WO2023199481A1

WO2023199481A1 - Control apparatus and control panel

Info

Publication number: WO2023199481A1
Application number: PCT/JP2022/017843
Authority: WO
Inventors: 献一郎大倉; 知樹奥野; 正和竹冨; 剛広山田
Original assignee: 三菱電機株式会社
Priority date: 2022-04-14
Filing date: 2022-04-14
Publication date: 2023-10-19

Abstract

This control apparatus (1000) comprises a main circuit board (40), a first heating element (40a), a second heating element (40b), a structure (ST), a first heat dissipation sheet (41), and a second heat dissipation sheet (23). The first heating element (40a) is mounted to a front surface (FS) of the main circuit board (40). The second heating element (40b) is mounted to a rear surface (RS) of the main circuit board (40). The structure (ST) has a first protruding part (42a) and a second protruding part (20a). The first heat dissipation sheet (41) is sandwiched between the first heating element (40a) and the first protruding part (42a). The second heat dissipation sheet (23) is sandwiched between the second heating element (40b) and the second protruding part (20a). The first heat dissipation sheet (41) is in contact with the first heating element (40a) and the first protruding part (42a). The second heat dissipation sheet (23) is in contact with the second heating element (40b) and the second protruding part (20a).

Description

Control equipment and control panel

The present disclosure relates to control equipment and control panels.

Conventionally, modules have been proposed that include a heat dissipation board for dissipating heat emitted from heat-generating components. For example, Japanese Unexamined Patent Publication No. 2010-3718 (Patent Document 1) describes a module including a heat dissipation board. In the module described in this publication, a plurality of heat generating components are arranged on one side of a heat dissipation board. The heat dissipation board sandwiches the circuit board with the interboard connection terminal of the heat dissipation board bent. This makes it possible to downsize the module, thereby making it possible to downsize the equipment in which the module is incorporated.

Japanese Patent Application Publication No. 2010-3718

In the module described in the above publication, the circuit board is heated by the heat generating components while the circuit board is sandwiched between the heat generating components mounted on the heat dissipation board. As a result, heat builds up inside the device in which the module is installed. Furthermore, since the heat dissipation substrate is bent, the projected area of the module becomes smaller, but the depth of the module becomes larger. For this reason, it is not possible to make the device in which the module is incorporated thinner.

The present disclosure has been made in view of the above problems, and its purpose is to provide a control device and a control panel that can realize an efficient cooling configuration and a thinner design.

The control device of the present disclosure includes a main circuit board, a first heating element, a second heating element, a structure, a first heat radiation sheet, and a second heat radiation sheet. The main circuit board has a front surface and a back surface. The first heating element is mounted on the surface of the main circuit board. The second heating element is mounted on the back surface of the main circuit board. The structure has a first protrusion and a second protrusion. The first protrusion protrudes toward the first heating element. The second protrusion protrudes toward the second heating element. The first heat dissipation sheet is sandwiched between the first heating element and the first protrusion. The second heat dissipation sheet is sandwiched between the second heating element and the second protrusion. The first heat dissipation sheet is in contact with the first heating element and the first protrusion. The second heat dissipation sheet is in contact with the second heating element and the second protrusion.

According to the control device and control panel of the present disclosure, it is possible to provide a control device that can realize an efficient cooling configuration and a thinner design.

1 is a perspective view schematically showing the configuration of a control device according to Embodiment 1. FIG. 2 is a cross-sectional perspective view taken along line II-II in FIG. 1. FIG. 2 is a cross-sectional perspective view taken along line III-III in FIG. 1. FIG. 1 is a perspective view schematically showing the internal configuration of a control device according to Embodiment 1. FIG. 5 is a cross-sectional perspective view taken along line VV in FIG. 4. FIG. 6 is an enlarged view of the VI section of FIG. 5. FIG. 5 is a cross-sectional perspective view taken along line VII-VII in FIG. 4. FIG. 8 is an enlarged view of part VIII in FIG. 7; FIG. FIG. 3 is a perspective view schematically showing the internal configuration of a control device according to a second embodiment. 10 is a cross-sectional perspective view taken along line XX in FIG. 9. FIG. 11 is an enlarged view of section XI in FIG. 10. FIG. 10 is a cross-sectional perspective view taken along line XII-XII in FIG. 9. FIG. 13 is an enlarged view of section XIII in FIG. 12. FIG. FIG. 7 is a cross-sectional perspective view schematically showing a state in which a control device according to a second embodiment is attached to a sheet metal bracket member. 15 is an enlarged view of section XV in FIG. 14. FIG. FIG. 3 is a cross-sectional view schematically showing the configuration of a control panel according to a second embodiment. FIG. 3 is a front view schematically showing the configuration of a control panel according to Embodiment 2. FIG.

Hereinafter, embodiments will be described with reference to the drawings. In addition, in the drawings, the same or corresponding parts are given the same reference numerals, and the description thereof will not be repeated. Note that, for convenience of drawing, cross sections are not hatched in the figures.

Embodiment 1.
The configuration of control device 1000 according to the first embodiment will be described with reference to FIGS. 1 to 8. As shown in FIGS. 1 to 3, in the first embodiment, an air conditioning control device will be described as an example of a control device 1000. In the first embodiment, control device 1000 is attached to a wall via a wall-mounting frame member (not shown). FIG. 1 is a perspective view showing a control device 1000 according to the first embodiment from the back side. FIG. 2 is a vertical cross-sectional perspective view of the first heating element 40a on the main circuit board 40 at its central position. FIG. 3 is a vertical cross-sectional perspective view of the second heating element 40b on the main circuit board 40 at its central position. Arrows in FIGS. 2 and 3 indicate air flow.

The control device 1000 according to the first embodiment includes a housing member 8, a base sheet metal member 20, a main circuit board 40, a first heating element 40a, a second heating element 40b, a first heat dissipation sheet 41, and a second heat dissipation sheet 23. , a heat spreader 42 and a housing cover member 60. In the first embodiment, the structure ST includes a base sheet metal member 20 and a heat spreader 42.

The base sheet metal member 20, main circuit board 40, first heating element 40a, second heating element 40b, first heat radiation sheet 41, second heat radiation sheet 23, and heat spreader 42 are covered by a housing cover member. The housing member 8 is arranged on the front side of the control device 1000. The housing cover member 60 is arranged on the back side of the control device 1000. The housing cover member 60 is fixed to the housing member 8.

A display device 1 is mounted on the front of the control device 1000. The display device 1 is fixed to a housing cover member 60. The display device 1 constitutes an operation section. The display device 1 is equipped with a touch panel (not shown).

The housing cover member 60 is provided with a plurality of intake slits 60c and a plurality of exhaust slits 60d. The plurality of intake slits 60c and the plurality of exhaust slits 60d are provided so as to penetrate the wall surface on the back side of the housing cover member 60. The plurality of intake slits 60c are for intake of air from the outside to the inside of the housing cover member 60. The plurality of exhaust slits 60d are for exhausting air from the inside of the housing cover member 60 to the outside. A plurality of intake slits 60c are provided at the lower part of the housing cover member 60. A plurality of exhaust slits 60d are provided at the top of the housing cover member 60.

The main circuit board 40 has a front surface FS and a back surface RS. A first heating element 40a is mounted on the surface FS of the main circuit board 40. The first heating element 40a is, for example, a CPU (Central Processing Unit). A second heating element 40b is mounted on the back surface RS of the main circuit board 40. The second heating element 40b is, for example, a PMIC (Power Management Integrated Circuit). That is, heating elements are mounted on both sides of the main circuit board 40. Note that the first heating element 40a is thermally more severe (has a larger amount of heat generated) than the second heating element 40b, and requires more heat dissipation than the second heating element 40b.

The first heating element 40a, the second heating element 40b, the first heat radiation sheet 41, and the second heat radiation sheet 23 are arranged between the main circuit board 40, the base metal sheet member 20, and the heat spreader 42. The first heat dissipation sheet 41 and the second heat dissipation sheet 23 are, for example, silicon-based heat dissipation sheets. The main circuit board 40, the base sheet metal member 20, and the heat spreader 42 allow air to pass between the main circuit board 40, the base sheet metal member 20, and the heat spreader 42 from the plurality of intake slits 60c to the plurality of exhaust slits 60d. It is configured to flow.

FIG. 4 is a perspective view showing a state in which the housing cover member 60 is removed from the housing member 8. As shown in FIGS. 2 to 4, a base metal member 20 is arranged on the back side of the display device 1. As shown in FIGS. The base sheet metal member 20 is made of, for example, a galvanized steel plate (iron-based). A sheet metal case member 30 is fixed to the back side of the base sheet metal member 20 with screws 403. A power supply system board 33 is fixed to the sheet metal case member 30. A main circuit board 40 is arranged on the back side of the base sheet metal member 20. The base sheet metal member 20 holds a main circuit board 40. The base sheet metal member 20 holds a heat spreader 42. The heat spreader 42 is made of aluminum, for example. That is, since the first heating element 40a is thermally more severe than the second heating element 40b, the heat spreader 42 is made of a material with better heat dissipation than the base metal member 20. Further, the heat spreader 42 is made of a plate material that is thicker than the base metal sheet member 20, thereby making heat dissipation advantageous. The base sheet metal member 20 faces the back surface RS of the main circuit board 40.

A heat spreader 42 is arranged on the back side of the main circuit board 40. Heat spreader 42 faces surface FS of main circuit board 40. A transmission system board 51 is fixed to the back side of the heat spreader 42 with screws 404. The heat spreader 42 is fixed to the base metal sheet member 20 with screws 404 passing through holes provided in the main circuit board 40.

FIG. 5 is a vertical cross-sectional perspective view at the center position of the first heating element 40a. FIG. 6 is an enlarged view of the vicinity of the first heating element 40a in FIG. As shown in FIGS. 2, 5, and 6, the heat spreader 42 has a first protrusion 42a. The first projection 42a projects toward the first heating element 40a. The first protrusion 42a has a diaphragm shape. The first heat dissipation sheet 41 is in contact with the lower surface of the first protrusion 42a. The first heat dissipation sheet 41 is sandwiched between the first heating element 40a and the first protrusion 42a. A through hole is provided in the surface of the first protrusion 42a on which the first heat dissipation sheet 41 is disposed. This through hole is for confirming whether the first heat dissipation sheet 41 is reliably located at a predetermined position when the main circuit board 40 and the heat spreader 42 are combined. The first heat dissipation sheet 41 is in contact with the first heating element 40a and the first protrusion 42a. The first heat dissipation sheet 41 has higher thermal conductivity than air. When the heat spreader 42 is fixed with the screws 404, the first projections 42a come into contact with the first heat radiation sheet 41, so that half of the thickness of the first heat radiation sheet 41 is collapsed. A boss portion having a screw hole is provided around the first protrusion 42a. In particular, a pair of boss portions are provided so as to sandwich the first protrusion 42a. The height of the boss portion is higher than the height of the first protrusion 42a and lower than the height of the first protrusion 42a and the height of the first heat dissipation sheet 41 before being crushed. By screwing the screw into the boss portion, the distance between the main circuit board 40 and the first protrusion 42a becomes closer, and as a result, the first heat dissipation sheet 41 is crushed to maintain reliable contact.

FIG. 7 is a vertical cross-sectional perspective view at the center position of the second heating element 40b. FIG. 8 is an enlarged view of the vicinity of the second heating element 40b in FIG. 7. As shown in FIGS. 3, 7, and 8, the base sheet metal member 20 has a second protrusion 20a. The second projection 20a projects toward the second heating element 40b. The second protrusion 20a has a diaphragm shape. The second heat dissipation sheet 23 is in contact with the upper surface of the second protrusion 20a. The second heat dissipation sheet 23 is sandwiched between the second heating element 40b and the second protrusion 20a. A through hole is provided in the surface of the second protrusion 20a on which the second heat dissipation sheet 23 is disposed. This through hole is for confirming whether the second heat dissipation sheet 23 is reliably located at a predetermined position when the main circuit board 40 and the base sheet metal member 20 are combined. The second heat dissipation sheet 23 is in contact with the second heating element 40b and the second protrusion 20a. The first heat dissipation sheet 41 has higher thermal conductivity than air. When the main circuit board 40 is fixed to the base sheet metal member 20, the second protrusion 20a comes into contact with the second heat radiation sheet 23, so that half of the thickness of the second heat radiation sheet is collapsed. A boss portion having a screw hole is provided around the second protrusion 20a. In particular, a pair of boss portions are provided so as to sandwich the second protrusion 20a. The height of the boss portion is higher than the height of the second protrusion 20a and lower than the height of the second protrusion 20a and the height of the second heat dissipation sheet 23 before being crushed. By screwing the screw into the boss portion, the distance between the main circuit board 40 and the second protrusion 20a becomes closer, and as a result, the second heat dissipation sheet 23 is crushed to maintain reliable contact.

A fire prevention partition sheet metal member 22 is fixed to the base sheet metal member 20. The heat spreader 42 is provided with a bent portion 42d. When the control device 1000 is installed on a wall, the bent portion 42d is located at the upper end of the main circuit board 40.

Mounted on the main circuit board 40 are electrical components such as connectors that are connected to the power supply system board 33 and to which high voltage is applied. There is a possibility that tracking (ignition) may occur from this mounted component. When tracking (ignition) occurs from a connector or the like mounted on the main circuit board 40, the bent portion 42d functions as a firewall that confines the fire. The fireproof partition sheet metal member 22 is located on the back side of the main circuit board 40 and also functions as a firewall.

A plate spring component 40c is mounted on the main circuit board 40. When the heat spreader 42 is fixed to the base sheet metal member 20, the leaf spring component 40c is pressed against the heat spreader 42 by contacting the surface of the heat spreader 42 facing the main circuit board 40. This reduces the height dimension of the leaf spring component 40c. When the leaf spring component 40c comes into contact with the opposing surface of the heat spreader 42, the ground connection of the main circuit board 40 is strengthened, and noise radiation generated from the electrical components mounted on the main circuit board 40 is reduced. Since the heat spreader 42 itself partially covers the main circuit board 40, the heat spreader 42 also has a noise radiation shielding function.

Next, air flow and heat radiation in the control device 1000 according to the first embodiment will be described with reference to FIGS. 2 and 3.

As shown in FIG. 2, when the control device 1000 is installed on a wall, air enters the inside of the control device 1000 through the plurality of intake slits 60c and rises through the gap between the main circuit board 40 and the heat spreader 42. The gas is then discharged to the outside of the control device 1000 through the plurality of exhaust slits 60d. The heat generated by the first heating element 40a is transmitted to the first protrusion 42a via the first heat dissipation sheet 41, and is diffused to the heat spreader 42. The heat spread by the heat spreader 42 is radiated to the outside of the control device 1000 by the air flow. Heat dissipation is enhanced by the wind hitting the first protrusion 42a. The iris-shaped side surface of the first protrusion 42a is arranged substantially perpendicular to the direction of the wind. When the wind collides with the constricted side surface of the first protrusion 42a, the heat of the first heating element 40a transmitted to the first protrusion 42a via the first heat dissipation sheet 41 is removed.

The first projection 42a includes a lower surface on which the first heat dissipation sheet 41 is disposed, and at least two first side surfaces connecting the lower surface and the main surface of the heat spreader 42. One first side surface of the at least two first side surfaces is arranged substantially perpendicular to the direction of the wind passing through the gap between the main circuit board 40 and the heat spreader 42.

One first side surface of the at least two first side surfaces is connected to the first side connected to the bottom surface, the second side connected to the main surface of the heat spreader 42, and the first side and the second side. and a third side connected to the other one of the at least two first side surfaces. The second side is longer than the first side.

As shown in FIG. 3, air enters the control device 1000 through the plurality of intake slits 60c, ascends through the gap between the main circuit board 40 and the base sheet metal member 20, and is controlled through the plurality of exhaust slits 60d. It is released to the outside of the device 1000. The heat generated by the second heating element 40b is transmitted to the second protrusion 20a via the second heat dissipation sheet 23, and is diffused into the base metal sheet member 20. The heat diffused into the base sheet metal member 20 is radiated to the outside of the control device 1000 by the air flow. Heat dissipation is enhanced by the wind hitting the second protrusion 20a. The diaphragm-shaped side surface of the second protrusion 20a is arranged substantially perpendicular to the direction of the wind. When the wind collides with the constricted side surface of the second protrusion 20a, the heat of the second heating element 40b transmitted to the second protrusion 20a via the second heat dissipation sheet 23 is removed.

The second protrusion 20a includes an upper surface on which the second heat dissipation sheet 23 is disposed, and at least two second side surfaces connecting the upper surface and the main surface of the base sheet metal member 20. One of the at least two second side surfaces is arranged substantially perpendicular to the direction of the wind passing through the gap between the main circuit board 40 and the heat spreader 42.

One second side surface of the at least two second side surfaces has a fourth side connected to the top surface, a fifth side connected to the main surface of the base sheet metal member 20, and a fourth side and a fifth side connected to the top surface. It has a sixth side that is connected to the other second side of the at least two second side surfaces. The fifth side is longer than the fourth side.

The gap between the main circuit board 40 and the heat spreader 42 is narrower than the gap between the main circuit board 40 and the base metal sheet member 20. The height of the first protrusion 42a is lower than the height of the second protrusion 20a. When the same amount of air enters each gap, the gap between the main circuit board 40 and the heat spreader 42 is narrower than the gap between the main circuit board 40 and the base sheet metal member 20. The wind speed in the gap between the main circuit board 40 and the base sheet metal member 20 is faster than the wind speed in the gap between the main circuit board 40 and the base sheet metal member 20. Therefore, it is possible to improve heat dissipation on the side of the first heating element 40a, which is more thermally severe.

Next, the effects of the control device 1000 according to the first embodiment will be explained.
According to the control device 1000 according to the first embodiment, the first heat dissipation sheet 41 is in contact with the first heat generating element 40a and the first protrusion 42a, and the second heat dissipation sheet 23 is in contact with the second heat generating element 40b and the second protrusion 42a. It is in contact with the protrusion 20a. Therefore, the heat generated by the first heating element 40a is transmitted to the first protrusion 42a via the first heat dissipation sheet 41, and the heat generated by the second heat generation pusher 40b is transmitted to the second protrusion via the second heat dissipation sheet 23. 20a. Therefore, it is possible to suppress heat from accumulating inside the control device 1000. This makes it possible to realize an efficient cooling configuration. Further, a first heating element 40a is mounted on the front surface FS of the main circuit board 40, and a second heating element 40b is mounted on the back surface RS of the main circuit board 40. Therefore, the main circuit board 40 can be made thinner than when it is bent. Therefore, it is an object of the present invention to provide a control device 1000 that can realize an efficient cooling configuration and a reduced thickness.

According to the control device 1000 according to the first embodiment, the main circuit board 40 and the structure ST pass from the plurality of intake slits 60c to the plurality of exhaust slits 60d between the main circuit board 40 and the structure ST. It is configured to allow air to flow through. Therefore, the heat dissipated from the first heating element 40a to the first protrusion 42a via the first heat dissipation sheet 41 and the heat dissipated from the second heat generation element 40b to the second protrusion 20a via the second heat dissipation sheet 23. The heat can be cooled by air flowing from the plurality of intake slits 60c, between the main circuit board 40 and the structure ST, and into the plurality of exhaust slits 60d.

Furthermore, in the control device 1000 according to the first embodiment, since the control device 1000 is not molded with mold resin, air can flow inside the control device 1000. Therefore, cooling efficiency can be increased.

According to the control device 1000 according to the first embodiment, the structure ST includes the heat spreader 42. The heat spreader 42 faces the surface FS of the main circuit board 40 and has a first protrusion 42a. Therefore, heat can be diffused using the heat spreader 42.

According to the control device 1000 according to the first embodiment, the structure ST includes the base sheet metal member 20. The base sheet metal member 20 holds the main circuit board 40 and the heat spreader 42, faces the back surface RS of the main circuit board 40, and has a second protrusion 20a. Therefore, heat can be diffused using the base sheet metal member 20.

According to the control device 1000 according to the first embodiment, the gap between the main circuit board 40 and the heat spreader 42 is narrower than the gap between the main circuit board 40 and the base sheet metal member 20. Therefore, by changing the speed of the wind flowing through the gap between the main circuit board 40 and the heat spreader 42 and the gap between the main circuit board 40 and the base sheet metal member 20, the first heating element 40a and the second heating element 40b can be effectively heated. can be cooled to Therefore, it is possible to improve heat dissipation on the side of the first heating element 40a, which is more thermally severe.

According to the control device 1000 according to the first embodiment, the height of the first protrusion 42a is lower than the height of the second protrusion 20a. Therefore, the gap between the main circuit board 40 and the heat spreader 42 can be made narrower than the gap between the main circuit board 40 and the base sheet metal member 20.

According to the control device 1000 according to the first embodiment, one of the at least two first side surfaces is oriented with respect to the direction of the wind passing through the gap between the main circuit board 40 and the heat spreader 42. It is arranged almost vertically. Further, one of the at least two second side surfaces is arranged substantially perpendicular to the direction of the wind passing through the gap between the main circuit board 40 and the heat spreader 42. Therefore, the first heating element 40a and the second heating element 40b can be effectively cooled.

According to the control device 1000 according to the first embodiment, the second side is longer than the first side on the first side surface of the first projection 42a. Further, on the second side surface of the second protrusion 20a, the fifth side of the second protrusion is longer than the fourth side. Therefore, the first protrusion 42a and the second protrusion 20a can be shaped into a constricted shape.

Air conditioning control equipment installed on walls often has limited space inside the wall, so the equipment must be thinner. In the control device 1000 according to the first embodiment, heat generated by the heat generating components is diffused to a structure ST that faces the main circuit board 40 on which a plurality of heat generating components are mounted and has other various functions. Can be done. Moreover, air can be efficiently flowed over the surface of the structure ST. Therefore, when the control device 1000 according to the first embodiment is applied to an air conditioning control device, it is possible to make the air conditioning control device thinner.

Embodiment 2.
The control device according to the second embodiment has the same configuration, operation, and effect as the control device according to the first embodiment, unless otherwise specified.

The configuration of control device 1000 according to the second embodiment will be described with reference to FIGS. 9 to 13. FIG. 9 is a perspective view showing a state in which the housing cover member 60 (see FIG. 14) is removed from the sheet metal outer case 200. As shown in FIG. 9, a control device 1000 according to the second embodiment includes a sheet metal outer case 200. In the second embodiment, the structure ST includes a sheet metal outer case 200. The sheet metal outer case 200 is arranged on the front side of the control device 1000. The sheet metal outer case 200 does not have a display device. The sheet metal outer case 200 holds the main circuit board 40. The main circuit board 40, the heat spreader 42, the transmission system board 51, the power supply system board 33, and the sheet metal case member 30 are fixed to the sheet metal outer case 200. A housing cover member 60 is attached to the sheet metal outer case 200 (see FIG. 14).

FIG. 10 is a vertical cross-sectional perspective view at the center position of the first heating element 40a. FIG. 11 is an enlarged view of the vicinity of the first heating element 40a in FIG. 10. As shown in FIGS. 10 and 11, heat spreader 42 faces surface FS of main circuit board 40. As shown in FIGS. The heat spreader 42 has a first protrusion 42a. The first projection 42a projects toward the first heating element 40a. The first heat dissipation sheet 41 is sandwiched between the first heating element 40a and the first protrusion 42a. The first heat dissipation sheet 41 is in contact with the first heating element 40a and the first protrusion 42a. The heat generated by the first heating element 40a is transmitted to the first protrusion 42a of the heat spreader 42 via the first heat dissipation sheet 41, and is diffused onto the surface of the heat spreader 42.

FIG. 12 is a vertical cross-sectional perspective view at the center position of the second heating element 40b. FIG. 13 is an enlarged view of the vicinity of the second heating element 40b in FIG. 12. As shown in FIGS. 12 and 13, the sheet metal outer case 200 faces the back surface RS of the main circuit board 40. As shown in FIGS. The sheet metal outer case 200 has a second protrusion 20a. The second projection 20a projects toward the second heating element 40b. The second heat dissipation sheet 23 is sandwiched between the second heating element 40b and the second protrusion 20a. The second heat dissipation sheet 23 is in contact with the second heating element 40b and the second protrusion 20a. The heat generated by the second heating element 40b is transmitted to the second protrusion 20a of the sheet metal outer case 200 via the second heat dissipation sheet 23, and is diffused to the surface of the sheet metal outer case 200.

A state in which the control device 1000 according to the second embodiment is attached to the sheet metal bracket member 120 will be described with reference to FIGS. 14 and 15.

FIG. 14 is a vertical cross-sectional perspective view at the center position of the second heating element 40b with the sheet metal outer case 200 attached to the sheet metal bracket member 120. FIG. 15 is an enlarged view of the vicinity of the second heating element 40b. The arrows in FIGS. 14 and 15 indicate the flow of heat. As shown in FIGS. 14 and 15, the sheet metal outer case 200 is attached to the sheet metal bracket member 120. The sheet metal bracket member 120 is fixed to the metal wall material 3000a (see FIG. 16) of the control panel 3000 with screws 501.

The heat generated by the second heating element 40b is transmitted to the second protrusion 20a of the sheet metal outer case 200 via the second heat dissipation sheet 23, and is diffused into the sheet metal outer case 200. The heat transmitted downward is transmitted to the surface of the sheet metal bracket member 120 via the contact portion between the sheet metal outer case 200 and the sheet metal bracket member 120.

With reference to FIGS. 16 and 17, a state in which the control device 1000 according to the second embodiment is installed on the control panel 3000 will be described.

FIG. 16 is a cross-sectional view of the control panel 3000 with the control device 1000 installed on the control panel 3000. Moreover, FIG. 17 is a front view of the control panel 3000 in a state where the control device 1000 is installed on the control panel 3000. Note that in FIG. 17, the front cover of the control panel 3000 is not shown for convenience of explanation. As shown in FIGS. 16 and 17, the sheet metal bracket member 120 is attached to a metal wall material 3000a within the control panel 3000. The heat transferred to the sheet metal bracket member 120 is transferred to the metal wall material 3000a having a large area, as shown by the arrow in FIG.

Note that in this embodiment, four control devices 1000 are housed in the control panel 3000, but the number of control devices 1000 is not limited to four.

Next, the effects of the control device 1000 and the control panel 3000 according to the second embodiment will be described.

According to the control device 1000 according to the second embodiment, the structure ST includes the sheet metal outer case 200. The sheet metal outer case 200 holds the main circuit board 40, faces the back surface RS of the main circuit board 40, and has a second protrusion 20a. Therefore, heat can be diffused using the sheet metal outer case 200.

The control panel 3000 according to the second embodiment includes a sheet metal bracket member 120 to which the sheet metal outer case 200 of the control device 1000 is attached, and a metal wall material 3000a to which the sheet metal bracket member 120 is attached. Therefore, heat can be diffused through the route of the sheet metal outer case 200, the sheet metal bracket member 120, and the metal wall material 3000a.

In the control panel 3000 in which the air conditioning control equipment is installed, the heat of the heat generating components mounted on the main circuit board 40 is transferred to the structure ST corresponding to the main circuit board 40, the sheet metal outer case 200, the sheet metal bracket member 120, and the control panel. Heat can be spread through 3000 routes. Even if a large number of heat generating components are mounted on the main circuit board 40, it is possible to suppress heat from accumulating inside the control device 1000. Therefore, an efficient cooling configuration can be realized. Therefore, when the control device 1000 according to the second embodiment is applied to an air conditioning control device, an efficient cooling structure can be realized.

The embodiments disclosed this time should be considered to be illustrative in all respects and not restrictive. The scope of the present disclosure is indicated by the claims rather than the above description, and it is intended that equivalent meanings and all changes within the scope of the claims are included.

1 Display device, 8 Housing member, 20 Base sheet metal member, 20a Second protrusion, 22 Fire prevention partition sheet metal member, 23 Second heat dissipation sheet, 30 Sheet metal case member, 33 Power supply system board, 40 Main circuit board, 40a 1st heating element, 40b 2nd heating element, 40c plate spring component, 41 1st heat dissipation sheet, 42 heat spreader, 42a 1st protrusion, 42d bent part, 51 transmission system board, 60 housing cover member, 60c air intake 60d Exhaust slit, 120 Sheet metal bracket member, 200 Sheet metal outer case, 403, 404, 501 Screws, 1000 Control equipment, 3000 Control panel, 3000a Metal wall material, FS front, RS back, ST structure.

Claims

a main circuit board having a front surface and a back surface;
a first heating element mounted on the surface of the main circuit board;
a second heating element mounted on the back surface of the main circuit board;
a structure having a first protrusion protruding toward the first heating element and a second protrusion protruding toward the second heating element;
a first heat dissipation sheet sandwiched between the first heating element and the first protrusion;
a second heat dissipation sheet sandwiched between the second heating element and the second protrusion,
The first heat dissipation sheet is in contact with the first heating element and the first protrusion,
The second heat dissipation sheet is in contact with the second heat generating element and the second projection.
Further comprising a housing cover member provided with a plurality of intake slits and a plurality of exhaust slits,
The main circuit board, the first heating element, the second heating element, the structure, the first heat radiation sheet, and the second heat radiation sheet are covered by the housing cover member,
The first heat generating element, the second heat generating element, the first heat dissipation sheet and the second heat dissipation sheet are arranged between the main circuit board and the structure,
The main circuit board and the structure are configured to allow air to flow from the plurality of intake slits to the plurality of exhaust slits through between the main circuit board and the structure. 1. The control device according to 1.
the structure includes a heat spreader;
The control device according to claim 1 or 2, wherein the heat spreader faces the surface of the main circuit board and has the first protrusion.
The structure includes a base sheet metal member,
The control device according to claim 3, wherein the base sheet metal member holds the main circuit board and the heat spreader, faces the back surface of the main circuit board, and has the second protrusion.
The control device according to claim 4, wherein a gap between the main circuit board and the heat spreader is narrower than a gap between the main circuit board and the base sheet metal member.
The control device according to claim 5, wherein the height of the first protrusion is lower than the height of the second protrusion.
The first protrusion includes a lower surface on which the first heat dissipation sheet is disposed, and at least two first side surfaces connecting the lower surface and the main surface of the heat spreader,
One of the first side surfaces of the at least two first side surfaces is arranged substantially perpendicular to the direction of wind passing through the gap between the main circuit board and the heat spreader;
The second protrusion includes an upper surface on which the second heat dissipation sheet is disposed, and at least two second side surfaces connecting the upper surface and the main surface of the base sheet metal member,
5. One of the at least two second side surfaces is arranged substantially perpendicular to the direction of wind passing through the gap between the main circuit board and the heat spreader. Control equipment described in .
One of the at least two first side surfaces has a first side connected to the lower surface, a second side connected to the main surface of the heat spreader, and a second side connected to the first side and the second side connected to the main surface of the heat spreader. a third side connected to the second side and connected to another of the at least two first side surfaces;
the second side is longer than the first side,
One of the at least two second side surfaces includes a fourth side connected to the top surface, a fifth side connected to the main surface of the base sheet metal member, and a fourth side connected to the main surface of the base sheet metal member. and a sixth side connected to the fifth side and connected to another of the at least two second side surfaces,
The control device according to claim 7, wherein the fifth side is longer than the fourth side.
Further equipped with a sheet metal outer case,
The structure includes the sheet metal outer case,
The control device according to claim 1, wherein the sheet metal outer case holds the main circuit board, faces the back surface of the main circuit board, and has the second protrusion.
The control device according to claim 9;
a sheet metal bracket member to which the sheet metal outer case of the control device is attached;
A control panel comprising: a metal wall material to which the sheet metal bracket member is attached.