JP2018098350A - Heat radiation structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat radiation structure which can improve heat radiation performance and EMC performance.SOLUTION: A heat radiation structure 1 includes: a heat radiation area extension member 11 which is disposed facing a component 3 and extends a heat radiation area of the component 3; a spring member 12 which is disposed on the side of the heat radiation area extension member 11 which is opposite to a surface facing the component 3 and biases the heat radiation area extension member 11 to the component 3; a holder member 13 fixed to a substrate 2 and supporting the spring member 12; and a heat radiation member 14 which is disposed at the outer side of the spring member 12 with respect to the heat radiation area extension member 11 and is thermally connected with the heat radiation area extension member 11.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a heat dissipation structure that dissipates heat generated by components mounted on a substrate.

  2. Description of the Related Art Conventionally, a heat sink with a heat radiation fin is provided on the upper side of a circuit component mounted on a circuit board, and the circuit component is cooled by this heat sink (see, for example, Patent Document 1).

Japanese Patent Laid-Open No. 2006-63064

  There is a circuit component with a small area of a portion (heat radiating portion) in contact with the heat radiating plate. For example, there is a circuit board in which only a part of the surface of the circuit board that is brought into contact with the heat sink is a heat dissipation portion. In the conventional heat dissipation structure, sufficient heat dissipation performance may not be ensured for such circuit components.

  Moreover, in the conventional heat dissipation structure, a circuit component and a heat sink may be in direct contact. There is a concern that EMC (Electro-Magnetic Compatibility) performance deteriorates when the circuit component and the heat sink directly contact each other. For example, external noise (immunity noise) applied to the heat sink may be conducted to the component through the heat sink and have an electrical effect, thereby deteriorating the component performance. In addition, for example, radiation noise (emission noise) generated from a circuit component may be adversely affected to other electronic components by being conducted to the other electronic components through the heat sink.

  This invention is made | formed in view of the said subject, and aims at providing the thermal radiation structure which can improve thermal radiation performance and EMC performance.

  In order to achieve the above object, a heat dissipation structure of the present invention is a heat dissipation structure that dissipates heat generated by a component mounted on a board, and is disposed opposite to the component to expand the heat dissipation area of the component. A heat dissipating area expanding member, a spring member disposed on the opposite surface of the heat dissipating area expanding member from the surface facing the component, and biased toward the component, and fixed to the substrate. A holder member that supports the spring member, and a heat dissipating member that is disposed outward of the heat dissipating area expanding member from the spring member and thermally connected to the heat dissipating area expanding member ( First configuration).

  In the heat dissipation structure having the first configuration described above, a configuration (second configuration) in which heat dissipation grease is interposed between the heat dissipation area expanding member and the heat dissipation member is preferable.

  In the heat dissipation structure having the first or second configuration, a configuration (third configuration) in which heat dissipation grease is interposed between the component and the heat dissipation area expanding member is preferable.

  In the heat dissipation structure having any one of the first to third configurations, the holder member has a pair of wall portions facing each other and having mounting legs attached to the substrate, and between the pair of wall portions. In the above, a configuration (fourth configuration) in which the mounting legs are asymmetrical may be employed.

  In the heat dissipation structure of any one of the first to fourth configurations, the holder member has a pair of engagement claws that position the heat radiation area expansion member and the spring member, and the pair of engagement claws are The holder member may have a configuration (fifth configuration) provided asymmetrically on opposite sides of the holder member.

  In the heat dissipation structure having any one of the first to fifth configurations, the heat dissipation member includes a plurality of linear heat dissipating fins on a surface opposite to the surface facing the heat dissipation area expanding member, The radiating fins are arranged substantially parallel to each other, and the height of the plurality of radiating fins is substantially parallel to the extending direction of the radiating fins, and is stepped outward from a center surface passing through the central portion of the component. The configuration may be a lower configuration (sixth configuration).

  In the heat dissipation structure having the sixth configuration, the heat dissipation member includes a portion in which the adjacent heat dissipating fins have substantially the same height and a portion in which the adjacent heat dissipating fins have different heights (first 7).

  The heat dissipation structure of the seventh configuration may have a configuration (eighth configuration) in which the adjacent heat dissipation fins have substantially the same height in the vicinity of the center surface.

  ADVANTAGE OF THE INVENTION According to this invention, the thermal radiation structure which can improve a thermal radiation performance and EMC performance can be provided.

Sectional drawing which shows typically the thermal radiation structure which concerns on this Embodiment Schematic top view of the component according to the present embodiment Schematic top view of heat dissipation area expanding member according to the present embodiment Schematic top view of the spring member according to the present embodiment Schematic side view of the spring member according to the present embodiment Schematic perspective view of a holder member according to the present embodiment Schematic top view of holder member according to the present embodiment Schematic perspective view of heat dissipation member according to the present embodiment Schematic cross-sectional view at position AA in FIG. Schematic cross-sectional view at the BB position in FIG. Sectional drawing which shows typically the modification of the thermal radiation structure which concerns on this Embodiment

  Hereinafter, a heat dissipation structure according to an embodiment of the present invention will be described. In this specification, the vertical direction is defined with the surface of the substrate on the side on which the component to be radiated is mounted as the upper surface and the surface opposite to the surface on which the component is mounted as the lower surface. However, the vertical direction is simply a name used for explanation, and is not intended to limit the actual positional relationship and direction in the product.

<1. Configuration of heat dissipation structure>
FIG. 1 is a cross-sectional view schematically showing a heat dissipation structure 1 according to the present embodiment. The heat dissipation structure 1 dissipates heat generated by the component 3 mounted on the substrate 2. In the present embodiment, the heat dissipation structure 1 is applied to an in-vehicle audio amplifier. The substrate 2 is a circuit board. The component 3 is planarly mounted on the upper surface of the substrate 2. The component 3 is an electronic component that generates heat, such as a power IC or a regulator. As shown in FIG. 1, the heat dissipation structure 1 includes a heat dissipation area expanding member 11, a spring member 12, a holder member 13, and a heat dissipation member 14.

  The heat dissipating area expanding member 11 is disposed opposite to the component 3 to expand the heat dissipating area of the component 3. In the present embodiment, as shown in FIG. 1, the heat dissipating area expanding member 11 is disposed on the upper side of the component 3. The heat radiating area expanding member 11 is composed of a plate-shaped metal member. The heat dissipating area expanding member 11 is preferably made of a metal having high thermal conductivity, and is made of, for example, copper, aluminum, or an alloy thereof. The type of metal constituting the heat dissipating area expanding member 11 may be appropriately changed according to the application.

  The heat radiating area expanding member 11 is formed larger than the heat radiating portion of the component 3. The heat dissipating part is a part that facilitates transferring the heat generated by the component 3 to the surroundings. The heat dissipation part is a flat part made of metal, for example. FIG. 2 is a schematic top view of the component 3 according to the present embodiment. In FIG. 2, the substantially cross-shaped part shown by the code | symbol 3a is a thermal radiation part. As shown in FIG. 2, in the present embodiment, the entire top surface of the component 3 is not a heat radiating portion. However, this is merely an example, and the entire top surface of the component 3 may be a heat radiating portion. In addition, since the heat radiation area expansion member 11 is provided for the purpose of artificially expanding the heat radiation area of the component 3, it is preferable to provide the heat radiation area expansion member 11 as large as possible within a necessary range. In the present embodiment, the area of the heat radiation area expanding member 11 is sufficiently larger than the area of the component 3 in a top view.

  The heat dissipating area expanding member 11 is thermally connected to the component 3 because it is necessary to extract heat from the component 3. The heat radiation area expanding member 11 may be configured to be in direct contact with the component 3. However, in the present embodiment, the heat radiation grease 15 is interposed between the component 3 and the heat radiation area expanding member 11. The heat radiation grease 15 is thermally conductive grease. The heat dissipating grease 15 may be configured, for example, by uniformly dispersing metal or metal oxide particles having high thermal conductivity in silicone. By disposing the heat radiation grease 15 between the component 3 and the heat radiation area expansion member 11, the unevenness of the component 3 and the heat radiation area expansion member 11 is smoothed, and both are in thermal contact evenly over a wide range. Can be made. In addition, it is preferable that the thermal radiation grease 15 has insulation. In some cases, a heat dissipation sheet may be disposed instead of the heat dissipation grease 15.

  FIG. 3 is a schematic top view of the heat dissipating area expanding member 11 according to the present embodiment. As shown in FIG. 3, in this Embodiment, the thermal radiation area expansion member 11 is rectangular shape in top view. However, this is an exemplification, and the heat dissipating area expanding member 11 may be, for example, a circular shape in a top view.

  As shown in FIG. 3, the heat dissipating area expanding member 11 has a pair of engaging holes 11 a and 11 b disposed in the vicinity of both ends in the longitudinal direction. In the present embodiment, the pair of engagement holes 11a and 11b are substantially rectangular in top view. The pair of engagement holes 11 a and 11 b are provided asymmetrically with respect to a bisector that bisects the longitudinal direction of the heat radiation area expanding member 11. Specifically, the pair of engagement holes 11a and 11b are not only displaced in the lateral direction but also different in size. Specifically, the engagement hole 11a has a shorter width in the short direction than the engagement hole 11b. The pair of engagement holes 11a and 11b engage with engagement claws provided in a holder member 13 described later.

  In the present embodiment, the heat radiation area expanding member 11 has an engagement hole. However, this is merely an example, and for example, the heat dissipating area expanding member 11 may have an engaging recess instead of the engaging hole.

  Returning to FIG. 1, the spring member 12 is disposed on the opposite side of the surface of the heat dissipating area expanding member 11 that faces the component 3. The spring member 12 biases the heat dissipating area expanding member 11 toward the component 3. In the present embodiment, the heat dissipating area extending member 11 is directly disposed on the upper surface. The spring member 12 biases the heat radiation area expanding member 11 downward. Due to the urging force of the spring member 12, the heat connection between the heat radiation area expansion member 11 and the component 3 is firmly performed, and the heat radiation area expansion member 11 can efficiently suck out heat from the component 3.

  FIG. 4 is a schematic top view of the spring member 12 according to the present embodiment. FIG. 5 is a schematic side view of the spring member 12 according to the present embodiment. In the present embodiment, the spring member 12 is a metal plate spring and can be formed by sheet metal processing. As shown in FIGS. 4 and 5, the spring member 12 includes a pair of curved portions 12 a that are arranged at intervals, and a pair of flat plate portions 12 b that are positioned at both ends of the pair of curved portions 12 a. The pair of flat plate portions 12 b is placed on the upper surface of the heat dissipation area expanding member 11. A biasing force is generated by elastically deforming the pair of curved portions 12a.

  As shown in FIG. 4, the spring member 12 has a substantially rectangular outer shape in a top view. The pair of flat plate portions 12b are arranged symmetrically with respect to a bisector that bisects the longitudinal direction of the spring member 12. The pair of curved portions 12a are arranged symmetrically with respect to a bisector that bisects the short direction of the spring member 12. Since the spring member 12 has a pair of curved portions 12a that are arranged symmetrically with a space therebetween, it is possible to apply an urging force evenly to the heat radiation area expanding member 11.

  Each of the pair of flat plate portions 12b is provided with engagement recesses 121a and 121b on the inner side. The pair of engaging recesses 121a and 121b are provided asymmetrically with respect to a bisector that bisects the longitudinal direction of the spring member 12. Specifically, the pair of engaging recesses 121a and 121b are not only displaced in the lateral direction but also different in size. The engagement recess 121a has a smaller width in the lateral direction than the engagement recess 121b. The pair of engagement recesses 121a and 121b engage with engagement claws provided on the holder member 13 described later.

  Returning to FIG. 1, the holder member 13 is fixed to the substrate 2 and supports the spring member 12. In the present embodiment, the holder member 13 is provided in a frame shape. The holder member 13 is disposed on the upper side of the spring member 12. A side surface portion of the holder member 13 surrounds the component 3, the heat radiation area expanding member 11, and the spring member 12. More specifically, the holder member 13 supports the spring member 12 by being sandwiched between the heat radiation area expanding member 11. As a result, the bending portion 12 a of the spring member 12 is elastically deformed, and a biasing force that biases the heat radiation area expanding member 11 toward the component 3 is generated. In the present embodiment, holder member 13 is made of metal. The holder member 13 is preferably composed of a member having high thermal conductivity. Since the holder member 13 is attached to the substrate 2, heat can be released from the holder member 13 to the substrate 2.

  FIG. 6 is a schematic perspective view of the holder member 13 according to the present embodiment. FIG. 7 is a schematic top view of the holder member 13 according to the present embodiment. In FIG. 7, for easy understanding, the spring member 12 in a state where no elastic deformation has occurred is shown by a broken line. As shown in FIG.6 and FIG.7, in this Embodiment, the frame-shaped holder member 13 has the rectangular-wall-shaped upper wall 13a and the side wall 13b extended below from the outer periphery of the upper wall 13a. The spring member 12 is pressed from above by the upper wall 13a.

  The holder member 13 has a pair of engaging claws 131a and 131b for positioning the heat radiation area expanding member 11 and the spring member 12. The pair of engaging claws 131a and 131b are provided asymmetrically on opposite sides of the holder member 13. In the present embodiment, the pair of engaging claws 131a and 131b are provided on the inner peripheral edge of the upper wall 13a. More specifically, the pair of engagement claws 131a and 131b are provided on two short sides of the rectangular inner peripheral edge that face each other. The pair of engaging claws 131a and 131b are not only displaced in the lateral direction, but also have different widths in the lateral direction. The width of the engaging claw 131a is shorter than that of the engaging claw 131b.

  In assembling the heat dissipation structure 1, the pair of engagement claws 131 a and 131 b are inserted into the pair of engagement holes 11 a and 11 b of the heat dissipation area expanding member 11. The pair of engaging claws 131 a and 131 b are inserted into the engaging recesses 121 a and 121 b of the spring member 12. As described above, the pair of engagement claws 131a and 131b, the pair of engagement holes 11a and 11b, and the pair of engagement recesses 121a and 121b provided in correspondence therewith are arranged asymmetrically. For this reason, at the time of an assembly, each member can be arrange | positioned in an appropriate position, without mistaking the front and back and direction of the thermal radiation area expansion member 11 and the spring member 12. FIG. In addition, after assembly, it is possible to prevent the heat radiation area expanding member 11 and the spring member 12 from being displaced or dropped due to vibration or impact.

  The holder member 13 has a pair of wall portions that are opposed to each other and have mounting legs attached to the substrate 2. Between the pair of wall portions, the mounting leg is disposed asymmetrically. In the present embodiment, the pair of wall portions are two side walls 13b extending in the longitudinal direction. Two mounting legs 132 are provided on one of the pair of side walls 13b. The two mounting legs 132 are provided near both ends in the longitudinal direction of the side wall 13b. One mounting leg 132 is provided on the other of the pair of side walls 13b. One mounting leg 132 is provided at the longitudinal center of the side wall 13b. That is, between the pair of side walls 13b, the location of the mounting leg 132 is asymmetric.

  The attachment leg 132 is a substantially boot-like projecting portion that projects downward from the lower end of the side wall 13b. The attachment leg 132 can be bent at a portion where the width is narrow. The mounting leg 132 is bent after being inserted into an insertion hole (not shown) provided in the substrate 2. It is possible to prevent the holder member 13 from floating from the substrate 2 by bending the mounting leg 132. In addition, since the mounting leg 132 is asymmetrical, the holder member 13 can be prevented from being inserted in the wrong direction with respect to the substrate 2.

  The holder member 13 has a soldering leg 133 separately from the mounting leg 132 described above. In the present embodiment, the soldering leg 133 is a substantially rectangular protruding portion that protrudes downward from the lower end of the one side wall 13b. The soldering leg 133 is provided at the center in the longitudinal direction of the side wall 13b on which the two mounting legs 132 are provided. The soldering leg 133 is soldered after being inserted into an insertion hole (not shown) provided in the substrate 2. Since the holder member 13 having conductivity is soldered directly to the substrate 2, GND can be strengthened.

  Returning to FIG. 1, the heat dissipating member 14 is disposed outside the spring member 12 with respect to the heat dissipating area expanding member 11. The heat radiating member 14 is disposed on the same side as the spring member 12 with respect to the heat radiating area expanding member 11. The heat radiating member 14 is thermally connected to the heat radiating area expanding member 11. The heat radiating member 14 is provided in order to improve the heat radiating efficiency. The heat dissipation member 14 is cooled by, for example, wind from a fan (not shown). The heat radiating member 14 is made of, for example, a metal having high thermal conductivity. The heat radiating member 14 is comprised, for example with copper, aluminum, those alloys. The heat radiating member 14 is not limited to metal, and may be made of ceramics, carbon fiber resin, or the like.

  In the present embodiment, heat radiation grease 15 is interposed between the heat radiation area expanding member 11 and the heat radiation member 14. That is, the heat radiating member 14 is thermally connected to the heat radiating area expanding member 11 through the heat radiating grease 15. By using insulating heat dissipation grease as the heat dissipation grease 15, the heat dissipation area expanding member 11 and the heat dissipation member 14 can be electrically disconnected. In the present embodiment, the heat dissipation grease 15 has an insulating property.

  By disposing the heat dissipation grease 15 between the heat dissipating area expanding member 11 and the heat dissipating member 14, the unevenness of the heat dissipating area expanding member 11 and the heat dissipating member 14 is smoothed, and both of them are thermally spread over a wide range. Can be contacted. Moreover, since the component 3 is electrically disconnected from the heat dissipation member 14 by the insulating heat dissipation grease 15, it is possible to prevent immunity noise from flowing into the component 3 via the heat dissipation member 14. Further, it is possible to prevent the emission noise from being conducted to other electronic components through the heat dissipation member 14.

  In the present embodiment, the spring member 12 can exhibit a function as a spacer that increases the distance between the heat radiation area expanding member 11 and the heat radiation member 14. For this reason, the thickness of the heat radiation grease 15 is sufficiently ensured, and it is possible to more reliably secure the electrical disconnection between the heat radiation area expanding member 11 and the heat radiation member 14.

  FIG. 8 is a schematic perspective view of the heat dissipation member 14 according to the present embodiment. FIG. 9 is a schematic cross-sectional view at the position AA in FIG. FIG. 10 is a schematic cross-sectional view at the BB position in FIG. FIG. 9 shows a cross-sectional structure at a position away from the component 3. FIG. 10 shows a cross-sectional structure at a position close to the part 3. A circle indicated by a broken line in FIG. 8 indicates a location where the component 3 is disposed below.

  As shown in FIG. 8, in this Embodiment, the heat radiating member 14 is substantially long shape in top view. The heat radiating member 14 has a plurality of linear heat radiating fins 141 on the side opposite to the surface facing the heat radiating area expanding member 11. The plurality of heat radiating fins 141 are arranged substantially parallel to each other. In the present embodiment, a plurality of heat radiation fins 141 are provided on the upper surface of the heat radiation member 14. The plurality of heat radiating fins 141 extend in the longitudinal direction of the heat radiating member 14. Thereby, the length of each radiation fin 141 can be lengthened, and heat can be transmitted to a position away from the component 3. In addition, the amount of each radiating fin 141 hitting the cooling air can be increased. However, this is only an example, and the plurality of radiating fins 141 may be configured to extend in the short direction of the radiating member 14. Depending on the arrangement state of the heat dissipation structure 1, the direction in which the plurality of heat dissipation fins 141 extend may be determined.

  As shown in FIG. 9, the height of the plurality of radiating fins 141 decreases stepwise from the center surface CS that is substantially parallel to the extending direction of the radiating fins 141 and passes through the center of the component 3 toward the outside. In the present embodiment, the outside refers to both ends of the heat dissipation member 14 in the short direction. That is, in the present embodiment, a line (line indicated by a dotted line in FIG. 9) connecting the apexes of the plurality of radiating fins 141 in the short direction has a mountain shape.

  In addition, although the shape of the upper part of the several radiation fin 141 may be the same, at least one part may be made into a different shape. For example, in the plurality of radiating fins 141, a portion having a rounded upper portion and a shape having a linear shape may be mixed. Further, for example, a plurality of radiating fins 141 whose upper part is formed in a straight line may have a configuration having no inclination and a configuration having an inclination. By comprising in this way, the unnecessary meat | flesh of the radiation fin 141 can be shaved, for example, or the outstanding designability can be exhibited.

  Conventionally, the heights of the plurality of heat dissipating fins are generally the same. The inventors of the present application have confirmed from the results of the heat conduction analysis that the heat conduction decreases with increasing distance from the component 3 that generates heat. From this, it was found that the heat radiation performance similar to that of the conventional configuration can be ensured even if the height of the heat radiation fin is changed at a location near the heat generation source where heat radiation is necessary and a location away from the heat radiation source. For this reason, in this Embodiment, it is set as the structure which the height of the several radiation fin 141 becomes low in steps toward the outer side from the center part side. According to the heat radiating member 14 of this Embodiment, weight reduction can be achieved, ensuring the heat dissipation performance equivalent to the conventional structure.

  The heat radiating member 14 has a portion where the heights of adjacent heat radiating fins 141 are substantially the same, and a portion where the heights of adjacent heat radiating fins 141 are different. In the present embodiment, as shown in FIG. 9, adjacent radiating fins 141 have approximately the same height in the vicinity of the center surface CS and the end side. Moreover, it has a part from which the height of adjacent radiation fin 141 differs between them.

  By comprising in this way, the cross-sectional shape of the heat radiating member 14 can be represented by the smooth mountain shape which connected the straight line and the curve, and it can be set as the structure excellent in the designability, ensuring heat dissipation performance. Further, the resonance points of the radiating fins 141 can be shifted from each other in the portions where the heights of the adjacent radiating fins 141 are different. For this reason, it is possible to reduce unnecessary vibrations and improve the audio quality. Further, in the present embodiment, only one radiating fin 141 present in the immediate vicinity of the center surface CS is not peaked, and the adjacent radiating fins 141 are substantially the same in the vicinity of the center surface CS. A part is provided. By comprising in this way, the excess meat | flesh of the heat radiating member 14 can be cut and weight reduction can be achieved.

  In addition, the heat radiating member 14 may be configured such that adjacent radiating fins 141 have different heights in the entire range. If comprised in this way, the effect of shifting the above-mentioned resonance point can be heightened. Moreover, depending on the case, the heat radiating member 14 may be configured such that the heights of the adjacent radiating fins 141 are substantially the same in the entire range.

  As shown in FIG. 10, the configuration of the radiation fins 141 is the same as the configuration described above even in the position where the heat radiation member 14 is close to the component 3. However, the difference is that the thickness between the radiation fins 141 is increased in the vicinity of the part facing the component 3 (in the vicinity of the center surface CS). By comprising in this way, heat conduction efficiency can be improved. Further, a difference is that a recess 142 is formed on the lower surface of the heat dissipation member 14 at a position close to the component 3. Contact between the heat dissipation member 14 and the holder member 13 can be avoided by the recess 142.

<2. Effect of heat dissipation structure>
In the heat radiating structure 1 of the present embodiment, the heat radiating portion of the component 3 can be expanded in a pseudo manner by the heat radiating area expanding member 11 to transmit heat to the heat radiating member 14. Further, the heat radiating area expanding member 11 and the component 3 can be reliably thermally connected by the spring member 12. Furthermore, heat can be released to the substrate 2 by the holder member 13 that supports the spring member 12. For this reason, according to the heat dissipation structure 1 of the present embodiment, it is possible to efficiently dissipate the heat generated in the component 3.

  In the present embodiment, the heat dissipation structure 1 is configured by stacking a plurality of members on the component 3. For this reason, it is possible to freely adjust the height of the heat dissipation structure 1 by adjusting the height of each member. For this reason, it can be applied to various devices having different thicknesses. Further, for example, by adjusting the thickness of the heat radiation area expanding member 11 and the spring member 12, the height of the heat radiation member 14 relative to the substrate 2 can be adjusted. For this reason, the freedom degree of arrangement | positioning of the thermal radiation member 14 can be raised. Moreover, since the stress adjustment when fixing the holder member 13 to the board | substrate 2 can be performed with the spring member 12, when assembling the thermal radiation structure 1, the probability that a structural member will generate | occur | produce can be reduced.

  Further, in the heat dissipation structure 1 of the present embodiment, the component 3 and the heat dissipation member 14 are insulated. For this reason, the conduction path of the immunity noise with respect to the component 3 becomes only the board | substrate 2, and noise resistance performance can be improved. In addition, since emission noise emitted from the component 3 is not conducted to the heat radiating member 14, a return path of emission noise can be secured in the substrate 2, and emission performance can be improved. Moreover, since the pseudo shield structure can be formed by the holder member 13, the emission noise generated from the component 3 can be confined inside the holder member 13. From this point, the emission performance can be improved. That is, according to the heat dissipation structure 1 of the present embodiment, the EMC performance can be improved.

  Furthermore, in the heat radiating structure 1 of the present embodiment, by arranging the plurality of heat radiating fins 141 included in the heat radiating member 14 in a mountain shape, the excess meat of the heat radiating member 14 is reduced, and the heat radiating member 14 Can reduce the weight. For this reason, according to this Embodiment, the weight of the vehicle-mounted audio amplifier provided with the thermal radiation structure 1 can be reduced, and it can anticipate that the fuel consumption of a vehicle improves.

<3. Modified example>
The configurations of the embodiments and modified examples in this specification are merely examples of the present invention. The configuration of the embodiment and the modification may be changed as appropriate without departing from the technical idea of the present invention. In addition, a plurality of embodiments and modifications may be implemented in combination within a possible range.

  In the above, the structure in which the heat dissipating structure of the present invention is applied to a planar mounting type heat generating component has been exemplified. The heat dissipating structure of the present invention may be applied to a vertically installed heat generating component. FIG. 11 is a cross-sectional view schematically showing a modified example of the heat dissipation structure of the present embodiment. In the heat radiating structure 1 of the modified example, as shown in FIG. 11, the heat radiating area expanding member 11, the spring member 12, and the heat radiating member 14 are oriented in accordance with the direction of the heat radiating portion of the vertically placed component 3. It is rotated 90 ° from the state shown in FIG. Moreover, the holder member 13 is not a frame shape, but is configured in a box shape having an opening on a side surface. Even in the heat dissipation structure 1 of the modification, the same effect as described above can be obtained.

  Further, the case where the present invention is applied to an on-vehicle audio amplifier has been exemplified above. The present invention is not limited to this, and can be widely applied to devices having heat generating components mounted on a substrate. The present invention can be applied to, for example, portable electronic devices such as portable devices, vehicle-mounted devices, and the like.

DESCRIPTION OF SYMBOLS 1 ... Radiation structure 2 ... Board | substrate 3 ... Parts 11 ... Radiation area expansion member 12 ... Spring member 13 ... Holder member 13b ... Side wall (wall part)
14 ... Radiating member 15 ... Radiating grease 131a, 131b ... Engaging claw 132 ... Mounting leg 141 ... Radiating fin CS ... Center surface

Claims (8)

A heat dissipation structure that dissipates heat generated by components mounted on a board,
A heat dissipating area extending member that is disposed opposite to the part and extends the heat dissipating area of the part;
A spring member disposed on the opposite side of the surface facing the component of the heat radiation area expansion member, and biasing the heat radiation area expansion member toward the component;
A holder member fixed to the substrate and supporting the spring member;
A heat dissipating member that is disposed outside the spring member with respect to the heat dissipating area expanding member and thermally connected to the heat dissipating area expanding member,
A heat dissipating structure.   The heat dissipation structure according to claim 1, wherein heat dissipation grease is interposed between the heat dissipation area expanding member and the heat dissipation member.   The heat dissipation structure according to claim 1 or 2, wherein heat dissipation grease is interposed between the component and the heat dissipation area expanding member. The holder member has a pair of wall portions facing each other and having mounting legs attached to the substrate,
The heat dissipation structure according to any one of claims 1 to 3, wherein the mounting leg is disposed asymmetrically between the pair of wall portions. The holder member has a pair of engaging claws for positioning the heat radiation area expanding member and the spring member,
5. The heat dissipation structure according to claim 1, wherein the pair of engaging claws are provided asymmetrically on opposite sides of the holder member. 6. The heat dissipating member has a plurality of linear heat dissipating fins on the side opposite to the surface facing the heat dissipating area expanding member,
The plurality of radiating fins are arranged substantially parallel to each other,
The height of the plurality of radiating fins is substantially parallel to a direction in which the radiating fins extend and gradually decreases from a center surface passing through a central portion of the component toward the outside. 2. A heat dissipation structure according to item 1.   The heat dissipation member according to claim 6, wherein the heat dissipating member has a portion where the adjacent heat dissipating fins have substantially the same height and a portion where the adjoining heat dissipating fins differ in height.   The heat dissipating structure according to claim 7, wherein the heat dissipating fins adjacent to each other have substantially the same height in the vicinity of the center surface.

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