CN108966618B - Shielding case and electronic device using same - Google Patents
Shielding case and electronic device using same Download PDFInfo
- Publication number
- CN108966618B CN108966618B CN201710384270.0A CN201710384270A CN108966618B CN 108966618 B CN108966618 B CN 108966618B CN 201710384270 A CN201710384270 A CN 201710384270A CN 108966618 B CN108966618 B CN 108966618B
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- China
- Prior art keywords
- shielding
- shield
- heat conductor
- circuit board
- heat
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- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention provides a shield case, including: the shielding body comprises a frame body, a shielding part and a hollow structure arranged on the shielding part, the shielding part is connected with the frame body to form an accommodating space, the hollow structure is arranged corresponding to the accommodating space, and the hollow structure comprises a deformation part and a hollow part; the shielding piece is connected to the shielding part and covers the hollow structure; when the shielding piece and the hollow structure are heated, the deformation part is heated and expands and deforms towards the direction far away from the shielding piece. The invention also provides an electronic device applying the shielding case, which comprises a shell and a circuit board assembly arranged in the shell, wherein the circuit board assembly comprises a circuit board, an electronic element, a heat conductor and the shielding case. Above-mentioned shield cover and applied this shield cover's electron device is through setting up the deformation portion that can be heated and warp, and when electronic component generates heat, deformation portion bulging deformation pressed electronic component with the heat conductor, has improved electronic component's radiating effect.
Description
Technical Field
The present invention relates to the field of shielding and heat dissipating structures and electronic devices, and particularly to a shielding case and an electronic device using the same.
Background
The existing electronic products, such as computers and mobile phones, can generate heat when electronic elements inside the electronic products work, if the electronic elements are not cooled in time, the electronic products are slow in reaction and blocked, and even are blocked, so that the use of the electronic products by people is greatly influenced. In addition to heat dissipation, signal shielding is also considered for electronic components of electronic products, and therefore, in electronic products, a shielding case or a shielding shell is generally used for shielding and dissipating heat of external signals, and the distance between the top of the shielding case and the electronic components is proper, and if the distance is too far, the heat dissipation effect is poor; too close a distance may touch or even press the electronic component.
At present, two shielding cases are mostly arranged on a circuit board, one is that a shielding frame and a shielding cover of the shielding case are mutually separated when the circuit board is not used, when the circuit board is used, an electronic element of the circuit board is firstly framed by the shielding frame with proper height, then the shielding cover and the shielding frame are assembled together, and the assembly modes of the shielding cover and the shielding frame are mostly buckles; the other is an integral structure of the shielding frame and the shielding cover of the shielding cover, and the shielding frame and the shielding cover are directly covered on the electronic elements of the circuit board when in use. However, the former shield case is separately installed, so that the number of installation steps is large, the operation time is increased, the installation efficiency is low, a relatively large space is required for operation, and the former shield case is not suitable for light, thin, short and small electronic products; when the latter shielding case is installed, the distance between the shielding case and the electronic component cannot be grasped, and the shielding cover of the shielding case may touch or press the electronic component, thereby causing adverse effects on the operation and heat dissipation of the electronic component.
Disclosure of Invention
In view of the above, it is desirable to provide a shield case with simple structure, fast installation, and deformable top portion, and an electronic device using the same.
A shielding cage, comprising:
the shielding body comprises a frame body, a shielding part and a hollow structure arranged on the shielding part, the shielding part is connected with the frame body to form an accommodating space, the hollow structure is arranged corresponding to the accommodating space, and the hollow structure comprises a deformation part and a hollow part; and
the shielding piece is connected to the shielding part and covers the hollow structure;
when the shielding piece and the hollow structure are heated, the deformation part is heated, expands and deforms towards the direction far away from the shielding piece and abuts against a heat conductor in contact with the electronic element, and the heat conductor is deformed under pressure to reduce the heat dissipation resistance value.
Further, the shielding body and the shielding piece are both of integrally formed metal structures, and the thermal expansion coefficients of the shielding body and the shielding piece are different.
Further, the deformation part is a sheet structure with a certain shape, and the thermal expansion coefficient of the deformation part is larger than that of the shielding part.
Furthermore, the shielding part is a flange structure extending from one side of the frame body to the center of the frame body, and the shielding part is perpendicular to the frame body.
The fixing part is arranged on the frame body, and the fixing part and the shielding part are respectively arranged on two opposite side surfaces of the frame body.
Furthermore, the fixing part is a hook and comprises two symmetrical clamping parts and a bayonet arranged between the two clamping parts; the fixing part and the frame body are integrally formed.
Further, the shield and the shielding portion are connected by any one of caulking, welding, and ultrasonic bonding.
An electronic device comprising a housing and a circuit board assembly disposed within the housing, the circuit board assembly comprising:
a circuit board;
the electronic element is fixedly arranged on the circuit board;
the heat conductor is attached to the electronic element; and
a shield case covering the electronic component and the heat conductor and connected to the circuit board;
the deformation portion is heated and deformed towards the heat conductor, and is abutted against the heat conductor to press the heat conductor to the electronic element, so that the heat conductor is deformed under pressure to reduce the heat dissipation resistance value.
Further, the circuit board is provided with a fixing hole, and the shielding case is fixed to the circuit board through the matching of the fixing portion and the fixing hole.
Further, the heat conductor is a plastically deformable sheet having a heat conductive property, and the heat resistance is low when it is pressed.
Therefore, the shielding case and the electronic device applying the shielding case provided by the invention are provided with the deformation part which can be deformed by heating, when the electronic element generates heat, the deformation part expands and deforms and presses the heat conductor to the electronic element, so that the heat conductor further compresses the electronic element, the heat dissipation resistance value of the heat conductor is reduced, the heat conduction of the heat conductor to the electronic element is improved, the heat dissipation effect of the electronic element is improved, the structure is simple, and the heat dissipation effect is good; the deformation part has a certain expansion deformation range, and the deformation part can compensate the heat radiation influence caused by insufficient thickness of the heat conductor when deforming, so that the requirement on the thickness tolerance of the heat conductor is low, and the processing is simple.
Drawings
Fig. 1 is an exploded view of a shield according to an embodiment of the invention.
Fig. 2 is a schematic structural diagram of a shielding case according to an embodiment of the invention.
Fig. 3 is an exploded view of a circuit board assembly according to an embodiment of the invention.
Fig. 4 is a schematic diagram illustrating an assembled structure of the circuit board assembly of fig. 3.
Fig. 5 is a schematic structural diagram of a circuit board assembly according to an embodiment of the invention with a heat conductor removed.
Description of the main elements
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
Fig. 1 is an exploded view of a shield can 100 according to an embodiment of the invention. In the figure, the shielding cover 100 includes a shielding body 110 and a shielding element 120, the shielding body 110 includes a frame 111, a shielding portion 112, and a hollow structure 117 disposed on the shielding portion 112, and the frame 111 is a thin plate frame and is substantially square. One side of the frame body 111 is provided with an opening, the other side of the frame body is provided with a shielding portion 112 and a hollow structure 117, the frame body 111 and the shielding portion 112 form a square accommodating space 116, and the hollow structure 117 is opposite to the accommodating space 116. The shielding portion 112 is a flange structure extending from one side of the frame 111 toward the center of the frame 111, and the shielding portion 112 is perpendicular to the frame 111. The frame 111 is further provided with a plurality of fixing portions 115 at a side opposite to the shielding portion 112, and the frame 111 can be mounted to a support, such as a circuit board (not shown) of an electronic device, through the plurality of fixing portions 115. Each fixing portion 115 is substantially a thin plate structure, and includes two symmetrical engaging portions 1151 and a bayonet 1152 disposed between the two engaging portions 1151, a middle portion of each of the two engaging portions 1151 is slightly larger than each of two ends, and when the two symmetrical engaging portions 1151 are compressed by an external force, the two symmetrical engaging portions 1151 are drawn close to each other to deform the bayonet 1152, so that the bayonet 1152 is reduced. Hollow out construction 117 includes deformation portion 113 and hollow out portion 114, and deformation portion 113 is connected to shielding portion 112, and hollow out portion 114 is located between deformation portion 113 and shielding portion 112. The deformation part 113 has a thin plate structure having a certain shape.
In this embodiment, it is preferable that two fixing portions 115 are disposed on the frame 111, the two fixing portions 115 are disposed on two opposite sides of the frame 111, respectively, and the fixing portions 115 are hooks; the shielding portion 112 and the deformation portion 113 are integrally formed, the shielding portion 112 is initially a square thin plate, the deformation portion 113 with a certain shape is formed by digging a hollow portion 114 on the shielding portion 112, and the deformation portion 113 is a thin plate structure and is approximately in a zigzag shape. In other embodiments, the fixing portion 115 may be provided in plurality, not limited to two; the shielding part 112 and the deformation part 113 can be connected together by welding; the deformation portion 113 is not limited to a polygonal line, and may have other shapes or patterns, such as an "S" shape.
Referring to fig. 2, the shielding member 120 is a rectangular thin plate for shielding and dissipating heat. The shielding body 110 and the shielding element 120 are both integrally formed metal structures, and the shielding element 120 is connected to the shielding portion 112 of the frame 111 and covers the hollow structure 117, so that the frame 111 forms a cover-shaped structure with one end closed and the other end opened. There are various ways of connecting the shield 120 and the frame 111, such as riveting, welding, and ultrasonic bonding, and in this embodiment, it is preferable that the shield 120 and the frame 111 are integrally connected by welding.
The shield body 110 has a thermal expansion coefficient different from that of the shield 120, and the deformation portion 113 has a thermal expansion coefficient greater than that of the shield 120. Since different metals have different thermal expansion coefficients and different thermal expansion degrees, and the metal having a large thermal expansion coefficient expands more than the metal having a small thermal expansion coefficient when absorbing the same amount of heat, the degree of expansion of the strain part 113 is larger than that of the shield 120 when the shield 120 and the strain part 113 are placed in the same heat-generating environment.
The operation of the shield 100 is described below with reference to fig. 1-2:
in use, the shielding case 100 is mounted on an electronic device requiring heat dissipation, such as a heat source (not shown) of a circuit board of an electronic device, the shielding case 100 covers the heat source and is mounted on the circuit board through the fixing portion 115, and the deformation portion 113 and the shielding member 120 are located right above the heat source. When not in operation, the deformation part 113 is attached to the shield 120; during operation, the source that generates heat, deformation portion 113 and shielding piece 120 are heated jointly, because the coefficient of thermal expansion of deformation portion 113 is greater than shielding piece 120, deformation portion 113 is the bulging deformation by a wide margin, and shielding piece 120 bulging deformation degree is little (can be seen as almost not warping), the bulging deformation direction of deformation portion 113 is indefinite, but shielding piece 120 is hardly out of shape, consequently deformation portion 113 can receive shielding piece 120 when warping towards shielding piece 120 and block, deformation portion 113 can't warp towards shielding piece 120's direction, can only warp towards the direction of the source that generates heat.
Referring to fig. 3, the present invention further provides an electronic device, including a housing (not shown) and a circuit board assembly 200 disposed in the housing, wherein the circuit board assembly 200 includes a circuit board 210, an electronic component 220 disposed on the circuit board 210, a heat conductor 230 closely attached to the electronic component 220, and a shielding cover 100, the shielding cover 100 includes a shielding body 110 and a shielding member 120 connected together by welding, one side of the shielding body 110 is provided with a deformation portion 113 and a hollow portion 114, the other side is provided with a fixing portion 115, and the circuit board 210 is provided with a fixing hole 211 matched with the fixing portion 115. The heat conductor 230 is a plastically deformable sheet having a heat conductive property, and has low thermal resistance when pressed. The thermal conductor 230 is shaped to conform to the electronic component 220 to completely cover the electronic component 220, thereby improving the heat dissipation effect of the electronic component 220.
The following description of the installation and operation of the circuit board assembly 200 is provided in conjunction with the accompanying fig. 1-5:
when the mounting is performed, the accommodating space 116 of the shielding case 100 is roughly aligned with the electronic component 220 and the heat conductor 230 on the circuit board 210, then the fixing portion 115 is precisely aligned with the fixing hole 211, then the fixing portion 115 is inserted into and clamped in the fixing hole 211, and finally the fixing portion 115 is soldered on the circuit board 210. After the mounting, the electronic component 220 and the heat conductor 230 are accommodated in the accommodating space 116 of the shield case 100, and the deformation portion 113 abuts against the heat conductor 230.
In operation, the circuit board 210 is powered on, the electronic component 220 starts to operate and continuously generates heat, the heat conductor 230 absorbs and emits the heat generated by the electronic component 220, and there are two heat emitting modes of the heat conductor 230, i.e. a first mode: the heat is first conducted directly to the deformation portion 113 in contact therewith, then conducted to the shielding member 120 through the deformation portion 113, and finally radiated to the external space of the shield can 100 through the shielding member 120. The second method comprises the following steps: the heat is firstly radiated to the air in the accommodating space 116, then conducted to the deformation part 113 and the shielding part 120 through the hollow part 114, and finally radiated to the external space of the shielding case 100 through the shielding part 120. The two heat dissipation methods are performed simultaneously to improve the heat dissipation effect of the electronic component 220.
In the two heat dissipation manners, the deformation portion 113 and the shielding element 120 both absorb heat emitted by the electronic component 220, and since the thermal expansion coefficient of the deformation portion 113 is greater than that of the shielding element 120, the deformation portion 113 expands and deforms greatly, and the shielding element 120 expands and deforms to a small extent (can be almost not deformed), and is blocked by the shielding element 120, the deformation portion cannot deform toward the shielding element 120, but only deforms toward the heat conductor 230, so as to press the heat conductor 230, and the heat conductor 230 further compresses the electronic component 220. In this embodiment, it is preferable that the heat conductor 230 is a plastic deformation sheet with a heat conduction characteristic, and the heat resistance is low when the heat conductor 230 is pressed by the deformation portion 113, so that the heat resistance of the heat conductor 230 is low, and the heat conduction rate of the heat conductor 230 is increased, thereby increasing the heat conduction efficiency of the heat conductor 230, and further increasing the heat dissipation effect of the shielding case 100 on the electronic component 220.
In other embodiments, the thickness of the heat conductor 230 may be slightly smaller than the distance between the deformation portion 113 and the electronic component 220, and after the mounting, the deformation portion 113 does not abut against the heat conductor 230, but has a slight distance from the heat conductor 230; during operation, the deformation portion 113 is deformed toward the heat conductor 230 by heat and abuts against and presses the heat conductor 230. Therefore, the thickness of the heat conductor 230 does not need to be precise, and the deformation of the deformation portion 113 can compensate for the heat dissipation effect caused by the insufficient thickness of the heat conductor 230. The thermal conductor 230 has low tolerance requirements and is easy to manufacture.
Therefore, the shielding case 100 and the electronic device using the shielding case 100 provided by the invention are provided with the deformation part 113 which can be deformed by heating, when the electronic element 220 generates heat, the deformation part 113 expands and deforms and presses the heat conductor 230 to the electronic element 220, so that the heat conductor 230 further compresses the electronic element 220, the heat dissipation resistance value of the heat conductor 230 is reduced, the heat conduction of the heat conductor 230 to the electronic element 220 is improved, the heat dissipation effect of the electronic element 220 is improved, the structure is simple, and the heat dissipation effect is good; the deformation part 113 has a certain expansion deformation range, so that the deformation part 113 can compensate the heat radiation influence caused by insufficient thickness of the heat conductor 230 when deforming, the requirement on the thickness tolerance of the heat conductor 230 is low, and the processing is simple.
It will be apparent to those skilled in the art that other corresponding changes and modifications can be made according to the actual needs created by the inventive arrangements and inventive concepts herein, and such changes and modifications are intended to fall within the scope of the appended claims.
Claims (10)
1. A shielding cage, comprising:
the shielding body comprises a frame body, a shielding part and a hollow structure arranged on the shielding part, the shielding part is connected with the frame body to form an accommodating space, the hollow structure is arranged corresponding to the accommodating space, and the hollow structure comprises a deformation part and a hollow part; and
the shielding piece is connected to the shielding part and covers the hollow structure;
when the shielding piece and the hollow structure are heated, the deformation part is heated, expands and deforms towards the direction far away from the shielding piece and abuts against a heat conductor in contact with the electronic element, and the heat conductor is deformed under pressure to reduce the heat dissipation resistance value.
2. The shield of claim 1, wherein the shield body and the shield are each an integrally formed metal structure, the shield body and the shield having different coefficients of thermal expansion.
3. The shield of claim 2, wherein the deformer is a configured sheet structure having a coefficient of thermal expansion greater than a coefficient of thermal expansion of the shield.
4. The shielding cage of claim 1, wherein the shielding portion is a flange structure extending from one side of the frame body to the center of the frame body, and the shielding portion is perpendicular to the frame body.
5. The shielding cage according to claim 4, further comprising a fixing portion disposed on the frame body, wherein the fixing portion and the shielding portion are disposed on two opposite sides of the frame body, respectively.
6. The shielding cage as claimed in claim 5, wherein said fixing portion is a hook, said fixing portion comprises two symmetrical engaging portions and a bayonet disposed between said two engaging portions; the fixing part and the frame body are integrally formed.
7. The shield according to claim 1, wherein the shield and the shielding portion are connected by any one of riveting, welding, and ultrasonic bonding.
8. An electronic device comprising a housing and a circuit board assembly disposed within the housing, the circuit board assembly comprising:
a circuit board;
the electronic element is fixedly arranged on the circuit board;
the heat conductor is attached to the electronic element; and
the shield case of any one of claims 1 to 7, covering the electronic component and the heat conductor and connected to the circuit board;
the deformation portion is heated and deformed towards the heat conductor, and is abutted against the heat conductor to press the heat conductor to the electronic element, so that the heat conductor is deformed under pressure to reduce the heat dissipation resistance value.
9. The electronic device according to claim 8, wherein the circuit board is provided with a fixing hole, and the shield case is fixed to the circuit board by fitting of the fixing portion with the fixing hole.
10. The electronic device according to claim 8, wherein the heat conductor is a plastically deformable sheet having a heat conductive property, which is low in thermal resistance under pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710384270.0A CN108966618B (en) | 2017-05-26 | 2017-05-26 | Shielding case and electronic device using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710384270.0A CN108966618B (en) | 2017-05-26 | 2017-05-26 | Shielding case and electronic device using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108966618A CN108966618A (en) | 2018-12-07 |
| CN108966618B true CN108966618B (en) | 2020-04-24 |
Family
ID=64494171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710384270.0A Expired - Fee Related CN108966618B (en) | 2017-05-26 | 2017-05-26 | Shielding case and electronic device using same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108966618B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112888207B (en) * | 2019-11-29 | 2022-12-13 | 宏碁股份有限公司 | Machine shell and manufacturing method thereof |
| CN113597241B (en) * | 2020-04-30 | 2023-05-02 | 华为技术有限公司 | Shielding cover and electronic equipment |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4438164B2 (en) * | 2000-03-01 | 2010-03-24 | ソニー株式会社 | Shield case |
| JP4052995B2 (en) * | 2003-10-27 | 2008-02-27 | 三洋電機株式会社 | Circuit equipment |
| CN101500391B (en) * | 2008-01-29 | 2012-08-29 | 瑞鼎科技股份有限公司 | Heat radiation assembly, chip comprising the heat radiation assembly and heat radiating method for the chip |
| TWI516198B (en) * | 2014-06-06 | 2016-01-01 | 緯創資通股份有限公司 | Heat dissipation module and electronic device with the same |
| CN106304772B (en) * | 2015-06-09 | 2019-02-05 | 联想(北京)有限公司 | Radiator, electronic equipment and thermal control method |
| CN205213256U (en) * | 2015-11-27 | 2016-05-04 | 上海与德通讯技术有限公司 | Mainboard shielding structure and mainboard |
-
2017
- 2017-05-26 CN CN201710384270.0A patent/CN108966618B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN108966618A (en) | 2018-12-07 |
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Granted publication date: 20200424 |
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