CN220292414U - Radiator convenient to disassemble and assemble - Google Patents
Radiator convenient to disassemble and assemble Download PDFInfo
- Publication number
- CN220292414U CN220292414U CN202320644643.4U CN202320644643U CN220292414U CN 220292414 U CN220292414 U CN 220292414U CN 202320644643 U CN202320644643 U CN 202320644643U CN 220292414 U CN220292414 U CN 220292414U
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- fixed cavity
- chip
- radiating
- elastic sheet
- radiator according
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- 239000003292 glue Substances 0.000 claims abstract description 10
- 230000006835 compression Effects 0.000 claims abstract description 5
- 238000007906 compression Methods 0.000 claims abstract description 5
- 238000003466 welding Methods 0.000 claims abstract description 5
- 235000014676 Phragmites communis Nutrition 0.000 claims description 26
- 229910000906 Bronze Inorganic materials 0.000 claims description 3
- 229910052790 beryllium Inorganic materials 0.000 claims description 3
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000010974 bronze Substances 0.000 claims description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 6
- 238000009434 installation Methods 0.000 abstract description 4
- 238000002788 crimping Methods 0.000 abstract description 3
- 210000004907 gland Anatomy 0.000 description 16
- 230000017525 heat dissipation Effects 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 7
- 239000012634 fragment Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a radiator convenient to assemble and disassemble, which comprises a radiating fin and elastic pieces used for crimping and fastening a chip, wherein the radiating fin comprises a radiating array surface and a fixed cavity connected with the bottom of the radiating array surface, the fixed cavity is used for providing a compression space of the chip and the elastic pieces, the top of the fixed cavity is provided with heat-conducting glue, four elastic pieces are respectively arranged on four side surfaces in the fixed cavity, and the head and the tail of two adjacent elastic pieces are mutually spaced. According to the utility model, the radiator can be customized according to the size of the chip, the radiating array surface of the radiating fin is used for radiating, the top of the fixed cavity at the bottom of the radiating fin is provided with the heat-conducting glue, so that the radiating of the chip is further accelerated, the radiating requirement of the chip is met, the radiating effect is good, the elastic sheet fixed at the periphery of the fixed cavity by spot welding is used for being in press-connection and fastening with the chip, the fixed cavity of the radiating fin is only required to be pressed and installed at the periphery of the chip during installation, the installation is convenient, and the cost of the radiating fin is low.
Description
Technical Field
The utility model relates to the field of chip-level external heat dissipation, in particular to a radiator convenient to assemble and disassemble.
Background
The PCB (Printed Circuit Board), namely a printed circuit board, is used as a carrier for the electrical connection of components and is a basic support for electronic components. The electronic components on the PCB board can produce heat when the operation, especially the treater chip, need handle a large amount of data in the operation in-process, and its working power is great, and the heat of production is more, if can not in time dispel the heat, the operating temperature of chip can continuously rise, will lead to the chip to lose efficacy after exceeding certain degree, therefore it is crucial to the heat dissipation treatment of electronic components.
For the processor chip in the patch package form, heat can only be dissipated through the PCB, in most of the existing methods, a large heat dissipating plate is designed at the center of the PCB corresponding to the chip, the chip is welded on the heat dissipating plate, and the generated heat is led out through the heat dissipating plate. Although the method is simple in process and easy to realize, the heat dissipation efficiency is low, the heat dissipation requirement of the processor chip cannot be met, and the temperature of the chip is still high.
For example, chinese patent publication No. CN215420889U discloses a heat dissipating plate structure for mounting a chip, in which a heat dissipating through hole penetrating through a PCB board is disposed in a region of a surface layer heat dissipating pad, so as to improve heat dissipating efficiency of a surface mount processor chip, so as to meet heat dissipating requirements thereof.
However, the electronic design system has increasingly complex functions and more compact spaces, and for designing a denser PCB, there is insufficient space to provide heat dissipation through holes on the PCB, so that the heat dissipation of the PCB can not meet the heat dissipation requirement.
The problems are worth solving.
Disclosure of Invention
In order to solve the problem that the existing PCB with dense design still cannot meet the heat dissipation requirement, the utility model provides the heat radiator which is convenient to assemble and disassemble.
The technical scheme of the utility model is as follows:
a radiator convenient to assemble and disassemble is characterized by comprising radiating fins and elastic sheets for crimping and fastening chips,
the radiating fin comprises a radiating array surface and a fixed cavity connected with the bottom of the radiating array surface, the fixed cavity is used for providing a compression space of the chip and the elastic pieces, the top of the fixed cavity is provided with heat conducting glue, four elastic pieces are respectively installed on four sides of the inside of the fixed cavity, and two adjacent elastic pieces are mutually spaced from head to tail.
The utility model according to the above-described aspect is characterized in that the length of the fixed cavity is greater than the length of the chip, the width of the fixed cavity is greater than the width of the chip, the length of the fixed cavity is smaller than the sum of the length of the chip and the thickness of the elastic sheet, and the width of the fixed cavity is smaller than the sum of the width of the chip and the thickness of the elastic sheet.
Furthermore, the elastic sheet is a locking reed formed by stamping beryllium bronze, and the locking reed is provided with a plurality of continuous circular arcs.
The present utility model according to the above aspect is characterized in that the protruding directions of the arcs are the same.
Further, the device also comprises an annular reed gland for fixing the locking reed at the depth position of the fixed cavity, wherein the reed gland is provided with a convex edge at the inner side of the through hole, the upper side of the locking reed is abutted with the top of the fixed cavity, and the lower side of the locking reed is abutted with the convex edge of the reed gland.
The utility model of the above scheme is characterized in that the length of the convex edge is larger than the length of the inner side of the fixed die cavity, and the width of the convex edge is larger than the width of the inner side of the fixed die cavity.
The utility model of the scheme is characterized in that the bottom of the fixed cavity is provided with a Z-shaped groove which is matched with the convex edge.
Further, the elastic sheet is an elastic sheet buckle formed by stamping stainless steel materials, and a return hook is arranged at the bottom of the elastic sheet buckle.
The utility model is characterized in that the four elastic sheet buckles are respectively fixed on four side surfaces in the fixed cavity by spot welding.
The utility model of the above scheme is characterized in that the cross section of the back hook is triangular or circular arc.
Further, the thickness of the heat-conducting glue is not less than 0.5mm.
According to the scheme, the radiator is customized according to the size of the chip, the radiating array surface of the radiating fin is used for radiating, the heat-conducting glue is arranged at the top of the fixed cavity at the bottom of the radiating fin, the radiating of the chip is further quickened, so that the radiating requirement of the chip is met, the radiating effect is good, the elastic pieces fixed at the periphery of the fixed cavity by spot welding are used for being in press-connection and fastening with the chip, the fixed cavity of the radiating fin is only required to be pressed and installed at the periphery of the chip during installation, the installation is convenient, and the cost of the radiating fin is low.
Drawings
FIG. 1 is a schematic diagram of a third embodiment of the present utility model;
FIG. 2 is a schematic diagram of an explosion structure of a third embodiment of the present utility model;
FIG. 3 is a front view of a first embodiment of the present utility model;
FIG. 4 is a bottom view of the first embodiment of the present utility model;
FIG. 5 is a cross-sectional view of FIG. 4 taken along section line A-A;
FIG. 6 is a front view of a second embodiment of the present utility model;
FIG. 7 is a bottom view of a second embodiment of the present utility model;
FIG. 8 is a cross-sectional view of FIG. 7 taken along section line B-B;
FIG. 9 is a front view of a third embodiment of the present utility model;
FIG. 10 is a bottom view of a third embodiment of the present utility model;
FIG. 11 is a cross-sectional view of FIG. 10 taken along section line C-C;
in the drawings, the respective reference numerals are as follows:
1. a heat sink; 11. a heat dissipation array surface; 12. fixing the die cavity; 121. a heat-conducting adhesive;
2. a spring plate; 21. locking the reed; 22. a reed gland; 221. a convex edge; 23. the spring plate is buckled; 231. a hook is returned;
Detailed Description
The utility model is further described below with reference to the drawings and embodiments:
it should be noted that the terms "comprising" and "having" and any variations thereof in the description and claims of the present utility model are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus. The term "disposed" and like terms are to be broadly interpreted, and may be fixedly connected, detachably connected, or integrally formed, for example; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The directions or positions indicated by the terms "upper", "lower", "left", "right", "front", "rear", "bottom", etc. are directions or positions based on those shown in the drawings, and are merely for convenience of description, and are not to be construed as limiting the present technical solution.
As shown in fig. 1-11, a convenient radiator of dismouting, including undertaking fixed, support, heat conduction, radiating effect's fin 1, be used for the shell fragment 2 of chip crimping knot, fin 1 includes the fixed die cavity 12 that heat dissipation array face 11 and heat dissipation array face 11 bottom are connected, fixed die cavity 12 is used for providing the space that compresses tightly of chip and shell fragment 2, heat-conducting glue 121 is installed at the top of fixed die cavity 12, heat-conducting glue 121 dispels the heat fast and strengthens fixed effect simultaneously, four shell fragments 2 are installed respectively at the inside four sides of fixed die cavity 12, and mutual interval between the head and the tail of two adjacent shell fragments 2, avoid forming big bending radius and then influence the chip and impress.
In the utility model, the LTM4620 chip is taken as an example, the specific parameters of the customized radiator which is convenient to assemble and disassemble can be adjusted according to the size of the chip, and the chip is a BGA package with the length of 15mm, the width of 15mm and the height of 5.01 mm.
In a preferred embodiment, the length of the fixed cavity 12 is greater than the length of the chip, the width of the fixed cavity 12 is greater than the width of the chip, the length of the fixed cavity 12 is less than the sum of the length of the chip and the thickness of the dome 2, and the width of the fixed cavity 12 is less than the sum of the width of the chip and the thickness of the dome 2. When the LTM4620 chip is used for radiating, the length and the width of the fixed cavity 12 are 15.18mm, so that the compression effect of the radiating fin 1 and the chip is ensured during compression joint. The thickness of the fixed cavity 12 is about 1.5mm, the strength of the fixed cavity 12 is ensured when the chip is pressed in, the depth depends on the mounting height and thickness of the specific chip, and in the utility model, the depth is 5.5mm, and more than 0.5mm can be used for accommodating the heat-conducting glue 121 at the top in the cavity.
In the preferred embodiment, the spring plate 2 is a locking reed 21 formed by stamping beryllium bronze, and has the mechanical characteristics of high strength, high hardness, high wear resistance, good elasticity, high fatigue limit, high heat resistance and the like, and the locking reed 21 is formed by connecting a plurality of continuous circular arcs, and the protruding directions of the circular arcs are the same. In other alternative embodiments, the protruding directions of the arcs are different, and the protruding directions of the adjacent two arcs are opposite.
The customized radiator of convenient dismouting still includes the annular reed gland 22 that fixes the depth position of locking reed 21 at fixed die cavity 12, fixes the depth position of locking reed 21 at the fixed die cavity 12 inner chamber of fin, guarantees that locking reed 21 does not carry out the displacement in the depth direction when compressing tightly with the chip tiny deformation to influence the effect of compressing tightly. The middle part of the reed gland 22 is provided with a through hole with the same size as the chip, the inside of the through hole of the reed gland 22 is provided with a convex edge 211, and two sides of the locking reed 21 are respectively abutted with the top of the fixed cavity 12 and the convex edge 221 of the reed gland 22. When the locking reed 21 is fixed, the force of the top surface of the inner cavity of the fixed cavity 12 at the bottom of the radiating fin 1 is from top to bottom, and the force of the reed gland 22 is from bottom to top, so that the locking reed is fixed.
The length of the flange 221 is greater than the length of the inside of the fixed cavity 12, and the width of the flange 221 is greater than the width of the inside of the fixed cavity 12. The spring gland 22 and the fixed cavity 12 of the radiating fin 1 are in interference fit, namely, the size of the outer edge of the convex edge 221 of the spring gland 22 is slightly larger than that of the fixed cavity 12 of the radiating fin 1, and after the spring gland 22 is assembled, elastic pressure is generated between the convex edge 221 of the spring gland 22 and the inner cavity surface of the fixed cavity 12 of the radiating fin 1 due to interference values, so that the purpose of fastening the two is achieved. The cooperation has higher fastening characteristic, so that the reed can be fixed.
The spring plates 2 are locking spring plates 21, and spring plate pressing covers 22 are needed. The scheme I is a scheme I, the manufacturing process of the scheme I is complex in assembly process and slightly high in cost, can be used for radiating a chip with large radiating capacity, and is the most firm with the chip fixing mode.
In an alternative embodiment, the elastic sheet 2 is an elastic sheet buckle 23 made of stainless steel by stamping, and has the characteristics of fatigue resistance, oxidation resistance, no burrs and the like, and a return hook 231 is arranged at the bottom of the elastic sheet buckle 23, and the return hook 231 is triangular or circular arc. The spring plate buckle 23 can be fixed on two sides of the inner cavity of the fixed cavity 12 of the radiating fin 1 by adopting a spot welding process so as to fix the radiator, and the scheme can adjust the height of the inner cavity of the fixed cavity 12, thereby omitting the spring plate gland 22. The scheme II is that the spring plates 2 are spring plate buckles 23, the spring plate gland 22 is omitted, the scheme manufacturing process is simple, the assembly process is simple in several schemes, the cost is low, the heat dissipation can be carried out on chips with small heat dissipation capacity, and the disassembly and assembly are most convenient.
In other alternative embodiments, the spring 2 is a combination of a locking spring 21 and a spring catch 23, requiring a spring gland 22. The scheme is a scheme III, the manufacturing process and the assembly process of the scheme are the most complex in several schemes, the cost is slightly high, the scheme can be used for radiating a chip with common radiating capacity, and the disassembly and assembly difficulty is centered
It will be understood that modifications and variations will be apparent to those skilled in the art from the foregoing description, and it is intended that all such modifications and variations be included within the scope of the following claims.
While the utility model has been described above with reference to the accompanying drawings, it will be apparent that the implementation of the utility model is not limited by the above manner, and it is within the scope of the utility model to apply the inventive concept and technical solution to other situations as long as various improvements made by the inventive concept and technical solution are adopted, or without any improvement.
Claims (10)
1. A radiator convenient to disassemble and assemble is characterized by comprising a radiating fin and an elastic sheet used for being pressed and fastened with a chip,
the radiating fin comprises a radiating array surface and a fixed cavity connected with the bottom of the radiating array surface, the fixed cavity is used for providing a compression space of the chip and the elastic pieces, the top of the fixed cavity is provided with heat conducting glue, four elastic pieces are respectively installed on four sides of the inside of the fixed cavity, and two adjacent elastic pieces are mutually spaced from head to tail.
2. The conveniently disassembled and assembled radiator according to claim 1, wherein the length of the fixed cavity is smaller than the sum of the length of the chip and the thickness of the elastic sheet, and the width of the fixed cavity is smaller than the sum of the width of the chip and the thickness of the elastic sheet.
3. The conveniently disassembled and assembled radiator according to claim 1, wherein the elastic sheet is a locking reed made of beryllium bronze by stamping, and the locking reed is provided with a plurality of continuous circular arcs.
4. A conveniently detachable radiator according to claim 3, wherein the protruding directions of the circular arcs are the same.
5. A conveniently detachable radiator according to claim 3, further comprising an annular spring cover for fixing the locking spring at the depth of the fixed cavity, wherein a convex edge is provided on the inner side of the spring cover, the upper side of the locking spring is abutted against the top of the fixed cavity, and the lower side of the locking spring is abutted against the convex edge of the spring cover.
6. The conveniently disassembled and assembled radiator according to claim 5, wherein a Z-shaped groove which is matched with the convex edge is formed in the bottom of the fixed cavity.
7. The conveniently disassembled and assembled radiator according to claim 1, wherein the elastic sheet is an elastic sheet buckle formed by stamping stainless steel materials, and a return hook is arranged at the bottom of the elastic sheet buckle.
8. The conveniently disassembled and assembled radiator according to claim 6, wherein four elastic sheet buckles are respectively fixed on four side surfaces inside the fixed cavity in a spot welding mode.
9. The conveniently detachable radiator according to claim 7, wherein the cross section of the return hook is triangular or circular.
10. The conveniently disassembled and assembled radiator according to claim 1, wherein the thickness of the heat conducting glue is not less than 0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320644643.4U CN220292414U (en) | 2023-03-16 | 2023-03-16 | Radiator convenient to disassemble and assemble |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320644643.4U CN220292414U (en) | 2023-03-16 | 2023-03-16 | Radiator convenient to disassemble and assemble |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220292414U true CN220292414U (en) | 2024-01-02 |
Family
ID=89344139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320644643.4U Active CN220292414U (en) | 2023-03-16 | 2023-03-16 | Radiator convenient to disassemble and assemble |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220292414U (en) |
-
2023
- 2023-03-16 CN CN202320644643.4U patent/CN220292414U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |