CN109801886A - A kind of compression elastic slice and radiator structure - Google Patents
A kind of compression elastic slice and radiator structure Download PDFInfo
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- CN109801886A CN109801886A CN201910014118.2A CN201910014118A CN109801886A CN 109801886 A CN109801886 A CN 109801886A CN 201910014118 A CN201910014118 A CN 201910014118A CN 109801886 A CN109801886 A CN 109801886A
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- Prior art keywords
- elastic slice
- power electronic
- electronic devices
- serpentine
- compression elastic
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- 230000006835 compression Effects 0.000 title claims abstract description 24
- 238000007906 compression Methods 0.000 title claims abstract description 24
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims abstract description 12
- 238000009413 insulation Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 8
- 238000004512 die casting Methods 0.000 claims description 4
- 239000004519 grease Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 230000008901 benefit Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 206010037660 Pyrexia Diseases 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000004584 weight gain Effects 0.000 description 1
- 235000019786 weight gain Nutrition 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A kind of compression elastic slice, the ontology of the compression elastic slice is rendered as serpentine, the interconnecting piece connected below ontology has screw hole, the compression elastic slice is for compressing power electronic devices in radiating seat, the compression elastic slice and power electronic devices for being fastened in radiating seat by the screw hole of interconnecting piece using screw, when the compression elastic slice compresses power electronic devices, the serpentine shape of its ontology to compress elastic slice for the power electronic devices surface with 2 pressure points, this 2 pressure points are the second pressure point positioned at first pressure point on serpentine head and positioned at serpentine tail portion respectively.
Description
Technical field
The invention belongs to power electronic devices technical field, in particular to a kind of compression elastic slice and use the compression elastic slice
Radiator structure.
Background technique
The fields such as new-energy automobile, rail traffic, Industry Control at present, as Vehicular charger, DC converter, exchange are handed over
Parallel operation, two-in-one system are integrated and three-in-one system is integrated etc., can all use MOSFET, IGBT electronic device set to pcb board
On, to realize the switch control of circuit.Due to MOSFET, IGBT electronic device are reliable in the switch control for realizing circuit,
Accurately, the advantages that service life is long, working frequency is high, thus be widely used.And function of MOSFET, IGBT electronic device itself
Rate loss brings serious fever, how to solve device temperature rise, guarantees that circuit works normally, becomes necessary in circuit design
It solves the problems, such as.
However it is existing on MOSFET, IGBT electronic device set to pcb board after, the method for solving heat dissipation problem is most
It needs to make to be screwed, thus increases the space of lock-screw Wrench in structure design, limit structure design
Effective use, cause volume to become larger, weight gain, increased costs.
Summary of the invention
The present invention provides a kind of compression elastic slice and radiator structures, it is therefore intended that solves existing compression elastic slice pressing force not
Foot, it is necessary to be screwed on pcb board, invalid problem is wasted so as to cause structure design space.
One of embodiment of the present invention, a kind of compression elastic slice, the ontology of the compression elastic slice is rendered as serpentine, below ontology
The interconnecting piece of connection has screw hole,
For the compression elastic slice for compressing power electronic devices in radiating seat, the screw hole of interconnecting piece is used for will using screw
The compression elastic slice and power electronic devices are fastened in radiating seat,
When the compression elastic slice compresses power electronic devices, the serpentine shape of ontology to compress elastic slice for described
Power electronic devices surface has 2 pressure points, this 2 pressure points are positioned at first pressure point on serpentine head and positioned at serpentine respectively
Second pressure point of tail portion.
In double pressure point elastic piece structures in the present embodiment, the heat dissipation base is die casting, is produced using die casting,
Have many advantages, such as mature production technology, be suitble to mass production, high production efficiency, precision high, at low cost, is convenient for following process.
In double pressure point elastic piece structures of the present invention, the polymer insulation gasket is cutting part, using high-volume
Package, then cut using stamping die, have high production efficiency, yield is big, yield is high, at low cost, versatility it is good with
The advantages that being used convenient for standardization.
In double pressure point elastic piece structures of the present invention, the compression elastic slice is that sheet metal component is convenient for using stamping die
Produce in enormous quantities, has many advantages, such as that high production efficiency, precision are high, non-defective unit is high, at low cost.
One of embodiment of the present invention, a kind of double pressure point elastic slice radiator structures, including radiating bottom plate, polymer insulation gasket,
Compress the electronic devices such as elastic slice and its MOSFET, GBT for needing radiating treatment.Radiating bottom plate structure uses aluminum alloy material,
It is at low cost, mature production technology is manufactured, and thermal diffusivity is high.Polymer insulation gasket construction, material use high molecular polymer
Material, has at low cost, versatility height, and insulating properties is high.Elastic piece structure is compressed, material is stainless steel material, and elasticity is good, intensity
Height, corrosion resistance are good.It is used in the electronic devices set to pcb board such as MOSFET, IGBT as power device.
Double pressure point elastic piece structures of the invention compared with prior art, have the advantages that
1, main pyrotoxin is used as in power electronics due to electronic devices such as MOSFET, IGBT, the present invention is using double
Pressure point elastic piece structure can make electronic device compress more firm stabilization, to make the fever of electronic device preferably and radiation shell
Body contact conducts as early as possible heat to radiate, thus heat dissipation effect is more preferable, improves the service life of electronic device, stablizes
Property and working frequency etc..
2, structure assembling is simple and reliable, does not need to put into big tooling device, uses to limit at two in structure and fix, from
And the mode of dual fail-safe guarantees the fixing of structure in structure.
3, structure design compatibility of the invention is good, and compressing elastic slice can optimize according to actual needs, simultaneously
It can also be by the way of being assisted with structure glue, to increase the fixing of this structure design.
Detailed description of the invention
The following detailed description is read with reference to the accompanying drawings, above-mentioned and other mesh of exemplary embodiment of the invention
, feature and advantage will become prone to understand.In the accompanying drawings, if showing by way of example rather than limitation of the invention
Dry embodiment, in which:
Fig. 1 is the structural schematic diagram of double pressure point elastic slices in the embodiment of the present invention.
Fig. 2 is the structural schematic diagram that power electronic devices is installed vertically on radiating seat in the embodiment of the present invention.
Fig. 3 is the structural schematic diagram being horizontally mounted after power electronic devices bending in the embodiment of the present invention.1 --- double pressure points
Elastic slice, 2a --- the first pressure point, 2b --- the second pressure point, 3 --- third device, 4 --- four device, 5 --- the 5th device,
6 --- pcb board, 7 --- screw, 8 --- heat dissipation base, 9 --- radiating bottom plate.
Specific embodiment
Since the length and width dimensions of power electronic devices such as MOSFET, IGBT etc. are bigger, and at work as main
Pyrotoxin, from thermal design such as thermal resistance, normal pressure, the finish of radiating surface, roughness etc. consider, by device such as MOSFET,
The devices such as IGBT it is reliable and stable be pressed abd fixed on radiating surface to which to reduce thermal resistance be important.According to one or more
Embodiment, pressure point at as shown in Figure 12, in different devices such as MOSFET, IGBT and pcb board assembling process, at 2
The mode of this dual fail-safe of pressure point guarantees the fixed of device.
According to one or more embodiment, it is illustrated in figure 2 double pressure point elastic slice structures in the vertical assembled state of device
Schematic diagram.In heat dissipation base 8, the surface of the elements 3,4 and 5 such as corresponding assembling electronic device such as MOSFET or IGBT is gently smeared
The heat-conducting silicone grease of last 0.10-0.20mm thickness, by 3,4 and 5 groups of the elements such as polymer insulation gasket and MOSFET or IGBT
Dress, double screws 7 of pressure point elastic slice 1 is fixed, then drawing the elements such as electronic device such as MOSFET or IGBT 3,4 and 5
Foot completes welding operation from the lower online via hole for passing through pcb board 6.This completes power electronic devices PCB component, the groups
Part is used for and casing structure direct-assembling.
According to one or more embodiment, it is horizontal after electronic device bending to be illustrated in figure 3 a kind of double pressure point elastic slices
The structural schematic diagram of installation.Elements such as electronic device such as MOSFET or IGBT 3,4 etc. are installed to the bending of leg first, so
Afterwards on radiating bottom plate 9, the last time is gently smeared in the position of the elements 3,4 such as corresponding assembling electronic device such as MOSFET or IGBT
Then the heat-conducting silicone grease of 0.10-0.20mm thickness assembles the elements such as polymer insulation gasket and electronic device such as MOSFET or IGBT
3,4, then double pressure point elastic slices 1 and screw 7 are fixed, then assemble pcb board 6 across electronic device such as from top to bottom
Welding operation is completed after the leg of the elements such as MOSFET or IGBT 3,4.
It is worth noting that although foregoing teachings are by reference to several essences that detailed description of the preferred embodimentsthe present invention has been described creates
Mind and principle, it should be appreciated that, the invention is not limited to the specific embodiments disclosed, the division also unawareness to various aspects
Taste these aspect in feature cannot combine, it is this divide merely to statement convenience.The present invention is directed to cover appended power
Included various modifications and equivalent arrangements in the spirit and scope that benefit requires.
Claims (7)
1. a kind of compression elastic slice, which is characterized in that the ontology of the compression elastic slice is rendered as serpentine, the company connected below ontology
Socket part has screw hole,
For the compression elastic slice for compressing power electronic devices in radiating seat, the screw hole of interconnecting piece is used for will be described using screw
It compresses elastic slice and power electronic devices is fastened in radiating seat,
When the compression elastic slice compresses power electronic devices, the serpentine shape of ontology to compress elastic slice for the electric power
Electronic device surface has 2 pressure points, this 2 pressure points are positioned at first pressure point on serpentine head and positioned at serpentine tail portion respectively
The second pressure point.
2. a kind of radiator structure, which is characterized in that the radiator structure include radiating seat, polymer insulation gasket, compress elastic slice and
Power electronic devices,
The ontology for compressing elastic slice is rendered as serpentine, and the interconnecting piece connected below ontology has screw hole, which uses
In compressing power electronic devices in radiating seat, the screw hole of interconnecting piece is used to use screw by the compression elastic slice and power electronics
Device is fastened in radiating seat,
When the compression elastic slice compresses power electronic devices, the serpentine shape of ontology to compress elastic slice for the electric power
Electronic device surface has 2 pressure points, this 2 pressure points are positioned at first pressure point on serpentine head and positioned at serpentine tail portion respectively
The second pressure point,
Polymer insulation gasket is close to the radiating surface of power electronic devices, passes through screw hole using screw, will compress elastic slice and electricity
Power electronic device is fastened on radiating seat.
3. radiator structure according to claim 2, which is characterized in that the surface of power electronic devices is coated with 0.10~
The heat-conducting silicone grease of 0.20mm thickness.
4. radiator structure according to claim 2, which is characterized in that the radiating seat is die casting, using die casting
Production.
5. radiator structure according to claim 2, which is characterized in that the polymer insulation gasket is cutting part, is used
High-volume is wrapped, and is then cut using stamping die.
6. radiator structure according to claim 2, which is characterized in that the compression elastic slice is sheet metal component, using stamping die
Tool production.
7. radiator structure according to claim 2, which is characterized in that power electronic devices in the radiator structure is drawn
Foot and pcb board carry out via hole welding, form power electronic devices PCB component, which is used for and casing structure direct-assembling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910014118.2A CN109801886A (en) | 2019-01-08 | 2019-01-08 | A kind of compression elastic slice and radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910014118.2A CN109801886A (en) | 2019-01-08 | 2019-01-08 | A kind of compression elastic slice and radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109801886A true CN109801886A (en) | 2019-05-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910014118.2A Pending CN109801886A (en) | 2019-01-08 | 2019-01-08 | A kind of compression elastic slice and radiator structure |
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| CN (1) | CN109801886A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021035801A1 (en) * | 2019-08-23 | 2021-03-04 | 张建平 | Heat dissipation type car caliper cover |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09232487A (en) * | 1996-02-21 | 1997-09-05 | Meidensha Corp | Fixing structure of circuit element |
| JPH10107467A (en) * | 1996-10-01 | 1998-04-24 | Ritoo Denshi:Kk | Semiconductor/heat radiating member assembling structure and structure of assembled structure to substrate |
| CN101421246A (en) * | 2006-04-20 | 2009-04-29 | 依必安-派特穆尔芬根股份有限两合公司 | Layout of power semiconductor contacts on a cooling surface |
| DE102010035169A1 (en) * | 2010-08-23 | 2012-02-23 | Marquardt Verwaltungs-Gmbh | Control device i.e. electrical switch, for e.g. rechargeable battery driller, has heat generating component arranged in opening such that direct heat conducting connection of heat generating component to cooling body is enabled |
| CN207602554U (en) * | 2017-12-27 | 2018-07-10 | 浙江西盈科技股份有限公司 | A kind of heat dissipation clamp system of power device |
| CN207733140U (en) * | 2017-12-25 | 2018-08-14 | 德州欧瑞电子通信设备制造有限公司 | A kind of upper and lower locating part of cabinet |
| CN108831864A (en) * | 2018-09-04 | 2018-11-16 | 常州索维尔电子科技有限公司 | Semiconductor power device heat dissipation base and assemble method |
| CN209947831U (en) * | 2019-01-08 | 2020-01-14 | 常州索维尔电子科技有限公司 | Compress tightly shell fragment and heat radiation structure |
-
2019
- 2019-01-08 CN CN201910014118.2A patent/CN109801886A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09232487A (en) * | 1996-02-21 | 1997-09-05 | Meidensha Corp | Fixing structure of circuit element |
| JPH10107467A (en) * | 1996-10-01 | 1998-04-24 | Ritoo Denshi:Kk | Semiconductor/heat radiating member assembling structure and structure of assembled structure to substrate |
| CN101421246A (en) * | 2006-04-20 | 2009-04-29 | 依必安-派特穆尔芬根股份有限两合公司 | Layout of power semiconductor contacts on a cooling surface |
| DE102010035169A1 (en) * | 2010-08-23 | 2012-02-23 | Marquardt Verwaltungs-Gmbh | Control device i.e. electrical switch, for e.g. rechargeable battery driller, has heat generating component arranged in opening such that direct heat conducting connection of heat generating component to cooling body is enabled |
| CN207733140U (en) * | 2017-12-25 | 2018-08-14 | 德州欧瑞电子通信设备制造有限公司 | A kind of upper and lower locating part of cabinet |
| CN207602554U (en) * | 2017-12-27 | 2018-07-10 | 浙江西盈科技股份有限公司 | A kind of heat dissipation clamp system of power device |
| CN108831864A (en) * | 2018-09-04 | 2018-11-16 | 常州索维尔电子科技有限公司 | Semiconductor power device heat dissipation base and assemble method |
| CN209947831U (en) * | 2019-01-08 | 2020-01-14 | 常州索维尔电子科技有限公司 | Compress tightly shell fragment and heat radiation structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021035801A1 (en) * | 2019-08-23 | 2021-03-04 | 张建平 | Heat dissipation type car caliper cover |
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