CN218512784U - DMD installation and heat radiation structure and projection ray apparatus - Google Patents

Abstract

The utility model relates to a DMD installation and heat radiation structure and projection ray apparatus, DMD installation and heat radiation structure are including installation base member, DMD, heat conduction pad and clamp plate, are equipped with DMD mounting groove and heat conduction pad mounting groove on the installation base member, DMD inlays and locates the DMD mounting groove, and the heat conduction pad sets up in the heat conduction pad mounting groove, and the medial surface of heat conduction pad is laminated with the lateral surface of DMD, and clamp plate fixed connection is on the installation base member, and the partial medial surface of clamp plate is laminated with the lateral surface of heat conduction pad; the pressure plate includes a plate-shaped pressure-bonding section and a plate-shaped main body section that are displaced from each other in the inward-outward direction, and the pressure-bonding section and the main body section are connected by a connecting section. The pressing part and the main body part which are staggered with each other are arranged, so that the pressing part and the main body part are connected through the connecting part, the structural strength of the pressing plate is integrally enhanced, the pressing part is prevented from bending and deforming after the pressing plate is fixed on an installation base body, and heat on the DMD can be smoothly conducted to the pressing plate.

Description

DMD installation and heat radiation structure and projection ray apparatus

Technical Field

The utility model relates to a DMD installation technical field, in particular to DMD installation and heat radiation structure and projection ray apparatus.

Background

Among the current projection ray apparatus, DMD carries out the location with the circuit board through the mount pad and is connected, the outside of circuit board sets up the clamp plate, the clamp plate is with DMD, mount pad and circuit board are fixed on the ray apparatus shell, the fin is set up again in the outside of clamp plate, the middle part of circuit board and the middle part of mount pad all are equipped with logical groove and form the heat dissipation passageway jointly, be equipped with the heat conduction post that extends to DMD one side on the fin, the heat conduction post passes this heat dissipation passageway and the laminating of the lateral surface of DMD, heat on the DMD directly dispels the heat to the fin through the heat conduction post. The above arrangement is only for contact type DMDs.

However, for the DMD with the plugging terminal, since the middle part of the outer side surface of the DMD is provided with the plugging terminal, the heat-conducting column on the heat sink cannot directly contact with the outer side surface of the DMD, and how to dissipate heat for the DMD with the plugging terminal is a technical problem to be solved urgently.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a DMD installation and heat radiation structure and projection ray apparatus derives the heat of DMD through setting up heat conduction pad and clamp plate to through crimping portion and the main part that misplaces each other to the clamp plate setting, make and connect through connecting portion between crimping portion and the main part, thereby wholly strengthened the structural strength of clamp plate, ensure that the clamp plate is fixed back on the installation base member, crimping portion can not take place bending deformation, and then ensure that the heat on the DMD can conduct smoothly to the clamp plate on.

The utility model discloses the technical scheme who adopts does:

a DMD installation and heat dissipation structure comprises an installation base body, a DMD, a heat conduction pad and a pressing plate, wherein a DMD installation groove and a heat conduction pad installation groove are formed in the installation base body, the DMD is embedded in the DMD installation groove, the heat conduction pad is arranged in the heat conduction pad installation groove, the inner side surface of the heat conduction pad is attached to the outer side surface of the DMD, the pressing plate is fixedly connected to the installation base body, and part of the inner side surface of the pressing plate is attached to the outer side surface of the heat conduction pad;

the pressing plate comprises a plate-shaped crimping part and a plate-shaped main body part which are staggered in the inner and outer directions, the crimping part is connected with the main body part through a connecting part, the plane where the crimping part is located is parallel to the plane where the main body part is located, the included angle between the plane where the connecting part is located and the plane where the crimping part is located is 70-110 degrees in the inner and outer directions, the inner side face of the crimping part is located on the inner side of the inner side face of the main body part, the inner side face of the crimping part serves as the partial inner side face of the pressing plate and is attached to the outer side face of the heat conducting pad, and the pressing plate is connected with the installation base body through the main body part.

Preferably, in the inward and outward direction, an orthographic projection of the pressure-bonding section on a plane where an outer side surface of the DMD is located within a range of the outer side surface of the DMD.

Preferably, a first through groove is formed in the heat conducting pad, a second through groove is formed in the middle of the pressing plate, and the first through groove and the second through groove are at least partially overlapped to form a connecting channel in the inner and outer directions, so that the first plug terminal on the DMD is electrically connected to the outside.

Preferably, the second leads to the groove and is the rectangle, the quantity of crimping portion is two, two crimping portion is located respectively one side on two long limits in second through groove, the type of square is personally submitted in the outside of DMD, the length direction on the long limit that the second led to the groove with the length direction of DMD parallels, two crimping portion is in projection on the lateral surface place plane of DMD is located the within range of DMD lateral surface.

Preferably, the heat conduction pad includes a first portion, a second portion, and a third portion, the first portion and the second portion are disposed opposite to each other in a width direction of the heat conduction pad, the first through groove is formed between the first portion and the second portion, one side of the first portion is connected to the same side of the second portion through the third portion, one of the two crimping portions is in crimping fit with the first portion, and the other crimping portion is in crimping fit with the second portion.

Preferably, the main body is provided with a first mounting hole, and a first screw passes through the first mounting hole to be connected with the mounting base.

Preferably, the mounting base is provided with a positioning column, and the main body part is provided with a positioning hole matched with the positioning column.

Preferably, the DMD mounting and heat dissipating structure further comprises a circuit board and a heat sink, the circuit board is disposed outside the pressing plate, the heat sink is disposed outside the circuit board, the heat sink is provided with a second mounting hole, and a second screw passes through the second mounting hole and is connected to the mounting base;

the inner side surface of the radiating fin is further connected with a heat conduction column, the main body portion comprises a first area overlapped with the circuit board and a second area outside the first area, and the heat conduction column is attached to the second area through the outer side of the circuit board.

Preferably, the inner side surface of the radiating fin is connected with foam, and the radiating fin extrudes the circuit board through the foam from outside to inside so as to fix the circuit board between the pressing plate and the radiating fin.

The utility model also provides a projection ray apparatus, including aforementioned DMD installation and heat radiation structure, the installation base member does a part of the ray apparatus shell of projection ray apparatus.

The utility model has the advantages that:

through the clamp plate that sets up the heat conduction pad in the outside of DMD for heat on the DMD can see through the heat conduction pad and conduct to the clamp plate on, dispel the heat through the outside transmission of clamp plate in order to make things convenient for this part heat, thereby solve the heat dissipation problem of the DMD that has plug terminal.

The pressing plate comprises a crimping part, a main body part and a connecting part, wherein the crimping part is staggered in the inner direction and the outer direction, when the pressing plate is fixed on an installation base body, the crimping part is directly contacted with the heat-conducting pad, the reaction force of the heat-conducting pad acts on the crimping part, the middle part of the crimping part tends to bend outwards, but the crimping part is connected with the connecting part, the bending of the crimping part also inevitably causes the bending of the connecting part, the included angle between the plane of the connecting part and the plane of the crimping part is 70-110 degrees, the plane of the connecting part is basically perpendicular to the plane of the crimping part, and the reaction force on the heat-conducting pad is basically parallel to the plane of the crimping part, so that the reaction force on the heat-conducting pad is difficult to bend the connecting part, the connecting part cannot be bent, the connecting part is protected by the connecting part, the crimping part cannot be bent, and the heat on the DMD can be efficiently conducted to the pressing plate through the heat-conducting pad.

Drawings

The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

FIG. 1 is a schematic diagram of a preferred embodiment of a DMD mounting and heat dissipating structure;

FIG. 2 is an exploded view of FIG. 1;

FIG. 3 is an exploded view of the mounting substrate, DMD, thermal pad, and platen;

FIG. 4 is a schematic structural view of a preferred embodiment of a mounting substrate;

FIG. 5 is a schematic view of the components of FIG. 3 after assembly;

FIG. 6 is a first schematic structural view of a platen;

FIG. 7 is a second schematic view of the platen;

FIG. 8 is a schematic view of a thermal pad;

FIG. 9 is an exploded view of the components, circuit board, foam and heat sink shown in FIG. 5;

FIG. 10 is a schematic view of an inside view of a heat sink;

FIG. 11 is a schematic view of a first zone and a second zone on a platen;

fig. 12 is a schematic structural diagram of a projection light engine.

In the figure: 1. installing a base body; 2. DMD; 3. a thermally conductive pad; 4. pressing a plate; 5. a circuit board; 6. soaking cotton; 7. a heat sink; 8. a connecting channel;

11. a DMD mounting groove; 12. a heat conducting pad mounting groove; 13. a positioning column; 14. an optical chassis;

21. a first plug terminal;

31. a first portion; 32. a second portion; 33. a third portion; 34. a first through groove;

41. a first screw; 42. a main body portion; 43. a crimping part; 44. a second through groove; 45. a first mounting hole; 46. positioning holes; 47. a connecting portion; 48. a second region; 49. a first region;

51. a second plug terminal;

71. a second screw; 72. a heat-conducting column; 73. second mounting hole

431. A first crimping part; 432. a second crimping part.

Detailed Description

The present invention will be described below based on examples, but the present invention is not limited to only these examples. In the following detailed description of the present invention, certain specific details are set forth in order to avoid obscuring the spirit of the present invention, well-known methods, procedures, flows, and components have not been described in detail.

Further, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.

Unless the context clearly requires otherwise, throughout the description and the claims, the words "comprise", "comprising", and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is, what is meant is "including, but not limited to".

In the description of the present invention, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the utility model, as shown in fig. 2, one side close to the installation base body is "inside", and one side far away from the installation base body is "outside".

Referring to fig. 1-6, the present invention relates to a DMD mounting and heat dissipating structure, which includes a mounting base 1, a DMD2, a thermal pad 3 and a pressing plate 4, wherein the mounting base 1 is provided with a DMD mounting groove 11 and a thermal pad mounting groove 12, the DMD2 is embedded in the DMD mounting groove 11, the thermal pad 3 is disposed in the thermal pad mounting groove 12, the inner side of the thermal pad 3 is attached to the outer side of the DMD2, the pressing plate 4 is fixedly connected to the mounting base 1, and part of the inner side of the pressing plate 4 is attached to the outer side of the thermal pad 3; the pressing plate 4 comprises a plate-shaped pressing part 43 and a plate-shaped main body part 42 which are staggered in the inner and outer directions, the pressing part 43 is connected with the main body part 42 through a connecting part 47, the plane where the pressing part 43 is located is parallel to the plane where the main body part 42 is located, the included angle between the plane where the connecting part 47 is located and the plane where the pressing part 43 is located is 70-110 degrees, in the inner and outer directions, the inner side surface of the pressing part 43 is located on the inner side of the inner side surface of the main body part 42, the inner side surface of the pressing part 43 serves as part of the inner side surface of the pressing plate 4 to be attached to the outer side surface of the heat conducting pad 3, and the pressing plate 4 is connected with the installation base body 1 through the main body part 42.

Referring to fig. 3 and 5, the pressing plate 4 is fixedly connected to the mounting base 1, and the pressing plate 4 is located outside the thermal pad 3, the pressing plate 4 can fix the DMD2 and the thermal pad 3 to the mounting base 1, specifically, when the pressing plate 4 is fixedly connected to the mounting base 1, the pressing plate 4 presses the thermal pad 3 from outside to inside, so that the thermal pad 3 presses the DMD2 inwards, so that the DMD2 and the thermal pad 3 are relatively stably fixed on the mounting base 1, that is, the position of the DMD2 relative to the mounting base 1 cannot be easily changed. Set up thermal pad 3 and clamp plate 4 through the outside at DMD2 for heat on DMD2 can see through on thermal pad 3 conducts to clamp plate 4, dispel the heat through the outside transmission of clamp plate 4 with this part of heat, thereby solve the heat dissipation problem of DMD2 that has plug terminal.

It can be seen that the pressing plate 4 has two functions, namely, a function of fixing the DMD2 and the heat conducting pad 3 into a whole and a function of conducting heat, and in order to enable the pressing plate 4 to conduct heat efficiently, the thickness (inner and outer directions) of the pressing plate 4 should be relatively limited, so that the pressing plate 4 has certain elasticity. If the pressing plate is flat, when the pressing plate is fixedly connected to the installation base body 1, the left side and the right side of the pressing plate are respectively connected with the installation base body 1 through screws, the inner side surface of the pressing plate can be extruded with the outer side surface of the heat conducting pad 3, meanwhile, the heat conducting pad 3 can exert an outward reaction force on the pressing plate, the middle part (the middle position of the left side and the right side) of the pressing plate is less limited, the pressing plate has certain elasticity, under the reaction force, the middle part of the pressing plate can be bent outwards to deform, the pressing effect of the middle part of the pressing plate and the heat conducting pad 3 is not ideal, certain influence is further caused on the fixation of the DMD2, further, heat on the DMD2 cannot be smoothly conducted to the pressing plate 4, and the fixation and heat dissipation of the DMD2 are influenced.

Referring to fig. 6 and 7, to solve the above problem, in the present invention, the pressure plate 4 includes a crimping portion 43 and a main body portion 42 which are displaced from each other in the inward and outward directions, and a connecting portion 47 which connects the crimping portion 43 and the main body portion 42, when the pressure plate 4 is fixed on the mounting base 1, the crimping portion 43 is directly contacted with the thermal pad 3, and a reaction force on the thermal pad 3 acts on the crimping portion 43, so that the middle portion of the crimping portion 43 tends to bend outward, but since the crimping portion 43 is connected to the connecting portion 47, the bending of the crimping portion 43 inevitably bends the connecting portion 47, an included angle between the plane of the connecting portion 47 and the plane of the crimping portion 43 is 70 ° to 110 °, so that the plane of the connecting portion 47 is substantially perpendicular to the plane of the crimping portion 43, and further the reaction force on the thermal pad 3 is substantially parallel to the plane of the crimping portion 43, the reaction force on the thermal pad 3 hardly bends the connecting portion 47, and since the connecting portion 47 cannot be bent, the connecting portion 47 is protected by the connecting portion 47, the heat of the connecting portion 47, the crimping portion 43 does not bend, thereby ensuring that the pressure plate 43 can be firmly pressed against the crimping portion 3, and heat can be smoothly conducted to the DMD 2.

In a preferred embodiment, the pressing plate 4 may be formed by stamping a plate material, and the main body 42, the crimping portion 43 and the connecting portion 47 are naturally formed by stamping. The processing process of the pressing plate 4 is simplified, and the manufacturing cost of the pressing plate 4 is reduced. In another embodiment, the pressure plate 4 may be welded by the main body portion 42, the crimping portion 43 and the connecting portion 47.

When the pressing plate 4 is formed by punching a plate material, the shape of the plate material is consistent with that of the pressing plate 4, the plate material comprises a main body part area corresponding to the main body part 42 and a pressing part area corresponding to the pressing part 43, the main body part area is fixed during punching, the pressing part area is pressed inwards, so that the pressing part area moves 1-1.5 times of the thickness of the plate material towards the inner side relative to the main body part area, the pressing part 43 and the main body part 42 which are staggered in the inner and outer directions are formed, the connecting part 47 connecting the pressing part 43 and the main body part 42 is naturally formed due to punching, and the fracture of the connecting part 47 cannot be caused due to the limitation of the staggered distance (1-1.5 times of the thickness of the plate material), so that the integrity of the pressing plate 4 is ensured.

In a preferred embodiment, referring to fig. 3, in the inward and outward direction, an orthographic projection of the pressure-bonding part 43 on the plane of the outer surface of the DMD2 is located within the range of the outer surface of the DMD 2. So that the inward pressure on the pressure plate 4 can completely act on the DMD2 through the thermal pad 3, ensuring that the DMD2 is relatively fixed on the mounting substrate 1.

In a preferred embodiment, referring to fig. 3, a first through groove 34 is formed on the thermal pad 3, a second through groove 44 is formed in the middle of the pressure plate 4, and in the inside and outside directions, the first through groove 34 and the second through groove 44 are at least partially overlapped to form a connecting channel 8, so that the first plug terminal 21 on the DMD2 is electrically connected to the outside.

The first through groove 34 and the second through groove 44 form a connecting channel 8 through which the first plug terminal 21 on the outer side of the dmd2 can be connected to the circuit board 5 on the outer side of the pressure plate 4. That is, the inner side surface of the circuit board 5 is provided with the second mating terminal 51 (see fig. 11), the circuit board 5 is arranged outside the pressing plate 4, and the second mating terminal 51 and the first mating terminal 21 are mated through the connection channel 8, so that the operation of the DMD2 can be controlled by the circuit board 5.

In a preferred embodiment, referring to fig. 6, the second through slot 44 is rectangular, the second through slot 44 may be considered to be substantially rectangular, and if the four corners of the second through slot 44 are arc transitions, the rectangular range also includes that the rectangular range, the number of the two press-connection parts 43 is two, the two press-connection parts 43 are respectively located on one side of two long sides of the second through slot 44, the outer side surface of the DMD2 is substantially square, where "square-like" refers to substantially square, such as substantially rectangular or substantially square, the length direction of the long side of the second through slot 44 is parallel to the length direction of the outer side surface of the DMD2, and the projection of the two press-connection parts 43 on the plane where the outer side surface of the DMD2 is located is within the range of the outer side surface of the DMD 2.

Due to the arrangement of the second through slot 44, and the second through slot 44 is rectangular, the second through slot 44 has two long sides and two short sides, so that the press-connection part 43 is arranged on one side of the long side, and the length direction of the long side is parallel to the length direction of the DMD2, the length of the press-connection part 43 can be designed to be relatively long, so as to increase the contact area between the press-connection part 43 and the heat conducting pad 3, and further more efficiently conduct the heat on the DMD2 to the pressure plate 4.

In a preferred embodiment, referring to fig. 8, the thermal pad 3 includes a first portion 31, a second portion 32, and a third portion 33, the first portion 31 and the second portion 32 are disposed opposite to each other in a width direction of the thermal pad 3, the first portion 31 and the second portion 32 form the first through slot 34 therebetween, one side of the first portion 31 is connected to the same side of the second portion 32 through the third portion 33, one of the two crimping portions 43 is crimped to the first portion 31, and the other crimping portion 43 is crimped to the second portion 32.

Referring to fig. 6 and 8, the first portion 31 and the second portion 32 are both elongated, a length direction of the first portion 31 is parallel to a length direction of the second portion 32 and parallel to a length direction of an outer side surface of the DMD2, a first through groove 34 is formed between the first portion 31 and the second portion 32, so that the first portion 31 corresponds to one of the press-connection portions 43, the second portion 32 corresponds to the other press-connection portion 43, the two press-connection portions 43 are respectively exemplified by a first press-connection portion 431 and a second press-connection portion 432, the first press-connection portion 431 presses the first portion 31, the second press-connection portion 432 presses the second portion 32, and the first portion 31 and the second portion 32 press the DMD2, respectively, thereby fixing the DMD2 and conducting heat on the DMD2 to the pressing plate 4. While the third portion 33 is arranged so that the first portion 31 and the second portion 32 form an integral thermal pad 3, facilitating the mounting of the thermal pad 3.

In a preferred embodiment, referring to fig. 3 and 6, the main body 42 is provided with a first mounting hole 45, and the first screw 41 passes through the first mounting hole 45 to be connected with the mounting base 1.

The number of the first mounting holes 45 is two, and the two first mounting holes 45 are respectively located at the left and right sides of the second through groove 44, that is, the two first mounting holes 45 are respectively located at the left and right sides of the press-bonding part 43. When the pressure plate 4 is fixedly connected to the mounting base 1, the inner side surface of the pressure-bonding part 43 is firstly attached to the outer side surface of the thermal pad 3, and at this time, a gap is left between the inner side surface of the main body 42 and the corresponding outer surface of the mounting base 1, and then the first screw 41 is locked (the first screw 41 passes through the first mounting hole 45 and is connected to the mounting base 1), so that the gap is reduced, and the purpose of compressing the thermal pad 3 and the DMD2 is achieved, however, because the compression amount of the thermal pad 3 in the thickness direction is relatively limited, when the thermal pad 3 is compressed to the utmost, if the gap is continuously reduced, the pressure plate 4 is plate-shaped, and has certain elasticity, the main body 42 at the first mounting hole 45 can be bent relative to the middle part (the position of the second through groove 44), so as to prevent the DMD2 from being crushed by the excessive inward pressure on the pressure plate 4, and thus playing a certain protection role on the DMD 2.

In a preferred embodiment, referring to fig. 4 and 6, the mounting base 1 is provided with a positioning post 13, and the main body 42 is provided with a positioning hole 46 matched with the positioning post 13. The positioning holes 46 and the positioning columns 13 are arranged, so that the pressing plate 4 and the mounting base body 1 can be conveniently positioned, and the accuracy of the mounting position when the pressing plate 4 is mounted on the mounting base body 1 is ensured. Of course, the main body 42 may be provided with the positioning posts 13, and the mounting base 1 may be provided with the positioning holes 46.

Further, the cross section of the positioning column 13 is kidney-shaped, and the positioning hole 46 is also a kidney-shaped positioning hole 46. The fool-proof purpose of positioning the pressing plate 4 can be realized through the matching of the single positioning column 13 and the single positioning hole 46.

In a preferred embodiment, referring to fig. 9-11, the DMD mounting and heat dissipating structure further includes a circuit board 5 and a heat sink 7, the circuit board 5 is disposed on the outer side of the pressing plate 4, the heat sink 7 is disposed on the outer side of the circuit board 5, the heat sink 7 is provided with a second mounting hole 73, and a second screw 71 passes through the second mounting hole 73 to be connected to the mounting base 1; the inner side surface of the heat sink 7 is further connected with a heat conduction column 72, the main body portion 42 includes a first region 49 overlapping with the circuit board 5 and a second region 48 outside the first region 49, and the heat conduction column 72 is bonded to the second region 48 through the outer side of the circuit board 5.

Just as the circuit board 5 is connected to the DMD2 by plugging, the heat sink 7 is disposed outside the circuit board 5, so that the heat sink 7 is located at the outermost side, the heat sink 7 can effectively contact with air for heat dissipation, and the heat-conducting posts 72 on the heat sink 7 contact and attach to the second area 48, so that the heat on the pressure plate 4 can be conducted to the heat sink 7 and finally dissipated through the heat sink 7.

The number of the heat conduction columns 72 can be one, two or more, and the heat conduction columns are reasonably arranged according to actual conditions, and only the end faces of the heat conduction columns 72 need to be attached to the second areas 48.

In a preferred embodiment, referring to fig. 9, the inner side of the heat sink 7 is connected with a foam 6, and the heat sink 7 presses the circuit board 5 from outside to inside through the foam 6 to fix the circuit board 5 between the press plate 4 and the heat sink 7. The heat dissipation sheet 7 can be effectively fixed on the mounting base body 1 through the second screw 71, the foam 6 is arranged, and the inner side surface of the heat dissipation sheet 7 can extrude the circuit board 5 through the foam 6, so that the circuit board 5 and the DMD2 are prevented from falling off. The foam 6 may be adhesively attached to the inside of the heat sink 7.

Referring to fig. 12, the present invention further provides a projection optical machine, which includes the aforesaid DMD2 mounting structure, and the mounting substrate 1 is a part of the optical enclosure 14 of the projection optical machine. The heat dissipation capability of the DMD2 can be effectively enhanced, and the effective operation of the DMD2 is ensured.

It will be understood that the above-described embodiments are illustrative only and not restrictive, and that various obvious and equivalent modifications and substitutions may be made in the details described herein by those skilled in the art without departing from the basic principles of the invention.

Claims (10)

1. A DMD installation and heat dissipation structure is characterized by comprising an installation base body, a DMD, a heat conduction pad and a pressing plate, wherein a DMD installation groove and a heat conduction pad installation groove are formed in the installation base body;

the clamp plate includes the platelike crimping portion and the platelike main part that misplace each other in outer and inner directions, crimping portion with connect through connecting portion between the main part, the plane at crimping portion place with the plane at main part place is parallel to each other, the plane at connecting portion place with contained angle between the plane at crimping portion place is 70-110, in outer and inner directions, the medial surface of crimping portion is located the inboard of main part medial surface, the medial surface of crimping portion is as the partial medial surface of clamp plate with the laminating of the lateral surface of heat conduction pad, the clamp plate passes through the main part with the installation base member is connected.

2. The DMD mounting and heat dissipating structure according to claim 1, wherein an orthographic projection of the pressure-bonding part on a plane on which an outer surface of the DMD is located within a range of the outer surface of the DMD in a medial-lateral direction.

3. The DMD mounting and heat dissipating structure of claim 1, wherein a first through slot is disposed on the heat conducting pad, a second through slot is disposed in a middle portion of the pressing plate, and the first through slot and the second through slot are at least partially overlapped to form a connecting channel in an inside-outside direction, so that a first plug terminal on the DMD is electrically connected to the outside.

4. The DMD mounting and heat dissipating structure of claim 3, wherein the second through slot is rectangular, the number of the press-connection parts is two, the two press-connection parts are respectively located on one side of two long sides of the second through slot, an outer side surface of the DMD is shaped like a square, a length direction of the long side of the second through slot is parallel to a length direction of the DMD, and projections of the two press-connection parts on a plane where the outer side surface of the DMD is located are located within a range of the outer side surface of the DMD.

5. The DMD mounting and heat dissipating structure of claim 4, wherein the thermal pad comprises a first portion, a second portion and a third portion, the first portion and the second portion are disposed opposite to each other along a width direction of the thermal pad, the first through slot is formed between the first portion and the second portion, one side of the first portion is connected to the same side of the second portion through the third portion, one of the two crimping portions is in crimping fit with the first portion, and the other crimping portion is in crimping fit with the second portion.

6. The DMD mounting and heat dissipating structure of claim 1, wherein the main body has a first mounting hole, and a first screw passes through the first mounting hole to connect to the mounting base.

7. The DMD mounting and heat dissipating structure of claim 1, wherein the mounting base has a positioning post, and the main body has a positioning hole matching with the positioning post.

8. The DMD mounting and heat dissipating structure according to any one of claims 1 to 7, further comprising a circuit board and a heat sink, wherein the circuit board is disposed outside the pressing plate, the heat sink is disposed outside the circuit board, the heat sink is provided with a second mounting hole, and a second screw passes through the second mounting hole to connect to the mounting substrate;

the inner side surface of the radiating fin is further connected with a heat conduction column, the main body portion comprises a first area overlapped with the circuit board and a second area outside the first area, and the heat conduction column is attached to the second area through the outer side of the circuit board.

9. The DMD mounting and heat dissipating structure of claim 8, wherein foam is attached to an inner side of the heat sink, and the heat sink presses the circuit board through the foam from the outside to the inside to fix the circuit board between the pressure plate and the heat sink.

10. A projection light engine, comprising the DMD mounting and heat dissipating structure of any one of claims 1 to 9, wherein the mounting substrate is a part of a light engine housing of the projection light engine.

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