JP2009182182A - Heat dissipation structure of electronic component storage case body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat dissipation structure of an electronic component storage case body which is easy to assemble. <P>SOLUTION: The heat dissipation structure of the electronic component storage case body comprises a heat generating electronic component 40, a circuit board 30 on which the heat generating electronic component 40 is mounted, and a case body 1 (10, 20) containing the circuit board 30. The heat dissipation structure of the electronic component storage case body is characterized in that heat can be dissipated by the case body 1 through projection portions 15 and 15A for heat transmission and the component can be easily assembled by: forming the case body 1 with a thermally conductive resin; and providing the case body 1 integrally with the heat generating electronic component 40 mounted on the circuit board 30 or the projection portions 15 and 15A abutting against the thermally conductive member 41 mounted on the circuit board 30 through the heat generating electronic component 40. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a heat dissipation structure in an electronic component storage case body including a heat generating electronic component that self-heats by energization such as a power transistor.

  Conventionally, an electronic circuit mounted on a circuit board is housed in a case to constitute a circuit unit, and particularly when a heat generating electronic component such as a power transistor is used, an excessive heat rise of the heat generating electronic component itself. It is necessary to prevent fluctuations in characteristics due to the thermal damage. For this reason, a structure is generally employed in which the heat of the heat dissipating electronic component is transmitted and dissipated to the outside of the case body using a metal plate having good heat conduction as a heat dissipating plate.

Generally, as in the heat dissipation structure described in Patent Document 1, when a heat sink (heat sink) is contacted and fixed to a heat generating electronic component and heat can be absorbed in a large case body, Heat is dissipated through a heat sink (heat sink). However, in the case where heat cannot be absorbed completely on the inner side of the case body, the heat radiating plate (heat radiating member) is exposed outside the case body as in the heat radiating structure described in Patent Document 2. Is arranged. At that time, a large heat radiating plate (heat radiating member) is fixed to the case body with screws, or fixed to the case body through individual fixing means, and thus radiates from the heat generating electronic components. A structure that dissipates the heat generated outside the case body is adopted.
Japanese Patent Laid-Open No. 5-160307 Japanese Patent Laid-Open No. 11-220821

  By the way, in the above heat dissipation structure, the fixing structure of the heat dissipation plate that is fixed in contact with the heat-generating electronic component and the heat dissipation plate that is exposed outside the case body and promotes heat dissipation is screwed with a screw or by a fixing pin. In the case of thermal welding, if the fixing position of each component is further shifted, stress due to the displacement may be applied to the electronic component, leading to damage. Therefore, accurate alignment is required, and assembly of electronic components including heat sinks is required. There is a problem that it takes time and labor, and the efficiency of the assembly work tends to deteriorate.

  An object of the present invention is to provide a heat dissipating structure in an electronic component housing case body that is easy to assemble and that does not require troublesome operations such as positioning and screwing.

  In order to solve the above-described problem, the present invention provides a heat generating electronic component that self-heats when energized, a circuit board on which the heat generating electronic component is mounted, and the heat generating electronic component together with the circuit board. In the heat dissipation structure in the electronic component housing case body having the case body, the case body is formed of a heat conductive resin, and the heat generating electronic component mounted on the circuit board is mounted on the case body, Alternatively, the heat dissipating structure in the electronic component storage case body is provided integrally with a heat transfer protrusion that contacts the heat dissipating member mounted on the circuit board via the heat generating electronic component.

  By configuring in this way, the heat transfer protrusion provided integrally from the case body emits from the heat source side only by directly contacting the heat generating electronic component or the heat radiating member set on the heat generating electronic component. Heat can be transferred, and heat can be dissipated by the case body through this heat transfer protrusion. At this time, it is possible to easily assemble the parts without increasing the number of fixing parts. The heat dissipation structure in the electronic component storage case body that can be provided can be provided.

  Further, in the heat dissipation structure in the electronic component storage case body according to claim 1, in claim 2, the heat transfer protrusion is in contact with the heat generating electronic component or the heat dissipation member so as to apply a predetermined tension. It is characterized by.

  By configuring in this way, even if there is a variation in the dimensions of the assembled parts, the heat transfer protrusions are brought into contact with the heat generating electronic parts and the heat radiating member by applying a predetermined tension. As a result, the heat can be efficiently radiated.

  The electronic component storage case body according to claim 1 or 2, wherein the case body includes two case bodies so as to cover a front side and a back side of the circuit board. A circuit board heat transfer protrusion is formed on either one of the case bodies, and is formed on the circuit board so as to come into contact with the back side of a predetermined portion of the circuit board on which the heat generating electronic component or the heat dissipation member is mounted. It is characterized by.

  With this configuration, the heat propagated from the heat generating electronic component or the heat radiating member, which is a heat source, to the circuit board can be radiated through the circuit board heat transfer protrusion. In this case, heat can be efficiently radiated by the case body covering the circuit board without adding individual components for heat radiation.

  Further, in the heat dissipation structure in the electronic component storage case body according to claim 3, in claim 4, the circuit board heat transfer protrusion is in contact with the circuit board so as to apply a predetermined tension. It is a feature.

  With this configuration, even if there is a variation in the dimensions of the assembly parts, the circuit board heat transfer protrusion is applied to the circuit board side with a predetermined tension between the circuit board and the case body. Therefore, the contact between the circuit board heat transfer protrusion and the circuit board can be kept good, and heat can be efficiently radiated.

  Further, in the heat dissipation structure for an electronic component storage case body according to any one of claims 1 to 4, in claim 5, the case body is provided with a heat radiating air hole. It is what.

  By comprising in this way, the heat radiated | emitted from the heat-generating electronic component which is a heat source, or a heat radiating member can be radiated | emitted outside via the vent hole provided in the case body.

  Further, in the heat dissipation structure in the electronic component storage case body according to claim 5, in claim 6, the case body is provided with a wall portion for promoting heat dissipation to the vent hole. To do.

  By configuring in this way, by suppressing the heat dissipated from the heat generating electronic components and heat radiating members, which are heat sources, from spreading from the wall portion to the outside, the wall portion has a function as a ventilation guide path. The heat dissipated to the air hole can be guided, and the heat radiation to the outside can be favorably performed.

  In the present invention, a heat dissipation structure in an electronic component housing case having a heat generating electronic component that self-heats when energized, a circuit board on which the heat generating electronic component is mounted, and a case body that houses the heat generating electronic component together with the circuit board. The case body is formed of a heat conductive resin, and the case body is provided with the heat generating electronic component mounted on the circuit board, or the heat dissipation mounted on the circuit board via the heat generating electronic component. By providing a heat transfer protrusion integrally with the member, the heat transfer electronic part is a heat source side only by contacting the heat transfer protrusion with the heat generation electronic component or the heat dissipation member set in the heat generation electronic component. The heat generated from the heat radiating member can be directly transferred to the heat transfer protrusion, and the heat is radiated by the case body through the heat transfer protrusion. It is possible. At this time, it is possible to provide a heat dissipation structure in an electronic component storage case body that can be easily assembled without increasing the number of heat dissipation components and fixing components, and can achieve the initial purpose. it can.

  Hereinafter, an embodiment of a heat dissipation structure in an electronic component storage case body to which the present invention is applied will be described with reference to the accompanying drawings.

  1 and 2 show a first embodiment of the present invention. FIG. 1 is an exploded perspective view showing a main part of a heat dissipation structure in an electronic component storage case body, and FIG. 2 shows an assembled state of FIG. It is sectional drawing of an AA line.

  As the entire structure of the electronic component storage case body in which the electronic component according to the present embodiment is mounted, the entire case body 1 is constituted by the upper case body 10 and the lower case body 20 formed of a synthetic resin material. A circuit board 30 is accommodated inside the bodies 10 and 20.

  A heat generating electronic component 40 such as a power transistor is mounted on the circuit board 30 together with general electronic components (not shown) such as a resistor and a capacitor. At this time, a heat radiating plate 41 (heat radiating member) made of aluminum or the like is attached to one of the heat generating electronic components 40.

  The upper case body 10 and the lower case body 20 are each formed in a cup shape so as to accommodate and hold the circuit board 30 between the upper and lower sides. The lower case body 20 is formed in the shape of a box whose lower part is opened by the side wall part 12 extending downward from the periphery of the upper wall part 11, and the lower case body 20 is similar to the upper case body 10, and has a substantially flat bottom wall part 21. And a side wall portion 22 extending upward from the periphery of the bottom wall portion 21 to form a box shape (cup shape) whose upper side is opened.

  In addition, as a structure of the case body 1 for positioning, storing and fixing the circuit board 30, a plurality of mounting boss portions 23 each having a columnar shape project integrally upward on the bottom wall portion 21 of the lower case body 20. A cylindrical hole 23 </ b> A for fixing and holding the circuit board 30 is provided at the upper end of the boss 23. A pin-like boss 13 protrudes downward from the upper wall 11 of the upper case 10 corresponding to the position of the cylindrical hole 23A provided in the boss 23 of the lower case 20. In addition, an alignment pin 13A to be inserted into a cylindrical hole portion 23A provided in the boss portion 23 of the lower case body 20 is integrally provided at the lower end portion of the boss portion 13 and provided on the upper case body 10 side. The circuit board 30 is sandwiched and held between the boss portion 13 and the boss portion 23 provided on the lower case body 20 side. At this time, an alignment hole 31 is provided in the circuit board 30 for alignment with the case bodies 10 and 20.

  In addition, a locking portion 24 having a triangular cross section for engaging and fixing with the upper case 10 is projected from the outer wall portion of the side wall portion 22 of the lower case 20. An elastic hook portion 14 that engages with the locking portion 24 is integrally provided at a position facing the locking portion 24 of the lower case 20.

  In the present embodiment, the case body 1 including the upper case body 10 and the lower case body 20 is formed of a heat conductive resin, and the heat conductive resin is made of, for example, a carbon material having good heat conductivity. Added resin such as PPS, PC, ABS, PBT, and PPS), and has a characteristic of thermal conductivity of 0.3 W / mK or more. In this embodiment, for example, [trade name: Raheama] manufactured by Teijin Limited is applied as the heat conductive resin.

  The case body 1 includes a heat dissipation structure. In the first embodiment, the heat generating electronic component 40 mounted on the circuit board 30 or the heat generating electronic component 40 is mounted on the circuit board 30. A heat transfer protrusion 15 is integrally provided from the upper wall portion 11 of the upper case body 10 so as to directly contact the fixed heat radiating member 41. In this case, as shown in FIGS. 1 and 2, the heat transfer protrusion 15 provided facing the heat generating electronic component 40 located on the left side of the circuit board 30 is formed of a substantially cylindrical heat conductive resin. A heat transfer protrusion 15A having a prismatic shape is integrally provided from the upper case body 10 so as to be in direct contact with the heat radiating member 41 assembled to the heat generating electronic component 40 located on the right side of the circuit board 30. ing.

  In addition, the upper case body 10 on the base side of the heat transfer protrusion 15 having a cylindrical shape that contacts the heat generating electronic component 40 located on the left side on the circuit board 30 surrounds the periphery of the heat transfer protrusion 15. A cutout portion 16 having a substantially U shape is formed in the upper wall portion 11, and an elastic arm piece 17 that supports the heat transfer protrusion 15 is formed by the cutout portion 16.

  Further, the heat transfer protrusion 15A is supported on the base side of the heat transfer protrusion 15A having a prismatic shape that comes into contact with the heat dissipation member 41 assembled and fixed to the heat generating electronic component 40 located on the right side of the circuit board 30. An elastic arm piece 17A connected to the upper case body 10 is formed.

  In addition, vents 18 for radiating heat emitted from the heat generating electronic component 40 and the heat radiating member 41 that are heat sources are provided at appropriate positions on the side wall portion 12 and the upper wall portion 11 of the upper case body 10. The upper case body 10 is provided with a wall portion 19 for promoting heat radiation to the vent hole 18.

  In the first embodiment, as the heat dissipation structure on the lower case body 20 side, the lower case body is in contact with a position located on the back side of the circuit board 30 on which the heat generating electronic component 40 located on the left side is mounted. A circuit board heat transfer protrusion 25 having a substantially cylindrical shape is integrally formed from the bottom wall portion 20 of the protrusion 20. In this case, a substantially U-shaped cutout 26 is formed in the bottom wall portion 21 so as to surround the circuit board heat transfer protrusion 25, and the circuit board heat transfer protrusion 25 is formed by the cutout 26. An elastic arm piece 27 is formed to support the.

  In addition, the side wall portion 22 and the bottom wall portion 21 of the lower case body 20 are appropriately provided at a place for dissipating heat transmitted from the heat generating electronic component 40 or the heat radiating member 41 serving as a heat source to the circuit board 30. An air hole 28 is provided, and a wall portion 29 for promoting heat radiation to the air hole 28 is provided in the upper case body 10.

  In addition to the function for promoting heat dissipation, the walls 19 and 29 may be provided so as to function as a heat shield in order to prevent characteristic fluctuations of the electronic components due to excessive heat rise and thermal destruction. is there.

  In the heat dissipation structure in the electronic component storage case body according to the first embodiment configured as described above, for example, the circuit board 30 on which the electronic component and the heat generating electronic component 40 are mounted is set with the lower case body 20 as a reference. At this time, the boss portion 13 provided on the upper case body 10 side is set by setting the upper case body 10 by aligning the position of the alignment hole 31 of the circuit board 30 with the position of the boss portion 23 of the lower case body 20. The positioning pin 13A is inserted into the cylindrical hole portion 23A of the boss portion 23 provided on the lower case body 20 side and positioned, and at the same time, the circuit board 30 is sandwiched between the boss portions 13 and 23. While being held, the circuit board 30 is housed in the case body 1 by engaging the engaging portion 24 of the lower case body 20 and the elastic hook portion 14 of the upper case body 10, and the assembly and fixing are completed.

  In this assembled state, in the present embodiment, the case body 1 (upper case body 10 and lower case body 20) is formed of a heat conductive resin and is integrated from the case body 1 (upper case body 10). Heat generated from the heat source side can be transmitted simply by contacting the heat generating electronic component 40 or the heat radiating member 41 set on the heat generating electronic component 40 directly by the heat transfer protrusion 15 provided to the heat generating component. An electronic component storage case body that can dissipate heat through the heat transfer protrusion 15 by the case body 10 and can be easily assembled without increasing the number of fixing components. The heat dissipation structure can be provided.

  Further, by providing a notch portion 16 having a substantially U shape on the upper wall portion 11 of the upper case body 10 so as to surround the periphery of the heat transfer protrusion portion 15 provided in the upper case body 10, the heat transfer protrusion portion. Since the elastic arm piece 17 that supports 15 is formed, the elastic arm piece 17 can be brought into contact with the heat generating electronic component 40 so that a predetermined tension is applied even if there is a variation in the dimensions of the assembled parts. As a result, the heat transfer protrusion 15 and the heat source (the heat generating electronic component 40) can be kept in good contact with each other. As a result, efficient heat dissipation can be performed.

  Also, a heat transfer protrusion 15A having a prismatic shape is integrally provided from the upper case body 10 so as to be in direct contact with the heat radiating member 41 mounted on the right side of the circuit board 30 and assembled to the heat generating electronic component 40. As a result, it is possible to maintain good contact between the heat transfer protrusion 15 and the heat radiation member 41 serving as a heat source, and as a result, heat can be radiated from the upper case body 10 via the heat transfer protrusion 15A.

  At this time, an arm piece 17A having elasticity that supports the heat transfer protrusion 15A and is connected to the upper case body 10 is formed on the base side of the heat transfer protrusion 15A. Even if there is, the heat transfer protrusion 15A is in good contact with the heat radiating member 41 as a heat source by contacting the heat radiating member 41 with a predetermined tension by the elastic arm piece 17A. It can hold | maintain and can perform efficient heat dissipation.

  Further, by projecting and forming a circuit board heat transfer protrusion 25 having a substantially cylindrical shape integrally with the bottom wall portion 21 of the lower case body 20 so as to be in direct contact with a location located on the back side of the circuit board 30, Heat transmitted from the heat generating electronic component 40 or the heat radiating member 41 serving as a heat source to the circuit board 30 can be radiated through the circuit board heat transfer protrusion 25. At this time, heat can be efficiently radiated by the case body 20 covering the circuit board 30 without adding individual components for heat radiation. An elastic arm piece 27 that supports the circuit board heat transfer protrusion 25 by forming a substantially U-shaped notch 26 in the bottom wall 21 so as to surround the circuit board heat transfer protrusion 25. Therefore, the contact between the circuit board heat transfer protrusion 25 and the circuit board 30 can be kept good, and efficient heat dissipation can be performed.

  Further, a heat generating electronic component which is a heat source is provided at a suitably set location on the side wall portion 12 or the top wall portion 11 of the upper case body 10 or a suitably set location on the side wall portion 22 or the bottom wall portion 21 of the lower case body 20. By providing the vent holes 18 and 28 for radiating the heat dissipated from the heat radiating member 40 and the heat radiating member 41, the case body 10 can radiate the heat radiated from the heat generating electronic component 40, the heat radiating member 41 or the circuit board 30 as heat sources. , 20 can be radiated to the outside through the vent holes 18, 28. In addition, while suppressing the heat dissipated from the heat generating electronic component 40, the heat radiating member 41, or the circuit board 30 as a heat source from spreading from the wall portions 19 and 29 to the outside, the wall portions 19 and 29 are passed through the ventilation guide path. By providing the function, the heat dissipated to the vent holes 18 and 28 can be guided, and the heat radiation to the outside can be performed satisfactorily.

  FIG. 3 shows a second embodiment of the present invention, and FIG. 3 is a front view of the main part showing a state in which the electronic component mounted on the circuit board is housed and fixed in the electronic component housing case body. The same parts as those of the first embodiment and equivalent parts will be described with the same reference numerals.

  As the entire structure of the electronic component storage case body in which the electronic components according to the present embodiment are mounted, the upper case body 10 and the lower case body 20 formed of the heat conductive resin material in the same manner as in the first embodiment described above. The entire case body 1 is configured, and a circuit board 30 is accommodated in the upper and lower case bodies 10 and 20. A heat generating electronic component 40 such as a power transistor is mounted on the circuit board 30 together with general electronic components (not shown) such as a resistor and a capacitor. At this time, a heat radiating plate 41 (heat radiating member) made of aluminum or the like is attached to one of the heat generating electronic components 40.

  Further, as the heat dissipation structure in the second embodiment, the heat transfer protrusion 15 provided to face the heat generating electronic component 40 located on the left side on the circuit board 30 is formed of a substantially cylindrical heat conductive resin. In addition, a protrusion 15A for heat transfer having a prismatic shape provided integrally with the heat radiating member 41 assembled to the heat generating electronic component 40 located on the right side on the circuit board 30 is integrally provided from the upper case body 10, respectively. ing.

  In addition, the upper case body 10 on the base side of the heat transfer protrusion 15 having a cylindrical shape facing the heat generating electronic component 40 located on the left side on the circuit board 30 surrounds the periphery of the heat transfer protrusion 15. A cutout portion 16 having a substantially U shape is formed in the upper wall portion 11, and an elastic arm piece 17 that supports the heat transfer protrusion 15 is formed by the cutout portion 16.

  Further, a heat transfer protrusion is formed on the base side of the heat transfer protrusion 15 </ b> A having a prismatic shape disposed opposite to the heat dissipation member 41 assembled and fixed to the heat generating electronic component 40 located on the right side of the circuit board 30. An elastic arm piece 17A that supports the portion 15A and is connected to the upper case body 10 is formed.

  In addition, vents 18 for radiating heat emitted from the heat generating electronic component 40 and the heat radiating member 41 that are heat sources are provided at appropriate positions on the side wall portion 12 and the upper wall portion 11 of the upper case body 10. The upper case body 10 is provided with a wall portion 19 for promoting heat radiation to the vent hole 18.

  Further, as the heat dissipation structure on the lower case body 20 side, a configuration substantially the same as that of the first embodiment is adopted. In the second embodiment, a substantially cylindrical body is integrally formed from the bottom wall portion 21 of the lower case body 20 so as to face a portion located on the back side of the circuit board 30 on which the heat generating electronic component 40 located on the left side is mounted. A circuit board heat transfer protrusion 25 having a shape is formed so as to protrude. In this case, a substantially U-shaped notch 26 is formed in the bottom wall 21 so as to surround the periphery of the circuit board heat transfer protrusion 25 in substantially the same manner as in the first embodiment described above. An elastic arm piece 27 that supports the circuit board heat transfer protrusion 25 is formed by the notch 26.

  In addition, the side wall portion 22 and the bottom wall portion 21 of the lower case body 20 are appropriately provided at a place for dissipating heat transmitted from the heat generating electronic component 40 or the heat radiating member 41 serving as a heat source to the circuit board 30. An air hole 28 is provided, and a wall portion 29 for promoting heat radiation to the air hole 28 is provided in the upper case body 10.

  By the way, in the second embodiment, a heat transfer member 50 such as silicon rubber having elasticity and good thermal conductivity is disposed on the side in contact with the heat generating electronic component 40 or the heat radiating member 41 which is a heat source. .

  Further, on the back side of the circuit board 30, a heat transfer member 50 such as silicon rubber having elasticity and good elasticity between the circuit board heat transfer protrusions 25 arranged opposite to the circuit board 30. Is arranged.

  The circuit board 30 is provided so as to be sandwiched and held between the side wall portions 12 and 22 of the upper and lower case bodies 10 and 20.

  In the heat dissipation structure in the electronic component storage case body according to the second embodiment configured as described above, the case body 1 (the upper case body 10 and the lower case body 20) is formed of a heat conductive resin, and the case body 1 The heat-generating electronic component 40 or the heat-dissipating member 41 set directly on the heat-generating electronic component 40 via the heat transfer member 50 having elasticity by the heat-transfer protrusion 15 integrally provided from the (upper case body 10). Heat generated from the heat source side can be transmitted simply by abutting with. At this time, even if there is a slight variation in the dimensions of the assembled parts, a heat transfer member 50 such as silicon rubber having elasticity and good thermal conductivity is provided on the side in contact with the heat generating electronic component 40 or the heat radiating member 41. By absorbing the dimensional variation, the elastic arm pieces 17 and 17A are brought into contact with the heat generating electronic component 40 and the heat radiating member 41 via the heat transfer member 50 so that a predetermined tension is applied. Since the contact between the heat transfer protrusion 15 and the heat source (the heat generating electronic component 40) can be kept better, as a result, efficient heat dissipation can be performed.

  Similarly, on the back side of the circuit board 30, even if there is a slight variation in the dimensions of the assembled parts, the circuit board 30 is elastic between the circuit board 30 and the circuit board heat transfer protrusions 25. By disposing the heat transfer member 50 such as silicon rubber having good thermal conductivity, it is possible to absorb dimensional variations and to transfer the heat on the circuit board 30 side to the heat transfer member 50 having elasticity. Further, the elastic arm piece 27 is brought into contact with the circuit board 30 through the heat transfer member 50 so that a predetermined tension is applied, so that the contact between the circuit board heat transfer protrusion 25 and the circuit board 30 is further improved. As a result, efficient heat dissipation can be performed.

  In addition, this invention is not limited to the Example mentioned above, A various deformation | transformation implementation is possible in the range of the summary of this invention. For example, in the above-described embodiment, the case body 1 (the upper case body 10 and the lower case body 20) is formed of a heat conductive resin, and the cylindrical or square heat transfer provided integrally from the case body 1 is performed. Although the structure that directly contacts the heat-generating electronic component 40 or the heat-dissipating member 41 set on the heat-generating electronic component 40 by the projecting portion 15 is adopted to obtain a heat dissipation effect, the shape is the shape of the heat-dissipating electronic component. Other shapes, for example, an elliptical shape, a polygonal shape, or a rectangular shape that also serves as a wall, can be set as appropriate. In some cases, a fin for heat dissipation is provided on the outer surface of the case body 1. As a result, the heat dissipation effect can be further enhanced.

FIG. 1 is an exploded perspective view showing a main part of a heat dissipation structure in an electronic component storage case body according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line AA showing the assembled state of FIG. FIG. 3 is a cross-sectional view of a main part showing a state in which an electronic component mounted on a circuit board according to a second embodiment of the present invention is housed and fixed in an electronic component housing case body.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Case body 10 Upper case body 11 Upper wall part 12 Side wall part 13 Boss part 13A Positioning pin 14 Elastic hook part 15, 15A Heat transfer protrusion 16 Notch part 17 Elastic arm piece 17A Arm piece 18 Vent hole 19 Wall part DESCRIPTION OF SYMBOLS 20 Lower case body 21 Bottom wall part 22 Side wall part 23 Assembling boss part 23A Cylindrical hole part 24 Locking part 25 Projection part for circuit board heat transfer 26 Notch part 27 Elastic arm piece 28 Vent hole 29 Wall part 30 Circuit board 31 Alignment hole 40 Heat-generating electronic component 41 Heat dissipation member 50 Heat transfer member

Claims (6)

  In the heat dissipation structure in an electronic component housing case body, comprising: a heat generating electronic component that self-heats when energized; a circuit board on which the heat generating electronic component is mounted; and a case body that houses the heat generating electronic component together with the circuit board. The body is made of a heat conductive resin, and the case body is in contact with the heat generating electronic component mounted on the circuit board or the heat dissipation member mounted on the circuit board via the heat generating electronic component. A heat dissipating structure in an electronic component storage case body, wherein a heat transfer protrusion is integrally provided.   2. The heat dissipation structure in an electronic component storage case body according to claim 1, wherein the heat transfer protrusion is in contact with the heat generating electronic component or the heat dissipation member so as to apply a predetermined tension.   The case body is formed by two case bodies so as to cover the front side and the back side of the circuit board, and the predetermined portion of the circuit board on which the heat generating electronic component or the heat dissipation member is mounted on the circuit board The heat dissipation structure in the electronic component storage case body according to claim 1, wherein a protrusion for heat transfer on the circuit board that contacts the back side of the electronic circuit board is provided on one of the case bodies.   4. The heat dissipation structure for an electronic component storage case according to claim 3, wherein the circuit board heat transfer protrusion is in contact with the circuit board so as to apply a predetermined tension.   The heat dissipation structure in the electronic component storage case according to any one of claims 1 to 4, wherein the case body is provided with a heat dissipation air passage.   6. The heat dissipation structure in an electronic component storage case according to claim 5, wherein the case body is provided with a wall portion for promoting heat dissipation to the air passage.

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