CN210470133U - Power tube heat radiation structure and controller - Google Patents
Power tube heat radiation structure and controller Download PDFInfo
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- CN210470133U CN210470133U CN201921301215.1U CN201921301215U CN210470133U CN 210470133 U CN210470133 U CN 210470133U CN 201921301215 U CN201921301215 U CN 201921301215U CN 210470133 U CN210470133 U CN 210470133U
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- dissipation structure
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Abstract
The utility model discloses a power tube heat radiation structure and controller relates to controller technical field. Including the radiator to and a plurality of power tubes through ceramic substrate and radiator laminating, the pin of power tube is buckled and is preset the angle, and a plurality of power tubes are connected through pin and circuit board electricity respectively, and power tube and circuit board interval set up. The radiating efficiency between the circuit board and the power tube can be improved, and the use stability of the controller is further improved.
Description
Technical Field
The utility model relates to a controller technical field particularly, relates to a power tube heat radiation structure and controller.
Background
With the development of society and the increasing of fuel oil vehicles, the problems of insufficient natural resources such as petroleum fuel and the like faced by human beings and global warming caused by fuel oil emission are increasingly highlighted. This has forced the development of a purely electric vehicle that is not fueled by petroleum, against which background electric vehicles have come into operation. The controller is a core component of the electric vehicle, ensures the power required by the running of the vehicle by controlling the current of the motor, and plays an important role in ensuring the normal running and the safety of the vehicle.
In the state of the art, electric vehicle controllers are rapidly developing toward high integration, high density packaging, and high operating speed. The controller is used as a core component of the electric vehicle, the working dominant frequency is faster and faster, the consumed power consumption is larger and larger, and the emitted heat is more and more. If the heat dissipation capability of the controller is not strong, the dissipation of power will cause the temperature of the electronic components of the controller to rise, which affects the working performance and reliability of the controller, and the performance of the controller is easily reduced, even fails or is damaged.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a power tube heat radiation structure and controller can promote the radiating efficiency between circuit board and the power tube, and then promotes the stability that the controller used.
The embodiment of the utility model is realized like this:
an aspect of the embodiment of the utility model provides a power tube heat radiation structure, including the radiator, and through ceramic substrate with a plurality of power tubes of radiator laminating, the pin of power tube is buckled and is preset the angle, and is a plurality of the power tube passes through respectively the pin is connected with the circuit board electricity, the power tube with the circuit board interval sets up.
Optionally, a supporting shell is arranged between the power tube and the circuit board, a plurality of hollow parts are arranged on the supporting shell, and two sides of the supporting shell in the penetrating direction of the hollow parts are respectively opposite to the power tube and the circuit board.
Optionally, a plurality of through holes are formed in the circuit board, the through holes correspond to the hollowed-out portions, elastic columns penetrate through the through holes, the diameter of each elastic column is smaller than that of the through hole, one end of each elastic column penetrates through the hollowed-out portion to abut against the power tube, and the other end of each elastic column abuts against a pressing plate arranged on one side, far away from the supporting shell, of the circuit board.
Optionally, one side of the supporting housing, which is close to the circuit board, is provided with a limiting column and a buckle, the circuit board is correspondingly provided with a positioning hole and a mounting hole, the limiting column is matched with the positioning hole, and the buckle is matched with the mounting hole.
Optionally, the length of the limiting column and the length of the buckle are greater than the thickness of the circuit board, so that a gap is formed between the pressing plate and the circuit board.
Optionally, the radiator is provided with a limiting boss for limiting the ceramic substrate.
Optionally, an adhesive is disposed between the elastic column and the power tube.
Optionally, a through hole is formed in the pressing plate, a screw hole is correspondingly formed in the radiator, and a connecting piece penetrates through the through hole and the screw hole, so that the pressing plate is fixedly connected with the radiator.
Optionally, the heat sink is an air-cooled heat sink or a liquid-cooled heat sink.
The embodiment of the present invention provides a controller, which comprises the power tube heat dissipation structure as described above.
The utility model discloses beneficial effect includes:
the embodiment of the utility model provides a power tube heat radiation structure and controller, through a plurality of power tubes with the radiator laminating, the heat that makes the biggest electronic components of heating power-power tube produce can in time be derived. Through setting up the ceramic substrate between power tube and radiator, when satisfying the heat with the power tube and leading out the radiator, played insulating effect, and then more reliable and more stable when making the power tube use. Through the power tube and the circuit board which are arranged at intervals, the heat transfer between the power tube and the circuit board is reduced, the heat dissipation effect is better, and the stability and the reliability in use are favorably improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a power tube heat dissipation structure according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of the exploded structure of FIG. 1;
fig. 3 is a schematic structural diagram of a power tube and a support housing according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of the supporting housing and the circuit board according to an embodiment of the present invention.
Icon: 100-power tube heat dissipation structure; 110-a heat sink; 112-a limit boss; 114-screw holes; 120-ceramic substrate; 130-power tube; 132-a pin; 140-a circuit board; 146-mounting holes; 142-a via; 144-positioning holes; 150-a support housing; 152-a hollowed-out; 154-a spacing post; 156-snap fastener; 160-a resilient post; 170-pressing plate; 172-through holes; 180-connecting piece.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "inside" and "outside" are used for indicating the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship that the utility model is usually placed when using, and are only for convenience of describing the present invention and simplifying the description, but not for indicating or implying that the device or element to be referred must have a specific position, be constructed and operated in a specific position, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1 and 2, the present embodiment provides a power tube heat dissipation structure 100, which includes a heat sink 110 and a plurality of power tubes 130 attached to the heat sink 110 through a ceramic substrate 120, pins 132 of the power tubes 130 are bent to form a predetermined angle, the plurality of power tubes 130 are electrically connected to a circuit board 140 through the pins 132, and the power tubes 130 and the circuit board 140 are disposed at intervals.
It should be noted that the embodiment of the present invention does not specifically limit the preset angle for bending the pin 132, as long as the process of assembling and electrically connecting is convenient and stable, and the preset angle can be set to 90 ° for example.
In addition, the embodiment of the present invention does not specifically limit the shape of the ceramic substrate 120, as long as the power tube 130 and the heat sink 110 can form good heat transfer therebetween to promote the heat dissipation effect. In an example, the ceramic substrate 120 may be correspondingly provided with a plurality of grooves, so that the body of the power tube 130 is clamped in the grooves, and the lateral movement of the power tube 130 is avoided, which affects the connection stability.
The embodiment of the utility model provides a power tube heat radiation structure 100, through a plurality of power tubes 130 with the laminating of radiator 110, the heat that produces as the biggest electronic components of heating power-power tube 130 can in time be derived. Through the ceramic substrate 120 arranged between the power tube 130 and the radiator 110, the heat of the power tube 130 is conducted to the radiator 110, and meanwhile, the insulating effect is achieved, and the power tube 130 is more stable and reliable in use. Through the power tube 130 and the circuit board 140 which are arranged at intervals, the heat transfer between the power tube 130 and the circuit board 140 is reduced, the heat dissipation effect is better, and the stability and the reliability in use are improved.
As shown in fig. 1 to fig. 3, a supporting housing 150 is disposed between the power tube 130 and the circuit board 140, a plurality of hollow portions 152 are disposed on the supporting housing 150, and two sides of the hollow portions 152 in the penetrating direction are respectively opposite to the power tube 130 and the circuit board 140.
Specifically, the hollow portion 152 of the supporting housing 150 is opposite to the power tube 130, so that the pin 132 can pass through the hollow portion 152 to be electrically connected to the circuit board 140. In addition, the power tube 130 and the circuit board 140 have a predetermined distance therebetween by supporting the housing 150, which is advantageous to disperse a heat source. Through the hollow portion 152, the heat source is not attached to other surfaces, so that the heat dissipation of the power tube 130 and the circuit board 140 is facilitated, and the stability of the power tube 130 and the circuit board 140 is improved.
As shown in fig. 1 and fig. 2, the circuit board 140 is provided with a plurality of through holes 142, the through holes 142 correspond to the hollow portions 152, the elastic columns 160 penetrate through the through holes 142, the diameter of the elastic columns 160 is smaller than that of the through holes 142, one end of each elastic column 160 penetrates through the hollow portion 152 and abuts against the power tube 130, and the other end of each elastic column 160 abuts against the pressing plate 170 arranged on one side of the circuit board 140 far from the supporting housing 150.
Specifically, the elastic column 160 passes through the through hole 142 of the circuit board 140 and the hollow portion 152 of the supporting housing 150, so as to limit the elastic column 160 and prevent the elastic column 160 from deviating. Can be stably supported between the power tube 130 and the pressure plate 170. The utility model discloses do not do specific restriction to elasticity post 160, the example, elasticity post 160 can set up to elastic material such as silica gel, also can set up to column compression spring etc. as long as can be stable play flexible pressure to power tube 130 can.
Under the pressure effect of clamp plate 170 and power tube 130, elastic column 160 resumes elastic deformation's reaction force and compresses tightly the laminating on ceramic substrate 120 with power tube 130, thereby dispel the heat through the radiator 110 who closely laminates with ceramic substrate 120, elastic column 160's elastic restoring force has fully guaranteed can not produce destructive rigid extrusion to power tube 130 when compressing tightly power tube 130, avoid damaging power tube 130, the stability of power tube 130 has been promoted, the life of power tube 130 is strengthened.
As shown in fig. 2 and 4, a limiting column 154 and a buckle 156 are disposed on one side of the support housing 150 close to the circuit board 140, the circuit board 140 is correspondingly disposed with a positioning hole 144 and a mounting hole 146, the limiting column 154 is engaged with the positioning hole 144, and the buckle 156 is engaged with the mounting hole 146.
Specifically, the positioning hole 144 is disposed on one side of the circuit board 140, the mounting hole 146 is disposed on the other side of the circuit board 140, and the positioning hole 144 is asymmetric to the mounting hole 146, so that the circuit board 140 cannot be assembled normally when the mounting angle is wrong, thereby facilitating the avoidance of the error rate in the mounting process and further improving the assembly rate.
It should be noted that the embodiment of the present invention does not specifically limit the number of the positioning holes 144 and the mounting holes 146, as long as the normal positioning and mounting requirements can be satisfied. For example, the number of the positioning holes 144 and the number of the mounting holes 146 may be two, respectively, or may be other numbers according to actual needs.
As shown in fig. 4, the length of the retention posts 154 and the clips 156 is greater than the thickness of the circuit board 140 such that a gap is formed between the pressure plate 170 and the circuit board 140.
Specifically, the end of the limiting column 154 and the buckle 156 protruding from the circuit board 140 abuts against the pressing plate 170, so that a gap is formed between the pressing plate 170 and the circuit board 140, and thus, the circuit board 140 can better dissipate heat, and the probability that the circuit board 140 affects heat dissipation due to contact with other components is reduced.
In addition, the gap formed between the pressing plate 170 and the circuit board 140 increases the distance between the pressing plate 170 and the power tube 130, reduces the probability of overvoltage damage to the power tube 130 due to the small distance between the pressing plate 170 and the power tube 130, and also reduces the assembly tolerance, so that each power tube 130 can be pressed without being damaged.
As shown in fig. 2, the heat sink 110 is provided with a limiting boss 112 for limiting the ceramic substrate 120.
Specifically, the limiting bosses 112 are disposed at two sides of the heat sink 110, so that the ceramic substrate 120 is clamped between the two limiting bosses 112. Thus, the ceramic substrate 120 is prevented from being shifted in the horizontal direction during the assembly pressing process. Meanwhile, the groove area between the two limiting bosses 112 ensures that the ceramic substrate 120 has a sufficient creepage distance, thereby improving the stability of the power tube 130 in use.
Optionally, an adhesive is disposed between the elastic column 160 and the power tube 130. Specifically, the elastic column 160 may be adhered to the non-metallic surface of the power tube 130 by an adhesive. Thus, the stability of the connection between the elastic column 160 and the power tube 130 can be improved, and the through hole 142 on the circuit board 140 and the hollow portion 152 on the supporting housing 150 can ensure that the elastic column 160 does not deviate in the compressing process, thereby improving the stability of the power tube heat dissipation structure 100.
As shown in fig. 2, the pressing plate 170 is provided with a through hole 172, the heat sink 110 is correspondingly provided with a screw hole 114, and the connecting member 180 passes through the through hole 172 and the screw hole 114, so that the pressing plate 170 is fixedly connected with the heat sink 110.
It should be noted that, the embodiment of the present invention does not specifically limit the number and the position of the through holes 172, and can be flexibly set according to actual needs. In addition, the connection member 180 may employ a fastening bolt to facilitate the fixed connection between the pressure plate 170 and the heat sink 110.
Optionally, the heat sink 110 is an air-cooled heat sink or a liquid-cooled heat sink to achieve the desired heat dissipation purpose.
The embodiment of the utility model provides a controller is still disclosed, including above arbitrary power tube heat radiation structure 100. The controller has the same structure and advantages as the power tube heat dissipation structure 100 in the previous embodiment. The structure and the beneficial effects of the power tube heat dissipation structure 100 have been described in detail in the foregoing embodiments, and are not repeated herein. In addition, the power tube heat dissipation structure 100 of the present application can also be applied to a power module, and the power module, that is, as long as the problem of heat dissipation of the power tube is concerned, the structure can be applied to a required product.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a power tube heat radiation structure, its characterized in that, including the radiator to and through ceramic substrate with a plurality of power tubes of radiator laminating, the pin of power tube is buckled and is preset the angle, and is a plurality of the power tube passes through respectively pin and circuit board electricity are connected, the power tube with the circuit board interval sets up.
2. The power tube heat dissipation structure of claim 1, wherein a support housing is disposed between the power tube and the circuit board, the support housing is provided with a plurality of hollow portions, and two sides of the support housing in a penetrating direction of the hollow portions are respectively opposite to the power tube and the circuit board.
3. The power tube heat dissipation structure of claim 2, wherein the circuit board has a plurality of through holes corresponding to the hollow portions, elastic posts are inserted into the through holes, the diameter of each elastic post is smaller than that of each through hole, and one end of each elastic post passes through the hollow portion and abuts against the power tube, and the other end of each elastic post abuts against a pressing plate disposed on one side of the circuit board away from the support housing.
4. The power tube heat dissipation structure of claim 3, wherein a side of the support housing close to the circuit board is provided with a position-limiting post and a buckle, the circuit board is correspondingly provided with a positioning hole and a mounting hole, the position-limiting post is engaged with the positioning hole, and the buckle is engaged with the mounting hole.
5. The power tube heat dissipation structure of claim 4, wherein the length of the limiting posts and the clips is greater than the thickness of the circuit board, so that a gap is formed between the pressure plate and the circuit board.
6. The power tube heat dissipation structure of claim 1, wherein the heat sink is provided with a limiting boss for limiting the ceramic substrate.
7. The power tube heat dissipation structure according to claim 3, wherein an adhesive is disposed between the elastic column and the power tube.
8. The power tube heat dissipation structure of claim 3 or 5, wherein the pressure plate is provided with a through hole, the heat sink is correspondingly provided with a screw hole, and a connecting member passes through the through hole and the screw hole to fixedly connect the pressure plate and the heat sink.
9. The power tube heat dissipation structure of claim 1, wherein the heat sink is an air-cooled heat sink or a liquid-cooled heat sink.
10. A controller, characterized by comprising the power tube heat dissipation structure of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921301215.1U CN210470133U (en) | 2019-08-12 | 2019-08-12 | Power tube heat radiation structure and controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921301215.1U CN210470133U (en) | 2019-08-12 | 2019-08-12 | Power tube heat radiation structure and controller |
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| Publication Number | Publication Date |
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| CN210470133U true CN210470133U (en) | 2020-05-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921301215.1U Active CN210470133U (en) | 2019-08-12 | 2019-08-12 | Power tube heat radiation structure and controller |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114828442A (en) * | 2022-02-15 | 2022-07-29 | 上海电气集团股份有限公司 | Method for installing IGBT module and radiator based on PCB connection |
| WO2024098761A1 (en) * | 2022-11-07 | 2024-05-16 | 华为数字能源技术有限公司 | Charging device and charging system |
-
2019
- 2019-08-12 CN CN201921301215.1U patent/CN210470133U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114828442A (en) * | 2022-02-15 | 2022-07-29 | 上海电气集团股份有限公司 | Method for installing IGBT module and radiator based on PCB connection |
| WO2024098761A1 (en) * | 2022-11-07 | 2024-05-16 | 华为数字能源技术有限公司 | Charging device and charging system |
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Address after: E206-2, R & D building, building e, HUanpu science and Technology Industrial Park, 211 tianguba Road, high tech Zone, Xi'an City, Shaanxi Province, 710000 Patentee after: Xi'an Telai Intelligent Charging Technology Co.,Ltd. Address before: E206-2, R & D building, building e, HUanpu science and Technology Industrial Park, 211 tianguba Road, high tech Zone, Xi'an City, Shaanxi Province, 710000 Patentee before: XI'AN TGOOD INTELLIGENT CHARGING TECHNOLOGY Co.,Ltd. |