fixed on the heat dissipation section bar 2. The connecting mode has simple and reliable structure, convenient installation and disassembly operation, and is beneficial to the general design of the structure of the heat dissipation section bar 2 and reduces the manufacturing cost.
Of course, in practical applications, the fixing and connecting structure (the fixing buckle 111) of the insulating bracket 11 can be adjusted according to the connecting structure (the clamping strip 23 and the clamping groove 24) on the heat dissipation profile 2, so that the heat conducting substrate 12 can be attached to the second heat conducting surface 22 of the heat dissipation profile 2 efficiently and reliably.
In order to ensure that the fourth heat conducting surface 122 of the heat conducting substrate 12 can be stably attached to the second heat conducting surface 22 of the heat dissipating profile 2, the heat dissipating profile 2 is provided with a supporting portion 25 arranged along the length direction of the heat dissipating profile 2, and the supporting portion 25 is provided with a supporting surface 251 perpendicularly intersecting with the second heat conducting surface 22; and one side of the heat conducting substrate 12 can abut against the supporting surface 251 when the insulating support 11 is fixed to the heat dissipation profile 2. Thereby can reduce connection structure vertically atress between insulating support 11 and heat dissipation section bar 2, avoid ageing deformation, extension connection structure's life improves the connection stability of structure, guarantees the radiating effect.
In practical application, the slot 24 can be disposed inside the side of the supporting portion 25 opposite to the supporting surface 251, which is beneficial to improving the utilization rate and practicability of the structure while ensuring the structural strength, thereby simplifying the structure, effectively reducing the processing procedures and lowering the processing cost.
In particular, the heat dissipation profile 2 has at least one positioning groove 26, the insulating support 11 has at least one positioning pin 115, and the positioning pin 115 on the insulating support 11 matches with the positioning groove 26 on the heat dissipation profile 2; and when insulating support 11 is fixed to heat dissipation section bar 2, locating pin 115 imbeds constant head tank 26 to can prevent effectively that power device installation module 1 from taking place the drunkenness in the length direction of heat dissipation section bar 2, carry out spacing completely to power device installation module 1, and then guarantee that the fourth heat-conducting surface 122 of heat conduction substrate 12 can carry out the heat transfer with the second heat-conducting surface 22 of heat dissipation section bar 2 is stable, improve the radiating effect.
In order to facilitate the installation and fixation of the power device installation module 1 and the circuit board 4, at least one circuit board hanging buckle 116 is arranged on the insulating support 11, and the orientation of the circuit board hanging buckle 116 is the same as the orientation of the pin 31 of the power device 3 in the installation position. That is, when the insulating support 11 is fixed to the circuit board 4 by the circuit board hanging buckle 116, each pin 31 is inserted into a corresponding position on the circuit board 4, so that the installation is convenient and fast, the assembly difficulty can be reduced, and the working efficiency can be improved.
Because the insulating support 11 is provided with the inspection windows 117 which are respectively arranged corresponding to each installation position, the model of the power device 3 in the installation position can be inspected and obtained through the inspection windows 117, the structure is simple and practical, and the working efficiency can be further improved.
In order to ensure the heat transfer stability between the heat dissipation components, heat conduction curing glue is respectively arranged between the heating surface of the power device 3 and the third heat conduction surface 121 of the heat conduction substrate 12, and between the fourth heat conduction surface 122 of the heat conduction substrate 12 and the second heat conduction surface 22 of the heat dissipation profile 2. Therefore, the stability and reliability of the bonding connection between each power device 3 and the heat conducting substrate 12 and between the heat conducting substrate 12 and the heat dissipation profile 2 can be ensured, and the heat dissipation and temperature reduction of the power device 3 are prevented from being influenced by the movement or separation between heat dissipation parts.
In practical application, the pre-pressing structure 118 may be further disposed on the insulating support 11, that is, when the insulating support 11 is fixed to the heat dissipation profile 2, the pre-pressing structure 118 of the insulating support 11 is pressed against a side surface of the power device 3 opposite to the heating surface, so that the heating surface of the power device 3 is tightly attached to the fourth heat conduction surface 122 of the heat conduction substrate 12, and the third heat conduction surface 121 of the heat conduction substrate 12 is tightly attached to the second heat conduction surface 22 of the heat dissipation profile 2, thereby further improving heat transfer efficiency between heat dissipation components, avoiding occurrence of a connection gap to influence heat transfer dispersion, and improving heat dissipation effect.
The power device heat dissipation assembly comprises a plurality of power device installation modules 1, and the plurality of power device installation modules 1 are arranged on the second heat conduction surface 22 of the heat dissipation section bar 2 side by side along the length direction of the heat dissipation section bar 2. Furthermore, the heat sink profile 2 comprises two second heat conducting surfaces 22, and the two second heat conducting surfaces 22 are arranged opposite to each other on the heat sink profile 2. From this can install a plurality of power device installation module 1 and fix on the second heat-conducting surface 22 of the both sides of section bar main part 2 to dispel the heat simultaneously, be favorable to improving the utilization ratio in space, reduce whole volume, improve the practicality.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. The utility model provides a power device radiator unit which characterized in that, includes heat dissipation section bar and at least one power device installation module, power device installation module includes insulating support and heat conduction substrate, wherein: the heat dissipation profile comprises a first heat conduction surface and a second heat conduction surface; the heat conducting substrate comprises a third heat conducting surface and a fourth heat conducting surface; the insulating support is provided with a fixing buckle used for fixing the insulating support to the heat dissipation section bar and at least one mounting position used for mounting a power device, when the insulating support is fixed to the heat dissipation section bar, the heating surface of the power device at the mounting position is attached to the third heat conduction surface of the heat conduction substrate, the fourth heat conduction surface of the heat conduction substrate is attached to the second heat conduction surface of the heat dissipation section bar, and the first heat conduction surface of the heat dissipation section bar is attached to an external radiator.
2. The power device heat dissipation assembly of claim 1, wherein each mounting location of the insulating support has a positioning post and a position-limiting buckle, and when the insulating support is fixed to the heat dissipation profile, the positioning post is inserted into the positioning hole of the power device in the mounting location, and the position-limiting buckle is inserted between the pins of the power device in the mounting location.
3. The power device heat dissipation assembly of claim 2, wherein the insulating support has a plurality of mounting locations thereon, and the mounting locations are arranged side by side along a length direction of the heat dissipation profile; the heat conduction substrate is provided with a plurality of mounting grooves corresponding to the mounting positions respectively, and the third heat conduction surface is formed by the bottom walls of the mounting grooves; when the insulating support is fixed to the heat dissipation section bar, the power devices on the insulating support are respectively embedded into one of the mounting grooves.
4. The power device heat dissipation assembly of claim 3, wherein the insulating support has a plurality of position limiting platforms spaced apart along a length direction of the heat dissipation profile, and when the insulating support is fixed to the heat dissipation profile, one edge of the heat conductive substrate abuts against the plurality of position limiting platforms.
5. The power device heat dissipation assembly of claim 1, wherein the heat dissipation profile comprises a slot and a strip respectively disposed along a length direction of the heat dissipation profile, the slot is located at a bottom of the second heat conduction surface, and the strip is located at a top of the second heat conduction surface; the insulating support is fixed to the heat dissipation section bar in a mode that the fixing buckles are buckled to the clamping grooves and the clamping strips.
6. The power device heat dissipation assembly of claim 1, wherein the heat dissipation profile comprises a support portion disposed along a length direction of the heat dissipation profile, the support portion having a support surface perpendicular to the second heat conduction surface; when the insulating support is fixed to the heat dissipation profile, one edge of the heat conduction substrate abuts against the supporting surface.
7. The power device heat sink assembly of claim 1 wherein the heat sink profile has at least one detent, the insulating support has at least one detent, and the detent engages the detent when the insulating support is secured to the heat sink profile.
8. The power device heat dissipation assembly of claim 1, wherein the insulating support has at least one circuit board hook thereon, and the circuit board hook is oriented in the same direction as the pins of the power device in the mounting location.
9. The power device heat dissipation assembly of claim 1, wherein the insulating support has an inspection window corresponding to each of the mounting locations.
10. The power device heat dissipation assembly of claim 1, wherein a heat conductive curing adhesive is respectively disposed between the heat generating surface of the power device and the third heat conductive surface of the heat conductive substrate, and between the fourth heat conductive surface of the heat conductive substrate and the second heat conductive surface of the heat dissipation profile;
the power device heat dissipation assembly comprises a plurality of power device installation modules, and the power device installation modules are arranged on the second heat conduction surface of the heat dissipation section bar side by side along the length direction of the heat dissipation section bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920960923.XU CN210328388U (en) | 2019-06-25 | 2019-06-25 | Power device heat radiation assembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920960923.XU CN210328388U (en) | 2019-06-25 | 2019-06-25 | Power device heat radiation assembly |
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| CN210328388U true CN210328388U (en) | 2020-04-14 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117650093A (en) * | 2024-01-30 | 2024-03-05 | 宁波均胜新能源研究院有限公司 | Positioning assembly for assembling power device and positioning assembly method for power device |
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2019
- 2019-06-25 CN CN201920960923.XU patent/CN210328388U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117650093A (en) * | 2024-01-30 | 2024-03-05 | 宁波均胜新能源研究院有限公司 | Positioning assembly for assembling power device and positioning assembly method for power device |
| CN117650093B (en) * | 2024-01-30 | 2024-04-16 | 宁波均胜新能源研究院有限公司 | Positioning assembly for assembling power device and positioning assembly method for power device |
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Address after: 215000 52 tianedang Road, Yuexi, Wuzhong District, Suzhou City, Jiangsu Province Patentee after: Suzhou Huichuan United Power System Co.,Ltd. Address before: 215000 52 tianedang Road, Yuexi Town, Wuzhong District, Suzhou City, Jiangsu Province Patentee before: SUZHOU HUICHUAN UNITED POWER SYSTEM Co.,Ltd. |