CN214125853U - Power module heat radiation structure - Google Patents

Abstract

The utility model discloses a power module heat radiation structure, include: the circuit board is placed in the box body, the power tube is fixed on the circuit board, and the radiator is fixed on the outer side of the box body; wherein, the radiator is provided with places the chamber and with place the opening of chamber intercommunication, the power tube is placed in placing the intracavity through the opening, and the power tube is fixed on placing the inner wall in chamber. The utility model discloses an among the power module heat radiation structure, the radiator is provided with places the chamber, and the power tube is located places the intracavity and fixes on the inner wall of placing the chamber for the whole chamber of placing dispels the heat to the power tube, compares than current heating panel, has effectively increased heat radiating area, has improved the radiating effect.

Description

Power module heat radiation structure

Technical Field

The utility model relates to a power module heat dissipation technical field, more specifically say, relate to a power module heat radiation structure.

Background

The power module is a main element of the electronic device, and is also a heating element, and the power module needs to be radiated to ensure normal operation. Specifically, the power module mainly comprises a circuit board and a power tube, wherein pins of the power tube penetrate through the circuit board.

At present, in order to dissipate heat from a power module, a power tube is fixed to a heat sink. Specifically, the heat sink is usually a heat dissipation plate, which has a small heat dissipation area and a poor heat dissipation effect.

In addition, in the heat dissipation structure of the conventional power tube, the circuit board cannot be isolated from the outside, so that the protection level of the circuit board is low, and the safety and reliability are poor.

In summary, how to design the heat dissipation of the power tube to increase the heat dissipation area and improve the heat dissipation effect is a problem to be solved urgently by those skilled in the art.

SUMMERY OF THE UTILITY MODEL

In view of this, the present invention provides a heat dissipation structure of a power module to increase the heat dissipation area and improve the heat dissipation effect.

In order to achieve the above object, the utility model provides a following technical scheme:

a power module heat dissipation structure comprising: the circuit board is placed in the box body, the power tube is fixed on the circuit board, and the radiator is fixed on the outer side of the box body;

the radiator is provided with a placing cavity and an opening communicated with the placing cavity, the power tube is placed in the placing cavity through the opening, and the power tube is fixed on the inner wall of the placing cavity.

Preferably, the power tube is vertically disposed on the circuit board, and the circuit board is covered on the opening.

Preferably, the power module heat dissipation structure further comprises an elastic pressing member capable of being fixedly connected with the heat sink, and the power tube is pressed on the inner wall of the placement cavity through the elastic pressing member.

Preferably, the heat sink and/or the box body are fixedly connected with the circuit board;

the elastic pressing piece can be fixedly connected with the circuit board, and the fixed connection of the elastic pressing piece and the circuit board can be released under the action of external force;

after the elastic pressing piece is fixedly connected with the circuit board and is released, the elastic pressing piece can move towards the placing cavity by being pressed by external force and can press the power tube on the inner wall of the placing cavity.

Preferably, when the elastic pressing piece is fixedly connected with the circuit board, the elastic pressing piece is contacted with the power tube.

Preferably, the elastic pressing member includes: the auxiliary part can be fixedly connected with the circuit board, and the pressing part is used for being pressed by external force;

the circuit board is provided with a first abdicating structure for exposing the pressing part, and the auxiliary part can be separated from the circuit board when the pressing part is pressed by external force; when the elastic pressing piece presses the power tube on the inner wall of the placing cavity, the pressing part can be fixedly connected with the radiator.

Preferably, the circuit board and/or the heat sink is provided with a mounting post, the mounting post is located between the circuit board and the heat sink, and the circuit board and the heat sink are fixedly connected through the mounting post.

Preferably, one of the circuit board and the heat sink is provided with a guide, and the other is provided with a guide hole which is engaged with the guide.

Preferably, the elastic pressing piece can be fixedly connected with the circuit board through bonding.

Preferably, there is one elastic pressing member in each placing cavity, and the elastic pressing member can press one row of power tubes or two rows of power tubes against the inner wall of the placing cavity.

Preferably, the opening is provided only at one end of the heat sink for fixedly connecting with the case.

Preferably, the heat sink is fixedly connected with the circuit board; the box body is provided with a through hole opposite to the opening, and the power tube and a connecting piece fixedly connected with the radiator and the circuit board penetrate through the through hole.

Preferably, the heat sink is fixedly connected with the circuit board; the box is provided with the second structure of stepping down and with the through-hole that the opening is relative, the power tube passes the through-hole, fixed connection the radiator with the connecting piece of circuit board passes the second structure of stepping down.

Preferably, the power module heat dissipation structure further includes an insulating heat conduction gasket disposed on the inner wall of the placement cavity, and the power tube is connected to the inner wall of the placement cavity through the insulating heat conduction gasket.

Preferably, the power module heat dissipation structure further includes a heat conduction layer disposed between the heat sink and the insulating heat conduction pad.

Preferably, one of the insulating and heat conducting gasket and the heat sink is provided with a limiting member, and the other is provided with a limiting hole matched with the limiting member.

Preferably, the power module heat dissipation structure further includes an elastic pressing member, and the elastic pressing member includes: the pressing part is arranged on two sides of the connecting part;

the connecting part can be fixedly connected with the radiator, and the power tube is pressed on the radiator through the pressing part on at least one side of the connecting part;

the number of the pressing parts on each side of the connecting part is at least two, and the pressing parts are sequentially distributed along the length direction of the connecting part; the pressing parts are positioned on the same side, and a gap is formed between every two adjacent pressing parts;

the pressing portion extends towards the same side of the connecting portion and is located on two sides of the connecting portion.

Preferably, both ends and the middle part of the connecting part can be fixedly connected with the radiator.

Preferably, the heat sink is provided with a sealing member for sealing connection with the case, the sealing member being located at a periphery of the opening.

The utility model provides an among the power module heat radiation structure, the radiator is provided with places the chamber, and the power tube is located places the intracavity and fixes on the inner wall of placing the chamber for the whole chamber of placing dispels the heat to the power tube, compares with current heating panel, has effectively increased heat radiating area, has improved the radiating effect.

And simultaneously, the utility model provides an among the power module heat radiation structure, because the radiator is located the outside of box, then can accelerate the heat dissipation of radiator, improved the radiating effect.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

Fig. 1 is an exploded view of a structure of a heat dissipation structure of a power module according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of the connection between the elastic pressing member and the circuit board in the heat dissipation structure of the power module shown in fig. 1;

fig. 3 is a schematic structural diagram of the connection between the elastic pressing member and the heat sink in the heat dissipation structure of the power module shown in fig. 1;

fig. 4 is a partial structural schematic view of the heat dissipation structure of the power module shown in fig. 1;

fig. 5 is an exploded view of another structure of a heat dissipation structure of a power module according to an embodiment of the present invention;

fig. 6 is a schematic structural view illustrating the connection between the elastic pressing member and the heat sink in the heat dissipation structure of the power module shown in fig. 5;

fig. 7 is a schematic structural view of an elastic pressing member in a heat dissipation structure of a power module according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1, an embodiment of the present invention provides a power module heat dissipation structure, including: a circuit board 1 for being placed in the case 4, a power tube 2 fixed on the circuit board 1, and a heat sink 6 for being fixed outside the case 4; wherein, radiator 6 is provided with places chamber 15 and with placing the opening of chamber 15 intercommunication, and power tube 2 places in placing chamber 15 through this opening, and power tube 2 fixes on the inner wall of placing chamber 15.

In the heat dissipation structure of the power module provided by the embodiment of the utility model, the heat sink 6 is provided with the placing cavity 15, and the power tube 2 is positioned in the placing cavity 15 and fixed on the inner wall of the placing cavity 15, so that the whole placing cavity 15 dissipates heat of the power tube 2, and compared with the existing heat dissipation plate, the heat dissipation area is effectively increased, and the heat dissipation effect is improved; meanwhile, the radiator 6 is positioned on the outer side of the box body 4, so that the heat dissipation of the radiator 6 can be accelerated, and the heat dissipation effect is improved.

In the above-described heat dissipation structure of the power module, the power tube 2 is usually fixed on the circuit board 1 and then assembled with the heat sink 6. Specifically, the pins of the power tube 2 pass through the circuit board 1 and the pins are soldered on the circuit board 1. In order to improve stability, the circuit board 1 is fixedly connected to the heat sink 6. The fixing structures of the two are selected according to actual needs. For the convenience of detachment, the circuit board 1 is preferably detachably fixed to the heat sink 6, and for example, the circuit board 1 is fixed to the heat sink 6 by first screws 13. Of course, the detachable fixed connection may also be realized by clamping or other methods, which is not limited in this embodiment.

In the practical application process, the circuit board 1 may also be selected to be fixedly connected with the box body 4, and the specific structure of the fixed connection is selected according to the practical requirement, which is not limited in this embodiment.

The specific fixing manner of the heat sink 6 and the box 4 is selected according to actual needs, for example, the box 4 is fixedly connected to the connecting end of the heat sink 6 through a third screw 10 or a clamping structure, which is not limited in this embodiment.

In fig. 1 to 6, only a part of the case 4 is shown. The type of the circuit board 1 is selected according to actual needs, for example, the circuit board 1 is a printed circuit board, which is not limited in this embodiment. The box 4 may be a sheet metal part, or may be made of other materials, which is not limited in this embodiment.

In order to facilitate the arrangement of the power tube 2 and the circuit board 1, it is preferable that the power tube 2 is vertically arranged on the circuit board 1, and the circuit board 1 is covered on the opening. In the practical application process, the power tube 2 may also be parallel to the circuit board 1, which is not limited in this embodiment.

In the structure, the power tubes 2 are vertically arranged on the circuit board 1, so that the utilization rate of the circuit board 1 is improved, and meanwhile, the fixing of the power tubes 2 in multiple rows can be realized.

In the above power module fixing structure, the power tube 2 is fixed on the inner wall of the placing cavity 15. Specifically, the power tube 2 may be fixed on the inner wall of the placing cavity 15 by a screw, a snap structure, or a pressing member, etc. When the power tube 2 is perpendicular to the circuit board 1, in order to fix the power tube 2, it is preferable that the heat dissipation structure of the power module further includes an elastic pressing member 3 capable of being fixedly connected to the heat sink 6, and the power tube 2 is pressed against the inner wall of the placement cavity 15 by the elastic pressing member 3.

In order to fix the power tube 2 by the elastic pressing member 3, preferably, the heat sink 6 and/or the case 4 are fixedly connected to the circuit board 1; the elastic pressing piece 3 can be fixedly connected with the circuit board 1, and the fixed connection between the elastic pressing piece 3 and the circuit board 1 can be released under the action of external force; after the elastic pressing piece 3 is released from the fixed connection with the circuit board 1, the elastic pressing piece 3 can move in the placing cavity 15 by being pressed by an external force and presses the power tube 2 on the inner wall of the placing cavity 15.

Specifically, the power tube 2 and the circuit board 1 are fixedly connected, the elastic pressing member 3 is fixed on the circuit board 1, and then the power tube 2 and the elastic pressing member 3 on the circuit board 1 are placed in the placing cavity 15, as shown in fig. 2; then the external force effect elasticity compresses tightly piece 3, removes the fixed connection that elasticity compressed tightly piece 3 and circuit board 1 for elasticity compressed tightly piece 3 breaks away from circuit board 1, and final elasticity compressed tightly piece 3 falls on the diapire of placing chamber 15, can fixed connection elasticity compressed tightly piece 3 and place the inner wall of chamber 15, as shown in fig. 3.

The fixed connection structure of the inner wall of the placing cavity 15 and the elastic pressing piece 3 is selected according to actual requirements. For example, the inner wall of the placing cavity 15 and the elastic pressing member 3 are fixedly connected through a clamping connection, or the inner wall of the placing cavity 15 and the elastic pressing member 3 are fixedly connected through a screw, etc.

Specifically, if the above-mentioned inner wall and the elasticity of placing chamber 15 compress tightly piece 3 and pass through the joint fixed connection, then compress tightly piece 3 through pressing elasticity and remove the fixed connection that elasticity compressed tightly piece 3 and circuit board 1, and compress tightly piece 3 through pressing elasticity and realize the joint that elasticity compressed tightly piece 3 and the inner wall of placing chamber 15. If the inner wall of the placing cavity 15 is fixedly connected with the elastic pressing piece 3 through a screw, the circuit board 1 is provided with a yielding hole 102 for a screw to pass through, and the yielding hole 102 and the first mounting hole 301 for the screw to pass through on the elastic pressing piece 3 are provided. In particular, the screw is a second screw 12.

In order to release the fixed connection between the elastic pressing piece 3 and the circuit board 1, the fixed connection between the elastic pressing piece 3 and the circuit board 1 is released by pressing the elastic pressing piece 3.

Among the above-mentioned power module heat radiation structure, elasticity compresses tightly piece 3 and can be through being pressed by external force to placing the intracavity 15 and compressing tightly power tube 2 on the inner wall of placing the chamber 15, and it can be understood that, above-mentioned elasticity compresses tightly piece 3 and has elasticity, and elasticity compresses tightly piece 3 and is pressed to placing the intracavity 15 removal in-process by external force, and elasticity compresses tightly piece 3 and takes place deformation to can compress tightly power tube 2 on the inner wall of placing the chamber 15. For the specific structure of the elastic pressing member 3, reference is made to the following description.

In order to increase the deformation of the elastic pressing member 3, it is preferable that the elastic pressing member 3 is in contact with the power transistor 2 when the elastic pressing member 3 is fixedly coupled to the circuit board 1.

In practical applications, the elastic pressing member 3 and the power tube 2 may not contact each other when the elastic pressing member 3 is fixedly connected to the circuit board 1, and the present invention is not limited to the above definition.

In order to facilitate the pressing, as shown in fig. 7, the elastic pressing member 3 includes: an auxiliary portion 302 capable of being fixedly connected with the circuit board 1, and a pressing portion 304 for being pressed by an external force; the circuit board 1 has a first avoiding structure 101 for exposing the pressing portion 304, and the auxiliary portion 302 can be separated from the circuit board 1 when the pressing portion 304 is pressed by an external force. It can be understood that the auxiliary portion 302 and the pressing portion 304 are fixedly connected.

It should be noted that, during the pressing process, the whole elastic pressing member 3 moves toward the bottom wall of the placing cavity 15. For stability, the pressing portion 304 is preferably fixedly connected to the heat sink 6. Specifically, the pressing portion 304 is fixedly connected to the heat sink 6 when the pressing portion 304 is pressed to the set position.

The fixing connection structure of the pressing portion 304 and the heat sink 6 is selected according to actual needs, for example, by clamping or connecting through a threaded connector. For the convenience of fixing, the pressing portion 304 can be fixed to the heat sink 6 by a second screw 12. The first abdicating structure 101 described above provides a space for placing and fastening the second screw 12. It is understood that the above-described heat sink 6 is provided with second mounting holes 306 into which the second screws 12 are inserted.

In order to ensure that the elastic pressing member 3 is uniformly stressed during the pressing process, it is preferable that the pressing portions 304 are two and located at two ends of the entire elastic pressing member 3.

In order to press the elastic pressing piece 3 conveniently, the circuit board 1 and/or the heat sink 6 are provided with mounting columns 8, the mounting columns 8 are positioned between the circuit board 1 and the heat sink 6, and the circuit board 1 and the heat sink 6 are fixedly connected through the mounting columns 8. In this way, the pressing stroke is increased, the deformation of the elastic pressing piece 3 is increased, the elastic pressing piece 3 is easier to press, and the safety distance from the circuit board 1 to the radiator 6 and the safety distance from the circuit board 1 to the box body 4 are also ensured; at the same time, it is also convenient to fixedly connect the circuit board 1 and the heat sink 6.

It will be appreciated that when the heat sink 6 is provided with mounting posts 8, the mounting posts 8 are located at the connection ends of the heat sink 6. For ease of installation, the mounting posts 8 are preferably provided only on the heat sink 6. The height, number and distribution of the mounting posts 8 are selected according to actual needs, and this embodiment is not limited to this.

In this case, for the sake of fixing, it is preferable that the circuit board 1 and the heat sink 6 are fixedly connected by first screws 13, and screw holes are provided in the mounting posts 8.

When the circuit board 1 and/or the heat sink 6 is provided with the mounting posts 8, the circuit board 1 is likely to be displaced due to an assembly error. To facilitate the assembly of the circuit board 1 and the heat sink 6, it is preferable that one of the circuit board 1 and the heat sink 6 is provided with a guide 9, and the other is provided with a guide hole 14 to be fitted with the guide 9.

For convenience of production and manufacture, it is preferable that the above-mentioned guide 9 is provided at the connection end of the heat sink 6 and the above-mentioned guide hole 14 is provided on the circuit board 1.

The number and distribution of the guide members 9 and the guide holes 14 are selected according to actual needs, and this embodiment is not limited to this.

Among the above-mentioned power module heat radiation structure, elasticity compresses tightly piece 3 and can link to each other with circuit board 1 is fixed, and elasticity compresses tightly piece 3 and circuit board 1's fixed phase even and can relieve under the exogenic action. In order to facilitate the above structure, it is preferable that the elastic pressing member 3 be fixedly connected to the circuit board 1 by adhesion. In this case, the auxiliary surface 302 is preferably a flat surface for easy fixing. Specifically, the elastic pressing member 3 can be fixedly connected to the circuit board 1 through a double-sided adhesive tape 11 or a fixing glue, for example, the double-sided adhesive tape 11 is a 3M adhesive tape.

In the practical application process, the elastic pressing member 3 may also be selected to be fixedly connected with the circuit board 1 by magnetic force, or other manners may also be selected to fixedly connect the elastic pressing member 3 and the circuit board 1, which is not limited in this embodiment.

In the above power module heat dissipation structure, one row of power tubes 2 may be placed in the placing cavity 15, and two rows of power tubes 2 may also be placed, and are selected as required. The number of the placing cavities 15 of the heat sink 6 may be one, or may be two or more, and is selected according to the number of rows of the power tubes 2 on the circuit board 1 and the number of the circuit boards 1, which is not limited in this embodiment.

For the sake of simple installation, preferably, one elastic pressing member 3 is disposed in each placing cavity 15, and the elastic pressing member 3 can press one row of power tubes 2 or two rows of power tubes 2 against the inner wall of the placing cavity 15. Specifically, if the power tubes 2 in the placing cavity 15 are arranged in a row, an elastic pressing member 3 in the placing cavity 15 presses the row of power tubes 2 against the inner wall of the placing cavity 15; if there are two rows of power tubes 2 in the placing cavity 15, an elastic pressing member 3 in the placing cavity 15 presses the two rows of power tubes 2 against the inner wall of the placing cavity 15.

In order to improve the protection performance, the opening is preferably provided only at one end of the heat sink 6 for fixedly connecting with the case 4. It will be appreciated that the power tube 2 is inserted into the placement chamber 15 through the opening and secured.

The opening is only arranged at one end of the radiator 6, and other surfaces are of a closed structure, so that the probability that foreign matters such as water and dust enter the box body 4 through the opening is reduced, and the protective performance is effectively improved.

In the above heat dissipation structure of the power module, if the heat sink 6 is fixedly connected to the circuit board 1, for the convenience of installation, it is preferable that the case 4 is provided with a through hole 401 opposite to the opening, and the power tube 2 and the connector fixedly connecting the heat sink 6 and the circuit board 1 are all passed through the through hole 401, as shown in fig. 1 to 4. It is understood that the inner wall of the through-hole 401 is located at the periphery of the opening.

It is understood that when the heat sink 6 is provided with the mounting posts 8 and the guides 9, the mounting posts 8 and the guides 9 each pass through the through-holes 401.

Of course, other ways of fixedly connecting the heat sink 6 and the circuit board 1 may be alternatively implemented. Specifically, as shown in fig. 5 and 6, the case 4 is provided with a second avoiding structure 402 and a through hole 401 opposite to the opening, the power tube 2 passes through the through hole 401, and a connector fixedly connecting the heat sink 6 and the circuit board 1 passes through the second avoiding structure 402. The specific structure and number of the second yielding structures 402 are selected according to actual needs, which is not limited in this embodiment.

It will be appreciated that when the heat sink 6 is provided with mounting posts 8, the mounting posts 8 pass through the second yielding structure 402. When the heat sink 6 is provided with the guide 9, the box 4 is further provided with a third relief structure 403 for the guide 9 to pass through.

In the heat dissipation structure of the power module, the power tube 2 is directly contacted with the inner wall of the placing cavity 15, so that electric leakage is easy to occur. In order to improve the safety performance, preferably, the power module heat dissipation structure further includes an insulating heat conduction gasket 7 disposed on an inner wall of the placement cavity 15, and the power tube 2 is connected to the inner wall of the placement cavity 15 through the insulating heat conduction gasket 7. In order to ensure heat dissipation, the insulating and heat-conducting gasket 7 can transfer the heat of the power tube 2 to the inner wall of the placing cavity 15.

The material and size of the insulating and heat-conducting pad 7 are selected according to actual needs, for example, the insulating and heat-conducting pad 7 covers all inner walls of the placing cavity 15, and the insulating and heat-conducting pad 7 is a ceramic pad, which is not limited in this embodiment.

Further, the power module heat dissipation structure further includes a heat conduction layer disposed between the heat sink 6 and the insulating heat conduction pad 7. Thus, the heat conduction layer can fill the gap between the radiator 6 and the insulating heat conduction gasket 7, thereby improving the heat conduction efficiency and the heat radiation efficiency.

The specific material of the heat conduction layer is selected according to actual needs. In order to position the insulating and heat-conducting pad 7, the heat-conducting layer is preferably adhesive, and is, for example, a heat-conducting silicone layer. Thus, the heat conduction layer increases the heat conduction efficiency, and meanwhile, the heat conduction layer has certain adhesiveness, so that the insulating heat conduction gasket 7 can be kept to be erected and not fall.

In order to avoid the movement of the insulating and heat-conducting pad 7, it is preferable that one of the insulating and heat-conducting pad 7 and the heat sink 6 is provided with a limiting member 16, and the other is provided with a limiting hole engaged with the limiting member 16, as shown in fig. 4. It is understood that if the limiting member 16 is disposed on the heat sink 6, the limiting hole is located in the placing cavity 15; if the limiting hole is arranged on the heat sink 6, the limiting piece 16 is located in the placing cavity 15.

For the convenience of installation, it is preferable that the above-mentioned stopper 16 is provided on the heat sink 6, and the stopper 16 is located on the bottom wall of the placing cavity 15.

In practical applications, the limiting members 16 may be distributed in other manners, and are not limited to the above limitations.

In the power module heat dissipation structure, the power tube 2 is fixed on the inner wall of the placing cavity 15. In order to facilitate the fixing and reduce the influence of the space between the two rows of power on the fixing of the power tube 2, it is preferable that the power module heat dissipation structure further includes an elastic pressing member 3, as shown in fig. 7, where the elastic pressing member 3 includes: a connecting portion 303, and pressing portions 305 provided on both sides of the connecting portion 303; the connection portion 303 can be fixedly connected to the heat sink 6, and the power tube 2 is pressed against the heat sink 6 by the pressing portion 305 on at least one side of the connection portion 303.

Specifically, if there is a row of power tubes 2 in the placing cavity 15, the pressing portion 305 on one side of the connecting portion 303 presses the row of power tubes 2 against the inner wall of the placing cavity 15, and the pressing portion 305 on the other side of the connecting portion 303 abuts against the inner wall of the placing cavity 15; if there are two rows of power tubes 2 in the placing cavity 15, the pressing portion 305 on one side of the connecting portion 303 presses one row of power tubes 2 against the inner wall of the placing cavity 15, and the pressing portion 305 on the other side of the connecting portion 303 presses the other row of power tubes 2 against the inner wall of the placing cavity 15.

The elastic pressing piece 3 can independently press the pair of power tubes 2 or one power tube 2, so that pressing force difference caused by flatness of the inner wall of the placing cavity 15 and different thicknesses of the power tubes 2 is avoided, and fixing of the power tubes 2 which are staggered mutually can be realized. Moreover, the elastic pressing piece 3 effectively reduces the influence of the height unevenness caused by the deformation of the circuit board 1 and the welding of the power tube 2 on the fixation of the power tube 2, and the power tube 2 reduces the tension in the vertical direction while being horizontally pressed, thereby prolonging the service life of the power tube 2.

In the elastic pressing member 3, the position of the pressing portion 305 on the connecting portion 303 can be set appropriately according to the position of the power tube 2.

The elastic pressing piece 3 can press only one power tube 2, and can also press more than two power tubes 2 simultaneously. In order to reduce the number of parts and simplify the installation, it is preferable that at least two pressing portions 305 are provided on each side of the connecting portion 303, and are sequentially distributed along the length direction of the connecting portion 303; in the pressing portions 305 located on the same side, a gap is provided between two adjacent pressing portions 305.

Above-mentioned elasticity compresses tightly piece 3 and has elasticity, to the concrete structure that above-mentioned elasticity compressed tightly piece 3, selects according to actual need. In order to facilitate the pressing of the power tube 2, it is preferable that the pressing portions 305 on both sides of the connecting portion 303 extend toward the same side of the connecting portion 303, and the pressing portions 305 on both sides of the connecting portion 303 are spaced apart from each other from the connecting portion 303.

Of course, the pressing portions 305 on both sides of the connecting portion 303 may be selected to be close to each other from the connecting portion 303, and are not limited to the above embodiment.

In the elastic pressing member 3, the connection portion 303 can be fixedly connected to the heat sink 6, and specifically, both ends and/or a middle portion of the connection portion 303 can be fixedly connected to the heat sink 6. To improve the stability, both ends and the middle portion of the connecting portion 303 are preferably fixedly connected to the heat sink 6.

For convenience of mounting and dismounting, the connecting portion 303 can be detachably and fixedly connected with the heat sink 6, for example, the connecting portion 303 and the heat sink 6 can be fixedly connected by the second screw 12.

Specifically, a first mounting hole 301 through which the second screw 12 passes is formed in the middle of the connecting portion 303, and second mounting holes 306 through which the second screw 12 passes are formed in both ends of the connecting portion 303.

In the power module fixing structure, when the elastic pressing member 3 includes the auxiliary portion 302 and the pressing portion 304, the auxiliary portion 302 is a part of the pressing portion 305 and the auxiliary portion 302 is located at the top of the pressing portion 305, for example, the auxiliary portion 305 is formed by bending the top of the pressing portion 305; the pressing portions 304 are a part of the connecting portion 303, the pressing portions 304 are located at two ends of the connecting portion 303, and the second mounting holes 306 are disposed on the pressing portions 304.

The pressing portion 304 is located at the tip of the connecting portion 303, and the pressing portion 304 is higher than the tip of the pressing portion 305. For the convenience of fixing, the bottom surface and the top surface of the connecting portion 303 are preferably flat, and specifically, the bottom surface of the connecting portion 303, the pressing portion 304, and the auxiliary portion 302 are all flat.

For the convenience of production and simplified installation, the elastic pressing member 3 is preferably of a one-piece structure. For example, the elastic pressing member 3 is a sheet metal member or an injection molded member, which is not limited in this embodiment.

In order to increase the protection level, the above-mentioned connection end is preferably provided with a seal 5 for sealing connection with the case 4, the seal 5 being located at the periphery of the opening. Like this, realized radiator 6 and box 4's sealing connection for circuit board 1 keeps apart with the external world, has avoided foreign matter such as water, dust to get into in the box 4, has avoided damaging circuit board 1 in the box 4, has effectively improved barrier propterty and protection level.

Specifically, the heat sink 6 is provided with a groove, and the sealing member 5 is fixed in the groove by adhesion so as to ensure sealing.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (19)

1. A power module heat dissipation structure, comprising: the circuit board (1) is placed in the box body (4), the power tube (2) is fixed on the circuit board (1), and the radiator (6) is fixed on the outer side of the box body (4);

the radiator (6) is provided with a placing cavity (15) and an opening communicated with the placing cavity (15), the power tube (2) is placed in the placing cavity (15) through the opening, and the power tube (2) is fixed on the inner wall of the placing cavity (15).

2. The power module heat dissipation structure according to claim 1, wherein the power tube (2) is vertically disposed on the circuit board (1), and the circuit board (1) is disposed on the opening in a covering manner.

3. The power module heat dissipation structure of claim 2, further comprising an elastic pressing member (3) capable of being fixedly connected with the heat sink (6), wherein the power tube (2) is pressed against the inner wall of the placement cavity (15) through the elastic pressing member (3).

4. The power module heat dissipation structure of claim 3,

the radiator (6) and/or the box body (4) are fixedly connected with the circuit board (1);

the elastic pressing piece (3) can be fixedly connected with the circuit board (1), and the fixed connection between the elastic pressing piece (3) and the circuit board (1) can be released under the action of external force;

after the elastic pressing piece (3) is fixedly connected with the circuit board (1) and is released, the elastic pressing piece (3) can move towards the placing cavity (15) by being pressed by external force and press the power tube (2) on the inner wall of the placing cavity (15).

5. The power module heat dissipation structure according to claim 4, wherein the elastic pressing member (3) is in contact with the power tube (2) when the elastic pressing member (3) is fixedly connected to the circuit board (1).

6. The power module heat dissipation structure according to claim 4, wherein the elastic pressing member (3) includes: an auxiliary portion (302) capable of being fixedly connected with the circuit board (1), and a pressing portion (304) for being pressed by an external force;

the circuit board (1) is provided with a first abdicating structure (101) for exposing the pressing part (304), and the auxiliary part (302) can be separated from the circuit board (1) when the pressing part (304) is pressed by an external force; when the elastic pressing piece (3) presses the power tube (2) on the inner wall of the placing cavity (15), the pressing part (304) can be fixedly connected with the radiator (6).

7. The power module heat dissipation structure according to claim 4, wherein the circuit board (1) and/or the heat sink (6) is provided with a mounting post (8), the mounting post (8) is located between the circuit board (1) and the heat sink (6), and the circuit board (1) and the heat sink (6) are fixedly connected through the mounting post (8).

8. The power module heat dissipation structure according to claim 7, wherein one of the circuit board (1) and the heat sink (6) is provided with a guide (9), and the other is provided with a guide hole (14) that fits the guide (9).

9. The power module heat dissipation structure according to claim 4, wherein the elastic pressing member (3) is fixedly connected to the circuit board (1) by adhesion.

10. The power module heat dissipation structure according to claim 3, wherein there is one elastic pressing member (3) in each placement cavity (15), and the elastic pressing member (3) can press one row of the power tubes (2) or two rows of the power tubes (2) against the inner wall of the placement cavity (15).

11. The power module heat dissipation structure according to claim 1, wherein the opening is provided only at one end of the heat sink (6) for fixed connection with the case (4).

12. The power module heat dissipation structure according to claim 1, wherein the heat sink (6) is fixedly connected to the circuit board (1), the case (4) is provided with a through hole (401) opposite to the opening, and the power tube (2) and a connector fixedly connecting the heat sink (6) and the circuit board (1) pass through the through hole (401).

13. The power module heat dissipation structure of claim 1, wherein the heat sink (6) and the circuit board (1) are fixedly connected, the box (4) is provided with a second yielding structure (402) and a through hole (401) opposite to the opening, the power tube (2) passes through the through hole (401), and a connecting piece fixedly connected with the heat sink (6) and the circuit board (1) passes through the second yielding structure (402).

14. The power module heat dissipation structure according to claim 1, further comprising an insulating heat conduction gasket (7) disposed on an inner wall of the placement cavity (15), wherein the power tube (2) is connected with the inner wall of the placement cavity (15) through the insulating heat conduction gasket (7).

15. The power module heat dissipation structure of claim 14, further comprising a thermally conductive layer disposed between the heat sink (6) and the insulating thermally conductive pad (7).

16. The power module heat dissipation structure according to claim 14, wherein one of the insulating heat conductive pad (7) and the heat sink (6) is provided with a stopper (16), and the other is provided with a stopper hole engaged with the stopper (16).

17. The power module heat dissipation structure according to claim 1, further comprising an elastic pressing member (3), the elastic pressing member (3) comprising: a connecting part (303) and pressing parts (305) arranged on two sides of the connecting part (303);

wherein the connecting part (303) can be fixedly connected with the radiator (6), and the power tube (2) is pressed on the radiator (6) through the pressing part (305) on at least one side of the connecting part (303);

the number of the pressing parts (305) on each side of the connecting part (303) is at least two, and the pressing parts are sequentially distributed along the length direction of the connecting part (303); the pressing parts (305) on the same side have a gap between every two adjacent pressing parts (305);

the pressing parts (305) extend towards the same side of the connecting part (303), and the pressing parts (305) located on two sides of the connecting part (303) are far away from the connecting part (303).

18. The power module heat dissipation structure according to claim 17, wherein both ends and a middle portion of the connection portion (303) are fixedly connectable to the heat sink (6).

19. The power module heat dissipation structure according to any one of claims 1 to 18, wherein the heat sink (6) is provided with a seal (5) for sealing connection with the case (4), the seal (5) being located at a periphery of the opening.

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