JP7325616B2 - Electronics - Google Patents

Description

The present application relates to electronic equipment.

A conventional electronic device, an example of which is a radar device, is mainly composed of an antenna substrate provided with an antenna for transmitting and receiving electromagnetic waves, a circuit section for generating and controlling radar waves, and a case that accommodates them.
The heat generated from the electronic components in the circuit part comes into contact with the outside air of the electronic device housing, etc. In many cases, a structure to escape to the face part is taken.

For example, a conventional radar device consists of a housing, a front cover, a rear cover, an antenna module, a control circuit board, and a radome. Therefore, the heat is dissipated to the outside air from heat dissipating fins provided on the outside of the rear cover (see, for example, Patent Document 1).
Another conventional radar device consists of a substrate, a heat transfer plate, and a housing. (See Patent Document 2, for example).

Patent No. 4286855 Japanese Patent Application Laid-Open No. 2007-116217

As described above, Patent Document 1 has a structure that performs cooling depending on the heat radiation fins, and the internal space of the housing formed by the cooperation of the front cover and the rear cover has a shape that approximates a rectangular parallelepiped, The shape of the housing was not devised to contribute to heat dissipation.
The same applies to Patent Document 2, which is a structure that performs cooling depending on the heat transfer plate, and the internal space of the housing that houses the internal components has a shape that approximates a rectangular parallelepiped. No contrivance was made to contribute to heat dissipation.

SUMMARY OF THE INVENTION The present application was made to solve the above-described problems, and aims to provide an electronic device capable of ensuring sufficient heat dissipation performance while suppressing the increase in size and weight of the device. and

An electronic device according to the present application includes a substrate on which a transmitting/receiving antenna module, which is an electronic component that constitutes a radar device, is mounted, and a housing that houses the substrate. and a housing lid covering one main surface side of the substrate are superimposed on each other, and the plane shape of the overlapping region where the housing main body and the housing lid of the housing overlap is , and a housing base extending on the xy plane and a convex portion partially protruding from the housing base in the y-axis direction are continuously provided. and the protrusions are formed parallel to and apart from the housing base, and the planar shape of the overlapping region of the housing composed of the housing base and the protrusions is U-shaped as a whole. None, the portion corresponding to the convex portion of the housing accommodates a substrate convex portion protruding from the base portion of the substrate, and a transmitting antenna, which is a component of the transmitting/receiving antenna module, is disposed. It is characterized.

According to the electronic device of the present application, since the convex portion is provided on the outer shape of the housing, it is possible to secure a hollow area that contributes to radiation on the side surface of the convex portion, and the size and weight of the device are increased. It is possible to ensure sufficient heat dissipation performance while suppressing the

1 is a perspective view of an electronic device according to Embodiment 1; FIG. 1 is an exploded perspective view of an electronic device according to Embodiment 1; FIG. 3(a) is a plan view and FIG. 3(b) is an enlarged cross-sectional view taken along line AA of FIG. 3(a). FIG. FIG. 11 is a perspective view of an electronic device according to Embodiment 2; FIG. 11 is an exploded perspective view of an electronic device according to Embodiment 2; 6(a) is a plan view and FIG. 6(b) is an enlarged cross-sectional view taken along line AA of FIG. 6(a). FIG. FIG. 11 is a perspective view of an electronic device according to Embodiment 3; 11 is an exploded perspective view of an electronic device according to Embodiment 3; FIG. FIG. 9 is an exploded perspective view of the electronic device of Embodiment 3 observed from a direction different from that of FIG. 8 ; 10(a) is a plan view and FIG. 10(b) is an enlarged cross-sectional view taken along line AA of FIG. 10(a). FIG. FIG. 11 is a perspective view of an electronic device according to Embodiment 4; FIG. 11 is an exploded perspective view of an electronic device according to Embodiment 4;

Embodiment 1.
An electronic device 100 according to Embodiment 1 of the present application will be described with reference to FIGS. 1 to 3. FIG. FIG. 1 is a perspective view of an electronic device 100 according to Embodiment 1, showing a housing 10 that accommodates a substrate 21 (described later) extending on the xy plane. The housing 10 includes a housing main body portion 11 that covers the back side of the substrate 21, and is superimposed on the housing main body portion 11 in the z-axis direction to cover one main surface side of the substrate 21 mounted inside the housing. It is mainly configured by a housing lid portion 12 that does the same. In the overlapping region where the housing main body 11 and the housing lid 12 overlap, the dimensions of the housing 10 in the z-axis direction are, for example, uniform in thickness.

As shown in FIG. 1 , the planar shape of the overlapping region where the housing main body 11 and the housing lid 12 of the housing 10 are overlapped includes a housing base 10 a extending vertically and horizontally (on the xy plane), a housing It has a shape in which a convex portion 10b partially protruding outward from a base portion 10a is continuously provided. In the example of FIG. 1, two protrusions 10b are provided at both ends of the housing 10 in the x-axis direction, so that a recess 1a (hollow region) is provided between the two protrusions 10b. becomes. The convex portion 10b is provided so as to protrude in the y-axis direction from the housing base portion 10a in parallel with the mounting surface of the substrate 21, and the inside of the convex portion 10b is hollow so that the circuit portion 20 can be accommodated therein. ing. The housing 10 is provided so that the outer shape in the xy plane is U-shaped as a whole. A housing base portion 10a is disposed so as to connect the two convex portions 10b.

For example, in FIG. 1, the housing base 10a corresponds to a quadrangular planar portion in which the maximum width in the x-axis direction of the overlapping region of the housing 10 extends in the y-axis direction. However, the planar shape of the housing base portion 10a is not limited to a quadrilateral shape, and it goes without saying that any surface portion other than the convex portion 10b, which extends vertically and horizontally, may be provided in a shape other than a quadrilateral shape. .
Although not shown, when the flat portion of the housing main body 11 is used as the installation surface, for example, a fastening portion for fastening to other parts is provided on the housing main body 11 so as to overlap the housing lid 12. It may be provided so as to protrude from the area. In that case, needless to say, the outer shapes of the housing body 11 and the housing cover 12 on the xy plane may not match each other.

FIG. 2 is an exploded perspective view of the electronic device 100, showing that the circuit section 20 is arranged between the housing main body section 11 and the housing lid section 12 and accommodated in the inner space thereof. . The circuit section 20 has a configuration in which an electronic component 22 (circuit component) is mounted on a substrate 21 . Inside the housing 10, a circuit section 20 having an outer shape that fits in a housing section surrounded by the inner walls of the housing 10 is housed. The circuit section 20 is mounted by a method such as being held by a substrate holding section on the inner wall of the housing main body section 11 . The convex portion 10b of the housing 10 is formed by combining the convex portion 11b protruding from the base portion 11a of the housing main body portion 11 and the convex portion 12b protruding from the base portion 12a of the housing lid portion 12 . A convex portion 20 b protruding from a base portion 20 a of a substrate 21 is accommodated in a portion of the housing 10 corresponding to the convex portion 10 b. An electronic component 22, which is a heat-generating component, is mounted on the convex portion 20b, for example. The housing main body 11, the housing cover 12 and the circuit section 20 are in a state in which a concave portion 1a is formed between two projections 11b, 12b and 20b that are spaced apart from each other.

FIG. 3A is a plan view of the electronic device 100 in the xy plane. FIG. 3(b) is an enlarged cross-sectional view in the yz plane taken along the line AA in FIG. 3(a), showing a cross-section at the position where the projection 10b is provided in the x-axis direction.

The electronic component 22 mounted on the convex portion 20b of the circuit section 20 is, for example, a heat-generating component. As a result, the electronic component 22 can be accommodated inside the convex portion 10b of the housing 10, and the concave portion 1a (hollow region) can be secured in the side surface portion of the convex portion 10b. Efficient heat dissipation of radiated heat is possible.

Next, verification of the electronic device 100 according to the first embodiment will be described. As a comparative example, an electronic device having the same weight as the housing 10 and a rectangular xy-plane external shape was assumed, and the temperature rise was verified when the electronic component 22 with the same heat generation amount was incorporated. As a result, it was confirmed that in the electronic device 100 of Embodiment 1, the temperature rise could be reduced by about 7% compared to the comparative example by deforming the external shape so as to have the convex portion 10b and the concave portion 1a. .

Also, another verification will be described. In the above-described verification method, the weight of the housing was the same between the comparative example and the present application, but in this other verification, the maximum external dimensions in the xy plane were the same between the comparative example and the present application, and the comparative example The case 10 of the present application has a structure that is 20% lighter in weight than the case of . That is, the electronic device 100 of the first embodiment has a shape obtained by cutting out a portion corresponding to the area of the concave portion 1a from the housing shape of the comparative example whose planar shape is a square. As a result, even if the electronic component 22 having the same amount of heat generation is incorporated, the temperature rise of the electronic device 100 of the first embodiment is about 5% higher than that of the comparative example. It was confirmed that the increase in
Needless to say, the degree of temperature rise in the above verification varies depending on various factors such as the ambient temperature, the material and size of the housing, the amount of heat generated, and the thermal resistance between the housing and the heating element.

As described above, according to the electronic device 100 of the first embodiment of the present application, the external shape is such that the two protrusions 10b protrude from the housing base 10a with the recess 1a interposed therebetween, and the recess 1a is a hollow region. , the heat dissipation effect due to radiation is increased, so heat dissipation performance can be maintained without increasing the weight of the housing 10 .
As described above, according to the present application, by devising the shape of the housing 10 and matching the shape of the internal substrate 21, etc., the size and weight of the electronic device 100 can be suppressed while ensuring sufficient heat dissipation performance. It becomes possible to

Embodiment 2.
In Embodiment 1 described above, an example in which electronic device 100 has a U-shaped outer shape has been described, but in Embodiment 2, electronic device 101 has an L-shaped outer shape. An example will be described with reference to FIGS. 4 to 6. FIG.
As shown in FIG. 4, which is a perspective view of the electronic device 101 of the second embodiment, the housing 10 configured by the housing body 11 and the housing lid 12 has an overall shape of L on the xy plane. It has a shape in which one convex portion 10b is provided at the upper end portion of one side of the housing base portion 10a in the x-axis direction, and a concave portion 1b serving as a hollow region is provided on the side surface portion of the convex portion 10b. It is

FIG. 5 shows an exploded perspective view of the electronic device 101 of the second embodiment. In the first embodiment described above, one board 21 forming the circuit section 20 is arranged in the housing 10, but in the second embodiment, a plurality of boards are spaced apart in the z direction. Then, an example in which they are built in parallel will be described.
The electronic device 101 is, for example, a radar device, and an antenna section 30 is configured by mounting a transmission/reception antenna module 32 on a substrate 31 additionally provided. As an antenna system, for example, a microstrip antenna or waveguide slot antenna can be applied. The transmitting/receiving antenna module 32 that constitutes the antenna section 30 includes a transmitting/receiving antenna, a transmitting/receiving IC, and the like (described later) as electronic components that constitute the antenna. The transmitting/receiving antenna and the transmitting/receiving IC may be mounted on the same surface of the substrate 31, or may be mounted on both surfaces (one principal surface and the back surface) of the substrate.
The planar shape of the antenna section 30 is formed in an L shape as a whole, and a convex section 30b protrudes in the y-axis direction from a base section 30a extending in the vertical and horizontal directions of the substrate 31 .

FIG. 6(a) is a plan view of the electronic device 101 of Embodiment 2 in the xy plane, and FIG. 6(b) is a cross-sectional view taken along line AA in FIG. 6(a). As shown in FIG. 6(b), the rear side of the substrate 21 of the circuit section 20 is in contact with the heat dissipation convex portion 11c provided on the inner surface of the convex portion 11b of the housing main body 11, so that the heat of the substrate 21 is dissipated. Heat is positively dissipated to the housing main body 11 via the convex portion 11c. Further, the substrate 31 of the antenna section 30 is held inside the housing (either the housing main body 11 or the housing lid 12) with a gap in the z-axis direction from the substrate 21. As shown in FIG.

As described above, even when the outer shape of the housing 10 is configured to be L-shaped, the heat dissipation effect by radiation is increased, so the heat dissipation performance can be maintained without increasing the weight of the housing 10. Become.
As the material of the housing main body 11, a metal having good thermal conductivity, such as aluminum, can be used. Further, as the material of the housing lid portion 12, a material having good radio wave permeability, such as resin, can be used.

Embodiment 3.
In the second embodiment described above, an example has been described in which the substrate 21 of the circuit section 20 and the substrate 31 of the antenna section 30 are spaced apart and opposed to each other inside the housing 10 of the electronic device 101 . In the third embodiment, an example in which a housing intermediate member 40 constituting the housing 10 of the electronic device 102 is additionally provided and interposed between the circuit section 20 and the antenna section 30 is shown in FIGS. will be used for explanation.

FIG. 7 is a perspective view of the electronic device 102 of Embodiment 3. In the z-axis direction, the housing intermediate member 40 is superimposed between the housing main body portion 11 and the housing lid portion 12. The housing 10 is configured by The housing intermediate member 40 is a plate-shaped member that divides the internal space of the housing 10 into two, and can be manufactured using a metal with good thermal conductivity similar to that of the housing main body 11, such as aluminum. Are suitable.

FIG. 8 is an exploded perspective view of the electronic device 102. FIG. The board 21 of the circuit section 20 is held by the board holding projection 11d provided inside the side surface of the housing main body 11, and the connector 23 formed on the board 21 is aligned with the board 31 side of the antenna section 30 in the z-axis direction. It is provided so as to protrude toward the This connector 23 is used for board-to-board connection.

The housing intermediate member 40 has a heat radiating recess 41 for supporting the heat radiating portion (heat generating element portion) of the substrate 31 of the antenna portion 30 in contact with the portion corresponding to the convex portion 10b of the housing 10, and the connector 23 of the substrate 21. It has an opening 43 for inserting the . Further, the main portion of the housing intermediate member 40 is a plane portion that spreads in the xy plane, but by having side portions with a predetermined width in the z-axis direction, the housing body portion 11 and the housing lid portion 12 can be separated from each other. are secured. Further, the outer peripheral portion of the substrate 31 of the antenna section 30 is held by the substrate holding convex portion 42 provided on the inner wall of the side surface portion of the housing intermediate member 40 .

In the second embodiment described above, the antenna unit 30 simply includes the transmitting/receiving antenna module 32. A receiving antenna 32b is provided as a component.

FIG. 9 is an exploded perspective view of the electronic device 102 observed from a different direction (installation surface side) from FIG. As shown in FIG. 9, a transmission IC 32aa is disposed in a portion corresponding to the projection on the back side of the substrate of the antenna section 30, and the heat of this transmission IC 32aa is radiated through the heat radiation recess 41 of the housing intermediate member 40. . Further, a receiving IC 32bb is arranged in a portion corresponding to the base portion of the antenna portion 30 on the back side of the substrate. Both the transmission IC 32aa and the reception IC 32bb are components of the transmission/reception antenna module 32. Both the transmission IC 32aa and the reception IC 32bb are heat-generating components that generate heat when energized. A tendency for a large amount of heat to be generated is seen.

FIG. 10(a) is a plan view of the electronic device 102 of Embodiment 3 in the xy plane, and FIG. 10(b) is a cross-sectional view taken along line AA in FIG. 10(a). As shown in FIG. 10B, the substrate 31 of the antenna section 30 is held via the substrate holding projections 42 on the plane portion (for example, the main surface side) of the housing intermediate member 40 . A transmission IC 32aa that generates a larger amount of heat than other electronic devices is mounted at a position corresponding to the convex portion 10b of the housing 10 on the back side of the substrate 31. is disposed in contact with the heat radiating recess 41 of the . The TIM 50 is composed of, for example, grease, a heat radiation sheet, or the like.

In this way, when a board on which an electronic component such as the transmission IC 32aa that tends to generate a large amount of heat is mounted is housed inside the housing 10, the transmission IC 32aa is placed at a position corresponding to the convex portion 10b of the housing 10. By arranging the structure, heat can be efficiently transferred to the outside air side, and heat dissipation can be ensured.

Embodiment 4.
Next, in Embodiment 1 described above, the convex portion 10b of the housing 10 of the electronic device 100 has a shape in which the dimension in the x-axis direction extends in the y-axis direction. are also plane portions along the yz plane and are arranged in parallel. In the fourth embodiment, an example in which the convex portion 10b forming the housing 10 of the electronic device 103 changes its shape along the y-axis direction will be described with reference to FIGS. 11 and 12. FIG.

FIG. 11 is a perspective view of an electronic device 103 according to Embodiment 4. Two convex portions 10b are spaced apart in the x-axis direction. A connector 60 is provided so that the connecting terminal protrudes into the concave portion 1c of the housing 10 sandwiched between the two inclined surface portions 10ba. there is

FIG. 12 is an exploded perspective view of the electronic device 103. FIG. A substrate 31 constituting the antenna section 30 is arranged between the housing main body 11 and the housing lid section 12, and the connector 60 is provided on the housing lid section 12 side. The housing main body 11 is provided with an inclined surface portion 11ba, and the housing cover portion 12 is provided with an inclined surface portion 12ba. Ten inclined surface portions 10ba are formed.

Further, the substrate 31 is provided with through holes 61 into which the pins of the connector 60 are inserted. Although the circuit section 20 shown in the second and third embodiments is omitted in FIG. It is needless to say that the configuration may be such that a plurality of substrates are accommodated as in the second embodiment.

As described above, in the electronic device 103 having the inclined surface portion 10ba of Embodiment 4, each of the opposing side surface portions of the two convex portions 10b of the housing 10 is the inclined surface portion 10ba that is inclined, and the convex portion 10b is the vertex portion. It is a structure formed wide from the housing base 10a. Therefore, when compared with the case where the side portions of the two convex portions 10b extend in parallel (perpendicular to the x-axis) and are arranged to face each other, the heat radiated from the inclined surface portion 10ba is easily transmitted outward, so that the heat dissipation is improved. It is possible to obtain a unique effect that is good.
Further, since the housing 10 has a structure having the inclined surface portions 10ba, the opening width of the convex portion 10b of the housing 10 in the x-axis direction, that is, the distance between the two inclined surface portions 10ba, increases as the distance from the position of the connector 60 increases in the y-axis direction. There is an advantage that the distance in the x-axis direction gradually increases, making it easier to access the connector 60 .

In the above example, the state in which the inclined surface portions 10ba are provided symmetrically in the x-axis direction is illustrated and explained, but the inclined surface portion 10ba is provided only on one side, and the other side is shown in the first embodiment. It can be used in a modified form, such as forming a convex portion 10b of the same size in the y-axis direction.
Needless to say, the connector 60 can be provided in a region of the outer peripheral portion surrounding the planar portion of the housing 10 where the convex portion 10b is not provided.

While this application describes various exemplary embodiments and examples, various features, aspects, and functions described in one or more embodiments may not apply to particular embodiments. can be applied to the embodiments singly or in various combinations.
Accordingly, numerous variations not illustrated are envisioned within the scope of the technology disclosed herein. For example, modification, addition or omission of at least one component, extraction of at least one component, and combination with components of other embodiments shall be included.

1a, 1b, 1c concave portion 10 housing 10a housing base portion 11a, 12a, 20a, 30a base portion 10b, 11b, 12b, 20b, 30b convex portion 10ba, 11ba, 12ba inclined surface portion 11 housing body portion , 11c heat dissipation protrusion 11d, 42 substrate holding protrusion 12 housing lid 20 circuit section 21, 31 substrate 22 electronic component 23, 60 connector 30 antenna section 32 transmission/reception antenna module 32a transmission antenna , 32aa transmission IC, 32b reception antenna, 32bb reception IC, 40 housing intermediate member, 41 heat dissipation recess, 43 opening, 50 TIM, 61 through hole, 100, 101, 102, 103 electronic equipment

Claims (5)

A board on which a transmitting/receiving antenna module, which is an electronic component that constitutes a radar device, is mounted;
Equipped with a housing for housing the substrate,
The housing has a structure in which a housing main body portion covering the back side of the substrate and a housing lid portion covering one main surface side of the substrate are superimposed,
The planar shape of the overlapping region where the housing main body portion and the housing lid portion of the housing overlap is a housing base portion that spreads on the xy plane and partially protrudes from the housing base portion in the y-axis direction. It is a shape in which the convex part is provided continuously,
The housing has two or more projections, the projections are formed parallel to each other and spaced apart from the housing base, and the overlapping region of the housing formed of the housing base and the projections. The planar shape of the as a whole forms a U shape,
A portion of the housing corresponding to the protrusion accommodates a substrate protrusion protruding from the base of the substrate, and further includes a transmitting antenna, which is a component of the transmitting/receiving antenna module. electronic equipment. A transmission IC, which is a component of the transmission antenna, is disposed inside the convex portion of the housing, and the transmission IC is an electronic component that generates a large amount of heat compared to other electronic components on the substrate. The electronic device according to claim 1, characterized by: 3. The electronic device according to claim 1, wherein the two convex portions have opposite side surfaces each inclined, and the convex portions are formed wide from the apex to the housing base. 2. The housing from claim 1, wherein the housing has a housing intermediate member between the housing main body and the housing lid, and another substrate is held by the housing intermediate member. 4. The electronic device according to any one of 3 . 5. The electronic device according to claim 1, wherein a connector is provided in a region of the outer peripheral portion of the housing where the convex portion is not provided.

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