JP2003087934A - Electric junction box - Google Patents

Electric junction box

Info

Publication number
JP2003087934A
JP2003087934A JP2001270440A JP2001270440A JP2003087934A JP 2003087934 A JP2003087934 A JP 2003087934A JP 2001270440 A JP2001270440 A JP 2001270440A JP 2001270440 A JP2001270440 A JP 2001270440A JP 2003087934 A JP2003087934 A JP 2003087934A
Authority
JP
Japan
Prior art keywords
insulating layer
heat
plate
circuit board
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001270440A
Other languages
Japanese (ja)
Inventor
Takeshi Hosokawa
剛 細川
Takao Nozaki
隆男 野崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd, AutoNetworks Technologies Ltd, Sumitomo Electric Industries Ltd filed Critical Sumitomo Wiring Systems Ltd
Priority to JP2001270440A priority Critical patent/JP2003087934A/en
Publication of JP2003087934A publication Critical patent/JP2003087934A/en
Withdrawn legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Connection Or Junction Boxes (AREA)

Abstract

PROBLEM TO BE SOLVED: To let out heat produced in the internal circuit of an electric junction box and improve the operating environment for the circuit. SOLUTION: A circuit plate 13 for current distribution through which a large or medium current is passed and a printed board 14 as a circuit for control through which a small current is passed are laminated with an insulating plate 16 in-between to constitute the internal circuit of the electric junction box 10. The insulating plate 16 comprises a heat sink 17 provided with a first insulating layer 18 on the surface 17a thereof on one side and a second insulating layer 19 on the surface 17b thereof on the other side. The first insulating layer 18 and the second insulating layer 19 are so set that the first insulating layer is higher in heat transfer coefficient than the second insulating layer. When the insulating plate 16 is installed, the first insulating layer 18 is positioned on the side of the circuit plate 13 for current distribution, and the second insulating layer 19 is positioned on the side of the printed board 14. Thus, heat produced in the circuit board 13 for current distribution is transferred to the heat sink 17 through the first insulating layer 18, and the heat is then let out of the case of the electric junction box through the heat sink 17.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は電気接続箱に関し、
詳しくは、電気接続箱の内部で生じる熱に対する放熱性
の向上を図るものである。
TECHNICAL FIELD The present invention relates to an electrical junction box,
Specifically, it is intended to improve the heat dissipation performance against heat generated inside the electric junction box.

【0002】[0002]

【従来の技術】自動車に搭載される電気接続箱は、車載
電装品及びワイヤハーネス本数の増加や電子制御化の進
行の影響を受けて、電流分配機能等に対応した内部回路
のみを収容し、別体にした制御部の電子ユニットが上記
内部回路を制御するという形態が普及している。しか
し、近時の一段と高まっている電気接続箱の小型化等の
要求に応えるため、電流分配機能等を有する大電流或い
は中電流用(アンペア単位の電流値)の回路と、小電流
(数10ミリアンペア単位の電流値)が流れる制御用の
回路を同一の電気接続箱に収容するものが使用され始め
ている。この種の電気接続箱は、大電流等の回路が発生
する熱が制御用の回路に伝達されないよう種々の工夫が
なされている。
2. Description of the Related Art An electric connection box mounted on an automobile receives only an internal circuit corresponding to a current distribution function or the like, under the influence of an increase in the number of vehicle-mounted electric components and wire harnesses and progress of electronic control, A form in which an electronic unit of a separate control unit controls the internal circuit is widely used. However, in order to meet the recent increasing demand for miniaturization of electric junction boxes, a circuit for large current or medium current (current value in amperes) having a current distribution function and a small current (several tens of minutes). The one that houses the control circuit in which the current value in milliamperes) flows in the same electrical junction box is beginning to be used. This kind of electrical junction box has been devised in various ways so that the heat generated by the circuit such as a large current is not transferred to the control circuit.

【0003】図6は、特開2000−83310号に開
示されている従来の熱伝達の防止を考慮した電気接続箱
1であり、上方のケース2と下方を被うカバー3で形成
される内部の空間に、リレーR等の電気部品を実装する
大電流等が流れるベース基板4と、制御用の電気素子5
等を実装する制御基板6を収容している。耐熱温度の低
い電気素子5等を実装する制御基板6は、ベース基板4
に対して略垂直方向で固定されており、ケース2の内部
には、リレーR等の電気部品と制御基板6を仕切る隔壁
2aを突設している。
FIG. 6 shows an electric junction box 1 disclosed in Japanese Patent Application Laid-Open No. 2000-83310 in consideration of prevention of heat transfer, which is formed by an upper case 2 and a lower cover 3 which covers the inside. In the space, the base substrate 4 through which a large current or the like for mounting electric components such as the relay R flows, and the electric element 5 for control.
A control board 6 for mounting the above components is housed. The control board 6 on which the electric element 5 having a low heat resistant temperature is mounted is the base board 4
It is fixed in a substantially vertical direction with respect to the inside of the case 2, and a partition wall 2a is provided inside the case 2 to partition the control board 6 from the electric components such as the relay R.

【0004】電気接続箱1は、ベース基板4と制御基板
6を上記のような位置関係にしているので、ベース基板
4の発する熱が制御基板6へ伝達されにくくしており、
また、隔壁2を突設することで、リレーR等が発生する
熱の伝達も防止して、マイコン等の電気素子5の確実な
作動を確保するようにしている。
In the electric junction box 1, since the base board 4 and the control board 6 are placed in the above-described positional relationship, heat generated by the base board 4 is difficult to be transferred to the control board 6.
Further, by projecting the partition wall 2, the heat generated by the relay R and the like is prevented from being transmitted, and the reliable operation of the electric element 5 such as the microcomputer is ensured.

【0005】[0005]

【発明が解決しようとする課題】しかし、図6の電気接
続箱1でも、長時間使用していると、リレーR等の発熱
により隔壁2が全体的に暖められることになり、隔壁2
が暖められると、やはり制御基板6へ熱が伝達されるこ
とになる。このように熱が伝達されると電気素子5等の
作動が不安定になるおそれもあり、電気接続箱1の信頼
性を維持できない問題がある。
However, even in the electrical junction box 1 of FIG. 6, if the electrical junction box 1 is used for a long period of time, the heat generated by the relay R or the like causes the bulkhead 2 to be entirely warmed up.
When is heated, heat is also transferred to the control board 6. When the heat is transferred in this way, the operation of the electric element 5 and the like may become unstable, and there is a problem that the reliability of the electric junction box 1 cannot be maintained.

【0006】また、ベース基板4と制御基板6は、直交
する位置関係で配置するため、どうしても無駄な空間が
生じると共に、電気接続箱1の高さ寸法は、制御基板6
の一辺の長さ寸法より小さくできないので、電気接続箱
1の小型化には一定の限度が生じ、上記寸法より小型化
することは物理的に不可能な問題がある。また、ケース
5の内部には、隔壁2を突設しているので、隔壁2を設
ける寸法も必要となり、電気接続箱1の小型化を阻む要
因となっている。
Further, since the base board 4 and the control board 6 are arranged in a positional relationship orthogonal to each other, a wasteful space is inevitably produced, and the height dimension of the electric junction box 1 is controlled by the control board 6.
Since it cannot be made smaller than the length dimension of one side, there is a certain limit to miniaturization of the electric junction box 1, and there is a problem that it is physically impossible to make it smaller than the above dimension. Further, since the partition wall 2 is provided so as to project inside the case 5, a size for providing the partition wall 2 is also required, which is a factor that hinders downsizing of the electrical junction box 1.

【0007】本発明は、上記した問題に鑑みてなされた
ものであり、電気接続箱の小型化を妨げることなく、内
部回路の放熱性の向上を図ることを課題としている。
The present invention has been made in view of the above problems, and an object thereof is to improve the heat dissipation of the internal circuit without hindering the downsizing of the electrical junction box.

【0008】[0008]

【課題を解決するための手段】上記課題を解決するた
め、本発明は、大電流或いは中電流が流れる電流分配用
回路板と小電流が流れる制御用回路板とを、絶縁板を介
在させて上下に積層した状態でアッパーケースとロアケ
ースで形成される空間内部に収容する電気接続箱におい
て、上記絶縁板は一方の面に第一絶縁層、他方の面に第
二絶縁層を設けた放熱板からなると共に、上記第一絶縁
層は上記第二絶縁層より熱伝達率を高く設定し、上記第
一絶縁層を上記電流分配用回路板側に、上記第二絶縁層
を上記制御用回路板側にして上記絶縁板を配置して、電
流分配用回路板で発生する熱を上記第一絶縁層より上記
放熱板へ伝達し、この伝達された熱を上記放熱板から放
出する構成としていることを特徴とする電気接続箱を提
供している。
In order to solve the above-mentioned problems, the present invention has a current distribution circuit board through which a large current or a medium current flows and a control circuit board through which a small current flows with an insulating plate interposed. In an electric junction box that is housed inside a space formed by an upper case and a lower case in a state of being stacked vertically, the insulating plate is a heat dissipation plate having a first insulating layer on one surface and a second insulating layer on the other surface. And the first insulating layer has a higher heat transfer coefficient than the second insulating layer, the first insulating layer is on the side of the current distribution circuit board, and the second insulating layer is on the control circuit board. The insulating plate is disposed on the side, the heat generated in the current distribution circuit board is transferred from the first insulating layer to the heat dissipation plate, and the transferred heat is released from the heat dissipation plate. We provide an electrical junction box characterized by.

【0009】このように本発明は、各回路板間に介在し
て上下の回路板を電気的に絶縁する絶縁板を利用して放
熱しており、図6の電気接続箱1のように制御用の回路
板を熱から隔離するだけという思想と相異し、発生した
熱を放出して、制御用の回路板へ伝達しようとする熱を
根本的に解消しようとするものである。絶縁板は電流分
配用回路板と制御用回路板との間に介在することで、熱
を発生する電流分配用回路板の一面と略全域にわたる範
囲で当接し、電気部品を実装して大電流或いは中電流が
流れる電流分配用回路板に生じる熱を確実に絶縁板へ伝
達できる。
As described above, according to the present invention, the heat is radiated by using the insulating plate which is interposed between the circuit boards and electrically insulates the upper and lower circuit boards from each other. This is different from the idea of only isolating the circuit board for use from heat, and the heat generated is radiated to fundamentally eliminate the heat transmitted to the circuit board for control. By interposing the insulating plate between the current distribution circuit board and the control circuit board, it abuts on one surface of the current distribution circuit board that generates heat over a substantially entire area, and mounts electrical parts to generate a large current. Alternatively, the heat generated in the current distribution circuit board through which the medium current flows can be reliably transferred to the insulating board.

【0010】特に、絶縁板の電流分配用回路板側に位置
する第一絶縁層は、他方の面の第二絶縁層より熱伝導率
を高く設定しているので、電流分配用回路板で発生した
熱を第一絶縁層へスムーズに移動させ、この移動した熱
をさらに放熱板へ移動させて放熱板から放出できる。ま
た、第二絶縁層は、熱伝導率が低いので、放熱板へ移動
した熱が第二絶縁層に移動することもなく、これにより
第二絶縁層が当接している熱の影響を受けやすい制御用
回路板への熱の伝達を断ち、断熱による安定した回路作
動を確保している。よって、基本的に、第一絶縁層は熱
伝達に優れた特性を有する材質で、第二絶縁層は熱伝達
が悪い特性を有する材質でそれぞれ形成する。
Particularly, since the first insulating layer located on the side of the current distribution circuit board of the insulating plate has a higher thermal conductivity than the second insulation layer on the other surface, it is generated in the current distribution circuit board. The generated heat can be smoothly transferred to the first insulating layer, and the transferred heat can be further transferred to the heat dissipation plate and released from the heat dissipation plate. In addition, since the second insulating layer has a low thermal conductivity, the heat transferred to the heat dissipation plate does not move to the second insulating layer, and is easily affected by the heat with which the second insulating layer is in contact. The heat transfer to the control circuit board is cut off to ensure stable circuit operation by heat insulation. Therefore, basically, the first insulating layer is formed of a material having excellent heat transfer characteristics, and the second insulating layer is formed of a material having poor heat transfer characteristics.

【0011】また、本発明の電気接続箱は内部回路を回
路基板の積層構造で形成しているため、電気接続箱の高
さは、従来の電気接続箱1に比べ低くおさえることがで
きる上、内部には隔壁等も突設する必要がないため、最
小限の内部スペースを構成するだけでよいため、小型化
の要求にも応えることができる。
Further, in the electric junction box of the present invention, since the internal circuit is formed by the laminated structure of the circuit boards, the height of the electric junction box can be kept lower than that of the conventional electric junction box 1. Since it is not necessary to project a partition wall or the like inside, it is only necessary to configure a minimum internal space, and it is possible to meet the demand for miniaturization.

【0012】上記絶縁板の放熱板は金属板材からなり、
該金属板材の両面に樹脂コーティングすることで上記第
一絶縁層及び第二絶縁層を形成していることが好まし
い。このように、放熱板を金属板材から形成すると、金
属材料は、一般に熱伝導率が優れているので、第一絶縁
層から伝達された熱を効率良く放出することができる。
放熱性とコストのバランスを考慮して放熱板に適用でき
る金属は、アルミニウム、銅、銀、さらにはアルミニウ
ム合金、銅合金、銀合金等がある。また、放熱板である
金属板材を樹脂でコーティングすることで容易に各絶縁
層も形成できる。
The heat dissipation plate of the insulating plate is made of a metal plate material,
It is preferable that the first insulating layer and the second insulating layer are formed by resin coating both surfaces of the metal plate material. As described above, when the heat dissipation plate is formed of the metal plate material, the metal material generally has excellent thermal conductivity, so that the heat transferred from the first insulating layer can be efficiently released.
Metals applicable to the heat dissipation plate in consideration of the balance between heat dissipation and cost include aluminum, copper, silver, aluminum alloy, copper alloy, and silver alloy. Also, each insulating layer can be easily formed by coating a metal plate material, which is a heat dissipation plate, with a resin.

【0013】上記電流分配用回路板は、一方の面に電気
部品が実装すると共に他方の面に上記絶縁板を配置して
おり、上記絶縁板は、上記電気部品の実装箇所と対応す
る箇所の第一絶縁層に開口部を設けていることが好適で
ある。このように第一絶縁層に開口部を設けると、電流
分配用回路板の実装面の裏面より突出する電気部品のリ
ード端子を開口部の内部に位置させることができ、第一
絶縁層を安定して電流分配用回路板に当接できる。ま
た、開口部においては効率の良い空気伝達により電気部
品の発する熱を確実に放熱板へ伝達して放出できる。な
お、第二絶縁層には、特に開口部を設けないで放熱板と
制御用回路板を断熱する。
In the current distribution circuit board, an electric component is mounted on one surface and the insulating plate is arranged on the other surface. The insulating plate is provided at a portion corresponding to a mounting portion of the electric component. It is preferable to provide an opening in the first insulating layer. When the opening is provided in the first insulating layer in this way, the lead terminals of the electrical component protruding from the back surface of the mounting surface of the current distribution circuit board can be located inside the opening, and the first insulating layer can be stabilized. Then, it can come into contact with the circuit board for current distribution. Further, in the opening portion, the heat generated by the electric component can be surely transmitted to the heat dissipation plate and released by efficient air transmission. In addition, the second insulating layer is not provided with an opening, and the heat sink and the control circuit board are thermally insulated.

【0014】上記絶縁板は、放熱板より延出して各面に
第一絶縁層及び第二絶縁層が備わらない放熱部を形成す
ると共に、上記放熱部を上記アッパーケース及びロアケ
ースで形成される内部空間から外方へ突出し、電流分配
用回路板で発生する熱を上記放熱部から外方へ放出す
る。上記のように放熱部を形成すると共に形成した放熱
部をケース外へ突出すると、放熱板に伝わった熱を放熱
部からケース外へ放出できるので、電気接続箱の内部に
熱がこもるのを防止して、マイコン等の電子部品の作動
条件に適した内部雰囲気を確保できる。なお、放熱部は
放熱板と一体で設けてもよく、別体で設けてもよく、さ
らに、放熱部の形状はできるだけ表面積が大きくなるよ
うな形状に形成し、放熱性を高めるようにしてもよい。
The insulating plate extends from the heat radiating plate to form a heat radiating portion without a first insulating layer and a second insulating layer on each surface, and the heat radiating portion is formed by the upper case and the lower case. The heat protruding from the inner space to the outside and generated in the circuit board for current distribution is radiated to the outside from the heat dissipation portion. By forming the heat dissipation part as described above and projecting the formed heat dissipation part to the outside of the case, the heat transmitted to the heat dissipation plate can be released from the heat dissipation part to the outside of the case, preventing heat from staying inside the electrical junction box. As a result, an internal atmosphere suitable for operating conditions of electronic parts such as a microcomputer can be secured. The heat radiating portion may be provided integrally with the heat radiating plate or may be provided separately. Further, the heat radiating portion may be formed in such a shape that the surface area is as large as possible to enhance the heat radiating property. Good.

【0015】[0015]

【発明の実施の形態】以下、本発明の実施形態の電気接
続箱を図面を参照して説明する。図1、2は、本発明の
実施形態にかかる電気接続箱10であり、アッパーケー
ス11及びロアケース12で形成される空間内に、内部
回路としてリレーRやヒューズF等の電気部品を実装す
る大電流、中電流が流れる電流分配用回路板13と、小
電流が流れる制御用回路板であるプリント基板14と
を、絶縁板16を介在させて上下に積層した状態で収容
している。
BEST MODE FOR CARRYING OUT THE INVENTION An electrical junction box according to an embodiment of the present invention will be described below with reference to the drawings. 1 and 2 show an electric connection box 10 according to an embodiment of the present invention, which is a large-sized device in which electric components such as a relay R and a fuse F are mounted as an internal circuit in a space formed by an upper case 11 and a lower case 12. A current distribution circuit board 13 through which a current and a medium current flow, and a printed circuit board 14 as a control circuit board through which a small current flows are housed in a vertically stacked state with an insulating plate 16 interposed.

【0016】電流分配用回路板13は、所要の回路形状
に打ち抜いて形成したバスバー15を絶縁基板13aへ
載置固定したものであり、実装面となる一面13bには
リレーRやヒューズF等の電気部品をバスバー15へ直
接実装しており、また、外部から取り付けるプラグイン
タイプのリレー、ヒューズ、外部回路のコネクタ接続用
のタブ15aも一面13bより多数突設している。ま
た、実装する各種電気部品は導通接続用のリード端子を
突設しており、一面13bから電気部品を実装すること
で他面13cにはリード端子が突出している。
The current distribution circuit board 13 is a bus bar 15 formed by punching into a desired circuit shape and mounted and fixed on an insulating substrate 13a. One surface 13b, which is a mounting surface, includes a relay R, a fuse F, and the like. The electric parts are directly mounted on the bus bar 15, and a large number of plug-in type relays, fuses, and tabs 15a for connecting connectors of external circuits, which are attached from the outside, are also projected from the one surface 13b. In addition, various electrical components to be mounted are provided with lead terminals for conductive connection, and by mounting the electrical components from one surface 13b, the lead terminals are projected on the other surface 13c.

【0017】また、バスバー15が形成する回路は電流
を分配する機能を備え、回路に電流が流れることでリレ
ーR等の作動して多量の熱が発生している。なお、電流
分配用回路板13の一辺13dの近辺には、プリント基
板14との接続部13eを多数並列配置している。
Further, the circuit formed by the bus bar 15 has a function of distributing a current, and when the current flows through the circuit, the relay R or the like operates to generate a large amount of heat. In addition, in the vicinity of one side 13d of the current distribution circuit board 13, a large number of connecting portions 13e with the printed board 14 are arranged in parallel.

【0018】一方、図3にも示すように、プリント基板
14には各種制御用の回路が形成され、熱の影響を受け
やすいFETやマイコン等の多数の電子部品20を一面
14aに実装している。なお、プリント基板14の一辺
14b附近には、電流分配用回路板13との接続部14
cが形成されており、この接続部14cにジャンパー線
21の一方の端部21aを半田付け等で接合すると共
に、他方の端部21bを電流分配用回路板13の接続部
13eに半田付け等で接合し、ジャンパー線21を介し
て、電流分配用回路板13の所要回路とプリント基板1
4の所要回路を接続して内部回路を形成している。
On the other hand, as shown in FIG. 3, various control circuits are formed on the printed circuit board 14, and a large number of electronic components 20, such as FETs and microcomputers, which are easily affected by heat, are mounted on the one surface 14a. There is. It should be noted that, in the vicinity of one side 14b of the printed circuit board 14, a connection portion 14 with the current distribution circuit board 13 is formed.
c is formed, and one end 21a of the jumper wire 21 is joined to the connecting portion 14c by soldering or the like, and the other end 21b is soldered to the connecting portion 13e of the current distribution circuit board 13 or the like. And the required circuit of the current distribution circuit board 13 and the printed circuit board 1 through the jumper wire 21.
4 required circuits are connected to form an internal circuit.

【0019】このようにジャンパー線19を接続してか
ら、プリント基板14を図中の白矢印方向となる電流分
配用回路板13の下面となる他面13c側へ折り返し、
電流分配用回路板13とプリント基板14との間に絶縁
板16を介在させて電流分配用回路板13とプリント基
板14との各回路が不用意に導通しないよう確実に絶縁
している。
After connecting the jumper wires 19 in this way, the printed circuit board 14 is folded back to the other surface 13c side which is the lower surface of the current distribution circuit board 13 in the direction of the white arrow in the drawing,
An insulating plate 16 is interposed between the current distribution circuit board 13 and the printed circuit board 14 so as to surely insulate the circuits of the current distribution circuit board 13 and the printed circuit board 14 from inadvertent conduction.

【0020】絶縁板16は、放熱板17の上面17aに
一側辺17cから電流分配用回路板13の面積と同等の
領域に樹脂でコーティングして第一絶縁層18を形成し
ており、下面17bの一側辺17cからプリント基板1
4の面積と同等の領域に樹脂コーティングして第二絶縁
層19を形成している。
The insulating plate 16 is formed by coating the upper surface 17a of the heat radiating plate 17 from one side 17c to a region equivalent to the area of the circuit board 13 for current distribution with a resin to form a first insulating layer 18. Printed circuit board 1 from one side 17c of 17b
The second insulating layer 19 is formed by resin-coating a region equivalent to the area of No. 4.

【0021】絶縁板16の放熱板17は、金属板材とし
て熱伝達率に優れたアルミニウム板より形成されてお
り、幅寸法Wは、電流分配用回路板13及びプリント基
板14の幅寸法と略同等に設定しているが、一側辺17
cからの寸法を電流分配用回路板13及びプリント基板
14の長手寸法よりも延出するように設定し、この延出
した箇所を放熱部17dとしている。この放熱部17d
は、アッパーケース11及びロアケース12の内部の空
間に絶縁板16を収めたとき、ケース外に突出するよう
にしている。
The heat dissipation plate 17 of the insulating plate 16 is formed of an aluminum plate having a high heat transfer coefficient as a metal plate material, and the width dimension W thereof is substantially equal to the width dimensions of the current distribution circuit board 13 and the printed circuit board 14. It is set to, but one side 17
The dimension from c is set so as to extend beyond the longitudinal dimensions of the current distribution circuit board 13 and the printed circuit board 14, and the extended portion is used as the heat dissipation portion 17d. This heat dissipation part 17d
When the insulating plate 16 is housed in the space inside the upper case 11 and the lower case 12, it projects outside the case.

【0022】一方、上面17aに形成された第一絶縁層
18は絶縁用の樹脂からなり、第一絶縁層18の樹脂の
特性は、第二絶縁層19を形成する樹脂より、熱伝達率
が高いものを用いている。即ち、第一絶縁層18は熱を
非常に伝達しやすい樹脂から形成している。また、第一
絶縁層18には、電流分配用回路板13の一辺13dと
放熱板17の一側辺17cおよび幅を揃えて積層した状
態で、電流分配用回路板13の一面13bのリレーR等
の電気部品の実装箇所と対応する箇所に開口部18aを
凹設して、開口部18a内で放熱板17の上面17aを
露出している。本実施形態では、リレーR等の電気部品
を三列で電流分配用回路板13に実装しているので、開
口部18aも三列で形成している。
On the other hand, the first insulating layer 18 formed on the upper surface 17a is made of an insulating resin, and the resin of the first insulating layer 18 has a heat transfer coefficient higher than that of the resin forming the second insulating layer 19. It is expensive. That is, the first insulating layer 18 is made of a resin that can transfer heat very easily. Further, on the first insulating layer 18, one side 13d of the current distribution circuit board 13 and one side 17c of the heat radiating plate 17 and the relay R of the one surface 13b of the current distribution circuit board 13 in a state of being laminated with the widths aligned. An opening 18a is provided at a location corresponding to a mounting location of an electric component such as, and the upper surface 17a of the heat dissipation plate 17 is exposed in the opening 18a. In the present embodiment, since the electrical components such as the relay R are mounted on the current distribution circuit board 13 in three rows, the openings 18a are also formed in three rows.

【0023】一方、図4に示すように、放熱板17の下
面17bの第二絶縁層19も、プリント基板14の外形
と略同等の大きさで形成されており、第二絶縁層19を
形成する絶縁用の樹脂は、熱伝達率が非常に低い特性を
有し、結果として第二絶縁層19は断熱層として機能し
ている。なお、第二絶縁層19は、第一絶縁層18のよ
うな開口部18aを設けておらず、積層時にプリント基
板14と当接する箇所を全域被っている。
On the other hand, as shown in FIG. 4, the second insulating layer 19 on the lower surface 17b of the heat dissipation plate 17 is also formed to have a size substantially equal to the outer shape of the printed board 14, and the second insulating layer 19 is formed. The insulating resin has a characteristic that the heat transfer coefficient is very low, and as a result, the second insulating layer 19 functions as a heat insulating layer. The second insulating layer 19 does not have the opening 18a like the first insulating layer 18, and covers the entire area where it abuts the printed circuit board 14 when laminated.

【0024】なお、アッパーケース11は電流分配用回
路板13やプリント基板14の外形より一回りほど大き
い縦横寸法で内部に空間を有するように樹脂成形されて
おり、上面11aにはプラグインタイプのリレーの取付
部11b、各種ヒューズの収容部11c、外部回路との
接続用のコネクタ収容部11dを設けている。また、一
方の端辺11eには絶縁板16の放熱部17dの突出用
の切欠11fを形成していると共に、内部空間には内部
回路保持用のリブ11eも設けている。
The upper case 11 is resin-molded so as to have an internal space with vertical and horizontal dimensions slightly larger than the outer shapes of the current distribution circuit board 13 and the printed circuit board 14, and the upper surface 11a is of a plug-in type. A relay mounting portion 11b, various fuse accommodating portions 11c, and a connector accommodating portion 11d for connecting to an external circuit are provided. Further, a notch 11f for projecting the heat dissipation portion 17d of the insulating plate 16 is formed on one end side 11e, and a rib 11e for holding an internal circuit is also provided in the internal space.

【0025】一方、ロアケース12もアッパーケース1
1と略同等の縦横寸法で内部に空間を有する樹脂成形品
であり、一方の端辺12aには、放熱部17dを突出用
の切欠12bを形成し、内部空間には内部回路保持用の
リブ12cを設けている。アッパーケース11とロアケ
ース12は相互にロック結合されるが、この結合状態で
は、内部回路を構成する電流分配用回路板13等を積層
状態で収容するため、図6の従来の電気接続箱1より高
さ寸法は低く小型化されている。
On the other hand, the lower case 12 is also the upper case 1.
1 is a resin molded product having vertical and horizontal dimensions approximately equal to 1 and having a space inside, a notch 12b for projecting a heat dissipation portion 17d is formed on one end side 12a, and a rib for holding an internal circuit is formed in the internal space. 12c is provided. The upper case 11 and the lower case 12 are lock-coupled to each other. In this coupled state, the current distribution circuit boards 13 and the like that form the internal circuit are housed in a stacked state, so that the conventional electrical junction box 1 of FIG. The height is low and the size is small.

【0026】電気接続箱10の組立は、図1、2に示す
ようにジャンパー線21で繋がれた電流分配用回路板1
3とプリント基板14との間に絶縁板16を介在させ、
プリント基板14の上に第二絶縁層19を下方にした状
態で絶縁板16を載置し、絶縁板16の第一絶縁層18
の上に電流分配用回路板13を載置して積層させてい
る。この際、絶縁板16の他側辺17cはプリント基板
14の一辺14b及び電流分配用回路板13の一辺13
dに合わせた状態にして、放熱部17dを突出した状態
にしている。
Assembling of the electric junction box 10 is carried out by the current distribution circuit board 1 connected by jumper wires 21 as shown in FIGS.
Insulating plate 16 is interposed between 3 and printed circuit board 14,
The insulating plate 16 is placed on the printed board 14 with the second insulating layer 19 facing downward, and the first insulating layer 18 of the insulating plate 16 is placed.
The current distribution circuit board 13 is placed and laminated on the above. At this time, the other side 17c of the insulating plate 16 is one side 14b of the printed board 14 and one side 13 of the current distribution circuit board 13.
The heat radiating portion 17d is in a protruding state in accordance with d.

【0027】これら電流分配用回路板13、絶縁板1
6、プリント基板14をロアケース12の内部に収める
と共に、上方からアッパーケース11を被せてロアケー
ス12と嵌合させている。この際、突出する放熱部17
dをアッパーケース11及びロアケース12のそれぞれ
の切欠11f、12bより外方へ突出させて電気接続箱
10の組立を完了している。
These current distribution circuit board 13 and insulating board 1
6. The printed circuit board 14 is housed inside the lower case 12, and the upper case 11 is covered from above and fitted to the lower case 12. At this time, the protruding heat dissipation portion 17
The assembly of the electric junction box 10 is completed by projecting d from the notches 11f and 12b of the upper case 11 and the lower case 12 to the outside.

【0028】組立の完了した電気接続箱10は、所要の
プラグインタイプのリレー、ヒューズ、外部回路のコネ
クタをアッパーケース11のリレー取付部11b、ヒュ
ーズ収容部11c、コネクタ収容部11dに取り付けた
後、電気接続箱10自体は、自動車のエンジンルーム内
の所要箇所に固定している。なお、電気接続箱10は小
型化されているので、車体への取付レイアウトの自由度
も向上している。
In the assembled electrical junction box 10, after the required plug-in type relays, fuses, and external circuit connectors have been attached to the relay mounting portion 11b, fuse accommodating portion 11c, and connector accommodating portion 11d of the upper case 11. The electric junction box 10 itself is fixed to a required place in the engine room of the automobile. Since the electric junction box 10 is downsized, the degree of freedom in the layout of attachment to the vehicle body is also improved.

【0029】上記のようにして車体に取り付けられた電
気接続箱10は、内部回路に通電されると、適宜、電流
分配用回路板13の電気部品であるリレーRが作動し、
リレーR等から熱が発生するが、発生した熱は、電流分
配用回路板13と当接する第一絶縁層18、および開口
部18aの内部の空気により放熱板17へ伝達されてい
る。この際、第一絶縁層18は熱伝達率が高く、空気も
熱の伝達に優れているため、発生した熱はスムーズに放
熱板17へ移動している。
In the electric connection box 10 mounted on the vehicle body as described above, when the internal circuit is energized, the relay R, which is an electric component of the current distribution circuit board 13, is appropriately operated,
Although heat is generated from the relay R and the like, the generated heat is transferred to the heat radiating plate 17 by the first insulating layer 18 in contact with the current distribution circuit board 13 and the air inside the opening 18a. At this time, the first insulating layer 18 has a high heat transfer coefficient, and the air is also excellent in heat transfer, so that the generated heat smoothly moves to the heat dissipation plate 17.

【0030】放熱板17へ移動した熱は、放熱板17自
体も熱伝達率に優れたアルミニウムであるため、熱平衡
の原理に基づき、高温の内部箇所から、外気に触れて低
温となっている放熱部17dへ移動し、放熱部17dか
ら外方へ放出されている。一方、放熱板17へ移動した
熱は、プリント基板14へは第二絶縁層19で断熱され
ているため、熱が伝達されることはなく、プリント基板
14に実装されたマイコン等の作動信頼性は維持されて
いる。
The heat transferred to the heat radiating plate 17 is aluminum, which is also excellent in heat transfer coefficient, so that the heat radiating from the high temperature inside part to the outside air is low based on the principle of heat balance. It moves to the portion 17d and is emitted outward from the heat radiating portion 17d. On the other hand, since the heat transferred to the heat dissipation plate 17 is insulated from the printed board 14 by the second insulating layer 19, the heat is not transferred, and the operation reliability of the microcomputer mounted on the printed board 14 is improved. Is maintained.

【0031】なお、長時間、内部回路に電流が流れてリ
レーRが作動しても、上記熱の放出は継続されるので、
電気接続箱10の内部温度も必要以上に上昇することも
なく、マイコン等の作動が乱されることはない。
Even if a current flows through the internal circuit for a long time to activate the relay R, the heat is continuously released,
The internal temperature of the electric junction box 10 does not rise more than necessary, and the operation of the microcomputer or the like is not disturbed.

【0032】なお、本発明の電気接続箱10は上記形態
に限定されるものではなく、例えば、図5の変形例の電
気接続箱10’のように、放熱部17d’に別体の上方
放熱部17e’、下方放熱部17f’を溶接等で取り付
けて、表面積を増大させて放熱性を更に向上するように
してもよい。また、放熱板自体の材質は、アルミニウム
以外にも、銀、銅、アルミ合金、銅合金、銀合金等が適
用可能であり、放熱部を一体で設けるとコストが高くな
る場合等は、別体の放熱部を第一絶縁層および第二絶縁
層を設けた放熱板に取り付けるようにしてもよい。
The electrical junction box 10 of the present invention is not limited to the above-described embodiment, and for example, like the electrical junction box 10 'of the modified example of FIG. The portion 17e ′ and the lower heat radiation portion 17f ′ may be attached by welding or the like to increase the surface area and further improve the heat radiation performance. In addition to aluminum, silver, copper, aluminum alloys, copper alloys, silver alloys, etc. can be applied to the material of the heat dissipation plate itself. The heat radiating part may be attached to a heat radiating plate provided with the first insulating layer and the second insulating layer.

【0033】[0033]

【発明の効果】上記した説明より明らかなように、本発
明の電気接続箱を用いると、熱をケース外部に放出する
ため、長時間の駆動でも内部に熱がこもることもなく、
その上プリント基板側には熱伝達の低い絶縁層で断熱し
ているため、熱に弱い電子部品でも安定した動作環境を
確保でき、電気接続箱自体の信頼性も維持できる。ま
た、本発明では内部回路を各種回路板を積層した構造で
あるため、特に高さ方向の寸法を従来に比べて小型化す
ることができ、車体への取付箇所の自由度も向上でき
る。
As is apparent from the above description, when the electric junction box of the present invention is used, heat is radiated to the outside of the case, so that even if it is driven for a long time, no heat is trapped inside.
In addition, since the printed circuit board is insulated by an insulating layer with low heat transfer, a stable operating environment can be secured even for electronic components that are weak to heat, and the reliability of the electrical junction box itself can be maintained. Further, according to the present invention, since the internal circuit has a structure in which various circuit boards are laminated, the size in the height direction can be made smaller in comparison with the conventional one, and the degree of freedom of the mounting position on the vehicle body can be improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の実施形態に係る電気接続箱の分解斜
視図である。
FIG. 1 is an exploded perspective view of an electrical junction box according to an embodiment of the present invention.

【図2】 実施形態の電気接続箱の断面図である。FIG. 2 is a cross-sectional view of the electrical junction box of the embodiment.

【図3】 電流分配用回路板とプリント基板をジャンパ
ーで接続した状態を示す斜視図である。
FIG. 3 is a perspective view showing a state in which a current distribution circuit board and a printed board are connected by jumpers.

【図4】 絶縁板の第二絶縁層側からの斜視図である。FIG. 4 is a perspective view from the second insulating layer side of the insulating plate.

【図5】 変形例の電気接続箱の断面図である。FIG. 5 is a cross-sectional view of a modified electrical junction box.

【図6】 従来の電気接続箱の断面図である。FIG. 6 is a cross-sectional view of a conventional electrical junction box.

【符号の説明】[Explanation of symbols]

10 電気接続箱 11 アッパーケース 12 ロアケース 13 電流分配用回路板 14 プリント基板 15 バスバー 16 絶縁板 17 放熱部 18 第一絶縁層 19 第二絶縁層 21 ジャンパー 10 electrical junction box 11 upper case 12 lower case 13 Current distribution circuit board 14 Printed circuit board 15 bus bars 16 Insulation plate 17 Heat sink 18 First insulating layer 19 Second insulating layer 21 jumper

───────────────────────────────────────────────────── フロントページの続き (72)発明者 細川 剛 愛知県名古屋市南区菊住1丁目7番10号 株式会社オートネットワーク技術研究所内 (72)発明者 野崎 隆男 愛知県名古屋市南区菊住1丁目7番10号 株式会社オートネットワーク技術研究所内 Fターム(参考) 5E322 AA03 AA11 AB06 AB08 5E348 AA02 AA08 AA31 CC08 CC09 EE38 EE39 5G361 BA01 BB02 BC01 BC02    ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Tsuyoshi Hosokawa             1-7-10 Kikuzumi, Minami-ku, Nagoya-shi, Aichi             Auto Network Technical Laboratory Co., Ltd. (72) Inventor Takao Nozaki             1-7-10 Kikuzumi, Minami-ku, Nagoya-shi, Aichi             Auto Network Technical Laboratory Co., Ltd. F-term (reference) 5E322 AA03 AA11 AB06 AB08                 5E348 AA02 AA08 AA31 CC08 CC09                       EE38 EE39                 5G361 BA01 BB02 BC01 BC02

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 大電流或いは中電流が流れる電流分配用
回路板と小電流が流れる制御用回路板とを、絶縁板を介
在させて上下に積層した状態でアッパーケースとロアケ
ースで形成される空間内部に収容する電気接続箱におい
て、 上記絶縁板は一方の面に第一絶縁層、他方の面に第二絶
縁層を設けた放熱板からなると共に、上記第一絶縁層は
上記第二絶縁層より熱伝達率を高く設定し、 上記第一絶縁層を上記電流分配用回路板側に、上記第二
絶縁層を上記制御用回路板側にして上記絶縁板を配置し
て、電流分配用回路板で発生する熱を上記第一絶縁層よ
り上記放熱板へ伝達し、この伝達された熱を上記放熱板
から放出する構成としていることを特徴とする電気接続
箱。
1. A space formed by an upper case and a lower case in which a current distribution circuit board through which a large current or a medium current flows and a control circuit board through which a small current flows are stacked one above the other with an insulating plate interposed therebetween. In the electrical connection box to be housed inside, the insulating plate is a heat dissipation plate having a first insulating layer on one surface and a second insulating layer on the other surface, and the first insulating layer is the second insulating layer. The heat transfer coefficient is set higher, the first insulating layer is arranged on the side of the circuit board for current distribution, and the second insulating layer is arranged on the side of the circuit board for control, and the insulating plate is arranged to form a circuit for current distribution. An electrical junction box, characterized in that heat generated in the plate is transferred from the first insulating layer to the heat dissipation plate, and the transferred heat is released from the heat dissipation plate.
【請求項2】 上記絶縁板の放熱板は金属板材からな
り、該金属板材の両面に樹脂コーティングすることで上
記第一絶縁層及び第二絶縁層を形成している請求項1に
記載の電気接続箱。
2. The electrical insulation according to claim 1, wherein the heat dissipation plate of the insulating plate is made of a metal plate material, and the first insulating layer and the second insulating layer are formed by resin coating both surfaces of the metal plate material. Connection box.
【請求項3】 上記電流分配用回路板は、一方の面に電
気部品が実装すると共に他方の面に上記絶縁板を配置し
ており、 上記絶縁板は、上記電気部品の実装箇所と対応する箇所
の第一絶縁層に開口部を設けている請求項1又は請求項
2に記載の電気接続箱。
3. The circuit board for current distribution has an electric component mounted on one surface and the insulating plate disposed on the other surface, and the insulating plate corresponds to a mounting location of the electric component. The electrical junction box according to claim 1 or 2, wherein an opening is provided in the first insulating layer at the location.
【請求項4】 上記絶縁板は、放熱板より延出して各面
に第一絶縁層及び第二絶縁層が備わらない放熱部を形成
すると共に、上記放熱部を上記アッパーケース及びロア
ケースで形成される内部空間から外方へ突出し、電流分
配用回路板で発生する熱を上記放熱部から外方へ放出す
る請求項1乃至請求項3のいずれか1項に記載の電気接
続箱。
4. The insulating plate extends from the heat radiating plate to form a heat radiating part without a first insulating layer and a second insulating layer on each surface, and the heat radiating part is formed by the upper case and the lower case. 4. The electrical junction box according to claim 1, wherein the electrical connection box projects outward from the internal space and discharges the heat generated in the current distribution circuit board outward from the heat dissipation portion.
JP2001270440A 2001-09-06 2001-09-06 Electric junction box Withdrawn JP2003087934A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001270440A JP2003087934A (en) 2001-09-06 2001-09-06 Electric junction box

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001270440A JP2003087934A (en) 2001-09-06 2001-09-06 Electric junction box

Publications (1)

Publication Number Publication Date
JP2003087934A true JP2003087934A (en) 2003-03-20

Family

ID=19096097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001270440A Withdrawn JP2003087934A (en) 2001-09-06 2001-09-06 Electric junction box

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006296073A (en) * 2005-04-08 2006-10-26 Sumitomo Wiring Syst Ltd Electric connection box for automobile
KR200476159Y1 (en) * 2013-03-04 2015-02-11 체-유안 우 Heat dissipation device of electronic apparatus
JP2015146714A (en) * 2014-02-04 2015-08-13 株式会社デンソー Power conversion device
KR20160036396A (en) * 2014-09-25 2016-04-04 프레스토라이트아시아 주식회사 Motor driving controller having improved radiant heat function
JP2016154442A (en) * 2016-04-20 2016-08-25 日立オートモティブシステムズ株式会社 Power conversion apparatus
JP2017112818A (en) * 2015-12-11 2017-06-22 株式会社オートネットワーク技術研究所 Electric connection box
JP2021145034A (en) * 2020-03-11 2021-09-24 パナソニックIpマネジメント株式会社 Electrical apparatus

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006296073A (en) * 2005-04-08 2006-10-26 Sumitomo Wiring Syst Ltd Electric connection box for automobile
KR200476159Y1 (en) * 2013-03-04 2015-02-11 체-유안 우 Heat dissipation device of electronic apparatus
JP2015146714A (en) * 2014-02-04 2015-08-13 株式会社デンソー Power conversion device
KR20160036396A (en) * 2014-09-25 2016-04-04 프레스토라이트아시아 주식회사 Motor driving controller having improved radiant heat function
KR101624733B1 (en) * 2014-09-25 2016-06-07 프레스토라이트아시아 주식회사 Motor driving controller having improved radiant heat function
JP2017112818A (en) * 2015-12-11 2017-06-22 株式会社オートネットワーク技術研究所 Electric connection box
DE112016005686B4 (en) 2015-12-11 2024-04-04 Autonetworks Technologies, Ltd. Electrical distributor
JP2016154442A (en) * 2016-04-20 2016-08-25 日立オートモティブシステムズ株式会社 Power conversion apparatus
JP2021145034A (en) * 2020-03-11 2021-09-24 パナソニックIpマネジメント株式会社 Electrical apparatus

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Effective date: 20081202