CN209947831U

CN209947831U - Compress tightly shell fragment and heat radiation structure

Info

Publication number: CN209947831U
Application number: CN201920030599.1U
Authority: CN
Inventors: 郭庭; 杨锡旺
Original assignee: Changzhou Suo Wei Electronic Technology Co Ltd
Current assignee: Changzhou Shiwei Electronics Co ltd
Priority date: 2019-01-08
Filing date: 2019-01-08
Publication date: 2020-01-14
Anticipated expiration: 2029-01-08

Abstract

A compressing spring piece is characterized in that a body of the compressing spring piece is S-shaped, a connecting portion connected below the body is provided with a screw hole, the compressing spring piece is used for compressing a power electronic device in a radiating seat, the screw hole of the connecting portion is used for fastening the compressing spring piece and the power electronic device in the radiating seat through screws, when the compressing spring piece compresses the power electronic device, the S-shaped body of the compressing spring piece enables the compressing spring piece to have 2 pressure points on the surface of the power electronic device, and the 2 pressure points are respectively a first pressure point located at the S-shaped head portion and a second pressure point located at the S-shaped tail portion.

Description

Compress tightly shell fragment and heat radiation structure

Technical Field

The utility model belongs to the technical field of power electronic device, in particular to compress tightly shell fragment and adopt this heat radiation structure who compresses tightly the shell fragment.

Background

At present, in the fields of new energy automobiles, rail transit, industrial control and the like, such as vehicle-mounted chargers, direct current exchangers, alternating current exchangers, two-in-one system integration, three-in-one system integration and the like, MOSFET and IGBT electronic devices are integrated on a PCB (printed Circuit Board), so that the on-off control of a circuit is realized. Because the MOSFET and IGBT electronic devices have the advantages of reliability, accuracy, long service life, high working frequency and the like in the process of realizing the on-off control of the circuit, the MOSFET and IGBT electronic devices are widely used. The power loss of the MOSFET and IGBT electronic devices brings serious heating, so that how to solve the temperature rise of the devices and ensure the normal work of the circuit becomes a problem which needs to be solved in the circuit design.

However, after the existing MOSFET and IGBT electronic devices are assembled on a PCB, most methods for solving the heat dissipation problem need to use screws for fixing, so that the space for locking a screw wrench tool is increased in structural design, the effective use of structural design is limited, and the problems of increased size, increased weight and increased cost are caused.

SUMMERY OF THE UTILITY MODEL

The utility model provides a compress tightly shell fragment and heat radiation structure, aim at solve and currently compress tightly the shell fragment packing force not enough, must adopt with the fix with screw on the PCB board to lead to the extravagant invalid problem in structural design space.

In one embodiment of the utility model, the pressing spring plate has an S-shaped body, a screw hole is arranged on a connecting part connected below the body,

the pressing elastic sheet is used for pressing the power electronic device in the heat dissipation seat, the screw hole of the connecting part is used for fastening the pressing elastic sheet and the power electronic device in the heat dissipation seat by using a screw,

when the pressing elastic sheet presses the power electronic device, the S-shaped pressing elastic sheet has 2 pressure points on the surface of the power electronic device, and the 2 pressure points are respectively a first pressure point at the head of the S shape and a second pressure point at the tail of the S shape.

In the double-pressure-point elastic sheet structure in the embodiment, the heat dissipation base is a die casting and is produced by adopting a die casting die, so that the double-pressure-point elastic sheet structure has the advantages of mature production process, suitability for mass production, high production efficiency, high precision, low cost, convenience for subsequent processing and the like.

Two pressure point shell fragment structures in, polymer insulating pad adopts big batch package for cross cutting piece, then uses stamping die to cut and forms, has that production efficiency is high, output is big, output is high, with low costs, advantage such as standardized use is so that the commonality is good.

Two pressure point shell fragment structures in, compress tightly the shell fragment and be the sheet metal component, adopt stamping die, the mass production of being convenient for has advantages such as production efficiency height, precision height, yields height, with low costs.

The embodiment of the utility model provides an one, a two pressure point shell fragment heat radiation structure, including radiating bottom plate, polymer insulating gasket, compress tightly shell fragment and need MOSFET, GBT isoelectron device that the heat dissipation was handled. The radiating bottom plate structure is made of aluminum alloy materials, and is low in cost, mature in manufacturing and production process and high in radiating performance. The high-molecular insulating gasket structure is made of high-molecular polymer materials, and has the advantages of low cost, high universality and high insulativity. The compressing spring plate structure is made of stainless steel, and has good elasticity, high strength and good corrosion resistance. Electronic devices such as MOSFETs and IGBTs are integrated on the PCB board to be used as power devices.

The utility model discloses two pressure point shell fragment structures compare with prior art, have following beneficial effect:

1. because electronic devices such as MOSFET, IGBT are as main source that generates heat in power electronics, the utility model discloses a two pressure point shell fragment structures can make electronic device compress tightly more firm stability to make electronic device generate heat better with the heat dissipation casing contact conduct the heat as early as possible away the heat and dispel the heat, therefore the radiating effect is better, improve electronic device's life, stability, and frequency of operation etc..

2. The structure equipment is simple reliable, need not drop into big tool equipment, structurally adopts two spacing fixes to structurally, structurally the firm nature of structure is guaranteed to the mode of dual fail-safe.

3. The utility model discloses a structural design is compatible good, compresses tightly the shell fragment and can carry out the optimal design according to actual need, also can adopt simultaneously with the supplementary mode of structure glue to increase this structural design's firm nature.

Drawings

The above and other objects, features and advantages of exemplary embodiments of the present invention will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. Several embodiments of the present invention are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which:

fig. 1 is a schematic structural view of a double-pressure-point elastic sheet in an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of the embodiment of the present invention in which the power electronic device is vertically mounted on the heat sink.

Fig. 3 is a schematic structural view of the power electronic device horizontally installed after being bent in the embodiment of the present invention.

1-double pressure point elastic sheet, 2 a-first pressure point, 2 b-second pressure point, 3-third device, 4-fourth device, 5-fifth device, 6-PCB board, 7-screw, 8-heat dissipation base, 9-heat dissipation bottom board.

Detailed Description

Since power electronic devices such as MOSFET and IGBT have large length and width dimensions and are used as main heat sources during operation, it is important to reliably and stably press and fix the devices such as MOSFET and IGBT on the heat dissipation surface to reduce thermal resistance in consideration of thermal design such as thermal resistance, positive pressure, smoothness and roughness of the heat dissipation surface. According to one or more embodiments, the 2-point pressing points shown in fig. 1 ensure the fixing of the device in a double-safety manner of the 2-point pressing during the assembly of different devices such as MOSFETs, IGBTs and the like with a PCB.

According to one or more embodiments, fig. 2 is a schematic structural view of a dual-piezoelectric dome in a vertically assembled state of the device. In the heat dissipation base 8, the surface of the

element

3, 4 and 5 correspondingly assembled with the electronic device such as MOSFET or IGBT is lightly coated with heat-conducting silicone grease with the thickness of 0.10-0.20mm, the high molecular insulating gasket is assembled with the

element

3, 4 and 5 such as MOSFET or IGBT, the double-pressure-point elastic sheet 1 is pressed and fixed by a screw 7, and then the pins of the

element

3, 4 and 5 such as MOSFET or IGBT penetrate through the through holes of the PCB 6 from the lower net to complete the welding operation. This completes the power electronics PCB assembly for direct assembly with the chassis structure.

According to one or more embodiments, fig. 3 is a schematic structural view illustrating a horizontally mounted dual-pressure-point dome after an electronic device is bent. Firstly, electronic devices such as elements 3 and 4 of MOSFET or IGBT and the like are installed to complete bending of welding feet, then, heat-conducting silicone grease with the thickness of 0.10-0.20mm is lightly coated on the positions of the elements 3 and 4 of MOSFET or IGBT and the like correspondingly assembled on the heat-radiating bottom plate 9, then, a high-molecular insulating gasket and the elements 3 and 4 of MOSFET or IGBT and the like are assembled, then, the double-pressure-point elastic sheet 1 and the screw 7 are pressed and fixed, and then, the PCB 6 is assembled from top to bottom and penetrates through the welding feet of the elements 3 and 4 of MOSFET or IGBT and the like to complete welding operation.

It is worth noting that while the foregoing has described the spirit and principles of the present invention with reference to several specific embodiments, it is to be understood that the present invention is not limited to the disclosed embodiments, nor is the division of aspects, which is for convenience only as the features in these aspects cannot be combined. The invention is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims

1. A pressing spring plate is characterized in that a body of the pressing spring plate is S-shaped, a connecting part connected below the body is provided with a screw hole,

2. A heat dissipation structure is characterized in that the heat dissipation structure comprises a heat dissipation seat, a polymer insulating gasket, a pressing spring plate and a power electronic device,

the body of the pressing elastic sheet is S-shaped, a connecting part connected below the body is provided with a screw hole, the pressing elastic sheet is used for pressing the power electronic device in the heat dissipation seat, the screw hole of the connecting part is used for fastening the pressing elastic sheet and the power electronic device in the heat dissipation seat by using a screw,

when the pressing elastic sheet presses the power electronic device, the S shape of the body of the pressing elastic sheet enables the pressing elastic sheet to have 2 pressure points on the surface of the power electronic device, the 2 pressure points are respectively a first pressure point positioned at the head of the S shape and a second pressure point positioned at the tail of the S shape,

the polymer insulating gasket is tightly attached to the heat dissipation surface of the power electronic device, and the pressing elastic sheet and the power electronic device are fastened on the heat dissipation seat by penetrating screws through the screw holes.

3. The heat dissipation structure of claim 2, wherein the surface of the power electronic device is coated with a heat conductive silicone grease having a thickness of 0.10 to 0.20 mm.

4. The heat dissipating structure of claim 2, wherein the heat sink is die cast and is produced using a die casting mold.

5. The heat dissipating structure of claim 2, wherein the polymer insulating spacer is a die-cut piece, and is formed by winding the die-cut piece in a large batch and then cutting the die-cut piece by using a stamping die.

6. The heat dissipation structure of claim 2, wherein the compression spring is a sheet metal part and is produced by a stamping die.

7. The heat dissipation structure of claim 2, wherein the pins of the power electronics device in the heat dissipation structure are via soldered to the PCB board to form a power electronics device PCB assembly for direct assembly with the chassis structure.